Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish CSP BGA 17 X 17 225 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size 0.60 mm Yes Yes No Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal CAS# Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 2.99 E-01 2.08 E-02 2.08 E-02 5.20 E-03 1.04 E-03 3.47 E-01 Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.0 862000 60000 60000 15000 3000 1000000 33.28 2.32 2.32 0.58 0.12 38.60 PPM 332760 23162 23162 5790 1158 386033 Laminate Homogeneous Material Level Description Substance Copper & its alloys Other inorganic materials Other inorganic materials Other inorganic materials Thermoset Thermoset Other inorganic materials Copper Foil Glass Cloth Pre-preg Glass Cloth Pre-preg filler Core Resin Prepreg Resin Core Filler Thermoset Other inorganic materials Other organic materials Thermoset Other organic materials Other inorganic materials Other organic materials Other organic materials Other organic materials Others Other organic materials Other organic materials Other organic materials CAS# Percentage (%) PPM Percentage (%) PPM 7440-50-8 65997-17-3 65997-17-3 21645-51-2 105391-33-1 / 25722-66-1, 9003-36-5 105391-33-1 / 25722-66-1, 9003-36-5 21645-51-2 2.91 E-02 6.89 E-03 2.62 E-02 2.75 E-02 1.17 E-02 2.62 E-02 1.29 E-02 1.40 E-01 8.98 2.13 8.11 8.49 3.61 8.11 3.98 43.40 89707 21271 80986 84782 36068 80986 39767 433566 3.23 0.77 2.92 3.06 1.30 2.92 1.43 15.63 32343 7669 29198 30567 13004 29198 14338 156317 Soldermask Acrylate Resin Barium Sulfate, Silica, Talc 3-Methoxy-3-Methyl Butyl-Acetate Epoxy Resin Dipropylene glycol monomethyl ether Barium Sulfate Acrylic Monomer Aromatic Carbonyl Compound High Boiling Point Petroleum Solvent Levelling Agents & Others Organic Fillers Amine Compound Phthalcyanine Green, Organic Pigment Soldermask Subtotal Copper Nickel Gold Proprietary Proprietary Proprietary 85954 - 11 - 6 34590-94-8 7727-43-7 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 8.52 E-03 6.50 E-03 4.78 E-03 4.48 E-03 3.06 E-03 2.19 E-03 1.31 E-03 8.42 E-04 8.08 E-04 5.39 E-04 4.38 E-04 1.35 E-04 6.73 E-05 3.37 E-02 1.27 E-01 1.97 E-02 3.56 E-03 3.24 E-01 2.63 2.01 1.48 1.38 0.95 0.676 0.406 0.260 0.250 0.166 0.135 0.042 0.021 10.40 39.1 6.1 1.0 100.0 26286 20052 14753 13818 9455 6753 4052 2597 2494 1662 1351 416 208 103896 390609 60939 10989 1000000 0.948 0.723 0.532 0.498 0.341 0.243 0.146 0.094 0.090 0.060 0.049 0.015 0.007 3.746 14.08 2.20 0.40 36 9477 7229 5319 4982 3409 2435 1461 936 899 599 487 150 75 37458 140829 21971 3962 360537 Substance CAS# Laminate Core Subtotal Copper & its alloys Nickel & its alloys Precious metals Subtotal Component Level Weight (g) 7440-50-8 7440-02-0 7440-57-5 Solder Ball Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Tin Silver Copper Component Level Weight (g) 7440-31-5 7440-22-4 7440-50-8 1.82 E-01 5.65 E-03 9.42 E-04 1.88 E-01 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 20.23 0.63 0.10 20.96 PPM 202287 6289 1048 209624 Bond Wires Homogeneous Material Level Description Precious metals Gold Component Level Weight (g) CAS# Substance 5.36 E-03 7440-57-5 Percentage (%) PPM Percentage (%) 99.99 1000000 0.60 PPM 5967 Chip Homogeneous Material Level Substance Description Other inorganic materials CAS# Doped Silicon Component Level Weight (g) 7440-21-3 3.05 E-02 Percentage (%) PPM Percentage (%) 100 1000000 3.39 PPM 33884 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Other organic materials Thermoset Subtotal Substance CAS# 7440-22-4 TS# 10049 TS# 10064 TS# 10042 TS# 10063 TS# 10051 Silver Bismaleimide monomer Acrylate monomer Epoxy resin Carbamate resin Acrylic resin resin 2.82 E-03 2.82 E-04 1.13 E-04 1.13 E-04 1.13 E-04 1.13 E-04 3.55 E-03 Weight (g) 8.99 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 79.38 7.94 3.17 3.17 3.17 3.17 100.00 793800 79400 31700 31700 31700 31700 1000000 0.31 0.03 0.01 0.01 0.01 0.01 0.40 Percentage (%) 100.00 PPM 3140 314 125 125 125 125 3956 PPM 1000000