Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
RoHS
MHS Varistor Series
Description
The Multilayer High–Speed MHS Series is a very-low
capacitance extension to the Littelfuse ML family of
transient voltage surge suppression devices available in an
0402 and 0603–size surface mount chip.
Their small size is ideal for high–density printed circuit
boards, being typically applied to protect intergrated
circuits and other sensitive components. They are
particularly well suited to suppress ESD events including
those specified in IEC 61000-4-2 or other standards used
for Electromagnetic Compliance (EMC) testing.
Size Table
Metric
EIA
0402
1608
0603
The MHS Series is manufactured from semiconducting
ceramics and is supplied in a leadless, surface mount
package. The MHS Series is also compatible with modern
reflow and wave soldering prcesses.
Littelfuse Inc. manufactures other multilayer varistor series
products, see the ML, MLE, MLN and AUML Series data
sheets.
Applications
Features
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Including Medical
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capacitance versions
suitable for high–speed
data rate lines
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61000-4-4 (Level 4)
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operating temp. range
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61000-4-2 (Level 4)
Absolute Maximum Ratings
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Continuous
MHS Series
Units
≤ 42
7
7.)4
≤ 18
7
7.)4
≤ 09
7
Steady State Applied Voltage:
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©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
25
Revision: July 16, 2009
UP
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0
C
MHS Varistor Series
MHS Series
The MHS Series provides protection from ESD and EFT in
high–speed data line and other high frequency applications.
The low capacitance of the MHS Series permits usage
in analog or digital circuits where it will not attenuate or
distort the desired signal or data.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Device Ratings and Specifications
Performance Specifications (25 ºC)
Part
Number
Typical Leakage
Current at Specified
DC Voltage
Maximum ESD Clamp
Voltage (Note 1)
Maximum
Clamping
Voltage At
1A (8X20μs)
8kV Contact (Note 2)
Clamp
Typical
Capacitance at
1MHz (1V p-p)
Typical
Inductance
(from Impedance
Analysis)
L
15kV AIR (Note 3)
Clamp
3.5V
P
5.5V
IL
C (Note 4)
MIN
MAX
(Vc)
(V)
(V)
(μA)
(μA)
(pF)
(pF)
(nH)
7.)4/
<300
<400
1.00
1
6 /PUF
<1.0
7.)4/
<300
<400
1.00
1
6
<1.0
7.)4/
<160
1.00
8
16
<1.0
7.)4/
<160
1.00
8
16
<1.0
7.)4/
30
<160
1.00
29
<1.0
7.)4/
30
<100
1.00
29
<1.0
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2. Direct discharge to device terminals (IEC preferred test method).
3. Corona discharge through air (represents actual ESD event).
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Standby Current at Normalized Varistor Voltage and
Temperature
Peak Current and Energy Derating Curve
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peak surge current and energy ratings must be reduced as
shown below.
NORMALIZED VARISTOR VOLTAGE (V)
1.2
PERCENT OF RATED VALUE
100
80
60
40
1.0
0.8
25O
0.6
85O
0.4
125O
0.2
0.0
20
0.0001
0.001
0.01
50
60
70
80
90
100
110
120
0.1
1
CURRENT (mA)
Figure 2
0
-55
130 140 150
AMBIENT TEMPERATURE ( oC)
Figure 1
Insertion Loss (S21) Characteristics
Nominal Voltage Stability to Multiple ESD Impulses
(8kV Contact Discharges per IEC 61000-4-2)
0
INSERTION LOSS (dB)
NOMINAL VOLTAGE AT 1mADC
60
V0402MHS03
V0603MHS03
50
40
30
V0402MHS22
V0603MHS22
10
10
MHS Varistor Series
-20
-30
V0402MHS22
V0603MHS22
Figure 3
V0402MHS03
V0603MHS03
V0402MHS12
V0603MHS12
20
0
V0402MHS12
V0603MHS12
-10
Figure 4
1
10
100
1000
100
1000
10000
FREQUENCY (MHz)
10000
Number of Pulses
26
Revision: July 16, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Device Characteristics
Speed of Response
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transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100μ"UZQJDBMMZμA;
for 0402 size below 20μ"UZQJDBMMZμA.
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZN0EJFMFDUSJDNBUFSJBMJTMFTT
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such as ESD. Additionally, in “real world” applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
Typical Temperature Dependance of the Characteristic
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Multilayer Internal Construction
METAL
ELECTRODES
METAL END
TERMINATION
DEPLETION
25
10%
1E -9
Figure 5
1E -8
o
REGION
50o 75o
1E -7
100o 125 oC
1E -6
1E -5
1E -4
1E -3
DEPLETION
1E -2
Figure 6
SUPPRESSOR CURRENT (ADC)
REGION
GRAINS
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
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and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
The recommended solder for the MHS suppressor is
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4O1C
PS4O1C
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230
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MHS chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
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peak temperature is essential to minimize thermal shock.
Figure 7
Wave Solder Profile
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still necessary to ensure that any further thermal shocks
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printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
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Figure 8
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
27
Revision: July 16, 2009
MHS Varistor Series
MHS Series
FIRED CERAMIC
DIELECTRIC
VNOM VALUE AT 25 oC (%)
SUPPRESSOR VOLTAGE IN PERCENT OF
100%
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Lead–free (Pb-free) Soldering Recommendations
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optimum Lead–free solder performance.
Lead–free Re-flow Profile
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flux, but there is a wide selection of pastes and fluxes
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compatible.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
The reflow profile must be constrained by the maximums
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TPMEFSJOHUIF8BWF4PMEFS1SPmMFTUJMMBQQMJFT
60 - 150 SEC
> 217˚C
PREHEAT ZONE
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
5.0
6.0
7.0
Figure 10
Product Dimensions (mm)
1"%-":065%&.&/4*0/4
$)*1-":065%*.&/4*0/4
E
D
L
W
Note: Avoid metal runs in this area, parts are
not recommended for use in applications using
Silver (Ag) epoxy paste.
Dimension
0402 Size
IN
0603 Size
MM
IN
MM
A
0.100
B
0.020
0.030
C
0.024
0.610
0.890
D (max.)
0.024
0.600
0.040
1.000
E
L
W
MHS Varistor Series
28
Revision: July 16, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Part Numbering System
V 0402 MHS 03 N H
PACKING OPTIONS (See quantities in Packaging section)
T: 13in (330mm) Diameter Reel, Plastic Carrier Tape (0603)
H: 7in (178mm) Diameter Reel, Plastic Carrier Tape
R: 7in (178mm) Diameter Reel, Paper Carrier Tape
DEVICE FAMILY
Littelfuse TVSS Device
DEVICE SIZE
i.e. 40Mil x 20Mil
(1.0mm x 0.5mm)
END TERMINATION OPTION
N: Nickel Barrier (Ni/Sn)
SERIES DESIGNATOR
CAPACITANCE DESIGNATION
03 = 3pF
12 = 12pF
22 = 22pF
Multilayer Hi-Speed
Packaging*
Device Size
7 Inch Reel
("H" Option)
0603
10,000
4,000
0402
/"
/"
10,000
MHS Series
Quantity
13 Inch Reel
("T" Option)
7 Inch Reel
("R" Option)
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Tape and Reel Specifications
D0
T
P0
P2
E
F
K0
W
B0
T1
D1
P1
Symbol
A0
Dimensions in Millimeters
Description
0402 Size
0603 Size
A0
Width of Cavity
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B0
Length of Cavity
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K0
Depth of Cavity
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W
Width of Tape
F
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E
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P1
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P2
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P0
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D0
Drive Hole Diameter
D1
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T1
Top Tape Thickness
0.1 Max
0.1 Max
T
Nominal Carrier Tape Thickness
1.1
1.1
Notes:
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©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
29
Revision: July 16, 2009
MHS Varistor Series