FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 12-FEB-2002 SUBJECT: ON Semiconductor Final Product/Process Change Notification #12310 TITLE: Qualification of 6 Inch VHVIC Production Line in Aizu, Japan EFFECTIVE DATE: 13-Apr-2002 AFFECTED CHANGE CATEGORY: Wafer Process AFFECTED PRODUCT DIVISION: Analog Products ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Rick Luevanos <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office or Jack Cartwright <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Office or Jack Cartwright <[email protected]> DISCLAIMER: Final Product/Process Change Notification (FPCN) -Final Notification completing the notification process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: MOS7 in Aizu, Japan, has been a qualified 4 inch production site for VHVIC(Very High Voltage Integrated Circuit) technology since 1999. MOS7A, ON Semiconductor's 6 inch VHVIC production site, has now successfully qualified the VHVIC process to meet additional capacity requirements. The 6 inch VHVIC process flow is very similar to the 4 inch VHVIC production process flow. However, new 6" production mask sets have been generated to accommodate minor process flow and equipment differences. There are no statistically significant electrical parameter differences as a result of this production transition to 6 inch wafers. Consequently, NO datasheet specification changes have been made as a result of the conversion. ON Semiconductor's application engineers have verified board level performance of each device based upon reference application designs. ON Semiconductor also recommends that our valued customers evaluate 6 inch material in their specific applications. ON Semiconductor will provide samples upon request based upon the schedule below. Issue Date: 12-Feb-2002 Page 1 of 3 Final Product/Process Change Notification #12310 RELIABILITY DATA SUMMARY: MC44608P75 was selected as the production process qualification vehicle for the affected devices listed below. In addition, each device design will complete 672 hours of HTBB (High Temperature Blocking Bias) reliability testing with 0 allowed failures. Device List Rel. Test Conditions Sample Results TY72011P HTBB 125DegC, 500V bias on HV pin, 672Hrs 80 due 3/11/02 [Other part numbers covered by this device qualification: TY72011P2] MC33260P HTOL 125DegC, 672Hrs 80 due 3/18/02 [Other part numbers covered by this device qualification: MC33260DR2,MC33260D] NCP1200P60 HTBB 125DegC, 450V bias on HV pin, 672Hrs 80 due 4/3/02 [Other part numbers covered by this device qualification: NCP1200P40, NCP1200P60, NCP1200P100, NCP1200D60R2, NCP1200D40R2, NCP1200D100R2] MC33364D HTBB 125DegC, 450V bias on HV pin, 672Hrs 80 due 4/3/02 [Other part numbers covered by this device qualification: MC33364D1R2, MC33364D2R2] MC33368P HTBB 125DegC, 450V bias on HV pin, 672Hrs 80 due 5/22/02 [Other part numbers covered by this device qualification: MC33368DR2, MC33368D] Test conditions and results are as follows: RELIABILITY DATA : MC44608P75 has successfully passed the qualification tests below on 6inch process : DEVICE MC44608P75 TEST CONDITIONS SS HTBB 125DegC, 400V bias on HV pin, 1000Hrs 240 HAST 130DegC, 100%RH, 15 psi, 96Hrs 240 TC -65DegC to 150DegC, 500 cycles 240 ESD +/- 2000V HBM 15 ESD +/- 200V MM 15 [Other part numbers covered by this device qualification: MC44608P75, MC44608P100, MC44608P40] Results 0 failures due 2/15/02 0 failures 0 failures 0 failures ELECTRICAL CHARACTERISTIC SUMMARY: All electrical parameters remain unchanged. Temperature characterization report is available upon request for each device at the time of sampling. Samples will be made available for customer qualification and application verification, in accordance with the following schedule: Device List Sample Date MC44608P75 2/1/02 MC44608P40, MC44608P100 3/25/02 TY72011P, TY72011P2 2/22/02 MC33260P, MC33260DR2, MC33260D 2/29/02 NCP1200P60, NCP1200P40, NCP1200P100 4/8/02 NCP1200D60R2, NCP1200D40R2, NCP1200D100R2 MC33364D, MC33364D1R2, MC33364D2R2 4/8/02 MC33368P, MC33368DR2, MC33368D 5/22/02 Issue Date: 12-Feb-2002 Page 2 of 3 Final Product/Process Change Notification #12310 CHANGED PART IDENTIFICATION: Device marking is not affected by this change. All part numbers with date code of 0221 (Calendar year 2002, work week 21) or later could represent product sourced from the 6 inch production line. AFFECTED DEVICE LIST (WITHOUT SPECIALS): PART MC33260D MC33260DR2 MC33260P MC33364D MC33364D1R2 MC33364D2R2 MC33368D MC33368DR2 MC33368P MC44608P100 MC44608P40 MC44608P75 NCP1200D100R2 NCP1200D40R2 NCP1200D60R2 NCP1200P100 NCP1200P40 NCP1200P60 TY72011P TY72011P2 Issue Date: 12-Feb-2002 Page 3 of 3