Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish CSP BGA 12 X 12 44 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size (mm) 0.60 Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal CAS# Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.54 E-01 1.08 E-02 1.08 E-02 2.69 E-03 5.38 E-04 1.79 E-01 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 41.63 2.90 2.90 0.72 0.14 48.30 PPM 416332 28979 28979 7245 1449 482983 Laminate Homogeneous Material Level Description Composite Other inorganic materials Thermoset Thermoset Thermoset Copper & its alloys Other organic materials Other inorganic materials Other organic materials Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Others Other organic materials Other inorganic materials Other organic materials Other organic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Substance Glass Cloth Inorganic Filler Epoxy Flame Resistant Epoxy Resin Heat Resistant Resin Copper Foil Laminate Core Subtotal Acrylate resin Barium Sulfate, Silica, Talc 3-Methoxy-3-Methyl Butyl-Acetate Epoxy resin Dipropylene gylcol monomethyl ether Acrylic monomer Aromatic Carbonyl compound High Boiling Point Petroleum Solvent Levelling Agents & Others Organic Filler Amine Compound Phthalcyanine Blue, Organic Pigment Diethylene Glycol Monoethyl Ether Acetate Soldermask Subtotal Copper Nickel Gold CAS# Component Level Weight (g) 2.33 E-02 5.06 E-04 1.16 E-02 7.59 E-03 7.59 E-03 3.70 E-02 5.06 E-02 2.76 E-03 2.82 E-03 1.55 E-03 1.44 E-03 9.86 E-04 4.23 E-04 2.71 E-04 2.60 E-04 1.08 E-04 1.41 E-04 4.34 E-05 2.17 E-05 1.08 E-05 1.08 E-02 4.11 E-02 2.05 E-02 2.89 E-03 1.63 E-01 65997-17-3 Proprietary 7328-97-4 Proprietary Proprietary 7440-50-8 Proprietary 7727-43-7/ 7440-50-8 / 14807-96-6 Proprietary 85954-11-6 34590-94-8 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 14.29 0.31 7.14 4.66 4.66 22.72 53.77 1.70 1.73 0.95 0.88 0.61 0.26 0.17 0.16 0.07 0.09 0.03 0.01 0.01 6.65 25.24 12.56 1.77 100.00 142864 3106 71432 46586 46586 227171 537745 16955 17288 9508 8843 6051 2593 1662 1596 665 864 266 133 66 66491 252412 125641 17710 1000000 6.28 0.14 3.14 2.05 2.05 9.98 23.62 0.74 0.76 0.42 0.39 0.27 0.11 0.07 0.07 0.03 0.04 0.012 0.006 0.003 2.92 11.09 5.52 0.78 43.93 PPM 62763 1364 31381 20466 20466 99800 236241 7449 7595 4177 3885 2658 1139 730 701 292 380 117 58 29 29211 110889 55196 7780 439317 Solder Ball Homogeneous Material Level Substance Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Tin Silver Copper CAS# Component Level Weight (g) 7440-31-5 7440-22-4 7440-50-8 1.58 E-02 4.92 E-04 8.20 E-05 1.64 E-02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 4.27 0.13 0.02 4.42 PPM 42661 1326 221 44208 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 8.24 E-04 8.32 E-06 8.32 E-04 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 0.22 0.00 0.22 PPM 2220 22 2242 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon Weight (g) CAS# 7440-21-3 1.09 E-02 Percentage (%) PPM Percentage (%) 100 1000000 2.95 PPM 29478 Die Attach Component Level Homogeneous Material Level Description Other inorganic materials Other organic materials Other organic materials Thermoset Other organic materials Subtotal Substance Silicon dioxide Bismaleimide monomer Acrylate monomer Epoxy resin Acryric resin CAS# Weight (g) 60676-86-0 TS #10049 TS #10050 TS #10042 TS #10051 3.17 E-04 2.05 E-04 5.60 E-05 5.60 E-05 2.24 E-05 6.57 E-04 Weight (g) 3.71 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 48.30 31.25 8.52 8.52 3.41 100.00 483000 312500 85200 85200 34100 1000000 0.09 0.06 0.02 0.02 0.01 0.18 Percentage (%) 100.00 PPM 855 553 151 151 60 1771 PPM 1000000