INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 12-Mar-2009 SUBJECT: ON Semiconductor Initial Product/Process Change Notification #16229 TITLE: NCP3420 Gresham Fab Qualification and Copper Wire Qualification Notification PROPOSED FIRST SHIP DATE: 12-Jul-2009 AFFECTED PRODUCT DIVISION: CCPG FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or David Chu < [email protected] > NOTIFICATION TYPE: Initial Product/Process Change Notification (IPCN) First change notification sent to customers. IPCNs are issued at least 120 days prior to implementation of the change. An IPCN is advance notification about an upcoming change and contains general information regarding the change details and devices affected. It also contains the preliminary reliability qualification plan. The completed qualification and characterization data will be included in the Final Product/Process Change Notification (FPCN). This IPCN notification will be followed by a Final Product/Process Change Notification (FPCN) at least 90 days prior to implementation of the change. DESCRIPTION AND PURPOSE: ON Semiconductor is qualifying the NCP3420 on a second fab process, Gresham ONBCD25. The products affected will be dual sourced from both TSMC and Gresham. ON Semiconductor is qualifying the use of copper wire on the NCP3420. The wire-bonding for the affected devices will be dual sourced and will use either gold or copper wire. Issue Date: 12-Mar-2009 Rev.07-31-07 Page 1 of 4 Initial Product/Process Change Notification #16229 QUALIFICATION PLAN: Gresham Qualification Plan 1. High Temp Op Life (125 ˚C Tj, Dynamic) 3 lots/vehicle Demonstrate ≤1000 FIT 2. High Temp Storage (150 ˚C)3 lots/vehicle X 80 units/lot 504, 1008 hrs. 3. Pre-Conditioning MSL 3 lots/vehicle X 240 units/lot 4. HAST (130 ˚C/85%RH) 3 lots/vehicle X 80 units/lot 96 hrs. 5. Autoclave (121 ˚C/100%RH/15PSIG)3 lots/vehicle X 80 units/lot 96 hrs. 6. Temp Cycling (-65 ˚C to +150 ˚C)3 lots/vehicle X 80 units/lot 500, 1000 cycles 7. External Visual Inspection All Units 8. Wire Bond Pull Strength 3 lots 9. Bond Shear Test 3 lots 10. ESD - Human Body Model 3 lots 11. ESD - Machine Model 3 lots 12. Latch-Up 3 lots 13. Characterization: A minimum of 30 packaged units from each of the three qualification lots are to be characterized across the full temperature range of the device as documented in the datasheet Issue Date: 12-Mar-2009 Rev.07-31-07 Page 2 of 4 Initial Product/Process Change Notification #16229 Copper Wire Qualification Plan # TEST 1 Prep 2 Initial Electrical NAME Sample preparation and initial part testing Initial Electrical Prior To PC 3 HTOL High Temp Op Life 4 PC Preconditioning MSL 1 5 HAST+P C Highly Accelerated Stress Test 6 TC+PC Temp Cycling+ preconditioning 7 AC+PC Autoclave+ preconditioning 8 HTSL High Temp Storage Life 9 RSH Resistance to Solder Heat 10 DPA DeProcessing Analysis 11 ED Tri-Temp Electrical Characterization 12 TR Thermal Resistance 13 Yield Wirebond Related Yield Analysis 14 BPS Bond Pull Strength 15 BS Bond Shear Issue Date: 12-Mar-2009 TEST CONDITIONS END POINT REQUIREMENTS SS x No. Lots various --- All --- ---- All c = 0, Room 80 x 3 lots c = 0, Room 240 x 3 lots c = 0, Room 80 x 3 lots c = 0, Room 80 x 3 lots c = 0, Room 80 x 3 lots c = 0, Room 80 x 3 lots N/A 30 x 3 lots Ta=125°C for 1008hrs (JA108) J STD 020A , JA 113 IR reflow at 260°C, HAST, TC, AC Temp = +130°C; RH = 85%, psig ~28 with bias** for 96hrs (JA110) Temp = -65°C to +150°C; for 500 cycles (JA104B) 121°C/100% RH/15 PSIG for 96 hrs (JA102) Ta=150°C for 1008hrs (JA103) TS=260C, Tdwell=10 sec. Test after RSH. SMD devices are fully submerged during test. (JESD22 B-106) Post HAST+PC, post TC+PC, and post AC+PC Characterization of all parameters Provide thermal comparison data to ensure spec compliance per assembly MRB procedure M2011 Condition C or D AEC-Q100-001 Rev.07-31-07 2 x 3 lots Room, Hot, Cold 30 units x 3 lots 10 units x 1 eval lot + 1 cont lot All units x 3 lots 30 bonds on min. 5 units 30 x 3 lots 30 bonds on min. 5 units 30 x 3 lots Page 3 of 4 Initial Product/Process Change Notification #16229 AFFECTED DEVICE LIST: NCP3420DR2G NCP3420MNR2G Issue Date: 12-Mar-2009 Rev.07-31-07 Page 4 of 4