BALF-2690-02D3 - STMicroelectronics

BALF-2690-02D3
50 ohm nominal input / conjugate match balun for STLC2690,
with integrated harmonic filter
Datasheet − production data
Description
STMicroelectronics BALF-2690-02D3 is a balun
design to transform single ended signal to
differential signals in Bluetooth applications. This
BALF-2690-02D3 has been customized for
STLC2690 Bluetooth transceiver with less than
1.2 dB insertion losses in the bandwidth
(2400 MHz-2500 MHz).
Flip-Chip package 4 bumps
Features
• 50 Ω nominal input / matched output differential
impedance
The BALF-2690-02D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate which optimize RF performance.
Figure 1. Device configuration (top view)
• Integrated harmonic filter
1
• Low insertion loss
• Low amplitude imbalance
2
A
SE
• Low phase imbalance
• Small footprint < 1.54 mm²
GND
B
DIFF
C
Benefits
• Very low profile (< 560 µm after reflow)
• High RF performance
DIFF
• RF BOM and area reduction
Applications
• Bluetooth STLC2690 application
• Mobile phone application
Figure 2. Application schematic
Antenna
STLC2690
BALF-2690-02D3
RF_P
Z IN
RF_N
GND
September 2015
This is information on a product in full production.
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www.st.com
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Characteristics
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BALF-2690-02D3
Characteristics
Table 1. Absolute maximum ratings (limiting values)
Value
Symbol
Parameter
Unit
Min.
PIN
Typ.
Max.
10
13
Input power RFIN
VESD
TOP
ESD rating, human body model (JESD22-A114-C) all I/O one at a time
while others connected to GND
2000
ESD rating, machine model, all I/O
200
Operating temperature range
-40
dBm
V
+85
°C
Table 2. Impedances (Tamb = 25 °C)
Value
Symbol
Parameter
Unit
Min.
ZDIFF
ZSE
Nominal differential impedance
Typ.
Max.
matched to STLC2690
Nominal single-ended impedance
Ω
50
Table 3. RF performance (Tamb = 25 °C)
Value
Symbol
Parameter
Test condition
Unit
Min.
f
Frequency range (bandwidth)
IL
Insertion loss in bandwidth
RL_SE
2/9
2400
Return loss in bandwidth
15
φimb
Output phase imbalance (single ended)
-10
Aimb
Output amplitude imbalance
-1
Common mode rejection (SSC12)
20
CMRR
Typ.
Att2fo
2nd harmonic S21 attenuation
4800-5000 MHz
31
Att3f0
3rd harmonic S21 attenuation
7200-7500 MHz
36
Max.
2500
MHz
+1.2
dB
21
dB
0.5
+10
°
1
dB
dB
dB
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BALF-2690-02D3
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Characteristics
Measurements
Figure 3. Return loss (Tamb = 25 °C)
Figure 4. Insertion loss (Tamb = 25 °C)
(dB)
-15.0
-0.5
(dB)
-0.6
-17.5
-0.7
-0.8
-20.0
-0.9
-22.5
-1.0
-25.0
-1.2
-1.1
-1.3
-27.5
-1.4
F (GHz)
F (GHz)
-30.0
2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
-1.5
2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
Figure 5. Phase imbalance (Tamb = 25 °C)
Figure 6. Amplitude imbalance (Tamb = 25 °C)
(dB)
(deg)
15
1.0
0.9
10
0.8
0.7
5
0.6
0
0.5
0.4
-5
0.3
-10
0.2
F (GHz)
-15
2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
0.0
2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
Figure 7. Transmission: 2nd harmonic (dB)
(Tamb = 25 °C)
Figure 8. Transmission: 3rd harmonic (dB)
(Tamb = 25 °C)
-25.0
(dB)
0.1
F (GHz)
-25.0
-27.5
-27.5
-30.0
-30.0
-32.5
-32.5
-35.0
-35.0
-37.5
-40.0
4.80
(dB)
-37.5
F (GHz)
F (GHz)
4.82 4.84 4.86 4.88 4.90 4.92 4.94 4.96 4.98
-40.0
5.0
7.20
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7.35
7.40
7.45
7.50
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Characteristics
BALF-2690-02D3
Figure 9. Transmission (dB)
0
(dB)
-10
-20
-30
-40
-50
-60
F (GHz)
-70
0
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2
3
4
5
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BALF-2690-02D3
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Package information
Package information
•
Epoxy meets UL94, V0
•
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Flip-Chip package information
Figure 10. Flip-Chip package outline
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Table 4. Flip-Chip package mechanical data
Parameter
Description
Min.
Typ.
Max.
Unit
A
Bump height + substrate thickness
0.570
0.630
0.690
mm
A1
Bump height
0.155
0.205
0.255
mm
A2
Substrate thickness
0.400
mm
b
Bump diameter
0.215
0.255
0.295
mm
D
Y dimension of the die
1.590
1.640
1.690
mm
D1
Y pitch
0.660
mm
D2
Y pitch2
0.540
mm
E
X dimension of the die
E1
X pitch
0.500
mm
fD
Distance from bump to edge of die on Y
axis
0.225
mm
fE
Distance from bump to edge of die on X
axis
0.215
mm
0.890
0.940
ccc
0.990
0.05
$
0.025
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mm
mm
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Package information
BALF-2690-02D3
Figure 11. Footprint
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mask defined
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BALF-2690-02D3
Package information
Figure 16. Marking
Figure 17. Recommended land pattern
800 µm
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing
location
yww = datecode
Width 120 µm
x x z
y ww
Pads diameter 220 µm
(Solder mask
opening 300 µm)
GND clearance 130µm
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Figure 18. Flip Chip tape and reel specifications
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More information is available in the STMicroelectronics application notes:
AN2348 Flip-Chip: “Package description and recommendations for use”
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Ordering information
3
BALF-2690-02D3
Ordering information
Table 5. Ordering information
4
Order code
Marking
Weight
Base Qty
Delivery mode
BALF-2690-02D3
SP
1.81 mg
5000
Tape and Reel
Revision history
Table 6. Document revision history
8/9
Date
Revision
Changes
27-Sep-2013
1
Initial release
19-Dec-2013
2
Added product weight in Table 5 and updated Table 1.
19-Nov-2014
3
Added tape and reel dimensions.
02-Sep-2015
4
Updated Figure 10. Added Figure 12, Figure 13, Figure 14,
Figure 15 and Table 4.
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BALF-2690-02D3
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