PRODUCT BULLETIN # 16561 Generic Copy Issue Date: 06-Jan-2011 TITLE: SOIC-7/8, 14, 16 Lead Conversion from MSL3 to MSL1 PROPOSED FIRST SHIP DATE: 06-Jan-2011 AFFECTED CHANGE CATEGORY(S): Assembly Process Moisture Sensitivity Level (MSL) FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor sales office or <[email protected]> NOTIFICATION TYPE: ON Semiconductor considers this change approved unless specific conditions of acceptance are provided in writing. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: Through continuous process improvement of our SOIC assembly line, ON Semiconductor would like to announce that it will be changing the Moisture Sensitivity Level for those products listed in this Bulletin from MSL3 to MSL1. This means that the product listed in this product bulletin will no longer be shipped in dry packing materials. There has been no change in the BOM material set to achieve this higher MSL rating, only improvements to the assembly process. RELIABILITY DATA SUMMARY: Reliability was performed to confirm the improvement with the results summarized here. Device Case Outline # NCP1200D100R2G 751U Halide free Wafer Fab Site Assembly Site MOS7A ON Semi OSPI Japan Philippines Package Mold Compound Die Attach Technology Die Size SOIC 8 G600 CRM1076WB VHVIC 66 x 78 mils Final Test Site Reliability Lab Max Voltage Rel Tracking # Flag Size ON Semi OSPI ON Semi 500 V P07336/7988 90 x 90 mils Philippines Arizona Device Case Outline # Package Mold Compound Die Attach Technology Die Size NCP1396DR2G 751AM Halide free SOIC 16 G600 CRM1076WB VHVIC 79 x 81 mils Wafer Fab Site Assembly Site Final Test Site Reliability Lab Max Voltage Rel Tracking # Flag Size MOS7A ON Semi OSPI ON Semi OSPI ON Semi 600 V P07361/7362 90 x 130 mils Japan Philippines Philippines Arizona Device Case Outline # Package Mold Compound Die Attach Technology NCP1271D65R2G 751U Halide free SOIC 7 G600 CRM1076WB VHVIC Wafer Fab Site Assembly Site Final Test Site Reliability Lab Max Voltage Rel Tracking # MOS7A ON Semi OSPI ON Semi OSPI ON Semi 500 V P07364 Japan Philippines Philippines Arizona Die Size 54 x 56 mils Flag Size 90 x 90 mils Issue Date: 06-Jan-2011 Rev. 06-Jan-2010 Page 1 of 5 PRODUCT BULLETIN #16561 Issue Date: 06-Jan-2011 Rev. 06-Jan-2010 Page 2 of 5 PRODUCT BULLETIN #16561 Issue Date: 06-Jan-2011 Rev. 06-Jan-2010 Page 3 of 5 PRODUCT BULLETIN #16561 Issue Date: 06-Jan-2011 Rev. 06-Jan-2010 Page 4 of 5 PRODUCT BULLETIN #16561 List of affected General Parts: PART MC33260DG NCP1217D65R2G MC33260DR2G NCP1230D100R2G MC33260DR2GH NCP1230D100R2GH MC33364D1G NCP1230D133R2G MC33364D1R2G NCP1230D165R2G MC33364D2G NCP1230D65R2G MC33364D2R2G NCP1230D65R2GH MC33364DG NCP1280DR2G MC33364DR2G NCP1308DR2G MC33368DG NCP1337DR2G MC33368DR2G NCP1338DR2G NCP1200D100R2G NCP1351ADR2G NCP1200D40R2G NCP1351BDR2G NCP1200D60R2G NCP1351BDR2GH NCP1201D100R2G NCP1351CDR2G NCP1201D60R2G NCP1351DDR2G NCP1203D100R2G NCP1377BD1R2G NCP1203D100R2GH NCP1377BDR2G NCP1203D40R2G NCP1377D1R2G NCP1203D60R2G NCP1377DR2G NCP1205DR2G NCP1378DR2G NCP1207ADR2G NCP1381DR2G NCP1207BDR2G NCP1382DR2G NCP1212DR2G NCP1395ADR2G NCP1215ADR2G NCP1395BDR2G NCP1215DR2G NCP1601ADR2G NCP1216AD100R2G NCP1601BDR2G NCP1216AD133R2G NCP1605ADR2G NCP1216AD65R2G NCP1605DR2G NCP1216D100R2G NCP1605DR2GH NCP1216D133R2G NCP1650DR2G NCP1217AD100R2G NCP1651DR2G NCP1217AD133R2G NCP1653ADR2G NCP1217AD65R2G NCP1653ADR2GH NCP1217D100R2G NCP1653DR2G NCP1217D133R2G NCP5181DR2G Issue Date: 06-Jan-2011 Rev. 06-Jan-2010 Page 5 of 5