No. 1 LTM9004 204LD 22mm X 15mm X 2.91mm (TABLE OF MATERIAL DECLARATION) The LTM9004 is RoHS compliant per EU RoHS Directive 2003/95/EC. It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Material Mass Materials Analysis Component Materials Analysis (element) CAS Number Part Name Material Name (gram) (weight %) Weight (gram) Acrylic Resin non-disclosure 0.0092 2.13 Substrate Circuit Board 0.43054 Phthalcyanine Blue, Organic Pigment non-disclosure 0.0001 0.02 Barium Sulfate Silica Talc Aromatic Carbony Compound Amine Compound Levelling Agents & Others 7727-43-7 14808-60-7 non-disclosure non-disclosure non-disclosure non-disclosure 0.0047 0.0023 0.0023 0.0009 0.0001 0.0006 1.09 0.54 0.54 0.21 0.03 0.13 Dipropylene Glyco Monomethy Ether 34590948 0.0033 0.77 3-Methoxy-3-Methyl Butyl-Acetate non-disclosure 0.0051 1.19 High Bopling Point Petroleum Solvent non-disclosure 0.0009 0.20 Acrylic Monomer Epoxy Resin Organic Filler Continuos Filament Fiber Glass Copper non-disclosure 85954-11-6 non-disclosure 65997-17-3 7440-50-8 105391-33-1 /25722-66-1 9003-36-5 21645-51-2 25722-66-1 0.0014 0.0048 0.0005 0.0527 0.2340 0.33 1.12 0.11 12.24 54.35 0.0220 5.10 0.0220 0.0404 0.0211 0.0018 0.0004 0.0344 0.0018 0.0001 0.0001 0.0010 5.10 9.38 4.89 0.41 0.09 95.00 5.00 8.00 8.00 84.00 2.58 1.31 2.55 2.02 91.54 32.00 Bismaleimide/Triazine 2 Solder Paste 3 Epoxy 4 Passive Components 5 Passive Alloy 0.03625 0.00117 Resistor Capacitor 0.01481 0.00078 Epoxy Resin Inorganic Filler Triazine Nickel Plating Soft Gold Sn Sb Di-ester resin Functionalized ester Silver Conductor/Resistor Glass Epoxy Nickel (Ni) Tin (Sn) Ceramic (Oxides) Copper (Cu) 7440-02-0 7440-57-5 7440-31-5 7440-36-0 non-disclosure non-disclosure 7440-22-4 non-disclosure non-disclosure 7440-02-0 7440-31-5 1344-28-1 7440-50-8 0.0004 0.0002 0.0004 0.0003 0.0136 0.0002 No. Part Name Material Name Component Weight (gram) Materials Analysis (element) CAS Number Material Mass (gram) Nickel (Ni) Tin (Sn) Ceramic (Ba) Compounds Iron Powder (Fe) Copper (Cu) Nickel (Ni) Tin (Sn) 7440-02-0 7440-31-5 12047-27-7 7439-89-6 7440-50-8 7440-02-0 7440-31-5 0.0001 0.0000 0.0004 0.0963 0.0227 0.0001 0.0007 MDS attached Silicon Au Fused Silica Epoxy Resin Phenol Resin Crytalline Silica Carbon Black Metal Hydroxide 7440-21-3 7440-57-5 60676-86-0 non-disclosure non-disclosure 14808-60-7 1333-86-4 non-disclosure 0.0364 0.0066 0.0024 1.1830 0.1364 0.1364 0.0460 0.0077 0.0230 Components 6 Passive Components inductor 0.11986 7 8 9 10 Active Components LTC-QFN Silicon Gold Epoxy Resin 0.03640 0.00664 0.00237 1.53236 Active Ics Wire Encapsulation Total Package Weight 2.18 Note: Composition derived from MSDS and material C of C from Vendors. Component Weight based on assembly of generic part * MDS for LTC-QFN is attached on Page 2 Materials Analysis (weight %) 8.00 2.40 57.60 80.38 18.91 0.10 0.62 100.00 100.00 99.99 77.20 8.90 8.90 3.00 0.50 1.50 LINEAR TECHNOLOGY MATERIALS DECLARATION LT5575EUF QFN 4mm X 4mm Exp. Pad (Engineering Calculation) (printed on: 2013-01-08 14:33:48) TOTAL MASS (g): 0.0364019982517 COMPONENT MATERIAL VENDOR/ INDUSTRY NAMES CONSTITUENT NAME CAS NUMBER CONSTITUENT MASS (g) CONSTITUENT (PPM) OF MATERIAL CONSTITUENT (PPM) OF TOTAL PKG. Active Device Linear Technology Silicon (Si) 7440-21-3 0.001077 1000000 29586 Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0 Lead Frame Cu Copper (Cu) 7440-50-8 0.012129 975000 333196 Iron (Fe) 7439-89-6 0.000299 24000 8214 Phosporus (P) 7723-14-0 0.000004 300 110 Zinc (Zn) 7440-66-6 0.000009 700 247 Nickel (Ni) 7440-02-0 0.000000 0 0 Silicon (Si) 7440-21-3 0.000000 0 0 Magnesium (Mg) 7439-95-4 0.000000 0 0 Tin (Sn) 7440-31-5 0.000000 0 0 0.012441 1000000 341767 Lead Frame Total: Plating PMI Exter. Plating Pb 7439-92-1 0.000092 150082 2527 Exter. Plating Sn 7440-31-5 0.000521 849918 849918 0.000613 1000000 16839 External Plating Total: Inter. Plating Ni 7440-02-0 0.000000 0 0 Inter. Plating Ag 7440-22-4 0.000278 1000000 7637 0.000278 1000000 7637 Internal Plating Total: Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000618 750000 16977 Tin (Sn) 7440-31-5 0.000000 0 0 Lead (Pb) 7439-92-1 0.000000 0 0 Silica (SiO2) 60676-86-0 0.000000 0 0 Indium (In) 7440-74-6 0.000000 0 0 0.000000 0 0 0.000000 0 0 0.000206 250000 5659 0.000824 1000000 22636 0.002739 130000 75243 Metal Oxide Antimony (Sb) 7440-36-0 Resin (EP) Die Attach Total: Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP) Bromine (Br) 40039-93-8 0.000000 0 0 Silica (SiO2) 60676-86-0 0.018120 860000 497775 Antimony Trioxide (Sb2O3) 1309-64-4 0.000000 0 0 0.000000 0 0 0.000211 10000 5796 0.021070 1000000 578814 0.000099 1000000 2720 Metal Hydroxide Carbon Black (C) 1333-86-4 Encapsulation Total: Bond Wire Estimated AFW/TANAKA/ Kn Gold (Au) 7440-57-5 TOTAL MASS (g): 0.036402