TDA1308; TDA1308A Class-AB stereo headphone driver Rev. 04 — 25 January 2007 Product data sheet 1. General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1 µm Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications. The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be used at low supply voltages. 2. Features n n n n n n Wide temperature range No switch ON/OFF clicks Excellent power supply ripple rejection Low power consumption Short-circuit resistant High performance u High signal-to-noise ratio u High slew rate u Low distortion n Large output voltage swing 3. Quick reference data Table 1. Quick reference data VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. Symbol Parameter Conditions VDD supply voltage TDA1308 Min Typ Max Unit single supply 3.0 5.0 7.0 V dual supply 1.5 2.5 3.5 V single supply 2.4 5.0 7.0 V dual supply 1.2 2.5 3.5 V −2.5 −3.5 V TDA1308A VSS negative supply voltage TDA1308; dual supply −1.5 TDA1308A; dual supply −1.2 −2.5 −3.5 V IDD supply current no load - 3 5 mA TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver Table 1. Quick reference data …continued VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Ptot total power dissipation no load - 15 25 mW Po maximum output power (THD + N)/S < 0.1 % [1] - 40 80 mW (THD + N)/S total harmonic distortion plus noise-to-signal ratio [1] - 0.03 0.06 % [1] - −70 −65 dB RL = 5 kΩ [2] - −92 −89 dB RL = 5 kΩ [3] - −52 −40 dB - −101 - dB 100 110 - dB - 70 - dB - 105 - dB - 90 - dB −40 - +85 °C RL = 5 kΩ S/N signal-to-noise ratio αcs channel separation PSRR power supply ripple rejection Tamb ambient temperature [1] RL = 5 kΩ fi = 100 Hz; Vripple(p-p) = 100 mV [1] VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). [2] VDD = 2.4 V; VO(p-p) = 1.62 V (at −4.8 dBV); for TDA1308A only. [3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only. 4. Ordering information Table 2. Ordering information Type number Package Name Description TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA1308AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA1308AUK WLCSP8 wafer level chip-size package; 8 bumps; 0.61 × 0.84 × 0.38 mm TDA1308AUK TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 TDA1308_A_4 Product data sheet Version © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 2 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 5. Block diagram OUTA INA(neg) INA(pos) VSS 1 TDA1308(A) 8 VDD 2 3 7 6 4 5 OUTB INB(neg) INB(pos) mka779 Fig 1. Block diagram 6. Pinning information 6.1 Pinning bump A1 index area TDA1308AUK 1 2 3 A B C TDA1308(A) OUTA 1 8 VDD INA(neg) 2 7 OUTB INA(pos) 3 6 INB(neg) VSS 4 5 INB(pos) D E 001aaf800 Transparent top view 001aaf782 Fig 2. Pin configuration TDA1308(A) Fig 3. Pin configuration TDA1308AUK 6.2 Pin description Table 3. Pin description TDA1308(A) Symbol Pin Description OUTA 1 output A INA(neg) 2 inverting input A INA(pos) 3 non-inverting input A VSS 4 negative supply INB(pos) 5 non-inverting input B TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 3 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver Table 3. Pin description TDA1308(A) …continued Symbol Pin Description INB(neg) 6 inverting input B OUTB 7 output B VDD 8 positive supply Table 4. Pin description TDA1308AUK Symbol Pin Description OUTA A1 output A VSS A3 negative supply INA(pos) B2 non-inverting input A OUTB C1 output B INA(neg) C3 inverting input A INB(neg) D2 inverting input B VDD E1 positive supply INB(pos) E3 non-inverting input B 7. Internal circuitry VDD I1 INA/B(pos) M1 M2 A1 M3 INA/B(neg) OUTA/B Cm M4 D1 D2 D3 D4 VSS M5 A2 M6 mka781 Fig 4. Equivalent schematic diagram TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 4 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD supply voltage 0 8.0 V tSC(O) output short-circuit duration Tamb = 25 °C; Ptot = 1 W 20 - s Tstg storage temperature −65 +150 °C Tamb ambient temperature Vesd electrostatic discharge voltage −40 +85 °C HBM [1] −2 +2 kV MM [2] −200 +200 V [1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative. [2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative. 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction to ambient Conditions Typ Unit DIP8 109 K/W SO8 210 K/W TSSOP8 220 K/W WLCSP8 1000 K/W TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 5 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 10. Characteristics Table 7. Characteristics VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit supply voltage TDA1308 single supply 3.0 5.0 7.0 V dual supply 1.5 2.5 3.5 V single supply 2.4 5.0 7.0 V dual supply 1.2 2.5 3.5 V TDA1308; dual supply −1.5 −2.5 −3.5 V TDA1308A; dual supply −1.2 −2.5 −3.5 V Supplies VDD TDA1308A VSS negative supply voltage IDD supply current no load - 3 5 mA Ptot total power dissipation no load - 15 25 mW Static characteristics VI(os) input offset voltage - 10 - mV Ibias input bias current - 10 - pA VCM common mode voltage 0 - 3.5 pA GV open-loop voltage gain - 70 - dB IO maximum output current - 60 - mA RO output resistance VO output voltage swing αcs RL = 5 kΩ - 0.25 - Ω [1] 0.75 - 4.25 V RL = 16 Ω [1] 1.5 - 3.5 V RL = 5 kΩ [1] 0.1 - 4.9 V - 70 - dB RL = 5 kΩ [1] - 105 - dB (THD + N)/S < 0.1 % channel separation PSRR power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV - 90 - dB CL load capacitance - - 200 pF [2] - 0.03 0.06 % [2] - −70 −65 dB RL = 5 kΩ [3] - −92 −89 dB RL = 5 kΩ [3] - −52 −40 dB RL = 5 kΩ [3] - 0.25 1.0 % RL = 5 kΩ [2] - −101 - dB RL = 5 kΩ [2] - 0.0009 - % Dynamic characteristics (THD + N)/S total harmonic distortion plus noise-to-signal ratio S/N signal-to-noise ratio 100 110 - dB fG unity gain frequency open-loop; RL = 5 kΩ - 5.5 - MHz Po maximum output power (THD + N)/S < 0.1 % - 40 80 mW TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 6 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver Table 7. Characteristics …continued VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. Symbol Parameter Conditions Ci input capacitance SR slew rate B bandwidth Min Typ Max Unit - 3 - pF unity gain inverting - 5 - V/µs unity gain inverting - 20 - kHz [1] Values are proportional to VDD; (THD + N)/S < 0.1 %. [2] VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). [3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only. 11. Application information VDD C5 C2 10 µF C1 100 nF C7 1 nF R3 R1 22 kΩ 5 BCK 1 2 8 1 100 µF 3.9 kΩ R5 10 kΩ 8 3 R2 WS 2 TDA1545A Vref 33 kΩ DATA 3 5 6 6 4 C6 100 µF TDA1308(A) 7 7 4 C3 1 µF R4 3.9 kΩ C4 1 nF C8 100 µF R6 10 kΩ mka783 Fig 5. Example of application with TDA1545A (stereo continuous calibration DAC) TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 7 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 12. Test information VDD 100 µF 3.9 kΩ VOUTA RL 8 1 3.9 kΩ VINA 2 3 Vref (typ. 2.5 V) C6 100 µF TDA1308(A) 5 3.9 kΩ VINB 6 7 4 100 µF 3.9 kΩ VOUTB RL mka782 Fig 6. Measurement circuit for inverting application mka784 Gv (dB) 80 Gv (dB) 40 mka785 −70 −90 RL = 32 Ω RL = 16 Ω no load −110 32 Ω 0 10−2 5 kΩ 10−3 10−4 10−5 10−6 10−7 10−8 fi (Hz) Fig 7. Open-loop gain as a function of input frequency −130 10−1 10−3 10−4 fi (Hz) 10−5 Fig 8. Crosstalk as a function of input frequency TDA1308_A_4 Product data sheet 10−2 © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 8 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver mka786 100 Po (mW) RL = 16 Ω 60 mka787 −50 (THD+N)/S (dB) RL = 16 Ω; Po = 50 mW 32 Ω −70 40 RL = 32 Ω; Po = 50 mW 8Ω −90 20 RL = 5 kΩ; VO(p−p) = 3.5 V 10 3 4 −110 10−1 5 VDD (V) Fig 9. Output power as a function of supply voltage 10−2 10−3 10−4 fi (Hz) 10−5 Fig 10. Total harmonic distortion plus noise-to-signal ratio as a function of input frequency mka788 −40 (THD+N)/S (dB) RL = 8 Ω 16 Ω −60 32 Ω −80 5 kΩ fi = 1 kHz −100 10−2 10−1 1 VO(p−p) (V) 10 Fig 11. Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level 12.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 9 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 13. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.02 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT97-1 050G01 MO-001 SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 12. Package outline SOT97-1 (DIP8) TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 10 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 13. Package outline SOT96-1 (SO8) TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 11 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm D E SOT505-1 A X c y HE v M A Z 5 8 A2 pin 1 index (A3) A1 A θ Lp L 1 4 detail X e w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.94 0.7 0.4 0.1 0.1 0.1 0.70 0.35 6° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18 SOT505-1 Fig 14. Package outline SOT505-1 (TSSOP8) TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 12 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver WLCSP8: wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm B D TDA1308AUK A bump A1 index area A2 E A A1 detail X e1 1/2 e1 ∅v ∅w b M M C C A B C y E 1/4 e2 1/2 e2 D e2 C B A 1 2 3 0 0.25 0.5 mm X scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 A2 b D E mm 0.49 0.10 0.07 0.39 0.37 0.123 0.091 0.65 0.57 0.88 0.80 OUTLINE VERSION e1 e2 0.396 0.588 v w y 0.15 0.05 0.08 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 06-11-20 06-12-15 TDA1308AUK Fig 15. Package outline TDA1308AUK (WLCSP8) TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 13 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 14. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 14 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 16) than a PbSn process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9 Table 8. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 9. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16. TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 15 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 16 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 15. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA1308_A_4 20070125 Product data sheet - TDA1308_A_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors • • Legal texts have been adapted to the new company name where appropriate Type number TDA1308AUK has been added TDA1308_A_3 20020719 Product specification - TDA1308_A_2 TDA1308_A_2 20020227 Product specification - TDA1308_1 TDA1308_1 19940905 Product specification - - TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 17 of 19 TDA1308; TDA1308A NXP Semiconductors Class-AB stereo headphone driver 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] TDA1308_A_4 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 04 — 25 January 2007 18 of 19 NXP Semiconductors TDA1308; TDA1308A Class-AB stereo headphone driver 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 12.1 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Introduction to soldering . . . . . . . . . . . . . . . . . 14 Wave and reflow soldering . . . . . . . . . . . . . . . 14 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 25 January 2007 Document identifier: TDA1308_A_4