FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 30-MAR-2004 SUBJECT: ON Semiconductor Final Product/Process Change Notification #13389 TITLE: Schottky Die Shrink EFFECTIVE DATE: 30-May-2004 AFFECTED CHANGE CATEGORY: Die Shrink AFFECTED PRODUCT DIVISION: Discretes Products ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Representative or Laura Rivers <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Representative or Dianne Von Borstel <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Representative or Roberto Guerrero <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 60 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is the second FPCN for IPCN 12687 available at www.onsemi.com. ON Semiconductor has qualified a reduction in die size for the listed Schottky Rectifier devices. The new die design will continue to be manufactured using the same design rules and process as the previous design. The new design will continue to meet the current data sheet specifications. RELIABILITY DATA SUMMARY: Reliability Test Results: Package = TO-220, Device = MBR20100CT Sample Size Test Conditions Interval (Lots x Units) Rejects HTRB 150 deg C, 80% rated Voltage 504 and 1008 hrs 3x80 0 IOL Delta Tj of 100 deg C max 4286 and 8572 cyc 3x80 0 TC Ta=-65C to +150 deg C 500 and 1000 cyc 3x80 0 Issue Date: 30 Mar, 2004 Page 1 of 3 Final Product/Process Change Notification #13389 ELECTRICAL CHARACTERISTIC SUMMARY: Electrical characterization has been completed on the designated qualification devices. These devices are representative of the entire family and will qualify the process. Datasheet specifications and electrical performance of the devices will remain unchanged. Characterization summary results: Device MBR20100CT Lot Temp CONTROL 25C DC Results Stat Ir@100V AVG 5.48E-07 STDEV 1.21E-07 MIN 2.88E-07 MAX 8.46E-07 CPK 274.53 Vf@10A 0.742 0.009 0.733 0.764 4.24 Vf@20A 0.820 0.009 0.812 0.843 4.96 ENG 1 25C AVG STDEV MIN MAX CPK 9.20E-07 8.64E-07 6.14E-07 6.20E-06 38.23 0.739 0.002 0.735 0.742 17.23 0.834 0.003 0.829 0.845 12.87 ENG2 25C AVG STDEV MIN MAX CPK 7.75E-07 1.78E-07 4.51E-07 1.39E-06 185.53 0.731 0.004 0.724 0.741 9.64 0.821 0.004 0.815 0.830 12.27 ENG3 25C AVG STDEV MIN MAX CPK 1.30E-06 5.54E-07 8.20E-07 3.00E-06 59.35 0.735 0.015 0.728 0.829 2.51 0.833 0.016 0.826 0.926 2.49 Device MBRB20100CT DC Results Lot Temp Stat Ir@100V CONTROL 25C AVG 6.02E-07 STDEV 5.51E-08 MIN 5.01E-07 MAX 7.15E-07 CPK 601.67 Vf@10A 0.754 0.002 0.749 0.759 13.42 Vf@20A 0.845 0.002 0.841 0.851 15.02 ENG 1 25C AVG STDEV MIN MAX CPK 7.53E-07 1.40E-07 6.50E-07 1.23E-06 236.01 0.727 0.003 0.719 0.731 15.33 0.821 0.003 0.816 0.828 13.70 ENG2 25C AVG STDEV MIN MAX CPK 6.89E-07 1.44E-07 5.67E-07 1.36E-06 229.14 0.730 0.002 0.727 0.735 22.14 0.823 0.002 0.819 0.830 17.86 Issue Date: 30 Mar, 2004 Page 2 of 3 ENG3 25C AVG STDEV MIN MAX CPK 1.33E-06 7.58E-07 9.87E-07 5.03E-06 43.41 0.725 0.002 0.721 0.730 16.89 0.820 0.003 0.816 0.825 16.27 Additional data on UIS, IFSM and ESD available on request. CHANGED PART IDENTIFICATION: There will be no changes to device marking, case outline and package functionality. Products with date code 0422 (June 4, 2004) and forward, may carry the change. AFFECTED DEVICE LIST (WITHOUT SPECIALS): PART MBR16100CT MBR20100CT MBR2080CT MBR2090CT MBR2090CTLFAJ MBRB20100CT MBRB20100CTT4 MBRF20100CT MBRF2060CT Issue Date: 30 Mar, 2004 Page 3 of 3