FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 28-Mar-2007 SUBJECT: ON Semiconductor Final Product/Process Change Notification #16002 TITLE: Final Notification for SO8-MCM Expansion to OSPI PROPOSED FIRST SHIP DATE: 28-May-2007 AFFECTED CHANGE CATEGORY(S): Assembly and Test AFFECTED PRODUCT DIVISION(S): DCG, Digital and Consumer Group; Applications Specific Integrated Products Division. FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Paul Alonas<[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Rick Luevanos <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is the Final Process Change Notice to IPCN 15506 located at www.onsemi.com to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 8 lead narrow SOIC MCM (SO-8 Multi Chip Module) packages. The devices listed on this FPCN have historically been assembled or tested at the ASE assembly/test facility located in Chung Li, Taiwan. At the expiration of this Final PCN, these devices may be processed at either location. The ON Semiconductor facility at Carmona, Philippines is fully qualified and has been producing the SOIC narrow body Product for many years. Issue Date: 28-Mar-2007 Rev.07-02-05 Page 1 of 3 Final Product/Process Change Notification #16002 RELIABILITY DATA SUMMARY: Table 1. Reliability Evaluation Results for Device LC03-6R2 Qualification Points in BOLD End Point Test Name Test Conditions (rej/ss) (rej/ss) (rej/ss) Req’s Results Read Point Lot A Lot B Lot C # Test 1 Prep 2 HTSL High Temp Storage Life Sample preparation and initial part testing various --- Initial Electrical done done done 150°C for 1008 hours c = 0, Room 504 Hrs 0/77 0/77 0/77 3 PC MSL1 Preconditioning 3 IR @ 260 deg C c = 0, Room 4 TCPC Precond. Temp Cycle -65/+150 C c = 0, Room 500 cyc 0/77 0/77 0/77 5 HASTPC Precond. HAST TA= +130C, RH = 85%, PSIG= 18.8, bias c = 0, Room 96 hrs 0/80 0/80 0/80 6 ACPC Precond. Autoclave TA = 121 C, RH = 100%,PSIG = 15 c = 0, Room 96 hrs 0/77 0/77 0/77 # Test Table 2. Reliability Evaluation Results for Device NUP4201DR2 Qualification Points in BOLD End Point Test Name Test Conditions (rej/ss) (rej/ss) (rej/ss) Req’s Results Read Point Lot A Lot B Lot C Sample preparation and initial part testing 1 Prep 2 HTSL High Temp Storage Life various --- Initial Electrical done done done 150°C for 1008 hours c = 0, Room 504 Hrs 1008 Hrs 0/80 0/80 0/80 0/80 0/80 0/80 3 PC MSL1 Preconditioning 3 IR @ 260 deg C c = 0, Room 4 TCPC Precond. Temp Cycle -65/+150 C c = 0, Room 500 cyc 0/80 0/80 0/80 5 HASTPC Precond. HAST TA= +130C, RH = 85%, PSIG= 18.8, bias c = 0, Room 96 hrs 0/80 0/80 0/80 6 ACPC Precond. Autoclave TA = 121 C, RH = 100%,PSIG = 15 c = 0, Room 96 hrs 0/80 0/80 0/80 ELECTRICAL CHARACTERISTIC SUMMARY: Because no die changes were associated with this FPCN the device characteristics have not changed from the Data Sheets already published. You may obtain data sheets from your local sales representative. CHANGED PART IDENTIFICATION: Devices assembled at ASECL, Taiwan will contain an “X” in the first digit of the second line of marking. Devices assembled at ON Semiconductor, Carmona, Philippines will contain a “P” as the first digit of the second line of marking. Issue Date: 28-Mar-2007 Rev.07-02-05 Page 2 of 3 Final Product/Process Change Notification #16002 AFFECTED DEVICE LIST NUP4201DR2 LC03-6R2 SRDA05-4R2 Issue Date: 28-Mar-2007 Rev.07-02-05 Page 3 of 3