SPS01N60C3 Cool MOS™ Power Transistor Feature VDS @ Tjmax 650 V RDS(on) 6 Ω ID 0.8 A • New revolutionary high voltage technology • Ultra low gate charge PG-TO251-3-11 • Periodic avalanche rated • Extreme dv/dt rated • Ultra low effective capacitances • Improved transconductance Type SPS01N60C3 Package Ordering Code PG-TO251-3-11 - Marking 01N60C3 Maximum Ratings Parameter Symbol Continuous drain current ID Value Unit A TC = 25 °C 0.8 TC = 100 °C 0.5 Pulsed drain current, tp limited by Tjmax I D puls 1.6 Avalanche energy, single pulse EAS 20 mJ I D = 0.6 A, VDD = 50 V Avalanche energy, repetitive tAR limited by Tjmax1) EAR 0.01 I D = 0.8 A, VDD = 50 V Avalanche current, repetitive tAR limited by Tjmax I AR Gate source voltage static VGS 0.8 A ±20 V Gate source voltage AC (f >1Hz) VGS ±30 Power dissipation, T C = 25°C Ptot 11 W Operating and storage temperature T j , T stg -55... +150 °C Reverse diode dv/dt 3) dv/dt Rev. 2.0 Page 1 15 V/ns 2005-10-24 SPS01N60C3 Maximum Ratings Parameter Symbol Drain Source voltage slope dv/dt Value Unit 50 V/ns Values Unit V DS = 480 V, I D = 0.8 A, Tj = 125 °C Thermal Characteristics Symbol Parameter min. typ. max. Thermal resistance, junction - case RthJC - - 11 Thermal resistance, junction - ambient, leaded RthJA - - 75 SMD version, device on PCB: RthJA @ min. footprint - - 75 @ 6 cm 2 cooling area 2) - - 50 - - 260 Soldering temperature, wavesoldering Tsold K/W °C 1.6 mm (0.063 in.) from case for 10s Electrical Characteristics, at Tj=25°C unless otherwise specified Parameter Symbol Conditions Drain-source breakdown voltage V(BR)DSS V GS=0V, ID=0.25mA Drain-Source avalanche V(BR)DS V GS=0V, ID=0.8A Values Unit min. typ. max. 600 - - - 700 - 2.1 3 3.9 V breakdown voltage Gate threshold voltage VGS(th) ID=250µΑ, VGS=V DS Zero gate voltage drain current I DSS V DS=600V, VGS=0V, Gate-source leakage current I GSS Drain-source on-state resistance RDS(on) Rev. 2.0 µA Tj=25°C, - 0.1 1 Tj=150°C - - 50 V GS=30V, VDS=0V - - 100 Ω V GS=10V, ID=0.5A, Tj=25°C - 5.6 6 Tj=150°C - 15.1 - Page 2 nA 2005-10-24 SPS01N60C3 Electrical Characteristics , at Tj = 25 °C, unless otherwise specified Parameter Transconductance Symbol g fs Conditions V DS≥2*I D*RDS(on)max, Values Unit min. typ. max. - 0.75 - S pF ID=0.5A Input capacitance Ciss V GS=0V, V DS=25V, - 100 - Output capacitance Coss f=1MHz - 40 - Reverse transfer capacitance Crss - 2.5 - Turn-on delay time td(on) V DD=350V, V GS=0/10V, - 30 - Rise time tr ID=0.8A, RG=100Ω - 25 - Turn-off delay time td(off) - 55 82 Fall time tf - 30 45 - 0.9 - - 2.2 - - 3.9 5 - 5.5 - ns Gate Charge Characteristics Gate to source charge Qgs Gate to drain charge Qgd Gate charge total Qg V DD=350V, ID=0.8A V DD=350V, ID=0.8A, nC V GS=0 to 10V Gate plateau voltage V(plateau) V DD=350V, ID=0.8A V 1Repetitve avalanche causes additional power losses that can be calculated as P =EAR*f. AV 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 3I <=I , di/dt<=400A/us, V SD D DClink=400V, Vpeak<VBR, DSS, Tj<Tj,max. Identical low-side and high-side switch. Rev. 2.0 Page 3 2005-10-24 SPS01N60C3 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Inverse diode continuous IS Conditions TC=25°C Values Unit min. typ. max. - - 0.8 - - 1.6 A forward current Inverse diode direct current, I SM pulsed Inverse diode forward voltage VSD VGS =0V, I F=IS - 1 1.2 V Reverse recovery time t rr VR =350V, IF=IS , - 570 970 ns Reverse recovery charge Q rr diF/dt=100A/µs - 0.75 - µC Typical Transient Thermal Characteristics Value Symbol Unit Symbol Value typ. Unit typ. Thermal resistance Thermal capacitance Rth1 0.225 Rth2 Cth1 0.00001221 0.395 Cth2 0.00005037 Rth3 0.603 Cth3 0.0000809 Rth4 0.995 Cth4 0.0002915 Rth5 0.691 Cth5 0.001844 Rth6 0.148 Cth6 0.412 Tj K/W R th1 R th,n T case Ws/K E xternal H eatsink P tot (t) C th1 C th2 C th,n T am b Rev. 2.0 Page 4 2005-10-24 SPS01N60C3 1 Power dissipation 2 Safe operating area Ptot = f (TC) ID = f ( V DS ) parameter : D = 0 , T C=25°C 10 1 12 W A 10 9 10 0 ID Ptot 8 7 6 5 10 -1 4 tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms DC 3 2 1 0 0 20 40 60 80 100 120 °C 10 -2 0 10 160 10 1 10 2 10 V VDS TC 3 Transient thermal impedance 4 Typ. output characteristic ZthJC = f (t p) ID = f (VDS); Tj=25°C parameter: D = tp/T parameter: tp = 10 µs, VGS 10 2 2.5 20V 10V K/W A 10 7V 1 ID ZthJC 6.5V 1.5 10 0 10 -1 6V 1 D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse 10 -2 -7 -6 -5 -4 -3 -2 -1 10 10 10 10 10 10 10 5.5V 0.5 5V 0 0 1 s 10 tp Rev. 2.0 5 10 15 V 25 VDS Page 5 2005-10-24 3 SPS01N60C3 5 Drain-source on-state resistance 6 Typ. transfer characteristics RDS(on) = f (Tj) ID= f ( VGS ); V DS≥ 2 x ID x RDS(on)max parameter : ID = 0.5 A, VGS = 10 V parameter: tp = 10 µs 2.5 34 Ω A 24 ID RDS(on) 28 20 1.5 16 1 12 98% 8 0.5 typ 4 0 -60 -20 20 60 °C 100 0 0 180 4 8 12 VGS Tj 20 V 7 Typ. gate charge 8 Forward characteristics of body diode VGS = f (QGate ) IF = f (VSD) parameter: ID = 0.8 A pulsed parameter: Tj , tp = 10 µs 10 1 16 V A 10 0 0.2 VDS max 10 IF VGS 12 0.8 VDS max 8 6 10 -1 Tj = 25 °C typ 4 Tj = 150 °C typ Tj = 25 °C (98%) 2 0 0 Tj = 150 °C (98%) 1 2 3 4 nC 10 -2 0 5.5 QGate Rev. 2.0 0.4 0.8 1.2 1.6 2 2.4 V 3 VSD Page 6 2005-10-24 SPS01N60C3 9 Avalanche SOA 10 Avalanche energy IAR = f (tAR) EAS = f (Tj) par.: Tj ≤ 150 °C par.: ID = 0.6 A, V DD = 50 V 0.9 22 mJ A 18 Tj(START) =25°C 16 EAS IAR 0.7 0.6 0.5 0.4 14 12 10 Tj(START) =125°C 8 0.3 6 0.2 4 0.1 0 -3 10 2 10 -2 10 -1 10 0 10 1 10 2 µs 10 tAR 0 25 4 50 75 100 11 Drain-source breakdown voltage 12 Typ. capacitances V(BR)DSS = f (Tj) C = f (VDS) 125 150 200 °C Tj parameter: V GS=0V, f=1 MHz 10 3 720 pF 680 Ciss 10 660 2 C V(BR)DSS V 640 620 Coss 10 1 600 580 Crss 560 540 -60 -20 20 60 100 °C 10 0 0 180 Tj Rev. 2.0 Page 7 10 20 30 40 50 60 70 80 V 100 VDS 2005-10-24 SPS01N60C3 Definition of diodes switching characteristics Rev. 2.0 Page 8 2005-10-24 SPS01N60C3 PG-TO-251-3-11 Rev. 2.0 Page 9 2005-10-24 SPS01N60C3 Published by Infineon Technologies AG 81726 München Germany © Infineon Technologies AG 2006 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.0 Page 10 2005-10-24