Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
RoHS
MHS Varistor Series
Description
The Multilayer High–Speed MHS Series is a very-low
capacitance extension to the Littelfuse ML family of
transient voltage surge suppression devices available in an
0402 and 0603–size surface mount chip.
Their small size is ideal for high–density printed circuit
boards, being typically applied to protect intergrated
circuits and other sensitive components. They are
particularly well suited to suppress ESD events including
those specified in IEC 61000-4-2 or other standards used
for Electromagnetic Compliance (EMC) testing.
Size Table
Metric
EIA
1005
0402
1608
0603
The MHS Series is manufactured from semiconducting
ceramics and is supplied in a leadless, surface mount
package. The MHS Series is also compatible with modern
reflow and wave soldering prcesses.
Littelfuse Inc. manufactures other multilayer varistor series
products, see the ML, MLE, MLN and AUML Series data
sheets.
Applications
Features
•
Data, Diagnostic
I/O Ports
•
Mobile
Communications
•
AEC - Q200 compliant
•
RoHS compliant
•
Universal Serial
Bus (USB)
•
Computer/DSP
Products
•
•
Video & Audio Ports
•
•
Portable/HandHeld Products
Industrial Instruments
Including Medical
3pF, 12pF, and 22pF
capacitance versions
suitable for high–speed
data rate lines
•
•
EFT/B rated to IEC
61000-4-4 (Level 4)
•
Low leakage currents
•
-55ºC to +125ºC
operating temp. range
•
Inherently bi-directional
ESD rated to IEC
61000-4-2 (Level 4)
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous
MHS Series
Units
≤ 42
V
Steady State Applied Voltage:
DC Voltage Range (VM(DC)) :
V0402/0603MHS03
V0402/0603MHS12
≤ 18
V
V0402/0603MHS22
≤ 09
V
Operating Ambient Temperature Range (TA)
-55 to +125
O
C
Storage Temperature Range (TSTG)
-55 to +150
O
C
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
MHS Varistor Series
Revision: June 28, 2010
MHS Series
The MHS Series provides protection from ESD and EFT in
high–speed data line and other high frequency applications.
The low capacitance of the MHS Series permits usage
in analog or digital circuits where it will not attenuate or
distort the desired signal or data.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Device Ratings and Specifications
Performance Specifications (25 ºC)
Maximum
Clamping
Voltage At
1A (8X20μs)
Part
Number
Typical
Typical Leakage
Typical
Inductance
Current at Specified Capacitance at
(from Impedance
DC Voltage
1MHz (1V p-p)
Analysis)
3.5V
5.5V
C (Note 4)
L
P
IL
MIN
MAX
Maximum ESD Clamp
Voltage (Note 1)
8kV Contact (Note 2)
Clamp
15kV AIR (Note 3)
Clamp
(Vc)
(V)
(V)
(μA)
(μA)
(pF)
(pF)
(nH)
V0402MHS03N (Note 5)
135
<300
<400
0.5
1.00
2
5
<1.0
V0603MHS03N
135
<300
<400
0.5
1.00
1
6
<1.0
V0402MHS12N (Note 5)
55
<125
<160
0.5
1.00
8
16
<1.0
V0603MHS12N
55
<125
<160
0.5
1.00
8
16
<1.0
30
<125
<160
0.5
1.00
15
29
<1.0
30
<65
<100
0.5
1.00
15
29
<1.0
V0402MHS22N
(Note 5)
V0603MHS22N
NOTES:
1. Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preferred test method).
3. Corona discharge through air (represents actual ESD event).
4. Capacitance may be customized, contact your Littelfuse Sales Representative.
5. V0402MHSxxx (0402 size devices) available as "R" packaging option only. Example: V0402MHS03NR. See Packaging and Tape and Reel sections (last page) for additional information.
Standby Current at Normalized Varistor Voltage and
Temperature
Peak Current and Energy Derating Curve
For applications exceeding 125ºC ambient temperature, the
peak surge current and energy ratings must be reduced as
shown below.
NORMALIZED VARISTOR VOLTAGE (V)
1.2
PERCENT OF RATED VALUE
100
80
60
40
1.0
0.8
25O
0.6
85O
0.4
125O
0.2
0.0
20
0.0001
0.001
0.01
50
60
70
80
90
100
110
120
0.1
1
CURRENT (mA)
Figure 2
0
-55
130 140 150
AMBIENT TEMPERATURE ( oC)
Figure 1
Insertion Loss (S21) Characteristics
Nominal Voltage Stability to Multiple ESD Impulses
(8kV Contact Discharges per IEC 61000-4-2)
0
INSERTION LOSS (dB)
NOMINAL VOLTAGE AT 1mADC
60
V0402MHS03
V0603MHS03
50
40
30
-20
V0402MHS22
V0603MHS22
-30
V0402MHS22
V0603MHS22
10
Figure 3
V0402MHS03
V0603MHS03
V0402MHS12
V0603MHS12
20
0
V0402MHS12
V0603MHS12
-10
10
Figure 4
1
10
100
1000
100
1000
10000
FREQUENCY (MHz)
10000
Number of Pulses
©2010 Littelfuse, Inc.
MHS Varistor Series
Revision: June 28, 2010
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Device Characteristics
Speed of Response
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100μA, typically 25μA;
for 0402 size below 20μA, typically 5μA.
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZNO dielectric material is less
than 1ns and the MLE can clamp very fast dV/dT events
such as ESD. Additionally, in “real world” applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
Typical Temperature Dependance of the Characteristic
Curve in the Leakage Region
Multilayer Internal Construction
METAL
ELECTRODES
METAL END
TERMINATION
DEPLETION
25
10%
1E -9
Figure 5
1E -8
o
REGION
50o 75o
1E -7
100o 125 oC
1E -6
1E -5
1E -4
1E -3
DEPLETION
1E -2
Figure 6
SUPPRESSOR CURRENT (ADC)
REGION
GRAINS
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
The recommended solder for the MHS suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
230
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MHS chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Figure 7
Wave Solder Profile
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Figure 8
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
MHS Varistor Series
Revision: June 28, 2010
MHS Series
FIRED CERAMIC
DIELECTRIC
VNOM VALUE AT 25 oC (%)
SUPPRESSOR VOLTAGE IN PERCENT OF
100%
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
Lead–free Re-flow Profile
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
60 - 150 SEC
> 217˚C
PREHEAT ZONE
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
5.0
6.0
7.0
Figure 10
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS
CHIP LAYOUT DIMENSIONS
E
D
L
W
Note: Avoid metal runs in this area, parts are
not recommended for use in applications using
Silver (Ag) epoxy paste.
Dimension
0402 Size
IN
0603 Size
MM
IN
MM
A
0.067
1.700
0.100
2.540
B
0.020
0.510
0.030
0.760
C
0.024
0.610
0.035
0.890
D (max.)
0.024
0.600
0.040
1.000
E
0.10 +/- 0.006
0.25 +/- 0.15
0.015 +/- 0.008
0.4 +/- 0.2
L
0.039 +/- 0.004
1.00 +/- 0.10
0.063 +/- 0.006
1.6 +/- 0.15
W
0.020 +/- 0.004
0.50 +/- 0.10
0.032 +/- 0.006
0.8 +/- 0.15
©2010 Littelfuse, Inc.
MHS Varistor Series
Revision: June 28, 2010
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Part Numbering System
V 0402 MHS 03 N R
PACKING OPTIONS (See quantities in Packaging section)
T = (0603 device only)13in (330mm) Diameter Reel, Plastic Carrier Tape
H = (0603 device only) 7in (178mm) Diameter Reel, Plastic Carrier Tape
R = (available for 0402 and 0603 devices) 7in (178mm) Diameter Reel, Paper Carrier Tape
DEVICE FAMILY
Littelfuse TVSS Device
DEVICE SIZE
0402 = .04 inch x .02 inch
(1.0 mm x 0.5 mm)
0603 = .063 inch x .031 inch
(1.6 mm x 0.8 mm)
END TERMINATION OPTION
N = Nickel Barrier (Ni/Sn)
CAPACITANCE DESIGNATION
03 = 3pF
12 = 12pF
22 = 22pF
SERIES DESIGNATOR
MHS = Multilayer Hi-Speed
Packaging*
Device Size
7 Inch Reel
("H" Option)
MHS Series
Quantity
13 Inch Reel
("T" Option)
7 Inch Reel
("R" Option)
0603
10,000
2,500
4,000
0402
not available
not available
10,000
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
Tape and Reel Specifications
D0
T
P0
P2
E
F
K0
W
B0
T1
D1
P1
Symbol
A0
Dimensions in Millimeters
Description
0402 Size
0603 Size
A0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
8 -/+ 0.2
8 -/+ 0.3
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 -/+.05
3.5 -/+.05
1.75 -/+ 0.1
1.75 -/+ 0.1
2 -/+ 0.05
4 -/+ 0.1
E
Distance Between Drive Hole Centers and Tape Edge
P1
Distance Between Cavity Centers
P2
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
2 -/+ 0.1
2 -/+ 0.1
P0
Axial Drive Distance Between Drive Hole Centers
4 -/+ 0.1
4 -/+ 0.1
D0
Drive Hole Diameter
1.55 -/+ 0.05
1.55 -/+ 0.05
D1
Diameter of Cavity Piercing
N/A
1.05 -/+ 0.05
T1
Top Tape Thickness
0.1 Max
0.1 Max
T
Nominal Carrier Tape Thickness
1.1
1.1
Notes:
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
MHS Varistor Series
Revision: June 28, 2010