NCP6334GEVB NCP6334B/C Evaluation Board User's Manual 3 MHz, 2 A, High Efficiency, Low Ripple, Adjustable Output Voltage, Synchronous Buck Converter http://onsemi.com EVAL BOARD USER’S MANUAL Overview This document is a manual file for a demo board of the NCP6334B/C, which includes demo board schematics, bill of materials, PCB layout, jumper setup, and test procedure. About NCP6334B/C The NCP6334B/C, a family of synchronous buck converters, which is optimized to supply different sub systems of portable applications powered by one cell Li-ion or three cell Alkaline/NiCd/NiMH batteries. The devices are able to deliver up to 2 A on an external adjustable voltage range from 0.6 V to 3.3 V. Operation with 3 MHz switching frequency allows employing small size inductor and capacitors. Input supply voltage feed-forward control is employed to deal with wide input voltage range. Synchronous rectification and automatic PWM/PFM power save mode offer improved system efficiency. The NCP6334B is in a space saving, low profile 2.0 2.0 0.75 mm WDFN−8 package. Typical Applications Features 2.3 V to 5.5 V Input Voltage Range External Adjustable Voltage Up to 2 A Output Current Vo = 0.6V to Vin NCP6334B 0.68uH Cout 22uF * 2 R1 Cfb PGND PVIN SW AVIN Vin = 2.3V to 5.5V Cin 10uF AGND MODE/ PG FB Cellular Phones, Smart Phones, and PDAs Portable Media Players Digital Still Cameras Wireless and DSL Modems USB Powered Devices Point of Load Game and Entertainment System Rpg 1M Power Good NCP6334C 1uH Vo = 0.6V to Vin Cout 10uF R1 Enable EN 3 MHz Switching Frequency Synchronous Rectification Automatic Power Save or External Mode Selection Enable Input Power Good Output Soft Start Over Current Protection Active Discharge When Disabled. Hi−Z Version Available upon Request Thermal Shutdown Protection WDFN−8, 2 2 mm, 0.5 mm Pitch Package Maximum 0.8 mm Height for Super Thin Applications Cfb PVIN SW AVIN Cin 10uF AGND MODE/ PG FB R2 Vin = 2.3V to 5.5V PGND EN Mode Enable R2 (a) Power Good Output (NCP6334B) (b) External Mode Selection (NCP6334C Available upon Request) Figure 1. Typical Application Circuits Semiconductor Components Industries, LLC, 2012 June, 2012 − Rev. 1 1 Publication Order Number: EVBUM2001/D NCP6334GEVB Table 1. PIN DESCRIPTION Pin Name Type 1 PGND Power Ground Power Ground for power, analog blocks. Must be connected to the system ground. Description 2 SW Power Output Switch Power pin connects power transistors to one end of the inductor. 3 AGND Analog Ground Analog Ground analog and digital blocks. Must be connected to the system ground. 4 FB Analog Input Feedback Voltage from the buck converter output. This is the input to the error amplifier. For fixed output devices, this pin is directly connected to the output capacitor; For external adjustable output devices, this pin is connected to the resistor divider network between the output and AGND. 5 EN Digital Input Enable of the IC. High level at this pin enables the device. Low level at this pin disables the device. 6 PG Digital Output PG pin is for NCP6334B with Power Good option. It is open drain output. Low level at this pin indicates the device is not in power good, while high impedance at this pin indicates the device is in power good. 7 AVIN Analog Input Analog Supply. This pin is the analog and the digital supply of the device. An optional 1 mF or larger ceramic capacitor bypasses this input to the ground. This capacitor should be placed as close as possible to this input. 8 PVIN Power Input Power Supply Input. This pin is the power supply of the device. A 10 mF or larger ceramic capacitor must bypass this input to the ground. This capacitor should be placed as close a possible to this input. 9 PAD Exposed Pad Exposed Pad. Must be soldered to system ground to achieve power dissipation performances. This pin is internally unconnected Table 2. MAXIMUM RATINGS Value Rating Input Supply Voltage to GND Switch Node to GND EN, PG to GND FB to GND Symbol Min Max Unit VPVIN, VAVIN −0.3 7.0 V VSW −0.3 7.0 V VEN, VPG −0.3 7.0 V VFB −0.3 2.5 V Human Body Model (HBM) ESD Rating are (Note 1) ESD HBM − 2,000 V Machine Model (MM) ESD Rating are (Note 1) ESD MM − 200 Latch up Current: (Note 2) All pins, except digital pins Digital pins ILU Operating Junction Temperature Range Operating Ambient Temperature Range V mA −100 −10 100 10 TJ −40 125 C TA −40 85 C Storage Temperature Range TSTG −55 150 C Thermal Resistance Junction-to-Top Case (Note 4) RqJC 12 C/W Thermal Resistance Junction-to-Board (Note 4) RqJB 30 C/W Thermal Resistance Junction-to-Ambient (Note 4) RqJA 62 C/W PD 1.6 W MSL 1 − Power Dissipation (Note 5) Moisture Sensitivity Level (Note 6) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22−A114. Machine Model (MM) 200 V per JEDEC standard: JESD22−A115. 2. Latch up Current per JEDEC standard: JESD78 class II. 3. The thermal shutdown set to 150C (typical) avoids potential irreversible damage on the device due to power dissipation. 4. The thermal resistance values are dependent of the PCB heat dissipation. Board used to drive these data was an 80 x 50 mm NCP6334EVB board. It is a multilayer board with 1 once internal power and ground planes and 2−once copper traces on top and bottom of the board. If the copper trances of top and bottom are 1 once too, RqJC = 11C/W, RqJB = 30C/W, and RqJA = 72C/W. 5. .The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected. 6. .Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. http://onsemi.com 2 NCP6334GEVB Electrical Characteristics Schematic of Demo Board For electrical characteristics, please refer to NCP6334B/C datasheet available on website: http://www.onsemi.com. A schematic of NCP6334B/C demo board is shown in Figure 2, which is for a typical application with 1.8 V output voltage. It is flexible to configure the board for both PG devices (NCP6334B) and Mode devices (NCP6334C). Please refer to Jumper Configuration for details. Vin+ Vo+ L 1.0uH J3 Co3 Co2 Co1 1 PGND R1 220k Cfb 15pF AVIN MODE/ PG 6 EN 5 SW 3 AGND 4 FB Ren 8 7 PG 1M Cin1 10uF EN Rpg 1M R2 110k Vo− Vin_sen 2 PVIN Vo+ Mode Vo_sen Rfb 20 DNP DNP 10uF Cin2 100uF IC1 NCP6334B/C Vin− Figure 2. Schematic of NCP6334B/C Demo Board. Table 3. BILL OF MATERIALS OF DEMO BOARD Item Part Reference Description Package Part Number Manufacturer Qty 1 IC1 3 MHz, 2 A, Synchronous Buck Converter WDFN−8 2.0 2.0 0.75 mm NCP63xyB/C ON Semiconductor 1 2 Cin1 MLCC Cap 10 V, 10 mF, X5R, 20% 0805 GRM21BR61A106KE19 muRata 1 3 Cin2 MLCC Cap 6.3 V, 100 mF, X5R, 20% 1210 GRM32ER60J107ME20 muRata 1 4 Co1 MLCC Cap 6.3 V, 10 mF, X5R, 20% 0603 GRM188R60J106ME47 muRata 1 5 L Power Choke 1.0 mH, 30%, 2450 mA, 30 mW 4.0 3.5 1.65 mm LQH44PN1R0NP0 muRata 1 6 Ren, Rpg Thick Film Chip Resistors, 1 MW, 5%, 0.1 W 0603 ERJ3GEYJ105V Panasonic 2 7 R1 Thick Film Chip Resistors, 220kW, 1%, 0.1 W 0603 ERA3AEB224V Panasonic 1 8 R2 Thick Film Chip Resistors, 110kW, 1%, 0.1 W 0603 ERA3AEB114V Panasonic 1 9 Cfb MLCC, 15 pF, 50 V, 0603 0603 ECJ1VC1H150J Panasonic 1 10 Rfb Thick Film Chip Resistors, 20 W, 1%, 0.1 W 0603 ERA3AEB200V Panasonic 1 http://onsemi.com 3 NCP6334GEVB PCB Layout of Demo Board planes (middle1 layer and middle2 layer) and 2-once copper traces on top layer and bottom layer of the board. Figure 3 shows layout information of the board. A 80 50 mm PCB is designed for NCP6334B/C demo board. It is a 4-layer board with 1-once internal ground (a) TopOver Layer (b) Top Layer (c) Middle 1 Layer (d) Middle 2 Layer (e) Bottom Layer Figure 3. PCB Layout of NCP6334B/C Demo Board http://onsemi.com 4 NCP6334GEVB Connections and Jumper Setup jumper setup for both configurations are shown in Figure 4. The default configuration of NCP6334B/C demo board is for NCP6334B devices. There are two main configurations of the demo board for two different devices, which are NCP6334B (PG device) and NCP6334C (Mode device). External connections and Enable by Connecting EN to Vin (Default) Open (Default) Pull PG to Vin (Default) Pull PG to Vo Short Rfb in Normal Operation (Default) Disable by Connecting EN to GND Open and Inject AC Signal (for AC Test) 1.8V Output 2.3V ~ 5.5V Supply To Multi−Meter for Vin Measurement To Multi−Meter for Vo Measurement ( a ) NCP6334B (Default) FPWM Mode Enable by Connecting EN to Vin (Default) AUTO Mode (Default) Open (Default) Short Rfb in Normal Operation (Default) Disable by Connecting EN to GND Open and Inject AC Signal (for AC Test) 1.8V Output 2.3V ~ 5.5V Supply To Multi−Meter for Vin Measurement To Multi−Meter for Vo Measurement ( b ) NCP6334C Figure 4. Connections and Jumper Setup of NCP6334B/C Demo Board http://onsemi.com 5 NCP6334GEVB Test Procedure of Demo Board 7. Set the electronic load to 10 mA and enable its output. Typical input supply current is about 6mA. 8. Monitor the output voltage and SW node signal using an oscilloscope. The converter should operate in DCM with similar waveforms as shown in Figure 5(a). 9. Increase the electronic load to 1.0 A. Typical input supply current is about 565 mA. 10. Monitor the output voltage and SW node signal using the oscilloscope. The converter should operate in CCM with similar waveforms as shown in Figure 5(b). The switching frequency is about 3 MHz. 11. After the test is done, make sure to disable the output of power supply before remove power connectors to protect the device from damage caused by possible high voltage spike in input. 1. Prepare equipments as below list. a. DC power supply b. Electronic load c. Multimeters d. Oscilloscope 2. Check jumper setup to make sure it is a right default configuration for the device under test. 3. Set the power supply to 3.6 V with a current limit higher than 1 A, and then disable the output of the power supply. 4. Connect the power supply to the demo board’s connectors Vin+ and Vin−. 5. Disable output of the electronic load and connect it to the demo board’s connectors Vo+ and Vo−. 6. Enable the output of the power supply and check the 1.8 V output voltage of the demo board. (a) Io = 10 mA (b) Io = 1000 mA Figure 5. Typical Operation Waveforms of NCP6334B/C Demo Board ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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