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Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
CSP BGA
17 X 17
225
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size
0.60 mm
Yes
Yes
No
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
CAS#
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
2.99 E-01
2.08 E-02
2.08 E-02
5.20 E-03
1.04 E-03
3.47 E-01
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.0
862000
60000
60000
15000
3000
1000000
33.28
2.32
2.32
0.58
0.12
38.60
PPM
332760
23162
23162
5790
1158
386033
Laminate
Homogeneous Material Level
Description
Substance
Copper & its alloys
Other inorganic materials
Other inorganic materials
Other inorganic materials
Thermoset
Thermoset
Other inorganic materials
Copper Foil
Glass Cloth
Pre-preg Glass Cloth
Pre-preg filler
Core Resin
Prepreg Resin
Core Filler
Thermoset
Other inorganic materials
Other organic materials
Thermoset
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Other organic materials
Other organic materials
CAS#
Percentage (%)
PPM
Percentage (%)
PPM
7440-50-8
65997-17-3
65997-17-3
21645-51-2
105391-33-1 / 25722-66-1, 9003-36-5
105391-33-1 / 25722-66-1, 9003-36-5
21645-51-2
2.91 E-02
6.89 E-03
2.62 E-02
2.75 E-02
1.17 E-02
2.62 E-02
1.29 E-02
1.40 E-01
8.98
2.13
8.11
8.49
3.61
8.11
3.98
43.40
89707
21271
80986
84782
36068
80986
39767
433566
3.23
0.77
2.92
3.06
1.30
2.92
1.43
15.63
32343
7669
29198
30567
13004
29198
14338
156317
Soldermask Acrylate Resin
Barium Sulfate, Silica, Talc
3-Methoxy-3-Methyl Butyl-Acetate
Epoxy Resin
Dipropylene glycol monomethyl ether
Barium Sulfate
Acrylic Monomer
Aromatic Carbonyl Compound
High Boiling Point Petroleum Solvent
Levelling Agents & Others
Organic Fillers
Amine Compound
Phthalcyanine Green, Organic Pigment
Soldermask Subtotal
Copper
Nickel
Gold
Proprietary
Proprietary
Proprietary
85954 - 11 - 6
34590-94-8
7727-43-7
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
8.52 E-03
6.50 E-03
4.78 E-03
4.48 E-03
3.06 E-03
2.19 E-03
1.31 E-03
8.42 E-04
8.08 E-04
5.39 E-04
4.38 E-04
1.35 E-04
6.73 E-05
3.37 E-02
1.27 E-01
1.97 E-02
3.56 E-03
3.24 E-01
2.63
2.01
1.48
1.38
0.95
0.676
0.406
0.260
0.250
0.166
0.135
0.042
0.021
10.40
39.1
6.1
1.0
100.0
26286
20052
14753
13818
9455
6753
4052
2597
2494
1662
1351
416
208
103896
390609
60939
10989
1000000
0.948
0.723
0.532
0.498
0.341
0.243
0.146
0.094
0.090
0.060
0.049
0.015
0.007
3.746
14.08
2.20
0.40
36
9477
7229
5319
4982
3409
2435
1461
936
899
599
487
150
75
37458
140829
21971
3962
360537
Substance
CAS#
Laminate Core Subtotal
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Component Level
Weight (g)
7440-50-8
7440-02-0
7440-57-5
Solder Ball
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
Copper
Component Level
Weight (g)
7440-31-5
7440-22-4
7440-50-8
1.82 E-01
5.65 E-03
9.42 E-04
1.88 E-01
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
20.23
0.63
0.10
20.96
PPM
202287
6289
1048
209624
Bond Wires
Homogeneous Material Level
Description
Precious metals
Gold
Component Level
Weight (g)
CAS#
Substance
5.36 E-03
7440-57-5
Percentage (%)
PPM
Percentage (%)
99.99
1000000
0.60
PPM
5967
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
CAS#
Doped Silicon
Component Level
Weight (g)
7440-21-3
3.05 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
3.39
PPM
33884
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Thermoset
Subtotal
Substance
CAS#
7440-22-4
TS# 10049
TS# 10064
TS# 10042
TS# 10063
TS# 10051
Silver
Bismaleimide monomer
Acrylate monomer
Epoxy resin
Carbamate resin
Acrylic resin resin
2.82 E-03
2.82 E-04
1.13 E-04
1.13 E-04
1.13 E-04
1.13 E-04
3.55 E-03
Weight (g)
8.99 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
79.38
7.94
3.17
3.17
3.17
3.17
100.00
793800
79400
31700
31700
31700
31700
1000000
0.31
0.03
0.01
0.01
0.01
0.01
0.40
Percentage (%)
100.00
PPM
3140
314
125
125
125
125
3956
PPM
1000000