PDF

Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
BGA_ED
12 X 12
196
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size (mm)
0.45
Yes
Yes
Yes
Yes
Materials Declaration
Heat Spreader Epoxy 1
Homogeneous Material Level
Substance
Description
Other inorganic materials
Other organic materials
Subtotal
Aluminum oxide
Dimethyl siloxane
Subtotal
CAS#
Component Level
Weight (g)
Proprietary
68083-19-2
7.00 E-03
3.00 E-03
1.00 E-02
Percentage (%)
PPM
Percentage (%)
70.0
30.0
100.0
700000
300000
1000000
1.03
0.44
1.47
PPM
10318
4422
14740
Heat Spreader Epoxy 2
Description
Precious metals
Other organic materials
Other organic materials
Subtotal
Substance
Silver
Methacrylate
Bismaleimide
Subtotal
CAS#
Weight (g)
7440-22-4
7534-94-3
Proprietary
2.74 E-03
2.57 E-04
2.05 E-04
3.20 E-03
Homogeneous Material Level
Percentage (%)
PPM
85.6
855600
8.0
80200
6.4
64200
100.0
1000000
Component Level
Percentage (%)
0.40
0.04
0.03
0.47
PPM
4036
378
303
4717
Heat Spreader
Homogeneous Material Level
Description
Copper & its alloys
Nickel & its alloys
Subtotal
Substance
CAS#
7440-50-8
7440-02-0
Copper
Nickel
Component Level
Weight (g)
3.30 E-01
3.34 E-03
3.34 E-01
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
48.69
0.49
49.18
PPM
486909
4918
491827
Laminate
Homogeneous Material Level
Substance
Description
Copper & its alloys
Composite
Other inorganic materials
Thermoset
Thermoset
Thermoset
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Copper & its alloys
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Copper Foil
Glass Cloth
Inorganic Filler
Epoxy
Flame Resistant Epoxy Resin
Heat Resistant Resin
Laminate Core Subtotal
Acrylic Resin
Barium Sulfate, Silica, Talc
Epoxy Resin
Acrylic Monomer
Aromatic Carbonyl Compound
Levelling Agents & Others
Amine Compound
Phthalcyanine Blue, Organic Pigment
Soldermask Subtotal
Copper Plating
Tin
Silver
Copper
CAS#
Component Level
Weight (g)
2.45 E-02
4.90 E-02
1.96 E-02
9.78 E-03
9.78 E-03
9.78 E-03
1.22 E-01
2.69 E-03
1.41 E-03
1.24 E-03
4.86 E-04
2.43 E-04
4.42 E-05
2.21 E-05
2.21 E-05
6.16 E-03
9.17 E-02
5.52 E-04
2.21 E-05
2.21 E-06
2.21 E-01
7440-50-8
65997-17-3
Proprietary
7328-97-4
Proprietary
Proprietary
Proprietary
7727-43-7/ 14807-96-6
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
7440-50-8
7440-31-5
7440-22-4
7440-50-8
Percentage (%)
PPM
Percentage (%)
11.10
22.17
8.87
4.43
4.43
4.43
55.43
1.22
0.64
0.56
0.22
0.11
0.02
0.01
0.01
2.79
41.52
0.25
0.01
0.001
100.00
111000
221700
88700
44300
44300
44300
554300
12200
6400
5600
2200
1100
200
100
100
27900
415190
2500
100
10
1000000
3.61
7.22
2.89
1.44
1.44
1.44
18.04
0.40
0.21
0.18
0.07
0.04
0.01
0.003
0.003
0.91
13.51
0.08
0.003
0.0003
32.55
PPM
36131
72164
28872
14420
14420
14420
180426
3971
2083
1823
716
358
65
33
33
9081
135145
814
33
3
325502
Solder Ball
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Silver
Copper
Component Level
Weight (g)
CAS#
7440-31-5
7440-22-4
7440-50-8
6.69 E-02
2.08 E-03
3.47 E-04
6.93 E-02
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
9.86
0.31
0.05
10.22
PPM
98613
3066
511
102190
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
Component Level
Weight (g)
CAS#
7440-21-3
3.32 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
4.90
PPM
48991
Wafer Bumps
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
CAS#
Component Level
Weight (g)
7440-31-5
7440-22-4
4.09 E-03
7.50 E-05
4.16 E-03
Percentage (%)
PPM
Percentage (%)
98.20
1.80
100.00
982000
18000
1000000
0.60
0.01
0.61
PPM
6027
110
6138
Underfill
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Thermosets
Other organic materials
Thermosets
Others
Other inorganic materials
Subtotal
Substance
Silicon dioxide
p-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline
Bisphenol F type liquid epoxy resin
Amine type hardener
Bisphenol A type liquid epoxy resin
Additive
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
5026-74-4
9003-36-5
Proprietary
25068-38-6
Proprietary
1333-86-4
2.20 E-03
6.78 E-04
6.78 E-04
2.54 E-04
8.48 E-05
8.48 E-05
1.70 E-05
4.00 E-03
Weight (g)
6.78 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
55.08
16.95
16.95
6.36
2.12
2.12
0.42
100.00
550840
169490
169490
63560
21190
21190
4240
1000000
0.32
0.10
0.10
0.04
0.01
0.01
0.002
0.59
Percentage (%)
100.00
PPM
3248
999
999
375
125
125
25
5896
PPM
1000000