PD - 96208 Applications l High Frequency Synchronous Buck Converters for Computer Processor Power l High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use IRLR8256PbF IRLU8256PbF HEXFET® Power MOSFET VDSS RDS(on) max 5.7m: 25V Qg 10nC D Benefits l Very Low RDS(on) at 4.5V VGS l Ultra-Low Gate Impedance l Fully Characterized Avalanche Voltage and Current l Lead-Free l RoHS compliant S S D G G D-Pak I-Pak IRLR8256PbF IRLU8256PbF G D S Gate Drain Source Absolute Maximum Ratings Parameter Max. VDS Drain-to-Source Voltage VGS Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V ± 20 81 Continuous Drain Current, VGS @ 10V Pulsed Drain Current 57 ID @ TC = 25°C ID @ TC = 100°C IDM c PD @TC = 25°C Maximum Power Dissipation PD @TC = 100°C Maximum Power Dissipation TJ Linear Derating Factor Operating Junction and TSTG Storage Temperature Range Units 25 V f f A 325 g g 63 W 31 0.42 -55 to + 175 W/°C °C Soldering Temperature, for 10 seconds 300 (1.6mm from case) Thermal Resistance Parameter h RθJC Junction-to-Case RθJA Junction-to-Ambient (PCB Mount) RθJA Junction-to-Ambient g Typ. Max. ––– 2.4 ––– 50 ––– 110 Units °C/W ORDERING INFORMATION: See detailed ordering and shipping information on the last page of this data sheet. Notes through are on page 11 www.irf.com 1 12/19/08 IRLR/U8256PbF Static @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions BVDSS ∆ΒVDSS/∆TJ Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient 25 ––– ––– 18 ––– ––– RDS(on) Static Drain-to-Source On-Resistance ––– ––– 4.2 6.7 5.7 8.5 VGS(th) ∆VGS(th)/∆TJ Gate Threshold Voltage Gate Threshold Voltage Coefficient 1.35 ––– 1.8 -7.2 2.35 V VDS = VGS, ID = 25µA ––– mV/°C IDSS Drain-to-Source Leakage Current ––– ––– ––– ––– 1.0 150 µA VDS = 20V, VGS = 0V VDS = 20V, VGS = 0V, TJ = 125°C IGSS Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage ––– ––– ––– ––– 100 -100 nA VGS = 20V VGS = -20V gfs Qg Forward Transconductance Total Gate Charge 81 ––– ––– 10 ––– 15 S VDS = 13V, ID = 20A Qgs1 Qgs2 Pre-Vth Gate-to-Source Charge Post-Vth Gate-to-Source Charge ––– ––– 2.3 1.6 ––– ––– nC VDS = 13V VGS = 4.5V Qgd Qgodr Gate-to-Drain Charge Gate Charge Overdrive Switch Charge (Qgs2 + Qgd) ––– ––– 3.6 2.6 ––– ––– Output Charge ––– ––– 5.1 9.0 ––– ––– RG td(on) Gate Resistance Turn-On Delay Time ––– ––– 2.5 9.7 3.9 ––– tr td(off) Rise Time Turn-Off Delay Time ––– ––– 46 12 ––– ––– Fall Time Input Capacitance ––– ––– 8.5 1470 ––– ––– Output Capacitance Reverse Transfer Capacitance ––– ––– 453 185 ––– ––– Qsw Qoss tf Ciss Coss Crss V VGS = 0V, ID = 250µA mV/°C Reference to 25°C, ID = 1mA mΩ VGS = 10V, ID = 25A VGS = 4.5V, ID = 20A e e ID = 20A See Fig. 16 nC VDS = 16V, VGS = 0V Ω VDD = 13V, VGS = 4.5V ns ID = 20A e RG = 1.8Ω See Fig. 14 VGS = 0V pF VDS = 13V ƒ = 1.0MHz Avalanche Characteristics Parameter EAS IAR Single Pulse Avalanche Energy Avalanche Current EAR Repetitive Avalanche Energy c d c Typ. ––– ––– Max. 86 20 Units mJ A ––– 6.3 mJ Diode Characteristics Parameter IS Continuous Source Current ISM (Body Diode) Pulsed Source Current VSD (Body Diode) Diode Forward Voltage trr Qrr Reverse Recovery Time Reverse Recovery Charge ton Forward Turn-On Time 2 c Min. Typ. Max. Units ––– ––– f Conditions MOSFET symbol 81 A showing the integral reverse ––– ––– 325 ––– ––– 1.0 V p-n junction diode. TJ = 25°C, IS = 20A, VGS = 0V ––– ––– 19 17 29 26 ns nC TJ = 25°C, IF = 20A, VDD = 13V di/dt = 300A/µs e e Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) www.irf.com IRLR/U8256PbF 1000 1000 100 BOTTOM 10 1 TOP ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) TOP VGS 10V 4.5V 3.7V 3.5V 3.3V 3.0V 2.7V 2.5V 100 BOTTOM 10 2.5V ≤60µs PULSE WIDTH 2.5V ≤60µs PULSE WIDTH Tj = 25°C 0.1 0.1 1 10 Tj = 175°C 1 100 0.1 V DS, Drain-to-Source Voltage (V) 1 10 100 V DS, Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 1000 2.0 RDS(on) , Drain-to-Source On Resistance (Normalized) ID, Drain-to-Source Current (A) VGS 10V 4.5V 3.7V 3.5V 3.3V 3.0V 2.7V 2.5V 100 T J = 175°C 10 T J = 25°C 1 VDS = 15V ≤60µs PULSE WIDTH 0.1 ID = 25A VGS = 10V 1.5 1.0 0.5 1 2 3 4 5 6 7 VGS, Gate-to-Source Voltage (V) Fig 3. Typical Transfer Characteristics www.irf.com 8 -60 -40 -20 0 20 40 60 80 100120140160180 TJ , Junction Temperature (°C) Fig 4. Normalized On-Resistance vs. Temperature 3 IRLR/U8256PbF 10000 5.0 VGS = 0V, f = 1 MHZ C iss = C gs + C gd, C ds SHORTED C rss = C gd VGS, Gate-to-Source Voltage (V) ID= 20A C, Capacitance (pF) C oss = C ds + C gd Ciss 1000 Coss Crss VDS= 20V VDS= 13V 4.0 3.0 2.0 1.0 0.0 100 1 10 0 100 1000 3 4 5 6 7 8 9 10 11 12 13 1000 ID, Drain-to-Source Current (A) ISD, Reverse Drain Current (A) 2 Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage Fig 5. Typical Capacitance vs. Drain-to-Source Voltage 100 TJ = 175°C 10 T J = 25°C 1 VGS = 0V 0.1 0.0 0.5 1.0 1.5 2.0 VSD, Source-to-Drain Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage 4 1 QG, Total Gate Charge (nC) VDS, Drain-to-Source Voltage (V) 2.5 OPERATION IN THIS AREA LIMITED BY R DS(on) 100µsec 100 1msec 10msec 10 Tc = 25°C Tj = 175°C Single Pulse 1 0 1 10 100 VDS, Drain-to-Source Voltage (V) Fig 8. Maximum Safe Operating Area www.irf.com IRLR/U8256PbF 90 2.5 Limited By Package VGS(th), Gate threshold Voltage (V) 80 ID, Drain Current (A) 70 60 50 40 30 20 10 0 2.0 1.5 ID = 25µA 1.0 0.5 25 50 75 100 125 150 175 -75 -50 -25 T C , Case Temperature (°C) 0 25 50 75 100 125 150 175 T J , Temperature ( °C ) Fig 9. Maximum Drain Current vs. Case Temperature Fig 10. Threshold Voltage vs. Temperature Thermal Response ( Z thJC ) °C/W 10 D = 0.50 1 0.20 0.10 0.05 0.1 0.02 0.01 τJ 0.01 R1 R1 τJ τ1 R2 R2 R3 R3 τC τ1 τ2 τ2 τ3 τ3 Ci= τi/Ri Ci i/Ri 1E-005 0.0001 τ4 τ4 Ri (°C/W) τi (sec) 0.04252 0.000007 0.57953 0.000109 1.17480 0.001003 τ 0.60472 0.005976 Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc SINGLE PULSE ( THERMAL RESPONSE ) 0.001 1E-006 R4 R4 0.001 0.01 0.1 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com 5 IRLR/U8256PbF 15V + V - DD IAS A 0.01Ω tp Fig 12a. Unclamped Inductive Test Circuit V(BR)DSS tp EAS , Single Pulse Avalanche Energy (mJ) D.U.T RG 20V VGS DRIVER L VDS 400 ID TOP 5.57A 8.50A BOTTOM 20A 350 300 250 200 150 100 50 0 25 50 75 100 125 150 175 Starting T J , Junction Temperature (°C) Fig 12c. Maximum Avalanche Energy vs. Drain Current I AS Fig 12b. Unclamped Inductive Waveforms V DS V GS RG Current Regulator Same Type as D.U.T. D.U.T. + -V DD VGS Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % 50KΩ 12V RD .2µF Fig 14a. Switching Time Test Circuit .3µF D.U.T. + V - DS VDS 90% VGS 3mA IG ID Current Sampling Resistors 10% VGS td(on) Fig 13. Gate Charge Test Circuit 6 tr t d(off) tf Fig 14b. Switching Time Waveforms www.irf.com IRLR/U8256PbF D.U.T Driver Gate Drive P.W. + + - - * D.U.T. ISD Waveform Reverse Recovery Current + RG • • • • dv/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test V DD P.W. Period VGS=10V Circuit Layout Considerations • Low Stray Inductance • Ground Plane • Low Leakage Inductance Current Transformer - D= Period + Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt Re-Applied Voltage - Body Diode VDD Forward Drop Inductor Curent Ripple ≤ 5% ISD * VGS = 5V for Logic Level Devices Fig 15. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs Id Vds Vgs Vgs(th) Qgodr Qgd Qgs2 Qgs1 Fig 16. Gate Charge Waveform www.irf.com 7 IRLR/U8256PbF D-Pak (TO-252AA) Package Outline Dimensions are shown in millimeters (inches) D-Pak (TO-252AA) Part Marking Information (;$03/( 7+,6,6$1,5)5 3$57180%(5 :,7+$66(0%/< ,17(51$7,21$/ /27&2'( ,5)5 $ 5(&7,),(5 $66(0%/('21:: /2*2 ,17+($66(0%/</,1($ '$7(&2'( <($5 :((. /,1($ 1RWH3LQDVVHPEO\OLQHSRVLWLRQ $66(0%/< LQGLFDWHV/HDG)UHH /27&2'( 3LQDVVHPEO\OLQHSRVLWLRQLQGLFDWHV /HDG)UHHTXDOLILFDWLRQWRWKHFRQVXPHUOHYHO 25 3$57180%(5 ,17(51$7,21$/ 5(&7,),(5 ,5)5 '$7(&2'( 3 '(6,*1$7(6/($')5(( 3 '(6,*1$7(6/($')5(( /2*2 352'8&7237,21$/ 352'8&748$/,),('727+( $66(0%/< &21680(5/(9(/237,21$/ /27&2'( <($5 :((. $ $66(0%/<6,7(&2'( Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 8 www.irf.com IRLR/U8256PbF I-Pak (TO-251AA) Package Outline Dimensions are shown in millimeters (inches) I-Pak (TO-251AA) Part Marking Information (;$03/( 7+,6,6$1,5)8 :,7+$66(0%/< /27&2'( $66(0%/('21:: ,17+($66(0%/</,1($ 1RWH3LQDVVHPEO\OLQHSRVLWLRQ LQGLFDWHV/HDG)UHH ,17(51$7,21$/ 5(&7,),(5 /2*2 3$57180%(5 ,5)8 $ $66(0%/< /27&2'( '$7(&2'( <($5 :((. /,1($ 25 ,17(51$7,21$/ 5(&7,),(5 /2*2 3$57180%(5 ,5)8 $66(0%/< /27&2'( '$7(&2'( 3 '(6,*1$7(6/($')5(( 352'8&7237,21$/ <($5 :((. $ $66(0%/<6,7(&2'( Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ www.irf.com 9 IRLR/U8256PbF D-Pak (TO-252AA) Tape & Reel Information Dimensions are shown in millimeters (inches) TR TRR 16.3 ( .641 ) 15.7 ( .619 ) 12.1 ( .476 ) 11.9 ( .469 ) FEED DIRECTION TRL 16.3 ( .641 ) 15.7 ( .619 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 13 INCH 16 mm NOTES : 1. OUTLINE CONFORMS TO EIA-481. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 10 www.irf.com IRLR/U8256PbF Orderable part number Package Type IRLR8256PBF IRLR8256TRPBF D-PAK D-PAK IRLR8256PBF I-PAK Standard Pack Form Quantity Tube/Bulk 75 Tape and Reel 2000 Tube/Bulk Note 75 Qualification Information† Qualification level Industrial †† ††† (per JEDEC JESD47F guidelines) Comments: This family of products has passed JEDEC’s Industrial qualification. IR’s Consumer qualification level is granted by extension of the higher Industrial level. Moisture Sensitivity Level D-PAK MSL1 (per JEDEC J-STD-020D†††) Not applicable I-PAK RoHS Compliant Yes † Qualification standards can be found at International Rectifier’s web site http://www.irf.com/product-info/reliability †† Higher qualification ratings may be available should the user have such requirements. Please contact your International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ ††† Applicable version of JEDEC standard at the time of product release. Notes: Repetitive rating; pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 0.43mH, RG = 25Ω, IAS = 20A. Pulse width ≤ 400µs; duty cycle ≤ 2%. Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 50A. When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. Rθ is measured at TJ approximately 90°C. Data and specifications subject to change without notice. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-790 Visit us at www.irf.com for sales contact information.12/2008 www.irf.com 11