Product / Package Information Environmental Information Package Body Size Ball Count Terminal Finish CSP BGA 19 X 19 mm 324 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size 0.60 mm Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal CAS# Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.48 E-01 1.03 E-02 1.03 E-02 2.58 E-03 5.16 E-04 1.72 E-01 Component Level Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 14.72 1.02 1.02 0.26 0.05 17.08 PPM 147205 10246 10246 2562 512 170771 Laminate Homogeneous Material Level Substance Description Thermoset Other inorganic materials Others Copper & its alloys Other inorganic materials Thermoset Others Prepreg resin Prepreg Glass Cloth Prepreg Filler Copper Foil Glass Cloth Core Resin Core Filler Thermoset Other inorganic materials Other organic materials Thermoset Other organic materials Other inorganic materials Other organic materials Other organic materials Other organic materials Others Other organic materials Other organic materials Other organic materials Soldermask Acrylate Resin Barium Sulfate, Silica, Talc 3-Methoxy-3-Methyl Butyl-Acetate Epoxy Resin Dipropylene glycol monomethyl ether Barium Sulfate Acrylic Monomer Aromatic Carbonyl Compound High Boiling Point Petroleum Solvent Levelling Agents & Others Organic Fillers Amine Compound Phthalcyanine Green, Organic Pigment Copper & its alloys Nickel & its alloys Precious metals Subtotal Copper Nickel Gold CAS# Component Level Weight (g) Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 6.98 E-02 4.27 E-02 4.27 E-02 7.52 E-02 1.79 E-02 3.02 E-02 3.34 E-02 3.12 E-01 3.04 E-02 2.32 E-02 1.71 E-02 1.60 E-02 1.09 E-02 7.81 E-03 4.68 E-03 3.03 E-03 2.87 E-03 1.91 E-03 1.54 E-03 4.78 E-04 2.66 E-04 1.20 E-01 9.57 E-02 3.19 E-03 5.31 E-04 5.31 E-01 Laminate Core Subtotal Proprietary Proprietary Proprietary Proprietary 34590-94-8 7727-43-7 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Soldermask Subtotal 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 13.14 8.03 8.03 14.16 3.36 5.69 6.28 58.69 5.72 4.36 3.21 3.01 2.06 1.47 0.88 0.57 0.54 0.36 0.29 0.09 0.05 22.61 18.00 0.60 0.10 100.0 131400 80300 80300 141600 33600 56900 62800 586900 57200 43600 32100 30100 20600 14700 8800 5700 5400 3600 2900 900 500 226100 180000 6000 1000 1000000 6.93 4.24 4.24 7.47 1.77 3.00 3.31 30.96 3.02 2.30 1.69 1.59 1.09 0.78 0.46 0.30 0.28 0.19 0.15 0.05 0.03 11.93 9.50 0.32 0.05 53 PPM 69320 42362 42362 74701 17726 30018 33130 309620 30176 23001 16934 15879 10868 7755 4642 3007 2849 1899 1530 475 264 119279 94959 3165 528 527551 Solder Ball Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Weight (g) CAS# 7440-31-5 7440-22-4 7440-50-8 Tin Silver Copper 2.62 E-01 8.14 E-03 1.36 E-03 2.71 2 71 E E-01 01 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 25.99 0.81 0.13 26 93 26.93 PPM 259881 8079 1347 269306 Bond Wires Homogeneous Material Level Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# Weight (g) 7440-57-5 7440-05-3 1.39 E-02 1.40 E-04 1.40 E-02 Component Level Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 1.38 0.01 1.39 PPM 13766 139 13905 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 1.67 E-02 Component Level Percentage (%) PPM Percentage (%) 100 1000000 1.65 PPM 16536 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Other organic materials Thermoset Subtotal Substance Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin CAS# Weight (g) 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary 1.29 E-03 3.21 E-04 1.21 E-04 1.21 E-04 4.82 E-05 4.82 E-05 1.94 E-03 Weight (g) 1.01 E+00 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level Percentage (%) PPM Percentage (%) 66.11 16.53 6.20 6.20 2.48 2.48 100.00 661100 165300 62000 62000 24800 24800 1000000 0.13 0.03 0.01 0.01 0.005 0.005 0.19 Percentage (%) 100.00 PPM 1276 319 120 120 48 48 1931 PPM 1000000