Silicon Spreading Resistance Temperature Sensor in Miniature Leaded Plastic Package KT 110, KT 210, KTY 11, KTY 21 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Miniature plastic package for very small thermal time constants • Fast response • High reliability due to multilayer gold contacts • n-conducting silicon crystal TO-92 Mini • Polarity independent due to symmetrical construction • Available selected in ± 1% tolerance groups (KTY-series) Type Marking Ordering Code KT 110 T-1 Q62705-K332 KTY 11-5 T-5 Q62705-K245 KTY 11-6 T-6 Q62705-K246 KTY 11-7 T-7 Q62705-K247 KT 210 N-1 Q62705-K334 KTY 21-5 N-5 Q62705-K258 KTY 21-6 N-6 Q62705-K259 KTY 21-7 N-7 Q62705-K260 Pin Configuration 1 2 electrical contact electrical contact Package TO-92 Mini Absolute Maximum Ratings Parameter Symbol Maximum operating voltage 1) TA ≤ 25 ˚C, t ≤ 10 ms Vopmax Maximum operating current Iopmax Iopp Peak operating current TA ≤ 25 ˚C, t ≤ 10 ms Operating temperature range Storage temperature range 1) Top Tstg KT 110 KTY 11 KT 210 KTY 21 25 Unit V 5 7 mA 7 10 mA − 50 … + 150 ˚C − 50 … + 150 ˚C ESD Class 1. When the temperature sensor is operated with long supply leads, it should be protected through the parallel connection of a > 10 nF capacitor to prevent damage to the sensor through induced voltage peaks. Semiconductor Group 1 1997-09-30 KT 110, KT 210, KTY 11, KTY 21 Electrical Characteristics at TA = 25 ˚C unless otherwise specified Parameter Symbol Unit min. typ. max. 1940 1950 1980 2010 970 975 990 1005 – – – – – – – – 2060 1990 2020 2050 1030 995 1010 1025 Ω Temperature sensor resistance IB = 1 mA R25 KT 110 KTY 11-5 KTY 11-6 KTY 11-7 KT 210 KTY 21-5 KTY 21-6 KTY 21-7 Thermal time constant (63% of ∆TA) in still air in still oil (Freon FC40/PP7) Limit Values s τair τoil – – 11 1.5 – – Package Outline TO-92 Mini 2.1-0.2 (1.9) 10˚ 1.7-0.2 2 0.928 1.9-0.2 1 14.1 0.5 ±0.1 0.4 ±0.1 0.2 +0.07 -0.03 0.9 ±0.1 Dimensions in mm Weight approx. 0.02 g Exterior Packaging I.e. tubes, trays, boxes are shown in our Data Book “Package Information”. Semiconductor Group 2 1997-09-30