PHILIPS TDA8543T

INTEGRATED CIRCUITS
DATA SHEET
TDA8543
2 W BTL audio amplifier
Product specification
File under Integrated Circuits, IC01
1997 Jun 12
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
FEATURES
GENERAL DESCRIPTION
• Flexibility in use
The TDA8543(T) is a one channel audio power amplifier
for an output power of 2 W with an 8 Ω load at a 7.5 V
supply. The circuit contains a BTL amplifier with
a complementary PNP-NPN output stage and
standby/mute logic. The TDA8543T comes in a 16 pin
SO package and the TDA8543 in a 16 pin DIP package.
• Few external components
• Low saturation voltage of output stage
• Gain can be fixed with external resistors
• Standby mode controlled by CMOS compatible levels
• Low standby current
• No switch-on/switch-off plops
APPLICATIONS
• High supply voltage ripple rejection
• Portable consumer products
• Protected against electrostatic discharge
• Personal computers
• Outputs short-circuit safe to ground, VCC and across
the load
• Telephony.
• Thermally protected.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VCC
supply voltage
Iq
quiescent current
Istb
standby current
Po
output power
THD
total harmonic distortion
SVRR
supply voltage ripple rejection
CONDITIONS
MIN.
2.2
VCC = 5 V
TYP.
5
MAX.
18
UNIT
V
−
8
12
mA
−
−
10
µA
THD = 10%
RL = 8 Ω; VCC = 5 V
1
1.2
−
W
RL = 8 Ω; VCC = 7.5 V
−
2.2
−
W
RL = 16 Ω; VCC = 9 V
−
2.0
−
W
−
0.15
−
%
50
−
−
dB
Po = 0.5 W
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8543T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
TDA8543
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
1997 Jun 12
2
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
BLOCK DIAGRAM
handbook, halfpage
TDA8543
−
IN−
IN+
6
5
11
−
+
OUT−
R
VCC
12
R
−
−
20 kΩ
SVR
14
OUT+
+
4
20 kΩ
MODE
3
STANDBY/MUTE LOGIC
13
GND
MGK402
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
n.c.
1
not connected
n.c.
2
not connected
MODE
3
operating mode select
(standby, mute, operating)
SVR
4
half supply voltage, decoupling
ripple rejection
IN+
5
positive input
IN−
6
negative input
n.c.
7
not connected
n.c.
8
not connected
n.c.
9
n.c.
handbook, halfpage
n.c. 1
16 n.c.
n.c. 2
15 n.c
MODE 3
14 OUT+
SVR 4
13 GND
TDA8543
IN+ 5
12 VCC
IN− 6
11 OUT−
not connected
n.c. 7
10 n.c.
10
not connected
n.c. 8
9
OUT−
11
negative loudspeaker terminal
VCC
12
supply voltage
GND
13
ground
OUT+
14
positive loudspeaker terminal
n.c.
15
not connected
n.c.
16
not connected
1997 Jun 12
n.c
MGK401
Fig.2 Pin configuration.
3
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
The voltage loss on the positive supply line is
the saturation voltage of a PNP power transistor,
on the negative side the saturation voltage of an
NPN power transistor.
FUNCTIONAL DESCRIPTION
The TDA8543(T) is a BTL audio power amplifier capable
of delivering an output power between 1 and 2 W,
depending on supply voltage, load resistance
and package. Using the MODE pin the device can
be switched to standby and mute condition. The device
is protected by an internal thermal shutdown protection
mechanism.
The gain can be set within a range from 6 dB to 30 dB
by external feedback resistors.
Mode select pin
The device is in standby mode (with a very low current
consumption) if the voltage at the MODE
pin is >(VCC − 0.5 V), or if this pin is floating. At a MODE
voltage level of less than 0.5 V the amplifier is fully
operational.
In the range between 1.5 V and VCC − 1.5 V the amplifier
is in mute condition. The mute condition is useful to
suppress plop noise at the output, caused by charging of
the input capacitor.
Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
VCC
supply voltage
VI
input voltage
CONDITIONS
operating
IORM
repetitive peak output current
Tstg
storage temperature
Tamb
operating ambient temperature
Vpsc
AC and DC short-circuit safe voltage
Ptot
total power dissipation
non-operating
MIN.
MAX.
UNIT
−0.3
+18
V
−0.3
VCC + 0.3
V
−
1
A
−55
+150
°C
−40
+85
°C
−
10
V
SO16
−
1.2
W
DIP16
−
2.2
W
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”. The number of the quality specification can be found in the “Quality Reference
Handbook”. The handbook can be ordered using the code 9397 750 00192.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
1997 Jun 12
PARAMETER
CONDITIONS
VALUE
UNIT
TDA8543T (SO16)
100
K/W
TDA8543 (DIP16)
55
K/W
thermal resistance from junction to ambient
4
in free air
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
MGK410
2.5
handbook, halfpage
P
(W)
2.0
1.5
(1)
1
(2)
0.5
0
0
40
80
120
160
Tamb (°C)
(1) DIP16.
(2) SO16.
Fig.3 Power derating curve.
Table 1
CONTINUOUS SINE WAVE DRIVEN
VCC (V)
RL (Ω)
Po (W)(1)
Pmax (W)
Tamb(max) (°C)
SO16
DIP16
5
8
1.2
0.7
80
112
7.5
8
2.2
1.6
−
62
7.5
16
1.4
0.9
60
100
9
16
2.0
1.3
−
78
9
25
1.3
0.9
60
100
Note
1. At THD = 10%; BTL.
1997 Jun 12
5
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
DC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; G = 20 dB; measured in test circuit Fig.4; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
2.2
5
MAX.
18
UNIT
VCC
supply voltage
operating
V
Iq
quiescent current
RL = ∞; note 1
−
8
12
mA
Istb
standby current
VMODE = VCC
−
−
10
µA
VO
DC output voltage
note 2
−
2.2
−
V
VOUT+ − VOUT− differential output voltage offset
−
−
50
mV
IIN+, IIN−
input bias current
−
−
500
nA
VMODE
input voltage mode select
operating
0
−
0.5
V
mute
1.5
−
VCC − 1.5 V
standby
VCC − 0.5 −
VCC
V
0 < VMODE < VCC
−
20
µA
IMODE
input current mode select
−
Notes
1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal
to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5 × VCC.
AC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE = 0 V; G = 20 dB; measured in test circuit Fig.4; unless otherwise
specified.
SYMBOL
Po
PARAMETER
output power
CONDITIONS
MIN.
TYP.
MAX.
UNIT
THD = 10%;
VCC = 5 V; RL = 8 Ω
1
1.2
−
W
VCC = 7.5 V; RL = 8 Ω
−
2.2
−
W
VCC = 9 V; RL = 16 Ω
−
2.0
−
W
VCC = 5 V; RL = 8 Ω
0.6
0.9
−
W
VCC = 7.5 V; RL = 8 Ω
−
1.7
−
W
VCC = 9 V; RL = 16 Ω
−
1.4
−
W
−
0.15
0.3
%
THD = 0.5%;
THD
total harmonic distortion
Po = 0.5 W
note 1
6
−
30
dB
−
100
−
kΩ
note 2
−
−
100
µV
note 3
50
−
−
dB
note 4
40
−
−
dB
−
−
200
µV
Gv
closed loop voltage gain
Zi
differential input impedance
Vno
noise output voltage
SVRR
supply voltage ripple rejection
Vo
output voltage in mute condition note 5
1997 Jun 12
6
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
Notes to the AC characteristics
R2
1. Gain of the amplifier is 2 × -------- in test circuit of Fig.4.
R1
2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with
a source impedance of RS = 0 Ω at the input.
3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input.
The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied
to the positive supply rail.
4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input.
The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.
5. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including
noise.
TEST AND APPLICATION INFORMATION
SE application
Test conditions
Tamb = 25 °C if not specially mentioned, VCC = 7.5 V,
f = 1 kHz, RL = 4 Ω, Gv = 20 dB, audio band-pass
22 Hz to 22 kHz.
Because the application can be either Bridge Tied Load
(BTL) or Single-Ended (SE), the curves of each application
are shown separately.
The SE application diagram is shown in Fig.14.
For Tamb = 60 °C the maximum total power dissipation is:
The capacitor value of C3 in combination with the load
impedance determines the low frequency behaviour.
The total harmonic distortion as a function of frequency
was measured with low-pass filter of 80 kHz. The value
of capacitor C2 influences the behaviour of the SVRR
at low frequencies, increasing the value of C2 increases
the performance of the SVRR.
150 – 60
---------------------- = 1.63 W
55
General remark
The thermal resistance = 55 K/W for the DIP16 envelope;
the maximum sine wave power dissipation
for Tamb = 25 °C is:
150 – 25
---------------------- = 2.27 W
55
The frequency characteristic can be adapted
by connecting a small capacitor across the feedback
resistor. To improve the immunity of HF radiation in radio
circuit applications, a small capacitor can be connected
in parallel with the feedback resistor; this creates a
low-pass filter.
See the power derating curve illustrated in Fig.3.
BTL application
Tamb = 25 °C if not specially mentioned, VCC = 5 V,
f = 1 kHz, RL = 8 Ω, Gv = 20 dB, audio band-pass
22 Hz to 22 kHz.
The BTL application diagram is shown in Fig.4.
The quiescent current has been measured without
any load impedance. The total harmonic distortion
as a function of frequency was measured with a low-pass
filter of 80 kHz. The value of capacitor C2 influences
the behaviour of the SVRR at low frequencies, increasing
the value of C2 increases the performance of the SVRR.
The figure of the mode select voltage (Vms) as a function
of the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels
of the mute and standby respectively depends
on the supply voltage level.
1997 Jun 12
7
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
BTL APPLICATION
handbook, full pagewidth
VCC
C1
R2
R1
56 kΩ
1 µF 11 kΩ
6
Vin
5
RL
TDA8543
SVR
C2
47 µF
OUT−
11
IN+
100 µF
100 nF
12
IN−
OUT+
4
14
MODE
3
13
GND
MGK403
R2
Gain = 2 × -------R1
Fig.4 BTL application.
MGD876
15
MGK404
10
handbook, halfpage
handbook, halfpage
Iq
(mA)
THD
(%)
(3)
(1)
10
1
5
10−1
10−2
10−2
0
0
4
8
12
20
16
VCC (V)
1
Po (W)
f = 1 kHz, Gv = 20 dB.
(1) VCC = 5 V, RL = 8 Ω.
(2) VCC = 7.5 V, RL = 8 Ω.
(3) VCC = 9 V, RL = 16 Ω.
RL = ∞.
Fig.5 Iq as a function of VCC.
1997 Jun 12
10−1
(2)
Fig.6 THD as a function of Po.
8
10
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
MGK409
10
MGD879
−20
handbook, halfpage
handbook, halfpage
THD
(%)
SVRR
(dB)
1
−40
(1)
(1)
(3)
(2)
(2)
10−1
10−2
10
−60
103
102
104
f (Hz)
(3)
−80
10
105
Po = 0.5 W, Gv = 20 dB.
(1) VCC = 5 V, RL = 8 Ω.
(2) VCC = 7.5 V, RL = 8 Ω.
(3) VCC = 9 V, RL = 16 Ω.
102
103
104
f (Hz)
105
VCC = 5 V, 8 Ω, Rs = 0 Ω, Vr = 100 mV.
(1) Gv = 30 dB.
(2) Gv = 20 dB.
(3) Gv = 6 dB.
Fig.7 THD as a function of frequency.
Fig.8 SVRR as a function of frequency.
MGK405
2.5
Po
(W)
MGK406
2
handbook, halfpage
handbook, halfpage
P
(W)
2
1.5
(1)
(2)
1.5
(1)
(2)
(3)
1
(3)
1
0.5
0.5
0
0
0
4
8
VCC (V)
0
12
8
VCC (V)
12
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
THD = 10%.
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
Fig.10 Worst case power dissipation as a function
of VCC.
Fig.9 Po as a function of VCC.
1997 Jun 12
4
9
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
MGK407
2
P
(W)
(3)
10
o
(V)
1
(1)
10−1
handbook, halfpage
MGD883
handbook,
V halfpage
1.6
10−2
1.2
(1)
(2)
(3)
10−3
(2)
0.8
10−4
0.4
10−5
10−6
10−1
0
0
0.5
1
1.5
2
Po (W)
2.5
Sine wave of 1 kHz.
(1) VCC = 9 V, RL = 16 Ω.
(2) VCC = 5 V, RL = 8 Ω.
(3) VCC = 7.5 V, RL = 8 Ω.
MGL070
16
Vms
(V)
12
standby
8
mute
4
operating
0
8
12
VP (V)
16
Fig.13 Vms as a function of VP.
1997 Jun 12
Vms (V)
Fig.12 Vo as a function of Vms.
handbook, halfpage
4
10
Band-pass = 22 Hz to 22 kHz.
(1) VCC = 3 V.
(2) VCC = 5 V.
(3) VCC = 12 V.
Fig.11 P as a function of Po.
0
1
10
102
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
SE APPLICATION
handbook, full pagewidth
VCC
C1
R2
110 kΩ
IN−
R1
1 µF 11 kΩ
IN+
Vin
SVR
C2
47 µF
MODE
100 µF
100 nF
12
6
C3
OUT−
11
5
TDA8543
470 µF
4
14
3
RL
OUT+
13
GND
MGK408
R2
Gain = -------R1
Fig.14 SE application.
MGD884
10
MGD885
10
handbook, halfpage
handbook, halfpage
THD
(%)
THD
(%)
1
1
(1)
(1)
(2)
10−1
10−1
(3)
(2)
(3)
10−2
10−2
10−1
1
Po (W)
10−2
10
10
f = 1 kHz, Gv = 20 dB.
(1) VCC = 7.5 V, RL = 4 Ω.
(2) VCC = 9 V, RL = 8 Ω.
(3) VCC = 12 V, RL = 16 Ω.
103
104
f (Hz)
105
Po = 0.5 W, Gv = 20 dB.
(1) VCC = 7.5 V, RL = 4 Ω.
(2) VCC = 9 V, RL = 8 Ω.
(3) VCC = 12 V, RL = 16 Ω.
Fig.15 THD as a function of Po.
1997 Jun 12
102
Fig.16 THD as a function of frequency.
11
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
MGD886
−20
MGD887
2
handbook, halfpage
handbook, halfpage
Po
(W)
SVRR
(dB)
1.6
−40
(1)
(3)
(2)
1.2
(1)
0.8
(2)
−60
(3)
−80
10
102
0.4
103
104
f (Hz)
0
105
0
VCC = 7.5 V, RL = 4 Ω, Rs = 0 Ω, Vi = 100mV.
(1) Gv = 24 dB.
(2) Gv = 20 dB.
(3) Gv = 0 dB.
4
8
12
VCC (V)
16
(1) THD = 10%, RL = 4 Ω.
(2) THD = 10%, RL = 8 Ω.
(3) THD = 10%, RL = 16 Ω.
Fig.17 SVRR as a function of frequency.
Fig.18 Po as a function of VCC.
MGD888
1.6
MGD889
1.2
handbook, halfpage
handbook, halfpage
P
(W)
(1)
P
(W)
(2)
1.2
0.8
(3)
(1)
(2)
(3)
0.8
0.4
0.4
0
0
0
4
8
12
VCC (V)
0
16
(1) RL = 4 Ω.
(2) RL = 8 Ω.
(3) RL = 16 Ω.
0.8
1.2
Po (W)
(1) VCC = 7.5 V, RL = 4 Ω.
(2) VCC = 12 V, RL = 16 Ω.
(3) VCC = 9 V, RL = 8 Ω.
Fig.19 Worst case power dissipation as a function
of VCC.
1997 Jun 12
0.4
Fig.20 P as a function of Po.
12
1.6
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
handbook, full pagewidth
a. Top view.
10 kΩ
MS
10 kΩ
16
1
IN
1 µF
11 kΩ
TDA8543
8
OUT+
9
56 kΩ
47 µF
OUT−
100 nF
100 µF
+VP
MGK411
b. Component side.
Fig.21 Printed-circuit board layout (BTL and SE).
1997 Jun 12
13
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT38-1
050G09
MO-001AE
1997 Jun 12
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
14
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.050
0.041
0.228
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.01
0.01
0.028
0.004
0.012
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07S
MS-012AC
1997 Jun 12
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
15
o
8
0o
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
SOLDERING
Introduction
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
DIP
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
1997 Jun 12
16
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Jun 12
17
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
NOTES
1997 Jun 12
18
Philips Semiconductors
Product specification
2 W BTL audio amplifier
TDA8543
NOTES
1997 Jun 12
19
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Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1997
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/50/01/pp20
Date of release: 1997 Jun 12
Document order number:
9397 750 02232