pdf

Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
CSP BGA
12 X 12
44
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size (mm)
0.60
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
CAS#
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
1.54 E-01
1.08 E-02
1.08 E-02
2.69 E-03
5.38 E-04
1.79 E-01
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
41.63
2.90
2.90
0.72
0.14
48.30
PPM
416332
28979
28979
7245
1449
482983
Laminate
Homogeneous Material Level
Description
Composite
Other inorganic materials
Thermoset
Thermoset
Thermoset
Copper & its alloys
Other organic materials
Other inorganic materials
Other organic materials
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Substance
Glass Cloth
Inorganic Filler
Epoxy
Flame Resistant Epoxy Resin
Heat Resistant Resin
Copper Foil
Laminate Core Subtotal
Acrylate resin
Barium Sulfate, Silica, Talc
3-Methoxy-3-Methyl Butyl-Acetate
Epoxy resin
Dipropylene gylcol monomethyl ether
Acrylic monomer
Aromatic Carbonyl compound
High Boiling Point Petroleum Solvent
Levelling Agents & Others
Organic Filler
Amine Compound
Phthalcyanine Blue, Organic Pigment
Diethylene Glycol Monoethyl Ether Acetate
Soldermask Subtotal
Copper
Nickel
Gold
CAS#
Component Level
Weight (g)
2.33 E-02
5.06 E-04
1.16 E-02
7.59 E-03
7.59 E-03
3.70 E-02
5.06 E-02
2.76 E-03
2.82 E-03
1.55 E-03
1.44 E-03
9.86 E-04
4.23 E-04
2.71 E-04
2.60 E-04
1.08 E-04
1.41 E-04
4.34 E-05
2.17 E-05
1.08 E-05
1.08 E-02
4.11 E-02
2.05 E-02
2.89 E-03
1.63 E-01
65997-17-3
Proprietary
7328-97-4
Proprietary
Proprietary
7440-50-8
Proprietary
7727-43-7/ 7440-50-8 / 14807-96-6
Proprietary
85954-11-6
34590-94-8
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
14.29
0.31
7.14
4.66
4.66
22.72
53.77
1.70
1.73
0.95
0.88
0.61
0.26
0.17
0.16
0.07
0.09
0.03
0.01
0.01
6.65
25.24
12.56
1.77
100.00
142864
3106
71432
46586
46586
227171
537745
16955
17288
9508
8843
6051
2593
1662
1596
665
864
266
133
66
66491
252412
125641
17710
1000000
6.28
0.14
3.14
2.05
2.05
9.98
23.62
0.74
0.76
0.42
0.39
0.27
0.11
0.07
0.07
0.03
0.04
0.012
0.006
0.003
2.92
11.09
5.52
0.78
43.93
PPM
62763
1364
31381
20466
20466
99800
236241
7449
7595
4177
3885
2658
1139
730
701
292
380
117
58
29
29211
110889
55196
7780
439317
Solder Ball
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
Copper
CAS#
Component Level
Weight (g)
7440-31-5
7440-22-4
7440-50-8
1.58 E-02
4.92 E-04
8.20 E-05
1.64 E-02
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
4.27
0.13
0.02
4.42
PPM
42661
1326
221
44208
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
8.24 E-04
8.32 E-06
8.32 E-04
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
0.22
0.00
0.22
PPM
2220
22
2242
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
Weight (g)
CAS#
7440-21-3
1.09 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
2.95
PPM
29478
Die Attach
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Subtotal
Substance
Silicon dioxide
Bismaleimide monomer
Acrylate monomer
Epoxy resin
Acryric resin
CAS#
Weight (g)
60676-86-0
TS #10049
TS #10050
TS #10042
TS #10051
3.17 E-04
2.05 E-04
5.60 E-05
5.60 E-05
2.24 E-05
6.57 E-04
Weight (g)
3.71 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
48.30
31.25
8.52
8.52
3.41
100.00
483000
312500
85200
85200
34100
1000000
0.09
0.06
0.02
0.02
0.01
0.18
Percentage (%)
100.00
PPM
855
553
151
151
60
1771
PPM
1000000