FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #17001 Generic Copy Issue Date: 21-Feb-2013 TITLE: MAX708 Device Family Qualification at Gresham Wafer Fab PROPOSED FIRST SHIP DATE: 21-May-2013 AFFECTED CHANGE CATEGORY(S): Wafer Fab Location FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or [email protected]. SAMPLES: Contact your local ON Semiconductor Sales Office or [email protected] ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or [email protected]. NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: ON Semiconductor is pleased to announce the qualification of the MAX708 family in ON Semiconductor’s Gresham wafer fab facility on the ACMOS1 technology. The MAX708 is currently produced at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan. Due to the announcement of the Aizu fab closure, this device family will be produced from ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fab. The Gresham wafer fab is compliant to ISO9001:2008, ISO/TS16949:2009, and ISO14001:2004. Performance of device electrical parameters is the same for Aizu and Gresham-sourced devices. The HBM ESD performance for the GSH device is updated to1000V. The latch up specification of +330mA/ -280mA applies to all pins of the GSH device but for the PFI input pin. A new datasheet revision will reflect the updated ESD and LU performance. The MAX708 devices will continue to be assembled and tested in existing, qualified locations. No changes to packaging will occur as a result of this fab qualification. Issue Date: 21-Feb-2013 Rev. 06-Jan-2010 Page 1 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #17001 RELIABILITY DATA SUMMARY: Reliability Test Results: The Gresham-sourced MAX708 family has been qualified based on the following test results: Test Conditions High Temp Op Life NCP304 NCP551 NCP2860 NCS2002 Ta=+125C, 1008 hours Early Life Failure Rate NCP304 NCP551 NCS2002 Ta=+125C, 48 hours Highly Accelerated Stress NCP304 NCP551 NCS2002 Ta=131C/85% RH, 96 hours w/MSL1 pre-conditioning Unbiased Highly Accel. Stress NCP304 NCP551 NCP2860 NCS2002 Ta=131C/85% RH, 96 hours w/MSL1 pre-conditioning Temperature Cycle NCP304 NCP551 NCP2860 NCS2002 -65C to +150C, 500 cycles 0/80 (1 lot) 0/80 (1 lot) 0/80 (3 lots) 0/80 (1 lot) 0/800 (1 lot) 0/800 (1 lot) 0/800 (1 lot) Latch Up Issue Date: 21-Feb-2013 0/80 (1 lot) 0/80 (1 lot) 0/80 (1 lot) 0/80 (1 lot) 0/80 (1 lot) 0/80 (3 lots) 0/80 (1 lot) 0/80 (1 lot) 0/80 (1 lot) 0/80 (3 lots) 0/80 (1 lot) Scan Acoustical Tomography NCP304 NCP551 NCP2860 NCS2002 ESD Results MSL1 0/5 (1 lot) 0/5 (1 lot) 0/5 (3 lots) 0/5 (1 lot) Human Body Model Machine Model JEDEC JESD78 All pins except PFI input Rev. 06-Jan-2010 Pass 1000V (MAX708) Pass 250V (MAX708) Pass 300mA Pos, Pass 280mA Neg (MAX708) Page 2 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #17001 ELECTRICAL CHARACTERISTIC SUMMARY: Electrical characterization test data has been obtained on Gresham MAX708 material. No significant changes in part performance as compared to the existing Aizu-sourced product were observed. Cpk’s of all critical parameters are greater than 1.67. Data may be provided upon request. CHANGED PART IDENTIFICATION: Devices with date codes of 2013 work week 21 or later may be sourced from either wafer Gresham or Aizu fab. List of affected General Parts: MAX708CUA-TG MAX708ESA-TG MAX708RCUA-TG MAX708RESA-TG MAX708SCUA-TG MAX708SESA-TG MAX708TCUA-TG MAX708TESA-TG Issue Date: 21-Feb-2013 Rev. 06-Jan-2010 Page 3 of 3