NL17SV32 Single 2-Input OR Gate The NL17SV32 is an ultra−high performance 2 input OR gate manufactured in 0.35 mm technology with excellent performance down to 0.9 V. This device is ideal for extremely high−speed and high−drive applications. Additionally, limitations of board space are no longer a constraint. The very small SOT−553 makes this device fit most tight designs and spaces. http://onsemi.com MARKING DIAGRAM Features • • • • • • • Extremely High Speed: tPD = 1.0 ns (Typ) at VCC = 3.3 V Designed for 0.9 to 3.3 V Operation Overvoltage Tolerance (OVT)* Input Pins Permit Logic Translation Balanced ±24 mA Output Drive @ 3.3 V Near Zero Static Supply Current Ultra−Tiny SOT−553 5 Pin Package Only 1.6 x 1.6 x 0.6 mm These Devices are Pb−Free and are RoHS Compliant 5 1 UM M G G SOT−553 CASE 463B UM = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) Typical Applications • • • • PIN DIAGRAM Cellular Digital Camera PDA Digital Video Important Information A 1 B 2 GND 3 5 VCC 4 Y • High ESD Ratings for Handling: • Human Body Model: 2000 V Machine Model: 200 V Latchup Max Rating: 500 mA PIN ASSIGNMENT Industry Standard • Compatible with Fairchild’s NC7SV32 and TI’s SN74AUC1G32 FUNCTION TABLE Input A Input B Output Y L L L L H H H L H H H H 1 Input A 2 Input B 3 GND − 4 Output Y 5 VCC − ORDERING INFORMATION Device Package NL17SV32XV5T2G SOT−553 (Pb−Free) IN A IN B w1 Shipping† 4000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. OUT Y Figure 1. Logic Symbol *Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. © Semiconductor Components Industries, LLC, 2014 May, 2014 − Rev. 5 1 Publication Order Number: NL17SV32XV5T2/D NL17SV32 MAXIMUM RATINGS Symbol VCC Rating Value Units DC Supply Voltage −0.5 to +4.6 V VI DC Input Voltage −0.5 to +4.6 V VO DC Output Voltage −0.5 to VCC + 0.5 V IIK DC Input Diode Current VIN < 0 V −50 DC Output Diode Current VOUT < 0 V VOUT > VCC −50 +50 IO DC Output Sink Current ±50 mA IOK mA mA ICC DC Supply Current per Supply Pin ±50 mA IGND DC Ground Current per Ground Pin ±50 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1.0 mm from Case for 10 seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL FR Moisture Sensitivity Level 1 Flammability Rating Oxygen index: 28 to 34 UL 94 V−0 @ 0125 in Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units 0.9 3.6 V Digital Input Voltage 0 3.6 V Output Voltage 0 VCC V VCC Positive DC Supply Voltage VIN Vout IOH/IOL tA tr, tf Output Current VCC = 3.0 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.4 V to 1.6 V VCC = 1.1 V to 1.3 V VCC = 0.9 V ±24 ±18 ±6 ±4 ±2 ±0.1 Operating Temperature Range. All Package Types −40 Input Rise or Fall Time VCC = 3.3V ± 0.3 V +85 mA °C nS/V 0 10 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 2 NL17SV32 DC CHARACTERISTICS – Digital Section (Voltages Referenced to GND) TA = 25°C Symbol Parameter Condition VCC Min 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 VIH High Level Input Voltage 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 VIL Low Level Input Voltage 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 VOH High Level Output Voltage VOL Low Level Output Voltage IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current TA = −40 to 85°C Max Min Max 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 Units V 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 V IOH = −100 mA 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 IOH = −2.0 mA 1.10 ≤ VCC ≤ 1.30 0.75 x VCC 0.75 x VCC IOH = −4.0 mA 1.40 ≤ VCC ≤ 1.60 0.75 x VCC 0.75 x VCC IOH = −6.0 mA 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 1.25 2.0 1.25 2.0 IOH = −12 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 1.8 2.2 1.8 2.2 IOH = −18 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 1.7 2.4 1.7 2.4 IOH = −24 mA 2.70 ≤ VCC ≤ 3.60 2.2 2.2 IOL = 100 mA 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 IOL = 2.0 mA 1.10 ≤ VCC ≤ 1.30 0.25 x VCC 0.25 x VCC IOL = 4.0 mA 1.40 ≤ VCC ≤ 1.60 0.25 x VCC 0.25 x VCC IOL = 6.0 mA 1.65 ≤ VCC ≤ 1.95 0.3 0.3 IOL = 12 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 0.4 0.4 0.4 0.4 IOL = 18 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 0.6 0.4 0.6 0.4 IOL = 24 mA 2.70 ≤ VCC ≤ 3.60 0.55 0.55 0 = VI = 3.6 V 0.90 to 3.60 ±0.1 ±0.9 mA 0 1 5 mA 0.90 to 3.60 0.9 5 mA VI = VCC or GND http://onsemi.com 3 V V NL17SV32 AC CHARACTERISTICS (Input tr = tf = 3.0 nS) −40°C Parameter Symbol TPHL, TPLH CIN Propagation Delay 25°C Min Typ 85°C Condition VCC Max Min Max CL = 15 pF, RL = 1.0 MW 0.90 CL = 15 pF, RL = 2.0 kW 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 3.0 1.0 6.0 3.2 15.8 8.7 1.0 1.0 18.6 9.7 nS CL = 30 pF, RL = 500 W 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 1.0 0.8 0.7 2.0 1.2 1.0 6.0 4.1 3.3 1.0 0.7 0.6 6.8 4.7 4.0 nS 13 Units nS Input Capacitance 0 2.0 pF COUT Output Capacitance 0 4.5 pF CPD Power Dissipation Capacitance 0.90 to 3.60 20 pF VI = 0 V or VCC F = 10 MHz DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 http://onsemi.com 4 NL17SV32 PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B ISSUE C D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.65 1.20 1.25 0.50 BSC 0.10 0.20 0.30 1.55 1.60 1.65 MIN 0.50 0.17 0.08 1.55 1.15 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.008 0.004 0.061 0.063 MIN 0.020 0.007 0.003 0.061 0.045 MAX 0.024 0.011 0.007 0.065 0.049 0.012 0.065 RECOMMENDED SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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