Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish BGA_ED 12 X 12 196 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size (mm) 0.45 Yes Yes Yes Yes Materials Declaration Heat Spreader Epoxy 1 Homogeneous Material Level Substance Description Other inorganic materials Other organic materials Subtotal Aluminum oxide Dimethyl siloxane Subtotal CAS# Component Level Weight (g) Proprietary 68083-19-2 7.00 E-03 3.00 E-03 1.00 E-02 Percentage (%) PPM Percentage (%) 70.0 30.0 100.0 700000 300000 1000000 1.03 0.44 1.47 PPM 10318 4422 14740 Heat Spreader Epoxy 2 Description Precious metals Other organic materials Other organic materials Subtotal Substance Silver Methacrylate Bismaleimide Subtotal CAS# Weight (g) 7440-22-4 7534-94-3 Proprietary 2.74 E-03 2.57 E-04 2.05 E-04 3.20 E-03 Homogeneous Material Level Percentage (%) PPM 85.6 855600 8.0 80200 6.4 64200 100.0 1000000 Component Level Percentage (%) 0.40 0.04 0.03 0.47 PPM 4036 378 303 4717 Heat Spreader Homogeneous Material Level Description Copper & its alloys Nickel & its alloys Subtotal Substance CAS# 7440-50-8 7440-02-0 Copper Nickel Component Level Weight (g) 3.30 E-01 3.34 E-03 3.34 E-01 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 48.69 0.49 49.18 PPM 486909 4918 491827 Laminate Homogeneous Material Level Substance Description Copper & its alloys Composite Other inorganic materials Thermoset Thermoset Thermoset Other organic materials Other inorganic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Other organic materials Copper & its alloys Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Copper Foil Glass Cloth Inorganic Filler Epoxy Flame Resistant Epoxy Resin Heat Resistant Resin Laminate Core Subtotal Acrylic Resin Barium Sulfate, Silica, Talc Epoxy Resin Acrylic Monomer Aromatic Carbonyl Compound Levelling Agents & Others Amine Compound Phthalcyanine Blue, Organic Pigment Soldermask Subtotal Copper Plating Tin Silver Copper CAS# Component Level Weight (g) 2.45 E-02 4.90 E-02 1.96 E-02 9.78 E-03 9.78 E-03 9.78 E-03 1.22 E-01 2.69 E-03 1.41 E-03 1.24 E-03 4.86 E-04 2.43 E-04 4.42 E-05 2.21 E-05 2.21 E-05 6.16 E-03 9.17 E-02 5.52 E-04 2.21 E-05 2.21 E-06 2.21 E-01 7440-50-8 65997-17-3 Proprietary 7328-97-4 Proprietary Proprietary Proprietary 7727-43-7/ 14807-96-6 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 7440-50-8 7440-31-5 7440-22-4 7440-50-8 Percentage (%) PPM Percentage (%) 11.10 22.17 8.87 4.43 4.43 4.43 55.43 1.22 0.64 0.56 0.22 0.11 0.02 0.01 0.01 2.79 41.52 0.25 0.01 0.001 100.00 111000 221700 88700 44300 44300 44300 554300 12200 6400 5600 2200 1100 200 100 100 27900 415190 2500 100 10 1000000 3.61 7.22 2.89 1.44 1.44 1.44 18.04 0.40 0.21 0.18 0.07 0.04 0.01 0.003 0.003 0.91 13.51 0.08 0.003 0.0003 32.55 PPM 36131 72164 28872 14420 14420 14420 180426 3971 2083 1823 716 358 65 33 33 9081 135145 814 33 3 325502 Solder Ball Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Substance Tin Silver Copper Component Level Weight (g) CAS# 7440-31-5 7440-22-4 7440-50-8 6.69 E-02 2.08 E-03 3.47 E-04 6.93 E-02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 9.86 0.31 0.05 10.22 PPM 98613 3066 511 102190 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon Component Level Weight (g) CAS# 7440-21-3 3.32 E-02 Percentage (%) PPM Percentage (%) 100 1000000 4.90 PPM 48991 Wafer Bumps Homogeneous Material Level Substance Description Tin & its alloys Tin & its alloys Subtotal Tin Silver CAS# Component Level Weight (g) 7440-31-5 7440-22-4 4.09 E-03 7.50 E-05 4.16 E-03 Percentage (%) PPM Percentage (%) 98.20 1.80 100.00 982000 18000 1000000 0.60 0.01 0.61 PPM 6027 110 6138 Underfill Homogeneous Material Level Description Other inorganic materials Other organic materials Thermosets Other organic materials Thermosets Others Other inorganic materials Subtotal Substance Silicon dioxide p-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline Bisphenol F type liquid epoxy resin Amine type hardener Bisphenol A type liquid epoxy resin Additive Carbon Black CAS# Component Level Weight (g) 60676-86-0 5026-74-4 9003-36-5 Proprietary 25068-38-6 Proprietary 1333-86-4 2.20 E-03 6.78 E-04 6.78 E-04 2.54 E-04 8.48 E-05 8.48 E-05 1.70 E-05 4.00 E-03 Weight (g) 6.78 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 55.08 16.95 16.95 6.36 2.12 2.12 0.42 100.00 550840 169490 169490 63560 21190 21190 4240 1000000 0.32 0.10 0.10 0.04 0.01 0.01 0.002 0.59 Percentage (%) 100.00 PPM 3248 999 999 375 125 125 25 5896 PPM 1000000