BALF-SPI-01D3 - STMicroelectronics

BALF-SPI-01D3
50 Ω nominal input / conjugate match balun to SPIRIT1,
with integrated harmonic filter
Datasheet − production data
Features
• 50 Ω nominal input / conjugate match to
SPIRIT1
• Low insertion loss
• Low amplitude imbalance
• Low phase imbalance
• Small footprint
Flip-Chip package 6 bumps
Benefits
Figure 1. Pin coordinates (top view)
• Very low profile (< 670 µm)
• High RF performance
• RF BOM and area reduction
$
5;B3
*1'
Applications
%
$17
5;B1
*1'
7;
• 868 MHz and 915 MHz impedance matched
balun filter
• Optimized for SPIRIT1 sub GHz RFIC
&
Description
Figure 2. Application schematic (top view)
C0
The BALF-SPI-01D3 uses STMicroelectronics
IPD technology on non-conductive glass
substrate which optimize RF performances.
1.8 - 3.6 V
MOSI
4
SCLK
17
SPIRIT1
16
VBAT
3
18
VREG
2
MISO
19
GPIO2
20
GPIO1
GPIO0
GPIO3
Digital interface
C13
1
C12
SDN
15
L7
SMPS Ext1
14
SMPS Ext2
13
TX
12
L8
STMicroelectronics BALF-SPI-01D3 is an ultra
miniature balun. The BALF-SPI-01D3 integrates
matching network and harmonics filters. Matching
impedance has been customized for the SPIRIT1
ST transceiver.
C11
L0
6
7
8
9
1.8-3.6 V
RFN
RFP
XOUT
XIN
CSn
VBAT
5
RBIAS
R0
CX
11
Antenna
(50 Ω)
10
BALF-SPI -01D3
XTAL
C9
C10
September 2015
This is information on a product in full production.
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www.st.com
12
Characteristics
1
BALF-SPI-01D3
Characteristics
Table 1. Absolute maximum ratings (limiting values)
Value
Symbol
Parameter
Unit
Min.
PIN
Typ.
Max.
Input power RFIN
VESD
TOP
20
ESD ratings human body model (JESD22-A114-C), all I/O one at a
time while others connected to GND
2000
ESD ratings machine model, all I/O
200
Operating temperature (JESD22-A115-C), all I/O
-40
dBm
V
+85
°C
Table 2. Impedances (Tamb = 25 °C)
Value
Symbol
Parameter
Unit
Min.
ZRX
Nominal differential RX balun impedance
ZTX
Nominal TX filter impedance
ZANT
Antenna impedance
Typ.
Max.
match to SPIRIT1
Ω
50
Ω
Table 3. RF performance (Tamb = 25 °C)
Value
Symbol
F
Parameter
Test condition
Frequency range (bandwidth)
Unit
Min.
Typ.
Max.
779
868
956
MHz
S21RX-ANT
Insertion loss in bandwidth
without mismatch loss (RX balun)
-1.7
-2
dB
S21TX-ANT
Insertion loss in bandwidth
without mismatch loss (TX filter)
-1.4
-2
dB
S11ANT
Input return loss in bandwidth (RX balun)
-23
-15
dB
S11ANT
Input return loss in bandwidth (TX filter)
-15
-12
dB
10
15
°
0.35
0.8
dB
φimb
Output phase imbalance (RX balun)
Aimb
Output amplitude imbalance (RX balun)
Att
2/12
Harmonic levels (TX filter)
5
Attenuation at 2fo
-35
Attenuation at 3fo
-40
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dBm
BALF-SPI-01D3
1.1
Characteristics
RF measurement (Rx balun)
Figure 3. Insertion loss (Tamb = 25 °C)
0.0
Figure 4. Return loss antenna (Tamb = 25 °C)
(dB)
-0
(dB)
-0.5
-5
-1.0
-10
-1.5
-15
-2.0
-20
-2.5
F (MHz)
F (MHz)
-3.0
779
799
819
839
859
879
899
919
939 956
Figure 5. Phase imbalance (Tamb = 25 °C)
20
-25
779
799
819
839
859
879
899
919
939 956
Figure 6. Amplitude imbalance (Tamb = 25 °C)
(dB)
1.0
(deg)
0.8
15
0.6
10
0.4
5
0.2
F (MHz)
0
779
F (MHz)
799
819
839
859
879
899
919
939 956
0.0
779
799
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819
839
859
879
899
919
939 956
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Characteristics
1.2
BALF-SPI-01D3
RF measurement (Tx filter)
Figure 7. Transmission (Tamb = 25 °C)
0.0
Figure 8. Insertion loss (Tamb = 25 °C)
(dB)
-0
-10
-0.5
-20
-1.0
-30
-1.5
-40
-2.0
(dB)
F (MHz)
F (GHz)
-50
0.4
0.6 0.8
1.0 1.2 1.4 1.6 1.8
2.0 2.2
2.4
2.6 2.8
Figure 9. Attenuation (Tamb = 25 °C)
0.0
-2.5
779
799
819
839
859
879
899
919
939 956
Figure 10. Return loss antenna (Tamb = 25 °C)
(dBm)
0
(dB)
3f0
2f0
-10
-5
-20
-10
-30
-15
-40
F (GHz)
-50
1.6
4/12
1.8
2.0
2.2
2.4
2.6
F (MHz)
2.8
-20
779
799
DocID025035 Rev 4
819
839
859
879
899
919
939 956
BALF-SPI-01D3
2
Application information
Application information
Figure 11. Application board EVB (4 layers)
Figure 12. TX output measurements with BALF-SPI-01D3 at 868 MHz
Measured output Power (dBm)
13
12
11
10
9
8
7
6
5
4
3
2
1
Requested Power (dBm)
0
0
1
2
3
4
5
6
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7
8
9
10
11
12
13
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Application information
BALF-SPI-01D3
Figure 13. TX output power measurements over frequency with BALF-SPI-01D3
Measured output Power (dBm)
12
915 - 920 MHz
868 MHz
10
+10 dBm mode
8
6
4
2
0
0 dBm mode
F (MHz)
-2
800
820
840
860
880
900
920
940
960
Figure 14. Harmonic measurements at Pout = 10 dBm with BALF-SPI-01D3
Att (dB)
H2
H3
H4
H5
H6
H7
H8
-30
-40
-50
-60
-70
-80
F (MHz)
-90
0
6/12
1000
2000
3000
4000
5000
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6000
7000
8000
9000
10000
BALF-SPI-01D3
3
Package information
Package information
•
Epoxy meets UL94, V0
•
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Flip-Chip package information
Figure 15. Flip-Chip package outline (top and side view)
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Table 4. Flip-Chip package mechanical data
Parameter
Description
Min.
Typ.
Max.
Unit
0.590
0.650
0.710
mm
A
Bump height + substrate thickness
A1
Bump height
0.200
mm
A2
Substrate thickness
0.400
mm
b
Bump diameter
0.210
0.250
0.290
mm
D
Y dimension of the die
1.950
2.000
1.950
mm
D1
Y pitch
0.960
1.000
1.040
mm
D2
Y pitch2
0.460
0.500
0.540
mm
E
X dimension of the die
1.350
1.400
1.450
mm
E1
X pitch
0.790
0.820
0.850
mm
fD1
Distance from bump to edge of die on Y
axis
0.295
mm
fD2
Distance from bump to edge of die on Y
axis
0.195
mm
ccc
0.05
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mm
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Package information
BALF-SPI-01D3
Figure 16. Recommended balun land pattern
1325 µm
1590 µm
1290 µm
125 µm
1125 µm
RX Ground clearance
130 microns
TX/ANT
Ground clearance
100 microns
Copper pads Æ = 220 µm
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DocID025035 Rev 4
BALF-SPI-01D3
Package information
Figure 17. Footprint - 3 mils stencil -non solder
mask defined
Figure 18. Footprint - 3 mils stencil - solder
mask defined
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mask defined
Figure 20. Footprint - 5 mils stencil - solder
mask defined
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Package information
BALF-SPI-01D3
Figure 21. Marking
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing
location
yww = datecode
x x z
y ww
Figure 22. Flip Chip tape and reel specifications
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More information is available in the STMicroelectronics Application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
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BALF-SPI-01D3
4
Ordering information
Ordering information
Table 5. Ordering information
5
Order code
Marking
Weight
Base Qty
Delivery mode
BALF-SPI-01D3
SJ
3.0 mg
5000
Tape and Reel
Revision history
Table 6. Document revision history
Date
Revision
Changes
27-Aug-2013
1
Initial release
03-Oct-2013
2
Updated document title. Updated Table 1 with JESD22 references.
15-May-2015
3
Updated Figure 1 and Figure 15. Added Figure 19 and Figure 20.
18-Sep-2015
4
Updated Figure 15 and added Table 4.
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BALF-SPI-01D3
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