INFINEON BSC440N10NS3G

BSC440N10NS3 G
OptiMOSTM3 Power-Transistor
Product Summary
Features
• Very low gate charge for high frequency applications
• Optimized for dc-dc conversion
VDS
100
V
RDS(on),max
44
mW
ID
18
A
• N-channel, normal level
• Excellent gate charge x R DS(on) product (FOM)
PG-TDSON-8
• Very low on-resistance R DS(on)
• 150 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC1) for target application
• Halogen-free according to IEC61249-2-21
Type
Package
Marking
BSC440N10NS3 G
PG-TDSON-8
440N10NS
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C
18
T C=100 °C
11
T A=25 °C,
R thJA=50 K/W 2)
5.3
Unit
A
Pulsed drain current3)
I D,pulse
T C=25 °C
72
Avalanche energy, single pulse
E AS
I D=12 A, R GS=25 W
18
mJ
Gate source voltage
V GS
±20
V
Power dissipation
P tot
29
W
Operating and storage temperature
T j, T stg
-55 ... 150
°C
T C=25 °C
IEC climatic category; DIN IEC 68-1
Rev. 2.4
55/150/56
page 1
2009-10-30
BSC440N10NS3 G
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
4.3
-
-
50
100
-
-
Thermal characteristics
Thermal resistance, junction - case
R thJC
Thermal resistance,
junction - ambient
R thJA
6 cm2 cooling area2)
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
Gate threshold voltage
V GS(th)
V DS=V GS, I D=12 µA
2
2.7
3.5
Zero gate voltage drain current
I DSS
V DS=100 V, V GS=0 V,
T j=25 °C
-
0.01
1
V DS=100 V, V GS=0 V,
T j=125 °C
-
10
100
V
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
1
100
nA
Drain-source on-state resistance
R DS(on)
V GS=10 V, I D=12 A
-
38
44
mW
V GS=6 V, I D=6 A
-
48.3
86
-
0.8
-
W
8
15
-
S
Gate resistance
RG
Transconductance
g fs
1)
|V DS|>2|I D|R DS(on)max,
I D=12 A
J-STD20 and JESD22
2)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
3)
see figure 3
Rev. 2.4
page 2
2009-10-30
BSC440N10NS3 G
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
610
810
-
120
160
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
C rss
-
6
-
Turn-on delay time
t d(on)
-
9
-
Rise time
tr
-
3
-
Turn-off delay time
t d(off)
-
13
-
Fall time
tf
-
3
-
Gate to source charge
Q gs
-
2.7
-
Gate to drain charge
Q gd
-
1.3
-
Switching charge
Q sw
-
2.2
-
Gate charge total
Qg
-
8.1
10.8
Gate plateau voltage
V plateau
-
4.5
-
Output charge
Q oss
-
12
16
nC
-
-
18
A
-
-
72
-
0.9
1.2
V
-
44
-
ns
-
61
-
nC
V GS=0 V, V DS=50 V,
f =1 MHz
V DD=50 V, V GS=10 V,
I D=6 A, R G=1.6 W
pF
ns
Gate Charge Characteristics4)
V DD=50 V, I D=6 A,
V GS=0 to 10 V
V DD=50 V, V GS=0 V
nC
V
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
4)
T C=25 °C
V GS=0 V, I F=18 A,
T j=25 °C
V R=50 V, I F=6 A,
di F/dt =100 A/µs
See figure 16 for gate charge parameter definition
Rev. 2.4
page 3
2009-10-30
BSC440N10NS3 G
2 Drain current
P tot=f(T C)
I D=f(T C); V GS≥10 V
40
20
30
15
ID [A]
Ptot [W]
1 Power dissipation
20
10
10
5
0
0
0
40
80
120
160
0
40
80
TC [°C]
120
160
TC [°C]
3 Safe operating area
4 Max. transient thermal impedance
I D=f(V DS); T C=25 °C; D =0
Z thJC=f(t p)
parameter: t p
parameter: D =t p/T
103
101
102
100 ns
0.5
ZthJC [K/W]
1 µs
ID [A]
10 µs
101
100 µs
0.2
100
0.1
1 ms
0.05
DC
0.02
100
0.01
single pulse
10-1
10-1
10-1
100
101
102
103
VDS [V]
Rev. 2.4
tp [s]
page 4
2009-10-30
BSC440N10NS3 G
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
50
70
5V
60
40
5.5 V
6V
10 V
50
30
RDS(on) [mW]
7V
ID [A]
6V
20
5.5 V
7V
40
10 V
30
20
5V
10
10
4.5 V
0
0
0
1
2
3
0
10
20
VDS [V]
30
40
50
60
20
25
30
ID [A]
7 Typ. transfer characteristics
8 Typ. forward transconductance
I D=f(V GS); |V DS|>2|I D|R DS(on)max
g fs=f(I D); T j=25 °C
parameter: T j
40
30
25
30
gfs [S]
ID [A]
20
20
15
10
10
5
150 °C
25 °C
0
0
0
2
4
6
VGS [V]
Rev. 2.4
0
5
10
15
ID [A]
page 5
2009-10-30
BSC440N10NS3 G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R DS(on)=f(T j); I D=12 A; V GS=10 V
V GS(th)=f(T j); V GS=V DS
parameter: I D
90
4
80
3.5
70
3
120 µA
2.5
98 %
50
VGS(th) [V]
RDS(on) [mW]
60
typ
40
12 µA
2
1.5
30
1
20
0.5
10
0
0
-60
-20
20
60
100
140
180
-60
-20
20
Tj [°C]
60
100
140
180
Tj [°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
C =f(V DS); V GS=0 V; f =1 MHz
I F=f(V SD)
parameter: T j
104
1000
103
Ciss
100
IF [A]
C [pF]
Coss
102
25 °C
150 °C
10
101
150 °C, 98%
Crss
25 °C, 98%
100
1
0
20
40
60
80
VDS [V]
Rev. 2.4
0
0.5
1
1.5
2
VSD [V]
page 6
2009-10-30
BSC440N10NS3 G
13 Avalanche characteristics
14 Typ. gate charge
I AS=f(t AV); R GS=25 W
V GS=f(Q gate); I D=6 A pulsed
parameter: T j(start)
parameter: V DD
100
10
80 V
8
50 V
10
VGS [V]
IAS [A]
6
25 °C
20 V
4
100 °C
125 °C
2
1
0
0.1
1
10
100
1000
0
2
4
6
8
Qgate [nC]
tAV [µs]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V BR(DSS)=f(T j); I D=1 mA
110
V GS
Qg
VBR(DSS) [V]
105
100
V gs(th)
95
Q g(th)
Q sw
Q gs
90
-60
-20
20
60
100
140
Q gate
Q gd
180
Tj [°C]
Rev. 2.4
page 7
2009-10-30
BSC440N10NS3 G
Package Outline: PG-TDSON-8
Rev. 2.4
page 8
2009-10-30
BSC440N10NS3 G
Dimensions in mm
Rev. 2.4
page 9
2009-10-30
BSC440N10NS3 G
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
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The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev. 2.4
page 10
2009-10-30