FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16450A Generic Copy 15-Nov-2011 TITLE: Final Notification for Capacity Expansion Qualification of ON Semiconductor Roznov, Czech Republic Wafer Fab (CZ4) for HD Plus Currently Fabricated at ON Semiconductor’s Aizu Japan Wafer Fab PROPOSED FIRST SHIP DATE: 15-Feb-2012 AFFECTED CHANGE CATEGORY(S): ON Semi Fab Site FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Ed Pope <[email protected]> or Debbie Kowal <[email protected] > SAMPLES: Contact your local ON Semiconductor Sales Office or Ed Pope <[email protected]> ADDITIONAL RELIABLITY DATA: Available. Contact your local ON Semiconductor Sales Office or Donna Scheuch < [email protected] > NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: This FPCN is a follow up from IPCN#16450. ON Semiconductor is notifying customers that these HD Plus process products are now fabricated in ON Semiconductor’s CZ4 wafer fabrication facility in Roznov, Czech Republic. Upon expiration of the associated Final PCN(s), devices may be supplied from either the Aizu or CZ4 wafer fab. The HD Plus processes are now qualified at the CZ4 wafer fab. No die design or process changes were occurred. No changes to product parameters or packaging occurred as a result of this wafer fab qualification. Issue Date: 15-Nov-2011 Rev. 3-Nov-2011 Page 1 of 2 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16450A RELIABILITY DATA SUMMARY: QUALIFICATION PLAN A full qualification and reliability testing were performed on a qualification vehicle NIS5132MN1TXG, which was chosen based on highest voltage. Reliability Test Results of NIS5132MN1TXG: # 1 2 3 4 5 Test AC-PC HAST-PC HTOL HTRB HTSL Test Conditions Ta = 121°C/ 100% RH/ 15psig 130°C/85% RH for 96 hrs TA = 125°C for 504hrs TA = 125°C for 504hrs TA = 150°C for 504hrs 6 TC-PC -65°C to +150°C for 500 cycles Read points Test @ 96hrs Test @ 96hrs Test @ 504 Hrs Test @ 504 Hrs Test @ 504 Hrs Test @ 500 cycles Sample Size 3 lots x 77 units 3 lots x 77 units 3 lots x 77 units 3 lots x 77 units 3 lots x 77 units Results 0 / 231 0 / 231 0 / 231 0 / 231 0 / 231 3 lots x 77 units 0 / 231 ELECTRICAL CHARACTERISTIC SUMMARY: Data are available upon request. Contact Ed Pope < [email protected] > CHANGED PART IDENTIFICATION: Affected products from ON Semiconductor with date code marking starting WW06 (2012) and greater may be sourced from either the Aizu Wafer Fab in Japan or the CZ4 Wafer fab in Roznov, Czech Republic. List of affected General Parts: NUD4700SNT1G Issue Date: 15-Nov-2011 Rev. 3-Nov-2011 Page 2 of 2