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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Generic Copy
30-MAR-2004
SUBJECT: ON Semiconductor Final Product/Process Change Notification #13389
TITLE: Schottky Die Shrink
EFFECTIVE DATE: 30-May-2004
AFFECTED CHANGE CATEGORY: Die Shrink
AFFECTED PRODUCT DIVISION: Discretes Products
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Representative or Laura Rivers <[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Representative
or Dianne Von Borstel <[email protected]>
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact Sales Representative or Roberto Guerrero <[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers. FPCNs are issued at least 60 days prior to implementation
of the change.
ON Semiconductor will consider this change approved unless specific conditions of acceptance
are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON
Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
This is the second FPCN for IPCN 12687 available at www.onsemi.com. ON Semiconductor has
qualified a reduction in die size for the listed Schottky Rectifier devices. The new die design will
continue to be manufactured using the same design rules and process as the previous
design. The new design will continue to meet the current data sheet specifications.
RELIABILITY DATA SUMMARY:
Reliability Test Results: Package = TO-220, Device = MBR20100CT
Sample Size
Test
Conditions
Interval
(Lots x Units) Rejects
HTRB
150 deg C, 80% rated Voltage 504 and 1008 hrs
3x80
0
IOL
Delta Tj of 100 deg C max
4286 and 8572 cyc
3x80
0
TC
Ta=-65C to +150 deg C
500 and 1000 cyc
3x80
0
Issue Date: 30 Mar, 2004
Page 1 of 3
Final Product/Process Change Notification #13389
ELECTRICAL CHARACTERISTIC SUMMARY:
Electrical characterization has been completed on the designated qualification devices. These devices
are representative of the entire family and will qualify the process. Datasheet specifications and
electrical performance of the devices will remain unchanged.
Characterization summary results:
Device MBR20100CT
Lot
Temp
CONTROL 25C
DC Results
Stat
Ir@100V
AVG
5.48E-07
STDEV
1.21E-07
MIN
2.88E-07
MAX
8.46E-07
CPK
274.53
Vf@10A
0.742
0.009
0.733
0.764
4.24
Vf@20A
0.820
0.009
0.812
0.843
4.96
ENG 1
25C
AVG
STDEV
MIN
MAX
CPK
9.20E-07
8.64E-07
6.14E-07
6.20E-06
38.23
0.739
0.002
0.735
0.742
17.23
0.834
0.003
0.829
0.845
12.87
ENG2
25C
AVG
STDEV
MIN
MAX
CPK
7.75E-07
1.78E-07
4.51E-07
1.39E-06
185.53
0.731
0.004
0.724
0.741
9.64
0.821
0.004
0.815
0.830
12.27
ENG3
25C
AVG
STDEV
MIN
MAX
CPK
1.30E-06
5.54E-07
8.20E-07
3.00E-06
59.35
0.735
0.015
0.728
0.829
2.51
0.833
0.016
0.826
0.926
2.49
Device MBRB20100CT DC Results
Lot
Temp Stat
Ir@100V
CONTROL
25C
AVG
6.02E-07
STDEV
5.51E-08
MIN
5.01E-07
MAX
7.15E-07
CPK
601.67
Vf@10A
0.754
0.002
0.749
0.759
13.42
Vf@20A
0.845
0.002
0.841
0.851
15.02
ENG 1
25C
AVG
STDEV
MIN
MAX
CPK
7.53E-07
1.40E-07
6.50E-07
1.23E-06
236.01
0.727
0.003
0.719
0.731
15.33
0.821
0.003
0.816
0.828
13.70
ENG2
25C
AVG
STDEV
MIN
MAX
CPK
6.89E-07
1.44E-07
5.67E-07
1.36E-06
229.14
0.730
0.002
0.727
0.735
22.14
0.823
0.002
0.819
0.830
17.86
Issue Date: 30 Mar, 2004
Page 2 of 3
ENG3
25C
AVG
STDEV
MIN
MAX
CPK
1.33E-06
7.58E-07
9.87E-07
5.03E-06
43.41
0.725
0.002
0.721
0.730
16.89
0.820
0.003
0.816
0.825
16.27
Additional data on UIS, IFSM and ESD available on request.
CHANGED PART IDENTIFICATION:
There will be no changes to device marking, case outline and package functionality.
Products with date code 0422 (June 4, 2004) and forward, may carry the change.
AFFECTED DEVICE LIST (WITHOUT SPECIALS):
PART
MBR16100CT
MBR20100CT
MBR2080CT
MBR2090CT
MBR2090CTLFAJ
MBRB20100CT
MBRB20100CTT4
MBRF20100CT
MBRF2060CT
Issue Date: 30 Mar, 2004
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