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PRODUCT BULLETIN # 16561
Generic Copy
Issue Date: 06-Jan-2011
TITLE: SOIC-7/8, 14, 16 Lead Conversion from MSL3 to MSL1
PROPOSED FIRST SHIP DATE: 06-Jan-2011
AFFECTED CHANGE CATEGORY(S): Assembly Process Moisture Sensitivity Level (MSL)
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor sales office or <[email protected]>
NOTIFICATION TYPE:
ON Semiconductor considers this change approved unless specific conditions of acceptance are
provided in writing. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
Through continuous process improvement of our SOIC assembly line, ON Semiconductor would like
to announce that it will be changing the Moisture Sensitivity Level for those products listed in this
Bulletin from MSL3 to MSL1. This means that the product listed in this product bulletin will no longer
be shipped in dry packing materials. There has been no change in the BOM material set to achieve
this higher MSL rating, only improvements to the assembly process.
RELIABILITY DATA SUMMARY:
Reliability was performed to confirm the improvement with the results summarized here.
Device
Case Outline #
NCP1200D100R2G
751U Halide free
Wafer Fab Site
Assembly Site
MOS7A
ON Semi OSPI
Japan
Philippines
Package
Mold Compound
Die Attach
Technology
Die Size
SOIC 8
G600
CRM1076WB
VHVIC
66 x 78 mils
Final Test Site
Reliability Lab
Max Voltage
Rel Tracking #
Flag Size
ON Semi OSPI
ON Semi
500 V
P07336/7988
90 x 90 mils
Philippines
Arizona
Device
Case Outline #
Package
Mold Compound
Die Attach
Technology
Die Size
NCP1396DR2G
751AM Halide free
SOIC 16
G600
CRM1076WB
VHVIC
79 x 81 mils
Wafer Fab Site
Assembly Site
Final Test Site
Reliability Lab
Max Voltage
Rel Tracking #
Flag Size
MOS7A
ON Semi OSPI
ON Semi OSPI
ON Semi
600 V
P07361/7362
90 x 130 mils
Japan
Philippines
Philippines
Arizona
Device
Case Outline #
Package
Mold Compound
Die Attach
Technology
NCP1271D65R2G
751U Halide free
SOIC 7
G600
CRM1076WB
VHVIC
Wafer Fab Site
Assembly Site
Final Test Site
Reliability Lab
Max Voltage
Rel Tracking #
MOS7A
ON Semi OSPI
ON Semi OSPI
ON Semi
500 V
P07364
Japan
Philippines
Philippines
Arizona
Die Size
54 x 56 mils
Flag Size
90 x 90 mils
Issue Date: 06-Jan-2011
Rev. 06-Jan-2010
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PRODUCT BULLETIN #16561
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Rev. 06-Jan-2010
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PRODUCT BULLETIN #16561
Issue Date: 06-Jan-2011
Rev. 06-Jan-2010
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PRODUCT BULLETIN #16561
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Rev. 06-Jan-2010
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PRODUCT BULLETIN #16561
List of affected General Parts:
PART
MC33260DG
NCP1217D65R2G
MC33260DR2G
NCP1230D100R2G
MC33260DR2GH
NCP1230D100R2GH
MC33364D1G
NCP1230D133R2G
MC33364D1R2G
NCP1230D165R2G
MC33364D2G
NCP1230D65R2G
MC33364D2R2G
NCP1230D65R2GH
MC33364DG
NCP1280DR2G
MC33364DR2G
NCP1308DR2G
MC33368DG
NCP1337DR2G
MC33368DR2G
NCP1338DR2G
NCP1200D100R2G
NCP1351ADR2G
NCP1200D40R2G
NCP1351BDR2G
NCP1200D60R2G
NCP1351BDR2GH
NCP1201D100R2G
NCP1351CDR2G
NCP1201D60R2G
NCP1351DDR2G
NCP1203D100R2G
NCP1377BD1R2G
NCP1203D100R2GH
NCP1377BDR2G
NCP1203D40R2G
NCP1377D1R2G
NCP1203D60R2G
NCP1377DR2G
NCP1205DR2G
NCP1378DR2G
NCP1207ADR2G
NCP1381DR2G
NCP1207BDR2G
NCP1382DR2G
NCP1212DR2G
NCP1395ADR2G
NCP1215ADR2G
NCP1395BDR2G
NCP1215DR2G
NCP1601ADR2G
NCP1216AD100R2G
NCP1601BDR2G
NCP1216AD133R2G
NCP1605ADR2G
NCP1216AD65R2G
NCP1605DR2G
NCP1216D100R2G
NCP1605DR2GH
NCP1216D133R2G
NCP1650DR2G
NCP1217AD100R2G
NCP1651DR2G
NCP1217AD133R2G
NCP1653ADR2G
NCP1217AD65R2G
NCP1653ADR2GH
NCP1217D100R2G
NCP1653DR2G
NCP1217D133R2G
NCP5181DR2G
Issue Date: 06-Jan-2011
Rev. 06-Jan-2010
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