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Product / Package Information
Environmental Information
Package
Body Size
Ball Count
Terminal Finish
CSP BGA
19 X 19 mm
324
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size
0.60 mm
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
1.48 E-01
1.03 E-02
1.03 E-02
2.58 E-03
5.16 E-04
1.72 E-01
Component Level
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
14.72
1.02
1.02
0.26
0.05
17.08
PPM
147205
10246
10246
2562
512
170771
Laminate
Homogeneous Material Level
Substance
Description
Thermoset
Other inorganic materials
Others
Copper & its alloys
Other inorganic materials
Thermoset
Others
Prepreg resin
Prepreg Glass Cloth
Prepreg Filler
Copper Foil
Glass Cloth
Core Resin
Core Filler
Thermoset
Other inorganic materials
Other organic materials
Thermoset
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Other organic materials
Other organic materials
Soldermask Acrylate Resin
Barium Sulfate, Silica, Talc
3-Methoxy-3-Methyl Butyl-Acetate
Epoxy Resin
Dipropylene glycol monomethyl ether
Barium Sulfate
Acrylic Monomer
Aromatic Carbonyl Compound
High Boiling Point Petroleum Solvent
Levelling Agents & Others
Organic Fillers
Amine Compound
Phthalcyanine Green, Organic Pigment
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Copper
Nickel
Gold
CAS#
Component Level
Weight (g)
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
6.98 E-02
4.27 E-02
4.27 E-02
7.52 E-02
1.79 E-02
3.02 E-02
3.34 E-02
3.12 E-01
3.04 E-02
2.32 E-02
1.71 E-02
1.60 E-02
1.09 E-02
7.81 E-03
4.68 E-03
3.03 E-03
2.87 E-03
1.91 E-03
1.54 E-03
4.78 E-04
2.66 E-04
1.20 E-01
9.57 E-02
3.19 E-03
5.31 E-04
5.31 E-01
Laminate Core Subtotal
Proprietary
Proprietary
Proprietary
Proprietary
34590-94-8
7727-43-7
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Soldermask Subtotal
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
13.14
8.03
8.03
14.16
3.36
5.69
6.28
58.69
5.72
4.36
3.21
3.01
2.06
1.47
0.88
0.57
0.54
0.36
0.29
0.09
0.05
22.61
18.00
0.60
0.10
100.0
131400
80300
80300
141600
33600
56900
62800
586900
57200
43600
32100
30100
20600
14700
8800
5700
5400
3600
2900
900
500
226100
180000
6000
1000
1000000
6.93
4.24
4.24
7.47
1.77
3.00
3.31
30.96
3.02
2.30
1.69
1.59
1.09
0.78
0.46
0.30
0.28
0.19
0.15
0.05
0.03
11.93
9.50
0.32
0.05
53
PPM
69320
42362
42362
74701
17726
30018
33130
309620
30176
23001
16934
15879
10868
7755
4642
3007
2849
1899
1530
475
264
119279
94959
3165
528
527551
Solder Ball
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Weight (g)
CAS#
7440-31-5
7440-22-4
7440-50-8
Tin
Silver
Copper
2.62 E-01
8.14 E-03
1.36 E-03
2.71
2 71 E
E-01
01
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
25.99
0.81
0.13
26 93
26.93
PPM
259881
8079
1347
269306
Bond Wires
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
Weight (g)
7440-57-5
7440-05-3
1.39 E-02
1.40 E-04
1.40 E-02
Component Level
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
1.38
0.01
1.39
PPM
13766
139
13905
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Weight (g)
7440-21-3
1.67 E-02
Component Level
Percentage (%)
PPM
Percentage (%)
100
1000000
1.65
PPM
16536
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Thermoset
Subtotal
Substance
Silver
Polymeric material
Acrylate resin
Diester resin
Functionalized urethane resin
Epoxy resin
CAS#
Weight (g)
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
1.29 E-03
3.21 E-04
1.21 E-04
1.21 E-04
4.82 E-05
4.82 E-05
1.94 E-03
Weight (g)
1.01 E+00
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
Percentage (%)
PPM
Percentage (%)
66.11
16.53
6.20
6.20
2.48
2.48
100.00
661100
165300
62000
62000
24800
24800
1000000
0.13
0.03
0.01
0.01
0.005
0.005
0.19
Percentage (%)
100.00
PPM
1276
319
120
120
48
48
1931
PPM
1000000