INCH-POUND MIL-M-38510/114B 20 August 2003 SUPERSEDING MIL-M-38510/114A 09 November 1979 MILITARY SPECIFICATION MICROCIRCUITS, LINEAR, BI-FET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON Reactivated after 20 August 2003 and may be used for either new or existing design acquisitions. This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, BI-FET operational amplifier microcircuit. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3) 1.2 Part number. The part number should be in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types are internally compensated and should be as follows: Device type 01 02 03 04 05 06 Circuit Operational amplifier, JFET input, low power Operational amplifier, JFET input, wide band Operational amplifier, JFET input, wide band, undercompensated Operational amplifier, JFET input, low power, low offset Operational amplifier, JFET input, wide band, low offset Operational amplifier, JFET input, wide band, under compensated, low offset 1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outline. The case outline should be as designated in MIL-STD-1835 and as follows: Outline letter G H P Descriptive designator MACY1-X8 GDFP1-F10 or CDFP2-F10 GDIP1-T8 or CDIP2-T8 Terminals 8 10 8 Package style Can Flat pack Dual-in-line Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed to [email protected]. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at www.dodssp.daps.mil. AMSC N/A DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. FSC 5962 MIL-M-38510/114B 1.3 Absolute maximum ratings. Supply voltage range ....................................................................... Input voltage range .......................................................................... Differential input voltage range ......................................................... Storage temperature range .............................................................. Output short-circuit duration ............................................................. Lead temperature (soldering, 60 seconds) ...................................... Junction temperature (TJ) ................................................................ ±22 V ±20 V 1/ ±40 V -65°C to +150°C Unlimited 2/ +300°C. +175°C 3/ 1.4 Recommended operating conditions. Supply voltage range ....................................................................... ±5 V dc to ±20 V dc Ambient operating temperature range (TA) ...................................... -55°C to +125°C 1.5 Power and thermal characteristics. Case outlines Maximum allowable power dissipation Maximum Maximum θJC θJA 150°C/W G 330 mW at TA = +125°C 40°C/W H 330 mW at TA = +125°C 400 mW at TA = +125°C 60°C/W 150°C/W 35°C/W 120°C/W P 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard for Microelectronics. - Interface Standard Electronic Component Case Outlines. (Copies of these documents are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094. 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein the text of this document shall takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. ______ 1/ The absolute maximum negative input voltage is equal to the negative power supply voltage. 2/ Short circuit may be to ground or either supply. Rating applies to +125°C case temperature or +75°C ambient temperature. 3/ For short term test (in the specific burn-in and life test configuration when required and up to 168 hours maximum), TJ = 275°C. 2 MIL-M-38510/114B 3. REQUIREMENTS 3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4). 3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein. 3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity (DSCC-VA) upon request. 3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3. 3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6). 3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and apply over the full recommended ambient operating temperature range, unless otherwise specified. 3.5.1 Offset null circuits. The nulling inputs shall be capable of being nulled 1 mV beyond the specified offset voltage limits for –55°C ≤ TA ≤ 125°C using the circuit of figure 2. 3.5.2 Instability oscillations. The devices shall be free of oscillations when operated in the test circuits of this specification. 3.6 Rebonding. Rebonding shall be in accordance with MIL-PRF-38535. 3.7 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III. 3.8 Marking. Marking shall be in accordance with MIL-PRF-38535. 3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). 3 MIL-M-38510/114B TABLE I. Electrical performance characteristics. Test Symbol Input offset voltage VIO Conditions -55°C ≤ TA ≤ +125°C unless otherwise specified See figure 3 ±VCC = ±5 V, VCM = 0 V Group A subgroups Device type 1 01,02, 03 Max 5 04,05, 06 -2 2 01,02, 03 -7 7 04,05, 06 -2.5 2.5 01,02, 03 -30 30 04,05, 06 -10 10 All -20 20 pA -20 20 nA -100 3500 pA TJ = +125°C -10 60 nA TJ = +25°C -100 300 pA TJ = +125°C -10 50 nA TJ = +25°C -100 100 pA TJ = -10 50 nA VCM = ±15 V, 0 V Input offset voltage temperature sensitivity ∆VIO / ∆T Input offset current ±VCC = ±20 V, VCM = 0 V ±VCC = ±20 V, VCM = 0 V IIO 1,2,3 TJ = +25°C TJ = +125°C Input bias current 1/ 2/ +IIB ±VCC = ±20 V, VCM = +15 V, t ≤ 25 ms -IIB 3/ ±VCC = ±15 V, VCM = +10 V, t ≤ 25 ms ±VCC = ±20 V, -15 V ≤ VCM ≤ 0 V, t ≤ 25 ms Power supply rejection ratio Input voltage common mode rejection 4/ Unit Min -5 2,3 ±VCC = ±20 V, Limits TJ = +25°C All mV µV/°C +125°C +PSRR +VCC = 10 V, -VCC = -20 V -PSRR +VCC = 20 V, -VCC = -10 V CMR ±VCC = ±20 V, 1,2,3 All 85 dB 85 1,2,3 All 85 dB 1,2,3 All +8 mV VIN = ±15 V Adjustment for input offset voltage VIO ±VCC = ±20 V ADJ(+) -8 VIO ADJ(-) Output short circuit current (for positive output) 5/ IOS(+) ±VCC = ±15 V, t ≤ 25 ms, (short circuit to ground) See footnotes at end of table. 4 1,2,3 All -50 mA MIL-M-38510/114B TABLE I. Electrical performance characteristics – Continued. Test Output short circuit current (for negative output) Supply current Symbol 5/ IOS(-) Conditions -55°C ≤ TA ≤ +125°C unless otherwise specified See figure 3 ±VCC = ±15 V, t ≤ 25 ms, Group A subgroups Device type 1,2,3 All Max 50 mA 1,2 01,04 4 mA 02,03, 05,06 7 01,04 6 02,03, 05,06 11 Min ICC Output voltage swing (maximum) ±VCC = ±15 V VOP ±VCC = ±20 V, RL = 10 kΩ 1,2,3 All 6/ 6/ Transient response, rise time AVS(+) ±VCC = ±20 V, RL = 2 kΩ, AVS(-) VOUT = ±15 V AVS ±VCC = ±5 V, RL = 2 kΩ, ±16 V ±15 ±VCC = ±20 V, RL = 2 kΩ Open loop voltage gain (single ended) Unit (short circuit to ground) 3 Open loop voltage gain (single ended) Limits 1 All 2,3 50 V/mV 25 1 All 10 V/mV 4,5,6 01,04 150 CL = 100 pF, VIN = 50 mV, AV = 1, see figure 4 02,05 100 ±VCC = ±15 V, RL = 2 kΩ, 03,06 450 01,02, 04,05 40 03,06 25 VOUT = ±2 V TR(tr) ±VCC = ±15 V, RL = 2 kΩ, ns CL = 100 pF, VIN = 50 mV, AV = 5, see figure 4 Transient response, overshoot TR(os) ±VCC = ±15 V, RL = 2 kΩ, CL = 100 pF, VIN = 50 mV, AV = 1, see figure 4 ±VCC = ±15 V, RL = 2 kΩ, CL = 100 pF, VIN = 50 mV, AV = 5, see figure 4 See footnotes at end of table. 5 % MIL-M-38510/114B TABLE I. Electrical performance characteristics – Continued. Test Slew rate Symbol Conditions -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type SR(+) See figure 3 VIN = ±5 V, ±VCC = ±15 V, 1 01 Min 2 and AV = 1, see figure 4 02 7.5 04 3 05 10 01 1 02 5 04 1.5 05 7 03 30 06 40 03 20 06 25 SR(-) 2,3 VIN = ±5 V, ±VCC = ±15 V, 1 AV = 5, see figure 4 2,3 Settling time ts(+) and ts(-) ±VCC = ±15 V, (0.1% error) 9 Limits Unit Max V/µs ns 01,04 4000 02,05 1500 03,06 800 9 All 10 µVrms 9 All 80 µVpk TA = +25°C, AV = -1, see figure 5 ±VCC = ±15 V, (0.1% error) TA = +25°C, AV = -5, see figure 5 Noise (referred to input) broadband NI(BB) Noise (referred to input) popcorn NI(PC) ±VCC = ±20 V, bandwidth = 5 kHz ±VCC = ±20 V, bandwidth = 5 kHz See footnotes at end of table. 6 MIL-M-38510/114B TABLE I. Electrical performance characteristics – Continued. 1/ Bias currents are actually junction leakage currents which double (approximately) for each 10°C increase in junction temperature (TJ). Measurement of bias current is specified at TJ rather than TA, since normal warm up thermal transients will affect the bias currents. The measurements for bias currents must be made within 25 ms or 5 loop time constants, whichever is greater after power is first applied to the device for test. Measurement at TA = -55°C is not necessary since expected values are too small for typical test systems. 2/ Bias current is sensitive to power supply voltage, common mode voltage and temperature as shown by the following typical curves: 3/ Negative IIB minimum limits reflect the characteristics of device with bias current compensation. 4/ CMR is calculated from VIO measurements at VCM = +15 V and –15 V. 5/ Continuous limits shall be considerably lower. Protection for shorts to either supply exists providing that TJ(max) ≤ 175°C. 6/ Because of thermal feedback effects from output to input, open loop gain is not guaranteed to be linear or positive over the operating range. These requirements, if needed, should be specified by the user in additional procurement documents. 7 MIL-M-38510/114B TABLE II. Electrical test requirements. Subgroups (see table III) Class S Class B devices devices MIL-PRF-38535 test requirements Interim electrical parameters 1 Final electrical test parameters 1*, 2, 3, 4 Group A test requirements Group B electrical test parameters when using the method 5005 QCI option Group C end-point electrical parameters Additional electrical subgroups for Group C periodic inspections Group D end-point electrical parameters 1, 2, 3, 4, 5, 6, 7, 8, 12 1, 2, 3 and table IV delta limits 1, 2, 3 and table IV delta limits N/A 1, 2, 3 1 1*, 2, 3, 4 1, 2, 3, 4, 5, 6, 7 N/A 1 and table IV delta limits 8, 12 1 *PDA applies to subgroup 1. 4. VERIFICATION. 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply: a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer. c. Additional screening for space level product shall be as specified in MIL-PRF-38535. NOTE: If accelerated high-temperature test conditions are used, the device manufacturer shall ensure that at least 85 percent of the applied voltage is dropped across the device at temperature. The device is not considered functional under accelerated test conditions. 8 MIL-M-38510/114B 4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535. 4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 9, 10, and 11 shall be omitted. c. Subgroup 12 shall be added to group A inspection for class S devices only as shown in table III herein. The sample size series number for subgroup 12 shall be 5. 4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535. 4.4.3 Group C inspection. Group C inspection shall be in accordance with table III of MIL-PRF-38535 and as follows: a. End point electrical parameters shall be as specified in table II herein. Delta limits shall apply only to subgroup 1 of group C inspection for class B devices. b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. c. Subgroup 3 and 4 shall be added to group C inspection and shall consist of group A, subgroup 8 and 12, as specified in table III herein. The sample size series number for subgroup 3 shall be 10 for class B; the sample size series number for subgroup 4 shall be 5 for class B. 4.4.4 Group D inspection. Group D inspection shall be in accordance with table IV of MIL-PRF-38535. End point electrical parameters shall be as specified in table II herein. 4.5 Methods of inspection. Methods of inspection shall be specified and as follows. 4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) are referenced to the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing into the referenced terminal. 4.5.2 Life test cooldown procedure. When devices are measured at +25°C following application of the operating life or burn-in test condition, they shall be cooled to room temperature prior to removal of the bias. 9 MIL-M-38510/114B Figure 1. Terminal connections. 10 MIL-M-38510/114B Figure 1. Terminal connections – Continued. Figure 2. Offset null circuit. 11 MIL-M-38510/114B NOTES: 1. All resistors are ±0.1% tolerance and all capacitors are ±10% tolerance unless otherwise specified. 2. Precautions shall be taken to prevent damage to the device under test during insertion into socket and change of state of relays (i.e. disable voltage supplies, current limit ±VCC, etc). 3. Compensation capacitors should be added as required for test circuit stability. Two general methods for stability compensation exist. One method is with a capacitor for nulling amp feedback. The other method is with a capacitor in parallel with the 49.9 kΩ closed loop feedback resistor. Both methods should not be used simultaneously. Proper wiring procedures shall be followed to prevent unwanted coupling and oscillations, etc. Loop response and settling time shall be consistent with the test rate such that any value has settled for at least 5 loop time constants before the value is measured. 4. Adequate settling time should be allowed such that each parameter has settled to within 5% of its final value. 5. All relays are shown in the normal de-energized state. 6. The nulling amplifier shall be a M38510/10101XXX. Saturation of the nulling amplifier is not allowed on tests where E (pin 5) value is measured. 7. The load resistors 2050 Ω and 11.1 kΩ yield effective load resistances of 2 kΩ and 10 kΩ respectively. 8. Any oscillation greater than 300 mV in amplitude (peak-to-peak) shall be cause for device failure. FIGURE 3. Test circuit for static tests. 12 MIL-M-38510/114B Notes: 1. Resistors are ±1.0% tolerance and capacitors are ±10% tolerance. 2. This capacitance includes the actual measured value with stray and wire capacitance. 3. Precaution shall be taken to prevent damage to the device under test during insertion into socket and in applying power. 4. Pulse input and output characteristics are shown on the next page. FIGURE 4. Test circuit for transient response and slew rate. 13 MIL-M-38510/114B Parameter symbol Device type Output pulse signal Equation All Input pulse signal at tr ≤ 50 ns +50 mV TR (tr) Waveform 1 TR (tr) = ∆t TR (os) All +50 mV Waveform 1 SR (+) 01,02,04,05 -5 V to +5 V step Waveform 2 TR (os) = 100 (∆VO / VO) % SR(+) = 03,06 -1 V to +1 V step Waveform 2 ∆VO(+) / ∆t(+) 01,02,04,05 +5 V to –5 V step Waveform 3 SR(-) = 03,06 -1 V to +1 V step Waveform 3 ∆VO(-) / ∆t(-) SR (-) FIGURE 4. Test circuit for transient response and slew rate – Continued. 14 MIL-M-38510/114B Notes: 1. Resistors are ±1.0% and capacitors are ±10% unless otherwise specified. 2. Precaution shall be taken to prevent damage to the device under test during insertion into socket and In applying power. 3. For device types 01, 02, 04 and 05, S1 is open, AV = -1 and VIN = 10 V. 4. For device types 03 and 06, S1 is closed, AV = -5 and VIN = 2 V. 5. Settling time, tS, measured on pin 5, is the interval during which the summing node is not nulled relative to the specified percentage of the final output value. (See table I settling time test conditions). FIGURE 5. Test circuit for settling time. 15 16 TA = +125°C 2 -IIB ∆VIO/ ∆T +IIB VIO ICC CMR VIO ADJ(+) VIO ADJ(-) IOS(+) IOS(-) IIO +PSRR -PSRR -IIB +IIB VIO 1 TA = +25°C Symbol Subgroup 27 28 29 30 31 32 33 34 “ “ “ “ “ “ “ “ “ 24 25 “ “ 4001 22 23 4001 “ 26 21 3005 “ 19 20 3011 18 16 17 13 14 15 “ 4003 4003 4003 11 12 “ “ 7 8 “ “ 9 6 “ “ 10 5 4001 “ 3 4 “ “ “ “ 2/ “ 1 2 “ “ “ “ “ “ “ “ “ 2/ 6/ “ “ 2/ “ 5/ 5/ 3/ “ “ “ “ “ “ “ “ “ “ “ “ “ Notes Test no. MILSTD883 method 4001 “ -20 V -5 V -25 V -25 V -35 V -20 V -5 V -25 V -25 V -35 V -20 V -5 V -5 V -35 V 2 4 “ “ “ “ “ “ “ “ “ “ “ “ 0V -15 V 10 V 10 V 15 V 0V -15 V 10 V 10 V 15 V 0V 0V Open -15 V “ 15 V 3 K2 K2 None K2 K2, K8 K1 K1 None K1 K1, K8 “ “ None “ Energized relays “ “ “ “ “ “ “ “ “ “ “ “ 5 “ No. -20 V -10 V Open Open 0V 0V None None 5 5 -20 V -5 V -5 V -35 V -15 V 0V “ “ 0V 0V Open -15 V “ 15 V “ “ “ None “ None “ “ 5 “ 2 20 V 35 V 5V 5V 5V 20 V 35 V 5V 5V 5V -20 V -5 V -35 V -25 V -25 V -20 V -5 V -25 V -25 V -35 V “ “ “ “ “ “ “ “ “ Open 0V -15 V 15 V 10 V 10 V 0V -15 V 10 V 10 V 15 V K2, K8 K2, K8 K2, K8 None K2, K8 K1, K8 K1, K8 None K1, K8 K1, K8 “ “ “ “ “ “ “ “ “ 5 ∆VIO / ∆T = [VIO (Test 24) – VIO (Test 3)] / 100°C 20 V 5V 35 V 5V 15 V Calculate value using data from tests 1 and 2 K7 5 20 V -20 V Open 0 V “ “ 0V K6, K7 5 20 V -20 V “ 15 V -15 V “ -10 V None 6 15 V -15 V “ 10 V None 6 10 V 20 V E31 E32 E30 E28 E29 E26 E27 E24 E25 E23 E21 E22 E19 E20 I3 I1 I2 E18 E17 E15 E16 E13 E14 E12 E11 E10 E8 E9 E6 E7 E5 E3 E4 E1 E2 Value “ “ “ “ “ “ “ “ “ V “ “ V “ mA mA mA V V V V “ “ “ “ “ “ “ “ “ “ “ “ V “ Units Measured pin Calculate value using data from tests 3, 7, and 11 20 V 35 V 5V 5V 5V 20 V 35 V 5V 5V 5V 20 V 5V 35 V 5V 1 Adapter pin numbers -IIB = 10 (E31 – E21) -IIB = 10 (E32 – E19) -IIB = 10 (E28 – E20) -IIB = 10 (E30 – E29) +IIB = 10 (E21 – E26) +IIB = 10 (E19 – E27) +IIB = 10 (E24 – E25) +IIB = 10 (E20 – E23) VIO = E21 VIO = E22 VIO = E19 VIO = E20 ICC = I3 IOS(+) = I1 IOS(-) = I2 VIO ADJ(-) = (E3 – E18) +PSRR = 20 log| 10 /(E3 – E15) | 4 -PSRR = 20 log| 10 /(E3 – E16) | CMR = 20 log| 3 x 104/(E1 – E2) | VIO ADJ(+) = (E3 – E17) 4 -IIB = 200 (E13 – E3) -IIB = 200 (E14 – E1) -IIB = 200 (E12 – E11) -IIB = 10,000 (E10 – E2) +IIB = 200 (E3 – E8) +IIB = 200 (E1 – E9) +IIB = 200 (E6 – E7) +IIB = 10,000 (E2 – E5) VIO = E3 VIO = E4 VIO = E1 VIO = E2 1/ Equation IIO = 200(2E3 – E8 – E13) TABLE III. Group A inspection for all device types. 2 5 Max “ “ All “ “ “ “ “ “ -10 -10 -10 -10 -10 -10 -10 -30 -10 -10 01,02,03 -2.5 04,05,06 All 04,05,06 50 50 60 50 50 50 50 10 60 30 2.5 7 4 7 50 -8 20 100 100 01,04 -7 -50 85 8 85 85 -20 -100 -100 300 “ “ “ “ “ “ “ “ “ °C nA µV/ “ “ mV “ mA mA mA mV dB mV dB pA “ “ “ “ “ -100 100 100 -100 3500 -100 -100 “ “ “ “ pA “ “ mV “ Unit 300 -100 -100 3500 -2 -5 Min Test limits 02,03, 05,06 01,02,03 “ “ “ “ “ “ “ “ “ “ “ “ All “ “ “ “ All 04,05,06 01,02,03 Device type MIL-M-38510/114B 17 4003 CMR 4003 CMR 60 61 62 63 “ “ “ AVS(+) AVS(-) AVS “ 59 “ “ 57 58 56 3005 4004 “ 54 55 3011 4/ 4/ 5/ 5/ 0V 0V 0V 4 None None K1,K2,K8 5 5 5 No. -20 V -5 V “ “ 0V 0V -15 V 15 V 0V -10 V 10 V 0V 0V “ “ None “ None None None K6, K7 K7 “ “ 5 “ 2 6 6 5 5 -20 V -10 V Open Open 0V 0V None None 5 5 -15 V -15 V -15 V 15 V 15 V “ “ 5V -5 V -5 V “ “ 5V “ “ “ “ 20 V “ 15 V -20 V “ “ -20 V 20 V “ “ “ “ “ “ Open “ “ “ “ Open -20 V 2V -2 V 15 V -15 V 20 V -20 V -20 V 20 V -10 V 10 V 0V 0V 0V “ “ “ “ “ K4 K3 K3 None None None K6, K7 K7 “ “ “ 5 “ “ 6 “ 6 6 6 5 5 Calculate value using data from tests 44 and 45. 10 V 20 V E49 E48 E47 E46 (E0)4 (E0)3 (E0)1 (E0)2 I7 I8 I9 E45 E44 E42 E43 E40 E41 E38 E39 I6 I4 I5 E37 E36 E34 E35 E33 Value 4 -VOP = (E0)4 “ “ “ “ AVS = 4/(E49 – E48) AVS(-) = 15/(E47 – E3) AVS(+) = 15/(E3 – E46) +VOP = (E0)3 “ “ +VOP = (E0)1 -VOP = (E0)2 ICC = I9 IOS(+) = I7 IOS(-) = I8 VIO ADJ(-) = (E40 – E45) VIO ADJ(+) = (E40 – E44) CMR = 20 log| 3 x 10 /(E38 – E39) | 4 4 +PSRR = 20 log| 10 /(E40 – E42) | 4 -PSRR = 20 log| 10 /(E40 – E43) | VIO = E40 VIO = E41 VIO = E38 VIO = E39 ICC = I6 IOS(+) = I4 IOS(-) = I5 VIO ADJ(-) = (E21 – E37) VIO ADJ(+) = (E21 – E36) CMR = 20 log| 3 x 104/(E19 – E20) | +PSRR = 20 log| 10 /(E21 – E34) | 4 -PSRR = 20 log| 10 /(E21 – E35) | IIO = 10(E21 –E33) 1/ Equation V “ mA mA mA V V V V “ “ V “ mA mA mA V V V V V Units Measured pin ∆VIO / ∆T = [VIO (Test 46) – VIO (Test 3)] / 80°C 20 V 5V 35 V 5V 53 -VOP TA = +25°C “ -15 V 15 V Open “ “ “ -15 V -15 V 15 V 15 V -5 V -35 V “ -20 V 20 V 20 V 3/ 6/ “ “ 2/ “ 5/ 5/ Open 52 +VOP +VOP -VOP VIO ADJ(+) VIO ADJ(-) IOS(+) IOS(-) ICC 49 50 4003 4003 51 48 “ 46 47 44 45 4001 “ “ “ 43 3005 ∆VIO/ ∆T +PSRR -PSRR VIO ICC 41 42 Open Open Open 3 -20 V 40 3011 -20 V -10 V -20 V 2 Energized relays Calculate value using data from tests 22 and 23. 10 V 20 V 20 V 1 Adapter pin numbers 20 V 3/ 2/ Notes 39 38 36 37 4003 4003 VIO ADJ(+) VIO ADJ(-) IOS(+) IOS(-) 35 4001 IIO +PSRR -PSRR Symbol MIL-STD- Test 883 no. method 4 TA = -55°C 3 TA = +125°C 2 Subgroup TABLE III. Group A inspection for all device types – Continued. “ “ “ “ “ “ All “ “ “ “ “ “ 10 50 50 15 16 -50 8 85 -10 85 85 “ -30 01,02,03 04,05,06 All “ 04,05,06 -2.5 -15 -16 11 50 -8 10 30 2.5 7 4 7 50 -8 20 Max 01,04 -7 -50 8 85 85 85 -20 Min Test limits 02,03, 05,06 01,02,03 “ “ “ “ “ “ “ All Device type “ “ “ V/mV “ “ V “ mA mA mA mV mV dB °C dB µV/ “ “ “ “ mV “ mA mA mA mV mV dB dB nA Unit MIL-M-38510/114B 70 AVS 74 75 76 77 “ “ “ “ +VOP -VOP AVS(+) AVS(-) AVS 18 82 83 NI(BB) “ “ “ “ “ 7/ 7/ 9/ 8/ 81 NI(PC) SR(-) 9/ 8/ “ 4002 SR(+) 4/ 4/ 4/ 4/ Notes “ “ “ “ 80 TR(os) TA = +25°C 4002 79 TR(tr) 7 78 73 “ “ 71 72 4004 “ TA = -55°C 69 “ “ AVS(-) +VOP -VOP 68 “ AVS(+) 6 67 “ 66 “ “ -VOP TA = +125°C 64 65 4004 “ +VOP +VOP -VOP Symbol MIL-STD- Test 883 no. method 5 Subgroup “ “ “ “ 20 V “ 20 V “ “ “ “ “ 15 V “ “ “ “ -20 V “ -20 V “ “ “ “ “ -15 V “ “ “ “ -15 V “ 15 V “ “ “ “ -15 V -5 V 15 V 5V -5 V “ 5V “ “ “ -20 V “ “ “ “ 20 V “ 5V “ “ -5 V “ “ -20 V “ 2 “ “ 20 V “ 1 Open “ Open notes “ “ “ “ See notes “ “ “ See “ “ “ +50 mV “ “ “ “ “ “ Open “ “ “ “ “ “ “ Open “ 3 4 0V “ 0V “ “ “ “ “ Open “ “ “ “ Open “ “ “ Open 2V -2 V 15 V 20 V -15 V -20 V -20 V 20 V 2V -2 V 15 V -15 V 20 V -20 V -20 V 20 V Adapter pin numbers K1,K2,K5, K8 K5 K9 None K9 None K9 None K9 None “ “ “ “ “ K4 K3 K3 “ “ “ “ “ K4 K3 K3 Energized relays “ “ 6 “ “ “ “ “ 6 “ “ “ “ 6 “ “ “ 6 “ “ “ “ 5 “ 6 “ “ “ “ 5 “ “ 6 “ No. V ∆V01(+) (E0)14 (E0)13 ∆t1(-) ∆V01(-) mVpk µs “ mVrms µs “ V mV ∆V01 ∆t1(+) mV ns ∆tr V01 ns “ “ “ “ “ “ V “ “ “ “ “ “ “ V “ Units E57 ∆tr E56 E55 (E0)12 E54 (E0)11 (E0)9 (E0)10 E53 E52 E51 E50 (E0)8 (E0)7 (E0)5 (E0)6 Value Measured pin -VOP = (E0)8 +VOP = (E0)7 +VOP = (E0)5 -VOP = (E0)6 1/ Equation NI(PC) = (E0)14 / 1000 NI(BB) = (E0)13 / 1000 (see figure 4) SR(-) = ∆V01(-) / ∆t1(-) (see figure 4) SR(+) = ∆V01(+) / ∆t1(+) (see figure 4) TR(os) = 100 (∆V01/V01) TR(tr) = ∆t1 (see figure 4) AVS = 4/(E57 – E56) AVS(-) = 15/(E55 – E40) -VOP = (E0)12 AVS(+) = 15/(E40 – E54) +VOP = (E0)11 +VOP = (E0)9 -VOP = (E0)10 AVS = 4/(E53 – E52) AVS(-) = 15/(E51 – E21) AVS(+) = 15/(E21 – E50) TABLE III. Group A inspection for all device types – Continued. 10 40 All 7.5 3 10 30 40 40 2 7.5 3 10 30 25 02 04 05 03 06 All 06 01 02 04 05 03 01 40 01,02, 04,05 03,06 150 -15 -16 -15 -16 Max 100 450 2 10 25 25 15 16 10 25 25 15 16 Min Test limits 02,05 03,06 01,04 “ “ “ “ “ “ All “ “ “ “ “ “ “ All “ Device type µVpk “ V/µs “ “ “ “ “ µVrms V/µs “ “ “ “ % ns “ “ “ V/mV “ “ V “ “ “ “ V/mV “ “ V “ Unit MIL-M-38510/114B TR(os) TA = -55°C 19 ts(-) TA = +25°C ts(+) 12 SR(-) SR(+) TR(tr) 8 SR(-) “ “ “ “ 4002 “ 15 V 93 “ “ “ “ “ -15 V “ -15 V “ “ “ “ -15 V “ “ “ “ “ -15 V “ -15 V “ -15 V “ “ “ “ “ “ “ “ “ “ -15 V “ “ “ “ “ -15 V “ “ “ “ “ 15 V “ “ “ “ “ 15 V “ 92 9/ “ -15 V “ 15 V “ “ “ “ -15 V “ “ 2 “ “ notes See “ “ “ “ “ “ “ Open “ “ “ “ “ Open “ Open “ “ “ “ “ “ “ “ Open “ “ “ “ “ Open “ Open “ “ “ “ Open 4 notes See notes See notes See “ “ “ “ +50 mV notes See notes See “ “ “ “ +50 mV 3 Adapter pin numbers 15 V 1 “ “ “ “ 15 V 91 8/ “ “ “ “ “ 4002 8/ 9/ 90 89 88 “ 4002 “ “ “ “ 9/ 8/ 87 “ “ “ “ 4002 “ 9/ 8/ Notes “ 86 SR(+) 4002 85 TR(os) TA = +125°C 84 TR(tr) Symbol MIL-STD- Test 883 no. method 8 Subgroup “ “ “ “ “ None K9 None K9 None K9 None K9 None K9 None K9 None K9 None K9 None Energized relays 5 “ “ “ “ 5 “ “ “ “ “ 6 “ 6 “ “ “ “ “ “ “ “ 6 “ “ “ “ “ 6 “ 6 “ “ “ “ 6 No. ns ∆t2 ts(-) ns ns ∆t3(-) ts(+) V, µs µs ∆t3(+) ∆V03(-) V, mV ∆V03 ∆V03(+) mV “ “ ns V03, ∆t3 V, µs ∆t2(+) µs V, ∆t2(+) mV ∆V02 ∆V02(+) ∆V02(+) mV V02, “ “ Units Value Measured pin TR(tr) = ∆t2 (see figure 4) 1/ Equation (See figure 5) (See figure 5) SR(-) = ∆V03(-) / ∆t3(-) (see figure 4) SR(+) = ∆V03(+) / ∆t3(+) (see figure 4) (see figure 4) TR(os) = 100 (∆V03 / V03) TR(tr) = ∆t3 (see figure 4) SR(-) = ∆V02(-) / ∆t2(-) (see figure 4) SR(+) = ∆V02(+) / ∆t2(+) (see figure 4) (see figure 4) TR(os) = 100 (∆V02 / V02) TABLE III. Group A inspection for all device types – Continued. 02,05 03,06 02,05 03,06 01,04 04 05 03 06 01,04 02 04 05 03 06 01 02 01 01,02, 04, 05 03,06 02,05 03,06 04 05 03 06 01,04 02 04 05 03 06 01 02 01 01,02, 04, 05 03,06 02,05 03,06 01,04 Device type 1.5 7 20 25 5 1.5 7 20 25 1 5 1 1.5 7 20 25 5 1.5 7 20 25 1 5 1 Min 1500 800 1500 800 4000 4000 25 40 100 450 150 25 40 100 450 150 Max Test limits “ “ “ “ “ “ “ “ ns “ “ “ “ V/µs “ V/µs “ % “ “ “ “ ns “ “ “ “ V/µs “ V/µs “ % ns Unit MIL-M-38510/114B MIL-M-38510/114B TABLE III. Group A inspection – Continued. 1/ The equations take into account both the closed loop gain of 1,000 and the scale factor multiplier so that the calculated value is in table I units. The measured value units should, therefore, be used in the equation. (For example: If E1 = 2 V and VIO = E1, then VIO = 2 mV). 2/ Each device shall be tested over the common mode range as specified in table III. VCM conditions are achieved by grounding the inputs and algebraically subtracting VCM from each supply. (For example: If VCM = -15 V, then +VCC = +20 V – (-15 V) = +35 V and –VCC = -20 V – (-15 V) = -5 V ). 3/ Common mode rejection is calculated using the offset voltage values measured at the common mode range and end points. 4/ To minimize thermal drift the reference voltage for the gain measurement (E3, E21 and E40) shall be taken immediately prior to or after the reading corresponding to device gain (E46, E47, E50, E51, E54, and E55). 5/ The output shall be shorted to ground for 25 ms or less. 6/ Tests 26 and 48 which require a read and record measurement plus a calculation may be omitted except when subgroups 2 and 3 are being accomplished for group A sampling inspection and groups C and D end point measurements. 7/ Broadband noise NI(BB) shall be measured using a true RMS voltmeter with a minimum bandwidth of 10 Hz to 20 kHz. “Popcorn” noise NI(PC) shall be measured for 15 seconds. 8/ Device types 01, 02, 04, and 05 are tested with a –5 V to +5 V step input as shown in figure 4. The circuit gain is 1 V/V. 9/ Device types 03 and 06 are tested with a –1 V to +1 V step input as shown in figure 4. The circuit gain is 5 V/V. 5. PACKAGING 5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military Department's System Command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 20 MIL-M-38510/114B TABLE IV. Group C end point electrical parameters. (TA = 25°C, ±VCC = ±20 V for all device types) Table III test no. 3 7 11 Symbol VIO +IIB -IIB Device types Delta limits Limits Units Min Max Min Max 01, 02, 03 -1 +1 -5 +5 04, 05, 06 -0.5 0.5 -2 2 01, 02, 03 -50 +50 -100 +100 04, 05, 06 -50 +50 -100 +100 01, 02, 03 -50 +50 -100 +100 04, 05, 06 -50 +50 -100 +100 mV pA pA 6. NOTES 6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of the specification. b. Complete part number (see 1.2). c. Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. d. Requirements for certificate of compliance, if applicable. e. Requirements for notification of change of product or process to acquiring activity in addition to notification of the qualifying activity, if applicable. f. Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003), corrective action and reporting of results, if applicable. g. Requirements for product assurance options. h. Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should not affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the Government. i. Requirements for "JAN" marking. j. Packaging requirements (see 5.1). 21 MIL-M-38510/114B 6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists. 6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-STD-1331. 6.6 Logistic support. Lead materials and finishes (see 3.3) are interchangeable. Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4). Longer length leads and lead forming should not affect the part number. 6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M38510 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535. Military device type 01 02 03 04 05 06 Generic-industry type LF 155 LF 156 LF 157 LF 155A LF 156A LF 157A 6.8 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue, due to the extensiveness of the changes. Custodians: Army – CR Navy - EC Air Force - 11 NASA - NA DLA – CC Preparing activity: DLA - CC Project 5962-1980 Review activities: Army - MI, SM Navy - AS, CG, MC, SH, TD Air Force – 03, 19, 99 22 STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7, and send to preparing activity. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. I RECOMMEND A CHANGE: 1. DOCUMENT NUMBER MIL-M-38510/114B 2. DOCUMENT DATE (YYYYMMDD) 2003/08/20 3. DOCUMENT TITLE MICROCIRCUITS, LINEAR, BI-FET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON, PART NUMBER M38510/11401 THROUGH M38510/11406 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First Middle Initial) c. ADDRESS (Include Zip Code) 8. PREPARING ACTIVITY a. NAME Rick Officer c. ADDRESS (Include Zip Code) DSCC-VAS 3990 East Broad Street Columbus, Ohio 43216-5000 DD Form 1426, FEB 1999 (EG) Feb 99 b. ORGANIZATION d. TELEPHONE (Include Area Code) (1) Commercial (2) DSN (If applicable) 7. DATE SUBMITTED (YYYYMMDD) b. TELEPHONE (Include Area Code (1) Commercial (2) DSN 614-692-0518 850-0518 IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Standardization Program Office (DLSC-LM) 8725 John J. Kingman Road, Suite 2533 Fort Belvoir, Virginia 22060-6221 Telephone (703)767-6888 DSN 427-6888 PREVIOUS EDITIONS ARE OBSOLETE. WHS/DIOR,