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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16450A
Generic Copy
15-Nov-2011
TITLE: Final Notification for Capacity Expansion Qualification of ON Semiconductor Roznov, Czech
Republic Wafer Fab (CZ4) for HD Plus Currently Fabricated at ON Semiconductor’s Aizu Japan Wafer
Fab
PROPOSED FIRST SHIP DATE: 15-Feb-2012
AFFECTED CHANGE CATEGORY(S): ON Semi Fab Site
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Ed Pope <[email protected]> or Debbie
Kowal <[email protected] >
SAMPLES: Contact your local ON Semiconductor Sales Office or Ed Pope <[email protected]>
ADDITIONAL RELIABLITY DATA: Available. Contact your local ON Semiconductor Sales Office or
Donna Scheuch < [email protected] >
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
This FPCN is a follow up from IPCN#16450. ON Semiconductor is notifying customers that these HD
Plus process products are now fabricated in ON Semiconductor’s CZ4 wafer fabrication facility in
Roznov, Czech Republic. Upon expiration of the associated Final PCN(s), devices may be supplied
from either the Aizu or CZ4 wafer fab.
The HD Plus processes are now qualified at the CZ4 wafer fab. No die design or process changes
were occurred. No changes to product parameters or packaging occurred as a result of this wafer fab
qualification.
Issue Date: 15-Nov-2011
Rev. 3-Nov-2011
Page 1 of 2
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16450A
RELIABILITY DATA SUMMARY:
QUALIFICATION PLAN
A full qualification and reliability testing were performed on a qualification vehicle NIS5132MN1TXG,
which was chosen based on highest voltage.
Reliability Test Results of NIS5132MN1TXG:
#
1
2
3
4
5
Test
AC-PC
HAST-PC
HTOL
HTRB
HTSL
Test Conditions
Ta = 121°C/ 100% RH/ 15psig
130°C/85% RH for 96 hrs
TA = 125°C for 504hrs
TA = 125°C for 504hrs
TA = 150°C for 504hrs
6
TC-PC
-65°C to +150°C for 500 cycles
Read points
Test @ 96hrs
Test @ 96hrs
Test @ 504 Hrs
Test @ 504 Hrs
Test @ 504 Hrs
Test @ 500
cycles
Sample Size
3 lots x 77 units
3 lots x 77 units
3 lots x 77 units
3 lots x 77 units
3 lots x 77 units
Results
0 / 231
0 / 231
0 / 231
0 / 231
0 / 231
3 lots x 77 units
0 / 231
ELECTRICAL CHARACTERISTIC SUMMARY:
Data are available upon request. Contact Ed Pope < [email protected] >
CHANGED PART IDENTIFICATION:
Affected products from ON Semiconductor with date code marking starting WW06 (2012) and greater
may be sourced from either the Aizu Wafer Fab in Japan or the CZ4 Wafer fab in Roznov, Czech
Republic.
List of affected General Parts:
NUD4700SNT1G
Issue Date: 15-Nov-2011
Rev. 3-Nov-2011
Page 2 of 2