89598

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
J
Add device types 42, 43, 44, 45, and 46. Editorial changes to pages
1, 3, 7-15. Update boilerplate. ksr
98-03-03
Raymond Monnin
K
Added provisions to accommodate radiation-hardened devices.
Added device type 47 to drawing. glg
00-03-01
Raymond Monnin
L
Corrected case outline 8 Figure 1 to show correct numbering of
terminals. Corrected Figure 2 Terminal connections. Corrected the
case outline Y Figure 1 to show the proper distance of E and E1.
Added note to Case outline Y Figure 1, to allow for bottom brazed
package as an alternative style to the side brazed package . Update
boilerplate. Editorial changes throughout. ksr
00-12-08
Raymond Monnin
M
Changed the minimum value for the Q dimension on package T from
0.026 to 0.020 and removed footnote 12. Editorial changes
throughout.. ksr
02-12-19
Raymond Monnin
N
Added device type 48 to drawing. ksr
03-08-12
Raymond Monnin
P
Corrected typo on Figure 4 (Read Cycle). ksr
05-08-16
Raymond Monnin
R
Vendor requested change in capacitance in Table I for devices 39
and 40 from 5 pF to 8 pF. ksr
06-02-13
Raymond Monnin
T
Vendor added RHA device type 49. Updated and re-sequenced
footnotes in Table I. Reformatted Appendixes. Update drawing to
current MIL-PRF-38535 requirements. - llb
14-06-25
Charles F. Saffle
REV
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
SHEET
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
REV
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
SHEET
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
REV
T
T
T
T
T
T
T
T
T
T
T
T
T
T
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
REV STATUS
OF SHEETS
PREPARED BY
Kenneth S. Rice
PMIC N/A
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
Raymond Monnin
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
APPROVED BY
Michael A. Frye
AMSC N/A
REVISION LEVEL
DRAWING APPROVAL DATE
89-04-21
T
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, 128K X 8 STATIC RANDOM
ACCESS MEMORY (SRAM) LOW POWER,
MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
1 OF
DSCC FORM 2233
APR 97
5962-89598
67268
54
5962-E258-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q
and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in
the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected
in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
89598
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01 _
Device
type
(see 1.2.2)
/
M
X
A
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix
A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number 1/
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Circuit function
Access time
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
120 ns
100 ns
85 ns
70 ns
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
120 ns
100 ns
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document
and will also be listed in MIL-HDBK-103.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
2
Device type
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
Generic number 1/
Circuit function
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 standard power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM
128K x 8 very low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
Access time
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
20 ns
20 ns
15 ns
70 ns
70 ns
15 ns
12 ns
12 ns
30 ns
15 ns
40 ns
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix
A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
T
N
M
9
8
7
2/
Descriptive designator
Terminals
GDIP1-T32 or CDIP2-T32
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
CQCC1-N32
See figure 1
See figure 1
See figure 1
32
32
32
32
32
32
32
32
32
32
Package style
dual-in-line
SOJ package
dual-in-line
rectangular chip carrier
flat pack
rectangular chip carrier
rectangular chip carrier
J-leaded rectangular chip carrier
zig-zag in-line
SOJ package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document
and will also be listed in MIL-HDBK-103.
2/ A bottom brazed option for this package now exists (See figure 1, case outline Y NOTE). Customers may specify in the
purchase order to negate the option as acceptable for their use.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
3
1.3 Absolute maximum ratings.
3/ 4/
Supply voltage range (VCC) .......................................... ……………
DC input voltage range (VIN) ........................................ …………...
DC output voltage range (VOUT) ................................... ……………
Storage temperature range .......................................... ……………
Maximum power dissipation (PD) ................................. ……………
Lead temperature (soldering, 10 seconds) .................. ……………
-0.5 V dc to +7.0 V dc
-0.5 V dc to VCC+0.5 V dc
-0.5 V dc to VCC+0.5 V dc
-65C to +150C
1.0 W
+260C
Thermal resistance, junction-to-case (θJC):
Case M ...................................................................... ……………
Cases X, Y, Z, U, and 7 ............................................. ……………
Cases T, N, and 9 ...................................................... ……………
Case 8 ....................................................................... ……………
Output voltage applied in high Z state ......................... ……………
Maximum power dissipation, (PD) ................................ ……………
Maximum junction temperature (TJ) ............................. ……………
See MIL-STD-1835
11C/W 6/
10C/W 6/
16C/W 6/
-0.5 V dc to VCC+0.5 V dc
1.0 W
+150C 7/
5/
5/
1.4 Recommended operating conditions.
Supply voltage range (VCC) .......................................... ……………
Supply voltage range (VSS) .......................................... ……………
High level input voltage range (VIH) ............................. ……………
Low level input voltage range (VIL)............................... ……………
Case operating temperature range (TC)....................... ……………
4.5 V dc minimum to 5.5 V dc maximum
0.0 V dc
2.2 V dc to VCC + 0.5 V dc
-0.5 V dc to 0.8 V dc
-55C to +125C
1.5 Radiation features.
For device type 49:
Maximum total dose available (dose rate = 1 rad(Si)/s)…………..
3/
4/
5/
6/
7/
8/
100 krads(Si) 8/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
All voltages referenced to VSS (VSS = ground) unless otherwise specified.
Negative undershoots to a minimum of -3.0 V are allowed with a maximum of 20 ns pulse width.
When the θJC for this case is specified in MIL-STD-1835, that value shall supersede the value indicated herein.
Maximum junction temperature may be increased to +175ºC during burn-in and steady-state life.
The device type 49 radiation end point limits for the noted parameters are guaranteed only for the conditions as
specified in MIL-STD-883, method 1019, condition B to a maximum total dose of 100 Krads(Si).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
4
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited
in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to: ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959; http://www.astm.org.)
JEDEC INTERNATIONAL (JEDEC)
JESD 78
-
IC Latch-Up Test.
th
(Copies of this document are available online at http://www.jedec.org/ or from JEDEC, 3103 North 10 Street, Suite 240-S,
Arlington, VA 22201).
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix C to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device
class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
5
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table. The truth table shall be as specified on figure 3.
3.2.4 Functional tests. Various functional tests used to test this device are contained in appendix A herein. If the test
patterns cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results
shall be allowed. For device class M, alternate test patterns shall be maintained under document revision level control by
the manufacturer and shall be made available to the preparing or acquiring activity upon request. For device classes Q and
V alternate test patterns shall be under the control of the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the preparing or acquiring activity upon request.
3.2.5 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection
only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and
pass the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water
vapor testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the
requirements as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The
electrical tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA
designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking
for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as
required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a
certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MILHDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an
approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V,
the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and
herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s
agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required
documentation. Offshore documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 041 (see MIL-PRF-38535, appendix A).
3.11 Substitution. Substitution data shall be as indicated in appendix B herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
6
TABLE I. Electrical performance characteristics.
Test
High level input
current
Low level input current
High impedance output
leakage current
Symbol
IIH
IIL
IOZH
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
VCC = 5.5 V, VIN = 5.5 V
Group A
subgroup
s
Device
types
1, 2, 3
1 - 48
10
49
3
VOH
Max
1 1/
1 – 48
2/
R
1 1/
49
2/
1, 2, 3
1 - 48
-10
49
-3
VCC = 5.5 V, VIN = 0.0 V
1 1/
1 - 48
2/
R
1 1/
49
2/
1, 2, 3
1 - 48
10
49
3
VCC = 5.5 V, VO = 5.5 V
VIL = 0.0 V, VIH = 5.0 V
M, D, P
1 1/
1 - 48
2/
R
1 1/
49
2/
1, 2, 3
1 - 48
-10
49
-3
VCC = 5.5 V, VO = 0.0 V
VIL = 0.0 V, VIH = 5.0 V
M, D, P
1 1/
1 - 48
2/
R
1 1/
49
2/
1, 2, 3
01-41,
47 - 49
M, D, P
1 1/
1 - 48
2/
R
1 1/
49
2/
IOH = -4.0 mA, VCC = 4.5 V
VIH = 2.2 V, VIL = 0.8 V
IOH = -1.0 mA, VCC = 4.5 V
VIH = 2.2 V, VIL = 0.8 V
42- 46
M, D, P
1 1/
42- 46
A
A
M, D, P
VIH  OE  VCC
Output high voltage
Min
Unit
M, D, P
VIH  OE  VCC
IOZL
Limits
2.4
A
V
2.4
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
7
TABLE I. Electrical performance characteristics – Continued.
Test
Output low voltage
Symbol
VOL
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
IOL = 8.0 mA, VCC = 4.5 V
VIH = 2.2 V, VIL = 0.8 V
M, D, P
R
Group A
subgroups
Operating supply
current
ICC1
VCC = 5.5 V, CE = VIL max
Limits
Min
Unit
Max
1, 2, 3
01 – 41,
47 – 49
0.4
1 1/
All
2/
1 1/
49
2/
42- 46
0.4
1 1/
42- 46
2/
1, 2, 3
49
50
01-04,
11,19,
26,27,
34,35,
42
125
05, 06,
13, 14
100
07, 08,
15, 16,
22, 23,
30, 31
110
09, 10,
17, 18
115
24, 25,
32, 33,
43
120
12,20,4
7
130
28, 36
135
21, 29,
37, 39,
40,48
140
38
150
41
180
IOL = 2.1 mA, VCC = 4.5 V
VIH = 2.2 V, VIL = 0.8 V
M, D, P
Device
types
OE , WE , and CE2 = VIH
f = 1/tAVAV min
44-46
250
M, D, P
1
1/
1-48
2/
R
1
1/
49
115
V
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
8
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Standby supply current
TTL
ICC2
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
1
R
ICC3
VCC= 5.5 V, CE  VCC -0.2 V
Inputs = VIH or VIL, f = 0
M, D, P
R
Data retention current
ICC4
VCC = 2.0 V, f = 0
1/
1 1/
1, 2, 3
Input capacitance
(A0 - A16)
Input capacitance
3/
3/
CIN
CCLK
( CE , WE , OE )
Output capacitance 3/
COUT
VIN = 0 V, f = 1.0 MHz
TC = +25C, see 4.4.1e
47
2
49
8
01-04,
42
10
05-40,
43,48
25
41
44-46
1 – 48
40
60
49
47
42
01-04,
40,43,48
70
0.3
1
5
49
7
05-39,
41
44-46
10
15
1
1/
49
65
01-04
2
05 - 21,
49
1
40,48
42
47
750
400
150
mA
mA
1
1/
1 – 48
2/
1
1/
49
40
01-38,
41-47
39, 40, 49
12
48
01-38,
41-47
39, 40, 49
5
20
48
5
01-38,
41-47
14
39, 40, 49
8
48
5
4
mA
2/
2/
4
VOUT = 0 V, f = 1.0 MHz
TC = +25C, see 4.4.1e
Max
1 – 48
4
VOUT = 0 V, f = 1.0 MHz
TC = +25C, see 4.4.1e
Unit
1/
CE  VCC - 0.2 V, all other
inputs = 0.2 V or VCC - 0.2 V
R
Limits
1
1, 2, 3
M, D, P
Device
types
Min
1, 2, 3
VCC = 5.5 V, CE = VIH
CE2 = VIL, f = 0 Hz
M, D, P
Standby supply current
CMOS
Group A
subgroups
A
pF
8
pF
8
pF
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
9
TABLE I. Electrical performance characteristics – Continued.
Test
Functional tests
Read cycle time
Symbol
4/
tAVAV
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
Group A
subgroups
See 4.4.1c
7, 8A, 8B
All
M, D, P
7 1/
1 – 48
R
7 1/
49
9, 10, 11
01,05,
13,22,30
120
02,06,
14,23,31
100
03,07,15,
24,32
85
04,08,16,
25,33,42,
43
70
09,17,
26,34
55
10,18,
27,35
45
49
40
11,19,
28,36
35
47
30
12,20,
29,37
25
21,38-40
20
41,44,48
15
45,46
12
See figure 4, as applicable 5/ 6/
Device
types
Limits
Min
M, D, P
9 1/
1 – 48
R
9 1/
49
Unit
Max
2/
ns
ns
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
10
TABLE I. Electrical performance characteristics – Continued.
Test
Address access time
Symbol
tAVQV
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
Group A
subgroups
See figure 4, as applicable
9, 10, 11
Device
types
Limits
Min
M, D, P
9 1/
R
9 1/
Unit
Max
01,05,
13,22,
30
120
02,06,
14,23,
31
100
03,07,
15,24,
32
85
04,08,
16,25,
33,42,
43
70
09,17,
26,34
55
10,18,
27,35
45
49
40
11,19,
28,36
35
47
30
12,20,
29,37
25
21,
38-40
20
41,44,48
15
45,46
12
1 – 48
49
2/
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
11
TABLE I. Electrical performance characteristics – Continued.
Test
Chip enable (CSX)
access time
Symbol
tELQV
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
Group A
subgroups
See figure 4, as applicable
9, 10, 11
Device
types
Limits
Min
Unit
Max
01,05,
13,22,30
120
02,06,
14,23,31
100
03,07,
15,24,32
85
04,08,
16,25,
33,42,43
70
09,17,
26,34
55
10,18,
27,35
45
49
40
11,19,
28,36
35
47
30
12,20,
29,37
25
21,38-40
20
41,44,48
15
45,46
12
2/
M, D, P
9 1/
1 – 48
R
9 1/
49
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
12
TABLE I. Electrical performance characteristics – Continued.
Test
Output enable (OE) to
output valid
Symbol
tOLQV
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
Group A
subgroups
Limits
Min
9, 10, 11
See figure 4, as applicable
Device
types
Unit
Max
01,02,
05,06,
13,14,
22,23,
30,31
50
42, 43
35
03,07,
15,24,32
30
04,08,
16,25,33
25
09,10,
17,18,
26,27,
34,35
20
11,19,
28,36
15
47
12
12, 20,
29, 37, 49
10
21,38,
41,44,
45,46
7
39,40,48
6
2/
M, D, P
9 1/
1 – 48
R
9 1/
49
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
13
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Output hold after
address change
tAVQX
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
See figure 4, as applicable
M, D, P
R
Chip enable to
output in low Z
3/ 7/
Chip disable to output
in high Z
3/ 7/
tELQX
M, D, P
R
tEHQZ
M, D, P
R
Output enable
3/ 7/
to output in low Z
Group A
subgroups
M, D, P
R
Limits
Min
9, 10, 11
All
9 1/
1 – 48
9 1/
49
Unit
Max
3
ns
2/
9, 10, 11
All
9 1/
9 1/
1 – 48
49
2/
9, 10, 11
01 - 08,
13 - 16,
22 - 25,
30 - 33,
42, 43
30
09,10,
17,18,
26,27,
34,35
20
11,19,
28,36,4
7
15
49
12
12,20,
29,37
10
21,3840,48
8
41,44,
45,46
7
1 – 48
49
2/
9 1/
9 1/
tOLQX
Device
types
9, 10, 11
All
9 1/
9 1/
1 – 48
49
3
ns
ns
0
ns
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
14
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Output disable to
output in high Z
tOHQZ
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
See figure 4, as applicable
Group A
subgroups
Limits
Min
9, 10, 11
3/ 7/
M, D, P
R
Device
types
9 1/
9 1/
Unit
Max
01 - 08,
13 - 16,
22 - 25,
30 - 33,
42, 43
30
09,10,
17,18,
26,27,
34,35
20
11,19,
28,36
15
12,20,
29,37,
49
10
21,38,4
7
8
41,44,
45,46
7
39,40,4
8
6
1 – 48
49
ns
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
15
TABLE I. Electrical performance characteristics - Continued.
Test
Write cycle time
Symbol
tAVAV
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
See figure 4, as applicable
M, D, P
R
Address setup to
beginning of write
tAVWL
tAVEL
Data hold after end of
write
tWHDX
tEHDX
M, D, P
R
Group A
subgroups
Device
types
Limits
Min
9, 10, 11
01,05,
13,22,
30
02,06,
14,23,
31
120
03,07,
15,24,
32
04,08,
16,25,
33,42,
43
85
09,17,
26,34
55
10,18,
27,35
11,19,
28,36
45
47, 49
30
12,20,
29,37
21,
38-40
25
41,44,48
15
45,46
12
9 1/
01 – 48
9 1/
9, 10, 11
49
9 1/
01 – 48
All
9 1/
49
9, 10, 11
M, D, P
9 1/
01 - 04
05 - 48,
49
1 – 48
R
9 1/
49
Unit
Max
ns
100
70
35
20
2/
0
ns
2/
5
0
ns
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
16
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Write pulse width
tWLWH
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
See figure 4, as applicable
Group A
subgroups
tAVWH
Chip select to end
of write
tELWH
Limits
Min
9, 10, 11
M, D, P
R
Address setup to
end of write
Device
types
9 1/
9 1/
9, 10, 11
M, D, P
R
9 1/
9 1/
05,13,22,30
100
06,14,23,31
80
07,15, 24,32
42, 43
01
10,18, 27,35
02,03
04,08, 09,16,
17,25, 26,33,
34
11,19, 28,36
70
65
50
40
49
26
12,20, 29,37
47
21, 38-40,48
41,44
45,46
1 – 48
49
01,05, 13,22,
30
02,06, 14,23,
31
03,07, 15,24,
32
42, 43
04,08, 16,25,
33
09,17, 26,34
10,18, 27,35
20
22
15
12
11
Unit
Max
ns
35
30
2/
100
85
75
65
60
45
35
49
28
11,19, 28,36
47
12,20, 29,37
21,38
39-41,44,48
45, 46
1 – 48
49
25
22
20
15
12
11
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
17
TABLE I. Electrical performance characteristics - Continued.
Test
Address hold after
end of write
Symbol
tWHAX
tEHAX
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
See figure 4, as applicable
M, D, P
R
Data setup to end of
write
tDVWH
tDVEH
M, D, P
R
Write enable to output
disable
3/ 7/
tWLQZ
tWHQX
9, 10, 11
5
49
3
11,12,19-21,
28,29,36-43,
47,48
0
1 – 48
9 1/
9, 10, 11
49
01,02,05, 06,
13,14, 22,23,
30,31
03,07,
15,24,32
04,08, 16,25,
33,42,43
09,17, 26,34
10,11,18, 19,
27,28, 35,36
47
12,20, 29,37,
49
21,38-40,48
41,44, 45,46
1 – 48
49
1 – 49
R
9 1/
1 – 48
9 1/
49
Unit
Max
ns
2/
40
ns
35
30
25
20
18
15
10
8
2/
01 – 08,
13 – 16,
22 – 25,
30 – 33,
42, 43
09,10, 17,18,
26,27, 34,35
11,19, 28,36
12,20, 29,37
21,38-40,48
47, 49
41, 44-46
1 – 48
49
9, 10, 11
M, D, P
Limits
01-10, 13-18,
22-27, 30-35,
44-46
9 1/
9 1/
9 1/
See figure 4, as applicable
Device
types
Min
9 1/
9 1/
9, 10, 11
M, D, P
R
Output active after
end of write
3/
Group A
subgroups
35
ns
20
15
10
9
8
7
2/
5
ns
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
18
TABLE I. Electrical performance characteristics - Continued.
Test
Retention time
Symbol
3/
Operation recovery time
3/
tCDR
Conditions
-55C  TC  +125C
VSS = 0 V; 4.5 V  VCC  5.5 V
unless otherwise specified
See figure 4, as applicable
Group A
subgroups
Device
types
Limits
Min
9, 10, 11
All
M, D, P
9 1/
1 – 48
R
9 1/
49
9, 10, 11
01,05,
13,22,
30
120
02,06,
14,23,
31
100
03,07,
15,24,
32
85
04,08,
16,25,
33,42,
43
70
09,17,
26,34
55
10,18,
27,35
49
45
11,19,
28,36
35
47
30
12,20,
29,37
25
21,
38- 40
20
41,44,
48
15
45,46
12
tR
M, D, P
9 1/
1 – 48
R
9 1/
49
Unit
Max
0
ns
2/
ns
40
2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
19
TABLE I. Electrical performance characteristics - Continued.
1/
Device type 49 RHA parts supplied to this drawing have been characterized through all levels M, D, P, L and R of
irradiation. However, device type 49 is only tested at the "R" level. Device type 49 is irradiated at dose rate = 1 rad
(Si)/s in accordance with MIL-STD-883, method 1019, condition B, and is guaranteed to a maximum total dose specified
herein section 1.5.
Pre and post irradiation values are identical unless otherwise specified in table I. When performing post irradiation
electrical measurements for any RHA level, TA = +25C.
2/
3/
4/
5/
6/
This parameter is tested initially and after any design or process change which could affect this parameter, and
therefore shall be guaranteed to the limits specified in table I.
Functional tests shall include the test table and other test patterns used for fault detection as approved by the qualifying
activity. Outputs are measured at VOL < 1.5 V, VOH > 1.5 V.
For timing waveforms see figure 4 and for output load circuits, see figure 5.
AC measurements assume transition time  5 ns, input levels are from ground to 3.0 V, and output load C L  30 pF
except as noted on figure 5. Timing reference levels are 1.5 V.
Transition is measured 500 mV from steady state voltage.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
20
Case Y
Inches
Millimeters
Symbol
Min
Max
Min
Max
A
.120
.165
3.05
4.19
A1
.088
.120
2.24
3.05
A2
.070
Ref.
1.78
---
B
.010
Ref.
0.25
---
B1
.030R
Typ.
0.76
---
B2
.020
Ref.
0.51
---
B3
.025
.045
0.64
1.14
D
.816
.838
20.73
21.29
D1
.750
Ref.
19.05
---
E
.419
.431
10.64
10.95
E1
.430
.445
10.42
11.30
E2
.360
.380
9.14
9.65
e
.050 BSC
e1
.038
e2
.005
j
.005
S
S1
Typ.
1.27 BSC
0.97
---
0.13
---
Typ.
0.13
---
.030
.040
0.76
1.02
.020
Typ.
0.51
---
NOTE: A bottom brazed package may be shipped as an alternative package style, provided the vendor makes the
receiving customer aware of the intent to ship the part as a bottom brazed package rather than the one
shown on this figure.
FIGURE 1. Case outlines.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
21
Case Z
Symbol
Inches
Millimeters
Min
Max
Min
Max
A
---
.232
---
5.89
b
.014
.023
0.36
0.58
b1
.038
.065
0.97
1.65
c
.008
.015
0.20
0.38
D
---
1.700
---
41.05
E
.350
.405
9.78
10.29
E1
.390
.420
9.91
10.67
e
.100 BSC
2.54 BSC
L
.125
.200
3.18
5.08
L1
.150
---
3.81
---
Q
.015
.060
0.38
1.52
S
---
.100
---
2.54
S1
.005
---
0.13
---
S2
.005
---
0.13
---

0
15
---
---
N
32
Note: Either configuration in detail A is allowed.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
22
Case U
Symbol
Inches
Millimeters
Min
Nom
Max
Min
Nom
Max
A
.080
.090
.100
2.03
2.29
2.54
b
.022
.025
.028
0.56
0.64
0.71
b1
.006
.014
.022
0.15
0.36
0.56
b2
.040
---
---
1.02
---
---
D
.800
.820
.840
20.32
20.83
21.34
E
.392
.400
.408
9.96
10.16
10.36
e
.050 BSC
1.27 BSC
h
.012 REF
0.30 REF
Notes
4
7
L
.070
.075
.080
1.78
1.90
2.03
L1
.090
.100
.110
2.29
2.54
2.79
5
L2
.003
.009
.015
0.08
0.23
0.38
4
N
32
---
8
FIGURE 1. Case outlines – Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
23
Case U – Continued.
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. All dimensions and tolerances conform to ANSI Y14.5M-1982.
4. Metallized castellations shall be connected to plane 1 terminals.
5. Index area: A pin identification mark shall be located adjacent to pin one within the shaded area shown.
Plane 1 terminal identification may be an extension of the length of the metallized terminal which shall not be
wider than the b dimension.
6. The cover shall not extend beyond the edges of the body.
7. The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option.
8. N indicates the number of terminals.
9. Unless otherwise specified, a minimum clearance of .015 inch (.381 mm) shall be maintained between all
metallized features (e.g., lid, castellation, terminals, thermal pads, etc.).
10. Solder finish is optional with a maximum allowable thickness of .007 inch. Measurement of dimensions A, b1,
and L2 may be made prior to solder application.
FIGURE 1. Case outlines – Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
A
REVISION LEVEL
T
SHEET
24
Case T
Symbol
Inches
Millimeters
Notes
Min
Max
Min
Max
A
.097
.125
2.46
3.18
b
.015
.019
0.38
0.48
5
c
.003
.009
0.08
0.23
5
D
---
.830
---
21.08
3
E
.400
.420
10.16
10.67
E1
---
.450
---
11.43
E2
.180
---
4.57
---
E3
.030
---
0.76
---
e
.050 BSC
1.27 BSC
3
9
4,6
L
.250
.370
6.35
9.40
Q
.020
.045
0.51
1.14
S
---
.045
---
1.14
7
S1
.000
---
0.00
---
7,8
N
32
6
NOTES:
1. Index area; a notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the
shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark.
2. Dimension Q shall be measured at the point of exit of the lead from the body. Dimension Q minimum shall be reduced
by .0015 inch (0.038 mm) maximum when lead finish A is applied.
3. This dimension allows for off-center lid, meniscus, and glass overrun.
4. The basic lead spacing is .050 (1.27 mm) between centerlines. Each lead centerline shall be located within .005 (0.13
mm) of its exact longitudinal position relative to lead 1 and the highest numbered (N) lead.
5. All leads - Increase maximum limit by .003 (0.08 mm) measured at the center of the flat, when lead finish A or B is
applied.
6. Total number of spaces = (N-2). Symbol "N" is the maximum number of leads.
7. Measure all four corner leads.
8. Dimension S1 (see 5.2.2 of MIL-STD-1835) may be .000 (0.00 mm) if the corner leads, upon entering the body of the
package, and within one lead's width, bend toward the die cavity. See 5.2.2 of MIL-STD-1835 for measurement of S1
on bottom-brazed flat packs.
9. Bottom brazed lead configuration. If this configuration is used, no organic or polymeric materials shall be molded to the
bottom of the package to cover the leads.
10. Dimensions are in inches.
11. Metric equivalents are given for general information only.
FIGURE 1. Case outlines – Continued.
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Case N
Symbol
Inches
Millimeters
Min
Max
Min
Max
A
.070
.100
1.78
2.54
b
.022
.028
0.56
0.71
b1
.009 R
b2
.038
.042
.97
1.07
D
.445
.460
11.30
11.68
D1
.295
.305
7.49
7.75
E
.695
.715
17.65
18.16
E1
.395
.405
10.03
10.29
.23 R
e
.050 TYP
1.27 TYP
h
.020 REF
.51 REF
J
.035 REF
.89 REF
L
.045
.055
1.14
1.40
L1
.077
.093
1.96
2.36
FIGURE 1. Case outlines – Continued.
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Case 9
FIGURE 1. Case outlines – Continued.
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Case 9 – Continued.
Symbol
Inches
Millimeters
Min
Max
Min
Max
A
.141
.177
3.58
4.50
A1
.073
.089
1.85
2.26
A2
.078 REF
A3
.033
.065
1.98 REF
.84
1.65
B
.017 REF
.43 REF
B1
.028 REF
.71 REF
D
.445
.458
11.30
11.63
D3
.290
.310
7.37
7.87
D4
.400
.440
10.16
11.18
E
.695
.710
17.65
18.03
E3
.390
.410
9.91
10.41
E4
.650
.690
16.51
17.53
e
.050 TYP
1.27 TYP
e1
.007 REF
.18 REF
h
.020 REF
.51 REF
L
.075
.115
1.91
2.92
Q
.040 MIN
1.02 MIN
R1
.023 R REF TYP
.58 R REF TYP
S1
.003
.035
.08
.89
FIGURE 1. Case outlines - Continued.
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Case 8
Symbol
Inches
Millimeters
Min
Max
Min
Max
A
.460
.500
11.68
12.70
A1
.020
.040
0.51
1.02
A2
.440
.460
11.18
11.68
A3
.565
.645
14.35
16.38
B
.016
.020
0.41
0.51
C
.008
.012
0.20
0.30
D
1.630
1.670
41.40
42.42
E
.090
.130
2.29
3.30
e1
.050 BSC
1.27 BSC
eA
.100 BSC
2.54 BSC
L
.125
.155
3.18
3.95
M
.055
.105
1.40
2.67
.030
.070
0.76
1.78
N
Notes
3
6
32
S
1
NOTES:
1. N is the number of leads.
2. The chamfer on the body is optional. If is not present, a visual index feature must be located within the cross hatched
area.
3. Lead configuration in this area is optional.
4. Controlling dimension: Inches.
5. Solder finish is optional. However, if leads are solder dipped or plated, increase maximum limit of all leads by 0.003"
from center of flat.
6. The cover shall not extend beyond the edges of the ceramic body.
FIGURE 1. Case outlines - Continued.
STANDARD
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Case 7
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
3.35
3.66
.132
.144
A2
0.66
0.91
.026
.036
b
0.38
0.48
.015
.019
B1
0.76
1.02
.030
.040
D
20.62
21.03
.812
.828
D1
18.80
19.30
.740
.760
E
10.29
10.54
.405
.415
E1
11.05
11.30
.435
.445
E2
9.14
9.85
.360
.380
e
N
1.27 BSC
.050 BSC
32
FIGURE 1. Case outlines - continued.
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Device types
Case outlines
01 through 12,
13 through 21,
22 through 29,39,
30 through 38,
40,42 through 46, 48
41,47, 49
X, Y, Z, U, T, N, M, 9, and 7
Terminal number
1
01 through 12,
22 through 29,
39
8
Terminal symbol
NC
NC
NC
2
A16
A16
VCC
3
A14
A14
A16
4
A12
A12
A15
5
A7
A7
A14
6
A6
A6
NC
7
A5
A5
A12
8
A4
A4
WE
9
A3
A3
A7
10
A2
A2
A13
11
A1
A1
A6
12
A0
A0
A8
13
I/O0
I/O0
A5
14
I/O1
I/O1
A9
15
I/O2
I/O2
A4
16
VSS
VSS
A11
17
I/O3
I/O3
A3
18
I/O4
I/O4
OE
19
I/O5
I/O5
A2
20
I/O6
I/O6
A10
21
I/O7
I/O7
A1
22
CE
CE 1
CS
23
A10
A10
A0
24
OE
OE
I/O7
25
A11
A11
I/O0
26
A9
A9
I/O6
27
A8
A8
I/O1
28
A13
A13
I/O5
29
WE
WE
I/O2
30
NC
CE2
I/O4
31
A15
A15
VSS
32
VCC
VCC
I/O3
NC = No connection
FIGURE 2. Terminal connections.
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Mode
CE
*CE2
WE
OE
I/O
Standby
H
X
X
X
High Z
Standby
X
L
X
X
High Z
Read
L
H
H
L
DOUT
Write
L
H
L
X
DIN
Read
L
H
H
H
High Z
H = logic "1" state, L = logic "0" state.
X = logic "don't care" state, and Z = high impedance state.
* = only applies to devices with dual CE .
FIGURE 3. Truth table.
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Read Cycle (see notes 1 and 2)
NOTES:
1.
2.
WE is held high during the read cycle.
Timing measurement reference level is 1.5 V.
FIGURE 4. Timing waveform diagrams.
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Write cycle 1 (see notes 1, 2, and 3)
( CE 1 or CE2 controlled)
NOTES:
1. Either CE1 or CE2 may be used to control the write cycle. If CE1 is used, CE2 should be high when WE is low. If CE2
is used, CE1 should be low when WE is low.
2. In a CE1 or CE2 controlled write cycle, the outputs assume a high impedance state, whether OE is high or low, as long
as WE is low.
3. Timing measurement reference is 1.5 V.
FIGURE 4. Timing waveform diagrams - Continued.
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Write cycle 2 (see notes 1 and 2)
( WE controlled)
NOTES:
1. In the WE controlled write cycle, while WE is low, it will force the outputs into a high impedance state, whether OE
is high or low.
2. Timing measurement reference level is 1.5 V.
FIGURE 4. Timing waveform diagrams - Continued.
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Data retention Waveform (see notes 1 and 2)
NOTES:
1. Either CE 1 or CE2 may be used to begin data retention mode.
2. For tCDR and tR: CE 1  VCC -0.2 V or CE2  0.2 V, VIN  VCC -2.0 V or VIN  0.2 V.
FIGURE 4. Timing waveform diagrams - Continued.
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NOTES:
1.
Use these output load circuits or equivalent for testing.
2.
Including scope and jig.
3.
Minimum of 5 pF for tEHQZ, tOHQZ, tELQX, tOLQX, and tWHQX.
FIGURE 5. Output load circuits.
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NOTE: Input protection resistors = 1 k.
FIGURE 6. Bias conditions for irradiation testing.
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4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance
with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection
procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be
conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall
be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance
inspection.
4.2.1 Additional criteria for device class M.
a.
Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in)
electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
b.
The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs,
biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015.
(1)
c.
Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
Interim and final electrical parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance
with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
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TABLE IIA. Electrical test requirements. 1/ 2/ 3/ 4/ 5/ 6/ 7/
Line
no.
Test requirements
Subgroups
(in accordance with
MIL-STD-883,
TM 5005, table I)
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class M
Device
class Q
Device
class V
1
Interim electrical
parameters (see 4.2)
1, 7, 9
2
Static burn-in
(method 1015)
3
Same as line 1
4
Dynamic burn-in
(method 1015)
5
Same as line 1
6
Final electrical
parameters (see 4.2)
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
7
Group A test
requirements (see 4.4)
1, 2, 3, 4**, 7,
8A, 8B, 9, 10, 11
1, 2, 3, 4**, 7,
8A, 8B, 9, 10, 11
1, 2, 3, 4**, 7,
8A, 8B, 9, 10, 11
8
Group C end-point
electrical
parameters (see 4.4)
2, 3, 7,
8A, 8B
1, 2, 3, 7,
8A, 8B
1, 2, 3, 7, 8A,
8B, 9, 10, 11 
9
Group D end-point
electrical
parameters (see 4.4)
2, 3, 8A, 8B
2, 3, 8A, 8B
2, 3, 8A, 8B
10
Group E end-point
electrical
parameters (see 4.4)
1, 7, 9
1, 7, 9
1, 7, 9
Not
required
Not
required
Required
1*, 7* 
Required
Required
Required
1*, 7* 
1/
2/
3/
4/
5/
6/
Blank spaces indicate tests are not applicable.
Any or all subgroups may be combined when using high-speed testers.
Subgroups 7 and 8 functional tests shall verify the truth table.
* indicates PDA applies to subgroup 1 and 7.
** see 4.4.1e.
 indicates delta limit (see table IIB) shall be required where specified, and the delta values shall be
computed with reference to the previous interim electrical parameters (see line 1).
7/ See 4.4.1d.
TABLE IIB. Delta limits at +25C.
Parameter 1/
Device types
(All)
ICC3 standby
10% of measured value
IIH, IIL
10% of measured value
IOHZ, IOLZ
10% of measured value
1/ The above parameter shall be recorded before and after the
required burn-in and life tests to determine delta (limits.
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4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be
performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and
E inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted.
c.
For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
d.
O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which
may affect the performance of the device. For device class M, procedures and circuits shall be maintained under
document revision level control by the manufacturer and shall be made available to the preparing activity or
acquiring activity upon request. For device classes Q and V, the procedures and circuits shall be under the control
of the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the preparing
activity or acquiring activity upon request. Testing shall be on all pins, on five devices with zero failures. Latch-up
test shall be considered destructive. Information contained in JEDEC JESD 78 may be used for reference.
e.
Subgroup 4 (CIN and COUT measurements) shall be measured only for initial qualification and after any process or
design changes which may affect input or output capacitance. Capacitance shall be measured between the
designated terminal and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all input and
output terminals tested.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1005 of MIL-STD-883.
b.
TA = +125C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test
temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MILPRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1005 of MIL-STD-883.
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4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All
device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at
TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019 condition B, and as specified herein section 1.5.
4.4.4.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level
greater than 5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and
shall be the pre-irradiation end-point electrical parameter limit at 25C 5C. Testing shall be performed at initial
qualification and after any design or process changes which may affect the RHA response of the device.
4.5 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded
before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical
parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option,
either perform delta measurements or within 24 hours after life test perform final electrical parameter tests, subgroups 1, 7 ,
and 9.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record
for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application
requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record
of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 432183990, or telephone (614) 692-0540.
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6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331, and as follows:
CIN, COUT ......................................... Input and bi-directional output, terminal-to-GND capacitance.
GND ................................................... Ground zero voltage potential.
ICC ..................................................... Supply current.
IIL ....................................................... Input current low.
IIH ....................................................... Input current high.
TC....................................................... Case temperature.
TA ....................................................... Ambient temperature.
VCC .................................................... Positive supply voltage.
VIC ..................................................... Positive input clamp voltage.
O/V ..................................................... Latch-up over-voltage.
6.5.1 Timing parameter abbreviations. All timing abbreviations use lower case characters with upper case character
subscripts. The initial character is always "t" and is followed by four descriptors. These characters specify two signal points
arranged in a "from-to" sequence that define a timing interval. The two descriptors for each signal specify the signal name
and the signal transitions. Thus the format is:
t
X
X
X
X




Signal name from which interval is derived







Transition direction for first signal





Signal name to which interval is defined



Transition direction for second signal

a.
Signal definitions:
A = Address
D = Data in
Q = Data out
W = Write enable
E = Chip enable
O = Output enable
b.
Transition definitions:
H = Transition to high
L = Transition to low
V = Transition to valid
X = Transition to invalid or don't care
Z = Transition to off (high impedance)
6.5.2 Timing limits. The table of timing values shows either a minimum or a maximum limit for each parameter. Input
requirements are specified from the external system point of view. Thus, address setup time is shown as a minimum since
the system must supply at least that much time (even though most devices do not require it). On the other hand, responses
from the memory are specified from the device point of view. Thus, the access time is shown as a maximum since the
device never provides data later than that time.
STANDARD
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6.5.3 Waveforms.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6
herein) to DLA Land and Maritime-VA and have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has
been submitted to and accepted by DLA Land and Maritime-VA.
STANDARD
MICROCIRCUIT DRAWING
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APPENDIX A
Appendix A forms a part of SMD 5962-89598
FUNCTIONAL ALGORITHMS
A.1 SCOPE
A.1.1 Scope. Functional algorithms are test patterns which define the exact sequence of events used to verify proper
operation of a random access memory (RAM). Each algorithm serves a specific purpose for the testing of the device. It is
understood that all manufacturers do not have the same test equipment; therefore, it becomes the responsibility of each
manufacturer to guarantee that the test patterns described herein are followed as closely as possible, or equivalent patterns
be used that serve the same purpose. Each manufacturer should demonstrate that this condition will be met. Algorithms
shall be applied to the device in a topologically pure fashion. This appendix is a mandatory part of the specification. The
information contained herein is intended for compliance.
A.2 APPLICABLE DOCUMENTS. This section is not applicable to this appendix.
A.3 ALGORITHMS
A.3.1 Algorithm A (pattern 1).
A.3.1.1 Checkerboard, checkerboard-bar.
Step 1.
Step 2.
Step 3.
Step 4.
Load memory with a checkerboard data pattern by incrementing from location 0 to maximum.
Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum.
Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum.
Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to maximum.
A.3.2 Algorithm B (pattern 2).
A.3.2.1 March.
Step 1.
Step 2.
Step 3.
Step 4.
Step 5.
Step 6.
Step 7.
Step 8.
Step 9.
Step 10.
Step 11.
Step 12.
Step 13.
Step 14.
Step 15.
Step 16.
Step 17.
Step 18.
Load memory with background data, incrementing from minimum to maximum address locations (All "0's").
Read data in location 0.
Write complement data to location 0.
Read complement data in location 0.
Repeat steps 2 through 4 incrementing X-fast sequentially, for each location in the array.
Read complement data in maximum address location.
Write data to maximum address location.
Read data in maximum address location.
Repeat steps 6 through 8 decrementing X-fast sequentially for, each location in the array.
Read data in location 0.
Write complement data to location 0.
Read complement data in location 0.
Repeat steps 10 through 12 decrementing X-fast sequentially for each location in the array.
Read complement data in maximum address location.
Write data to maximum address location.
Read data in maximum address location.
Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array.
Read background data from memory, decrementing X-fast from maximum to minimum address locations.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89598
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REVISION LEVEL
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APPENDIX A - Continued.
Appendix A forms a part of SMD 5962-89598
FUNCTIONAL ALGORITHMS
A.3.3 Algorithm C (pattern 3).
A.3.3 XY March.
Step 1.
Step 2.
Step 3.
Step 4.
Step 5.
Step 6.
Step 7.
Step 8.
Step 9.
Step 10.
Step 11.
Step 12.
Step 13.
Step 14.
Step 15.
Step 16.
Step 17.
Step 18.
Load memory with background data, incrementing from minimum to maximum address locations (All "0's").
Read data in location 0.
Write complement data to location 0.
Read complement data in location 0.
Repeat steps 2 through 4 incrementing Y-fast sequentially, for each location in the array.
Read complement data in maximum address location.
Write data to maximum address location.
Read data in maximum address location.
Repeat steps 6 through 8 decrementing X-fast sequentially for each location in the array.
Read data in location 0.
Write complement data to location 0.
Read complement data in location 0.
Repeat steps 10 through 12 decrementing Y-fast sequentially for each location in the array.
Read complement data in maximum address location.
Write data to maximum address location.
Read data in maximum address location.
Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array.
Read background data from memory, decrementing Y-fast from maximum to minimum address locations.
A.3.4 Algorithm D (pattern 4).
A.3.4.1 CEDES - CE deselect checkerboard, checkerboard-bar.
Step 1.
Step 2.
Step 3.
Step 4.
Step 5.
Step 6.
Load memory with a checkerboard data pattern by incrementing from location 0 to maximum.
Deselect device, attempt to load memory with checkerboard-bar data pattern by incrementing from location 0
to maximum.
Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum.
Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum.
Deselect device, attempt to load memory with checkerboard data pattern by incrementing from location 0 to
maximum.
Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to maximum.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
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APPENDIX B
Appendix B forms a part of SMD 5962-89598
SUBSTITUTION DATA
B.1 SCOPE
B.1.1 Scope. This appendix contains the PIN substitution information to support the one part-one part number system.
For new designs, after the date of this document the NEW PIN shall be used in lieu of the OLD PIN. For existing designs
prior to the date of this document the NEW PIN can be used in lieu of the OLD PIN. This appendix is a mandatory part of
the specification. The information contained herein is intended for compliance. The PIN substitution data shall be as
follows:
B.2 APPLICABLE DOCUMENTS
This section is not applicable to this appendix.
B.3 SUBSTITUTION DATA
NEW PIN
OLD PIN
5962-8959801MXX
5962-8959802MXX
5962-8959803MXX
5962-8959804MXX
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
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DSCC FORM 2234
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5962-8959801XX
5962-8959802XX
5962-8959803XX
5962-8959804XX
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APPENDIX C
Appendix C forms a part of SMD 5962-89598
C.1 SCOPE
C.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the
manufacturers approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic
modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product
assurance classes consisting of military high reliability (device class Q) and space application (device class V) are reflected
in the Part or Identification Number (PIN). When available, a choice of Radiation Hardiness Assurance (RHA) levels are
reflected in the PIN.
C.1.2 PIN. The PIN is as shown in the following example:
5962
-
89598
Federal
stock class
designator
\
RHA
designator
(see A.1.2.1)
01
V
6
A
Device
type
(see A.1.2.2)
Device
class
designator
(see A.1.2.3)
Die
code
Die
details
(see A.1.2.4)
/
\/
Drawing number
C.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A
dash (-) indicates a non-RHA die.
C.1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit function
Access time
47
65608EV-30
128K X 8 very low power CMOS SRAM
30ns
C.1.2.3 Device class designator.
Device class
Q or V
Device requirements documentation
Certification and qualification to the die requirements of MIL-PRF-38535
C.1.2.4 Die code. The die code designator shall be a number 6 for all devices supplied as die only with no case outline.
C.1.2.5 Die Details. The die details designation is a unique letter which designates the die's physical dimensions,
bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for
each product and variant supplied to this appendix.
C.1.2.5.1 Die physical dimensions.
Die type
Figure number
01
A-1
C.1.2.5.2 Die bonding pad locations and electrical functions.
Die type
Figure number
01
STANDARD
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APPENDIX C – Continued.
Appendix C forms a part of SMD 5962-89598
C.1.2.5.3 Interface materials.
Die type
Figure number
01
A-1
C.1.2.5.4 Assembly related information.
Die type
Figure number
01
A-1
C.1.3 Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.
C.1.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details.
C.2 APPLICABLE DOCUMENTS.
C.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form
a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those
cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARD
MIL-STD-883 - Test Method Standard Microcircuits.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
C.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
C.3 REQUIREMENTS
C.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The
modification in the QM plan shall not effect the form, fit or function as described herein.
C.3.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as
specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein.
C.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in C.1.2.5.1 and on figure A-1.
C.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall
be as specified in C.1.2.5.2 and on figure A-1.
C.3.2.3 Interface materials. The interface materials for the die shall be as specified in C.1.2.5.3 and on figure A-1.
STANDARD
MICROCIRCUIT DRAWING
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APPENDIX C – Continued.
Appendix C forms a part of SMD 5962-89598
C.3.2.4 Assembly related information. The assembly related information shall be as specified in C.1.2.5.4 and figure A-1.
C.3.2.5 Truth table(s). The truth table(s) shall be as defined within paragraph 3.2.3 of the body of this document.
C.3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.4 of the body
of this document.
C.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this
document.
C.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing
sufficient to make the packaged die capable of meeting the electrical performance requirements in table I.
C.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stacks of carriers, for shipment to a
customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN
listed in 10.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.
C.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see C.6.4 herein). The certificate of
compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this appendix shall
affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the
requirements herein.
C.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
shall be provided with each lot of microcircuit die delivered to this drawing.
C.4 VERIFICATION
C.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in
accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The
manufacturer's modifications in the QM plan shall not effect the form, fit or function as described herein.
C.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in
the manufacturer's QM plan. As a minimum it shall consist of:
a.
Wafer lot acceptance for Class V product using the criteria defined within MIL-STD-883 test method 5007.
b.
100% wafer probe (see paragraph C.3.4).
c. 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 test method 2010
or the alternate procedures allowed within MIL-STD-883 test method 5004.
C.4.3 Conformance inspection.
C.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured
(see C.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical
testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within
paragraphs 4.4.4, 4.4.4.1, 4.4.4.1.1., 4.4.4.2, 4.4.4.3 and 4.4.4.4.
C.5 DIE CARRIER
C.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM
plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical,
mechanical and electrostatic protection.
STANDARD
MICROCIRCUIT DRAWING
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APPENDIX C – Continued.
Appendix C forms a part of SMD 5962-89598
C.6 NOTES
C.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance
with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications
and logistics purposes.
C.6.2 Comments. Comments on this appendix should be directed to DLA Land and Maritime-VA, Columbus, Ohio,
43218-3990 or telephone (614)-692-8108.
C.6.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined within
MIL-PRF-38535 and MIL-STD-1331.
C.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see C.3.6 herein) to DLA Land and
Maritime-VA and have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
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REVISION LEVEL
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APPENDIX C – Continued.
Appendix C forms a part of SMD 5962-89598
Pad number
Top left corner
Pad
reference
Position relative to center of die
(dimensions are in millimeters)
Rotation angle
In degrees
Manufacturer
Pad reference
Signal
name
1
A
X
-7,706
Y
2,297
2
A
0
20
(A3)
-7,706
2,117
0
21
(A2)
3
A
-7,706
1,937
0
22
(Al)
4
A
-7,706
1,757
0
23
(A0)
5
A
-7,706
1,522
0
24
(1/O0)
6
A
-7,706
1,242
0
25
I/O1
7
A
-7,706
0,992
0
26
Gnd
8
A
-7,706
0,742
0
27
I/O2
9
A
-7,706
0,242
0
28
Gnd
10
B
-7,706
0,042
0
29
Gnd
11
A
-7,706
-0,158
0
30
Gnd
12
A
-7,706
-0,408
0
31
I/O3
13
A
-7,706
-0,688
0
32
I/O4
14
A
-7,706
-0,913
0
33
Gnd
15
A
-7,706
-1,138
0
34
I/O5
16
A
-7,706
-1,418
0
35
(I/O6)
17
A
-7,706
-1,698
0
36
(I/O7)
18
A
-7,706
-1,938
0
37
(CS1/)
19
A
-7,706
-2,118
0
38
(A1O)
20
A
-7,706
-2,298
0
39
(OE/)
21
A
-7,488
-2,504
0
40
I/O6
22
A
-7,227
-2,504
0
41
Gnd
23
A
-6,947
-2,504
0
42
I/O7
24
A
-5,787
-2,504
0
43
CS1/
25
A
-4,787
-2,504
0
44
Al0
26
A
-3,787
-2,504
0
45
OE/
27
A
-0,187
-2,504
0
46
Gnd
28
A
3,813
-2,504
0
47
All
29
A
4,813
-2,504
0
48
A9
Figure A-1 - MMO-65608EV Bond Pad Locations and Functions
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
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APPENDIX C – Continued.
Appendix C forms a part of SMD 5962-89598
Pad number
Top left corner
Pad
reference
Position relative to center of die
(dimensions are in millimeters)
Rotation angle
In degrees
Manufacturer
Pad reference
Signal
name
30
A
X
5,813
Y
-2,504
0
49
A8
31
A
6,613
-2,504
0
50
A13
32
A
7,213
-2,504
0
51
W/
33
A
7,729
-2,333
0
52
(A11)
34
A
7,729
-2,158
0
53
(A9)
35
A
7,729
-1,983
0
54
(A8)
36
A
7,729
-1,808
0
55
(A13)
37
A
7,729
-1,633
0
56
(W)
38
A
7,729
-1,407
0
57
CS2
39
A
7,729
-1,183
0
58
Gnd
40
A
7,729
-0,983
0
59
A15
41
A
7,729
-0,188
0
60
Vcc
42
B
7,722
0,042
0
61
Vcc
43
A
7,729
0,272
0
62
Vcc
44
A
7,729
0,842
0
1
A16
45
A
7,729
1,067
0
2
Gnd
46
A
7,729
1,267
0
3
A14
47
A
7,729
1,436
0
4
(A12)
48
A
7,729
1,617
0
5
(A7)
49
A
7,729
1,792
0
6
(A6)
50
A
7,729
1,967
0
7
(A5)
51
A
7,729
2,142
0
8
(A4)
52
A
7,729
2,323
0
9
A12
53
A
7,638
2,504
0
10
A7
54
A
6,813
2,504
0
11
A6
55
A
6,613
2,504
0
12
A5
56
A
4,413
2,504
0
13
A4
57
A
0,013
2,504
0
14
Gnd
58
A
-3,787
2,804
0
15
A3
59
A
-4,787
2,504
0
16
A2
60
A
-6,787
2,504
0
17
A1
61
A
-6,387
2,504
0
18
A0
62
A
-7,481
2,504
0
19
I/O0
Figure A-1 - MMO-65608EV Bond Pad Locations and Functions – Continued
STANDARD
MICROCIRCUIT DRAWING
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COLUMBUS, OHIO 43218-3990
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APPENDIX C – Continued.
Appendix C forms a part of SMD 5962-89598
Die physical dimensions.
Die size: 15 860 X 5 410 microns
Die thickness: 475 microns
Interface materials.
Top metallization: Aluminium + 1% Copper
Backside metallization: bare silicon
Glassivation.
Type: Silicon Oxide + Nitride
Thickness: 15 000 Angstroms
Substrate: Single crystal silicon
Assembly related information.
Substrate potential: not connected
Special assembly instructions: None
Figure A-1 - MMO-65608EV Bond Pad Locations and Functions – Continued
STANDARD
MICROCIRCUIT DRAWING
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COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
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STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 14-06-25
Approved sources of supply for SMD 5962-89598 are listed below for immediate acquisition only and shall be added to
MIL-HDBK-103 and QML-38535, as applicable, during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded
by the next dated revisions of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of
all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959801M8A
3/
EDI88128LPS120ZB
5962-8959801M9A
3/
MSM8128JXLMC-12
5962-8959801MNA
3/
3/
3/
L7C108-120 (GEN)
L7C108KMB25
MSM8128WXLMC-12
5962-8959801MTA
3/
3/
L7C108-120 (GEN)
L7C108MMB25
5962-8959801MUA
3/
3/
EDI88128LPS120LB
S128K8L-120ML
5962-8959801MXA
3/
3/
3/
EDI88128LPS120CB
MSM8128SXLMC-12
S128K8L-120MC
5962-8959801MYA
3/
3/
3/
EDI88128LPS120NB
L7C108YMB25
S128K8L-120MS
5962-8959801MZA
3/
3/
3/
3/
EDI88128LPS120TB
L7C108CMB25
MSM8128KXLMC-12
S128K8L-120ME
5962-8959802M8A
3/
EDI88128LPS100ZB
5962-8959802M9A
3/
MSM8128JXLMC-10
5962-8959802MNA
3/
3/
L7C108-100 (GEN)
MSM8128WXLMC-10
5962-8959802MTA
3/
3/
3/
3/
3/
EDI88128LPS100FB
L7C108MMB25
L7C108-100 (GEN)
MSM8128GXLMC-10
S128K8L-100MF
See footnotes at end of table.
1 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959802MUA
3/
3/
EDI88128LPS100LB
S128K8L-100ML
5962-8959802MXA
3/
3/
3/
EDI88128LPS100CB
MSM8128SXLMC-10
S128K8L-100MC
5962-8959802MYA
3/
3/
3/
3/
EDI88128LPS100NB
L7C108-100 (GEN)
L7C108YMB25
S128K8L-100MS
5962-8959802MZA
3/
3/
3/
3/
3/
EDI88128LPS100TB
L7C108-100 (GEN)
L7C108CMB25
MSM8128KXLMC-10
S128K8L-100ME
5962-8959803M8A
3/
EDI88128LPS85ZB
5962-8959803M9A
3/
MSM8128JXLMC-85
5962-8959803MNA
3/
3/
3/
L7C108-25 (GEN)
L7C108KMB25
MSM8128WXLMC-85
5962-8959803MTA
3/
3/
3/
3/
3/
EDI88128LPS85FB
L7C108-85 (GEN)
L7C108MMB25
MSM8128GXLMC-85
S128K8L-85MF
5962-8959803MUA
3/
3/
EDI88128LPS85LB
S128K8L-85ML
5962-8959803MXA
3/
3/
3/
EDI88128LPS85CB
MSM8128SXLMC-85
S128K8L-85MC
5962-8959803MYA
3/
3/
3/
3/
EDI88128LPS85NB
L7C108-85 (GEN)
L7C108YMB25
S128K8L-85MS
5962-8959803MZA
3/
3/
3/
3/
3/
EDI88128LPS85TB
L7C108-85 (GEN)
L7C108CMB25
MSM8128KXLMC-85
S128K8L-85ME
5962-8959804M8A
3/
EDI88128LPS70ZB
5962-8959804M9A
3/
MSM8128JXLMC-70
See footnotes at end of table.
2 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959804MNA
3/
3/
3/
L7C108-70 (GEN)
L7C108KMB25
MSM8128WXLMC-70
5962-8959804MTA
3/
3/
3/
3/
3/
EDI88128LPS70FB
L7C108-70 (GEN)
L7C108MMB25
MSM8128GXLMC-70
S128K8L-70MF
5962-8959804MUA
3/
3/
EDI88128LPS70LB
S128K8L-70ML
5962-8959804MXA
3/
3/
3/
EDI88128LPS70CB
MSM8128SXLMC-70
S128K8L-70MC
5962-8959804MYA
3/
3/
3/
3/
EDI88128LPS70NB
L7C108-70 (GEN)
L7C108YMB25
S128K8L-70MS
5962-8959804MZA
3/
3/
3/
3/
3/
EDI88128LPS70TB
L7C108-70 (GEN)
L7C108CMB25
MSM8128KXLMC-70
S128K8L-70ME
5962-8959805BTA
3/
5962-8959805BUA
3/
5962-8959805BXA
3/
5962-8959805BZA
3/
5962-8959805M7A
57300
MT5C1009DCJ-120L883C
5962-8959805M8A
54230
EDI88128LPS120ZB
5962-8959805M9A
3/
MSM8128JXLMC-12
5962-8959805MMA
57300
5962-8959805MNA
3/
3/
3/
MT5C1009ECA-120L883C
L7C108-120 (GEN)
L7C108KMB25
MSM8128WXLMC-12
See footnotes at end of table.
3 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959805MTA
54230
57300
3/
3/
3/
EDI88128LPS120FB
L7C108MMB25
MSM8128GXLMC-12
MT5C1009F-120L883C
S128K8L-120MF
5962-8959805MUA
54230
57300
3/
EDI88128LPS120LB
MT5C1009EC-120L883C
S128K8L-120ML
5962-8959805MXA
54230
3/
57300
3/
EDI88128LPS120CB
MSM8128SXLMC-12
MT5C1009CW-120L883C
S128K8L-120MC
5962-8959805MYA
54230
57300
3/
3/
EDI88128LPS120NB
MT5C1009SOJ-120L883C
L7C108YMB25
S128K8L-120MS
5962-8959805MZA
54230
3/
3/
57300
3/
EDI88128LPS120TB
L7C108CMB25
MSM8128KXLMC-12
MT5C1009C-120L883C
S128K8L-120ME
5962-8959806BTA
3/
5962-8959806BUA
3/
5962-8959806BXA
3/
5962-8959806BZA
3/
5962-8959806M7A
57300
MT5C1009DCJ-100L883C
5962-8959806M8A
54230
EDI88128LPS100ZB
5962-8959806M9A
3/
MSM8128JXLMC-10
5962-8959806MMA
57300
5962-8959806MNA
3/
3/
3/
5962-8959806MTA
54230
3/
3/
57300
3/
EDI88128LPS100FB
L7C108MMB25
MSM8128GXLMC-10
MT5C1009F-100L883C
S128K8L-100MF
5962-8959806MUA
54230
57300
3/
EDI88128LPS100LB
MT5C1009EC-100L883C
S128K8L-100ML
See footnotes at end of table.
4 of 49
MT5C1009ECA-100L883C
L7C108-100 (GEN)
L7C108KMB25
MSM8128WXLMC-10
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959806MXA
54230
3/
57300
3/
EDI88128LPS100CB
MSM8128SXLMC-10
MT5C1009CW-100L883C
S128K8L-100MC
5962-8959806MYA
3/
54230
57300
3/
L7C108YMB25
EDI88128LPS100NB
MT5C1009SOJ-100L883C
S128K8L-100MS
5962-8959806MZA
54230
3/
3/
57300
3/
EDI88128LPS100TB
L7C108CMB25
MSM8128KXLMC-10
MT5C1009C-100L883C
S128K8L-100ME
5962-8959807BTA
3/
5962-8959807BUA
3/
5962-8959807BXA
3/
5962-8959807BZA
3/
5962-8959807M7A
57300
MT5C1009DCJ-85L883C
5962-8959807M8A
54230
EDI88128LPS85ZB
5962-8959807M9A
3/
MSM8128JXLMC-85
5962-8959807MMA
57300
5962-8959807MNA
3/
3/
3/
L7C108-25 (GEN)
L7C108KMB25
MSM8128WXLMC-85
5962-8959807MTA
54230
3/
57300
3/
3/
EDI88128LPS85FB
L7C108MMB25
MT5C1009F-85L883C
MSM8128GXLMC-85
S128K8L-85MF
5962-8959807MUA
54230
57300
3/
EDI88128LPS85LB
MT5C1009EC-85L883C
S128K8L-85ML
5962-8959807MXA
54230
3/
57300
3/
EDI88128LPS85CB
MSM8128SXLMC-85
MT5C1009CW-85L883C
S128K8L-85MC
5962-8959807MYA
54230
3/
57300
3/
EDI88128LPS85NB
L7C108YMB25
MT5C1009SOJ-85L883C
S128K8L-85MS
5962-8959807MZA
54230
3/
3/
57300
3/
EDI88128LPS85TB
L7C108CMB25
MSM8128KXLMC-85
MT5C1009C-85L883C
S128K8L-85ME
See footnotes at end of table.
5 of 49
Vendor
Similar
PIN 2/
MT5C1009ECA-85L883C
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959808BTA
3/
5962-8959808BUA
3/
5962-8959808BXA
3/
5962-8959808BZA
3/
5962-8959808M7A
57300
MT5C1009DCJ-70L883C
5962-8959808M8A
54230
EDI88128LPS70ZB
5962-8959808M9A
3/
MSM8128JXLMC-70
5962-8959808MMA
57300
5962-8959808MNA
3/
3/
3/
L7C108-25 (GEN)
L7C108KMB25
MSM8128WXLMC-70
5962-8959808MTA
54230
3/
3/
57300
3/
EDI88128LPS70FB
L7C108MMB25
MSM8128GXLMC-70
MT5C1009F-70L883C
S128K8L-70MF
5962-8959808MUA
54230
57300
3/
EDI88128LPS70LB
MT5C1009EC-70L883C
S128K8L-70ML
5962-8959808MXA
54230
3/
57300
3/
EDI88128LPS70CB
MSM8128SXLMC-70
MT5C1009CW-70L883C
S128K8L-70MC
5962-8959808MYA
54230
3/
57300
3/
EDI88128LPS70NB
L7C108YMB25
MT5C1009SOJ-70L883C
S128K8L-70MS
5962-8959808MZA
54230
3/
3/
57300
3/
EDI88128LPS70TB
L7C108CMB25
MSM8128KXLMC-70
MT5C1009C-70L883C
S128K8L-70ME
5962-8959809BTA
3/
5962-8959809BUA
3/
5962-8959809BXA
3/
5962-8959809BZA
3/
5962-8959809M7A
57300
MT5C1009DCJ-55L
5962-8959809M8A
54230
EDI88128LPS55ZB
See footnotes at end of table.
6 of 49
Vendor
Similar
PIN 2/
MT5C1009ECA-70L883C
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959809M9A
3/
MSM8128JXLMC-55
5962-8959809MMA
57300
MT5C1009ECA-55L
5962-8959809MNA
3/
L7C108-25 (GEN)
5962-8959809MNA
3/
MSM8128WXLMC-55
5962-8959809MTA
54230
3/
3/
57300
3/
EDI88128LPS55FB
L7C108MMB25
MSM8128GXLMC-55
MT5C1009F-55L
S128K8L-55MF
5962-8959809MUA
54230
57300
3/
EDI88128LPS55LB
MT5C1009EC-55L
S128K8L-55ML
5962-8959809MXA
54230
3/
57300
3/
3/
EDI88128LPS55CB
MSM8128SXLMC-55
MT5C1009CW-55L
PDM41024L55CE0B
S128K8L-55MC
5962-8959809MYA
3/
54230
3/
60264
57300
S128K8L-55MS
EDI88128LPS55NB
L7C108YMB25
MS1128K8LC55S
MT5C1009SOJ-55L
5962-8959809MZA
54230
3/
65896
3/
57300
3/
EDI88128LPS55TB
L7C108CMB25
L7C108DMB55L
MSM8128KXLMC-55
MT5C1009C-55L
S128K8L-55ME
5962-8959809MZC
65896
L7C108DMB55L
5962-8959810BTA
3/
5962-8959810BUA
3/
5962-8959810BXA
3/
5962-8959810BZA
3/
5962-8959810M7A
65896
57300
L7C108DMB55L
MT5C1009DCJ-45L
5962-8959810M7C
65896
L7C108DMB55L
5962-8959810M8A
54230
EDI88128LPS45ZB
5962-8959810M9A
3/
MSM8128JXLMC-45
5962-8959810MMA
57300
MT5C1009ECA-45L
See footnotes at end of table.
7 of 49
Vendor
Similar
PIN 2/
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959810MNA
3/
3/
L7C108-25 (GEN)
MSM8128WXLMC-45
5962-8959810MTA
54230
3/
3/
57300
3/
EDI88128LPS45FB
L7C108MMB25
MSM8128GXLMC-45
MT5C1009F-45L
S128K8L-45MF
5962-8959810MUA
54230
57300
3/
EDI88128LPS45LB
MT5C1009EC-45L
S128K8L-45ML
5962-8959810MXA
54230
3/
57300
3/
3/
EDI88128LPS45CB
MSM8128SXLMC-45
MT5C1009CW-45L
PDM41024L45CE0B
S128K8L-45MC
5962-8959810MYA
54230
3/
65896
60264
57300
3/
EDI88128LPS45NB
L7C108YMB25
L7C108YMB45L
MS1128K8LC45S
MT5C1009SOJ-45L
S128K8L-45MS
5962-8959810MYC
65896
L7C108YMB45L
5962-8959810MZA
54230
3/
65896
3/
57300
3/
EDI88128LPS45TB
L7C108CMB25
L7C108DMB45L
MSM8128KXLMC-45
MT5C1009C-45L
S128K8L-45ME
5962-8959810MZC
65896
L7C108DMB45L
5962-8959811BTA
3/
5962-8959811BUA
3/
5962-8959811BXA
3/
5962-8959811BZA
3/
5962-8959811M7A
65896
57300
L7C108DMB35L
MT5C1009DCJ-35L
5962-8959811M7C
65896
L7C108DMB35L
5962-8959811M8A
54230
EDI88128LPS35ZB
5962-8959811M9A
3/
MSM8128JXLMC-35
5962-8959811MMA
57300
MT5C1009ECA-35L
5962-8959811MNA
3/
L7C108-25 (GEN)
See footnotes at end of table.
8 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959811MNA
3/
MSM8128WXLMC-35
5962-8959811MTA
54230
3/
3/
57300
3/
EDI88128LPS35FB
L7C108MMB25
MSM8128GXLMC-35
MT5C1009F-35L
S128K8L-35MF
5962-8959811MUA
54230
57300
3/
EDI88128LPS35LB
MT5C1009EC-35L
S128K8L-35ML
5962-8959811MXA
54230
3/
57300
3/
3/
EDI88128LPS35CB
MSM8128SXLMC-35
MT5C1009CW-35L
PDM41024L35CE0B
S128K8L-35MC
5962-8959811MYA
54230
3/
65896
60264
57300
3/
EDI88128LPS35NB
L7C108YMB25
L7C108YMB35L
MS1128K8LC35S
MT5C1009SOJ-35L
S128K8L-35MS
5962-8959811MYC
65896
L7C108YMB35L
5962-8959811MZA
54230
3/
65896
57300
3/
3/
EDI88128LPS35TB
L7C108CMB25
L7C108YMB35L
MT5C1009C-35L
MSM8128KXLMC-35
S128K8L-35ME
5962-8959811MZC
65896
L7C108YMB35L
5962-8959812BTA
3/
5962-8959812BUA
3/
5962-8959812BXA
3/
5962-8959812BZA
3/
5962-8959812M7A
65896
57300
L7C108YMB25L
MT5C1009DCJ-25L
5962-8959812M7C
65896
L7C108YMB25L
5962-8959812M8A
54230
EDI88128LPS25ZB
5962-8959812M9A
3/
MSM8128JXLMC-25
5962-8959812MMA
57300
MT5C1009ECA-25L
5962-8959812MNA
3/
3/
L7C108-25 (GEN)
MSM8128WXLMC-25
See footnotes at end of table.
9 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959812MTA
54230
3/
3/
57300
3/
EDI88128LPS25FB
L7C108-25 (GEN)
MSM8128GXLMC-25
MT5C1009F-25L
S128K8L-25MF
5962-8959812MUA
54230
57300
3/
EDI88128LPS25LB
MT5C1009EC-25L
S128K8L-25ML
5962-8959812MXA
54230
3/
57300
3/
3/
EDI88128LPS25CB
MSM8128SXLMC-25
MT5C1009CW-25L
PDM41024L25CE0B
S128K8L-25MC
5962-8959812MYA
54230
3/
65896
60264
57300
3/
EDI88128LPS25NB
L7C108-25 (GEN)
L7C108YMB25L
MS1128K8LC25S
MT5C1009SOJ-25L
S128K8L-25MC
5962-8959812MYC
65896
L7C108YMB25L
5962-8959812MZA
54230
3/
65896
3/
57300
3/
EDI88128LPS25TB
L7C108-25 (GEN)
L7C108YMB25L
MSM8128KXLMC-25
MT5C1009C-25L
S128K8L-25ME
5962-8959812MZC
65896
L7C108YMB25L
5962-8959813BTA
3/
5962-8959813BUA
3/
5962-8959813BXA
3/
5962-8959813BZA
3/
5962-8959813M7A
57300
5962-8959813M9A
3/
5962-8959813MMA
3/
54230
57300
3DTT2
5962-8959813MNA
3/
3/
MT5C1008DCJ-120L
MSM8128JLMC-12
CY7C1009L-120LMB
EDI88130LPS120L32B
MT5C1008ECA-120L
P4C1024L-120LMB
L7C109-120 (GEN)
MSM8128WLMC-12
See footnotes at end of table.
10 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959813MTA
54230
3/
3/
57300
3DTT2
3/
EDI88130LPS120FB
L7C109-120 (GEN)
MSM8128GLMC-12
MT5C1008F-120L
P4C1024L-120FSMB
S128K8TL-120MF
5962-8959813MTC
3/
MMDJ65608V120/883
5962-8959813MUA
54230
57300
3DTT2
3/
EDI88130LPS120LB
MT5C1008EC-120L
P4C1024L-120L1MB
S128K8TL-120ML
5962-8959813MXA
54230
3/
57300
3DTT2
3/
EDI88130LPS120CB
MSM8128SLMC-12
MT5C1008CW-120L
P4C1024L-120C6MB
S128K8TL-120MC
5962-8959813MYA
54230
3/
57300
3DTT2
3/
EDI88130LPS120NB
L7C108YMB25
MT5C1008SOJ-120L
P4C1024L-120CJMB
S128K8TL-120MS
5962-8959813MZA
3/
54230
3/
3/
3/
57300
3DTT2
3/
CY7C1009L-120DMB
EDI88130LPS120TB
L7C108CMB25
MMC965608V120/883
MSM8128KLMC-12
MT5C1008C-120L
P4C1024L-120C4MB
S128K8TL-120ME
5962-8959814BTA
3/
5962-8959814BUA
3/
5962-8959814BXA
3/
5962-8959814BZA
3/
5962-8959814M7A
57300
5962-8959814M9A
3/
5962-8959814MMA
3/
54230
57300
3DTT2
MT5C1008DCJ-100L
MSM8128JLMC-10
CY7C1009L-100LMB
EDI88130LPS100L32B
MT5C1008ECA-100L
P4C1024L-100LMB
See footnotes at end of table.
11 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959814MNA
3/
3/
L7C108KMB25
MSM8128WLMC-10
5962-8959814MTA
54230
3/
3/
57300
3DTT2
3/
EDI88130LPS100FB
L7C108MMB25
MSM8128GLMC-10
MT5C1008F-100L
P4C1024L-100FSMB
S128K8TL-100MF
5962-8959814MTC
3/
MMDJ65608V100/883
5962-8959814MUA
54230
57300
3DTT2
3/
EDI88130LPS100LB
MT5C1008EC-100L
P4C1024L-100L1MB
S128K8TL-100ML
5962-8959814MXA
54230
3/
57300
3DTT2
3/
EDI88130LPS100CB
MSM8128SLMC-10
MT5C1008CW-100L
P4C1024L-100C6MB
S128K8TL-100MC
5962-8959814MYA
54230
3/
57300
3DTT2
3/
EDI88130LPS100NB
L7C108YMB25
MT5C1008SOJ-100L
P4C1024L-100CJMB
S128K8TL-100MS
5962-8959814MZA
3/
54230
3/
3/
3/
57300
3DTT2
3/
CY7C1009L-100DMB
EDI88130LPS100TB
L7C108CMB25
MMC965608V100/883
MSM8128KLMC-10
MT5C1008C-100L
P4C1024L-100C4MB
S128K8TL-100ME
5962-8959815BTA
3/
5962-8959815BUA
3/
5962-8959815BXA
3/
5962-8959815BZA
3/
5962-8959815M7A
57300
5962-8959815M9A
3/
5962-8959815MMA
3/
54230
57300
3DTT2
MT5C1008DCJ-85L883C
MSM8128JLMC-85
CY7C1009L-85LMB
EDI88130LPS85L32B
MT5C1008ECA-85L883C
P4C1024L-85LMB
See footnotes at end of table.
12 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959815MNA
3/
L7C108KMB25
5962-8959815MNA
3/
L7C109-85 (GEN)
5962-8959815MNA
3/
MSM8128WLMC-85
5962-8959815MTA
54230
EDI88130LPS85FB
5962-8959815MTA
3/
L7C108MMB25
5962-8959815MTA
3/
MSM8128GLMC-85
5962-8959815MTA
57300
MT5C1008F-85L883C
5962-8959815MTA
3DTT2
P4C1024L-85FSMB
5962-8959815MTA
3/
S128K8TL-85MF
5962-8959815MTC
3/
MMDJ65608V85/883
5962-8959815MUA
3DTT2
54230
57300
3/
P4C1024L-85FSMB
EDI88130LPS85LB
MT5C1008EC-85L883C
S128K8TL-85ML
5962-8959815MXA
54230
3/
57300
3DTT2
3/
EDI88130LPS85CB
MSM8128SLMC-85
MT5C1008CW-85L883C
P4C1024L-85C6MB
S128K8TL-85MC
5962-8959815MYA
54230
3/
57300
3DTT2
3/
EDI88130LPS85NB
L7C108YMB25
MT5C1008SOJ-85L883C
P4C1024L-85CJMB
S128K8TL-85MS
5962-8959815MZA
3/
54230
3/
3/
3/
57300
3DTT2
3/
CY7C1009L-85DMB
EDI88130LPS85TB
L7C108CMB25
MMC965608V85/883
MSM8128KLMC-85
MT5C1008C-85L883C
P4C1024L-85C4MB
S128K8TL-85ME
5962-8959816BTA
3/
5962-8959816BUA
3/
5962-8959816BXA
3/
See footnotes at end of table.
13 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959816BZA
3/
5962-8959816M7A
57300
5962-8959816M9A
3/
5962-8959816MMA
3/
54230
57300
3DTT2
5962-8959816MNA
3/
3/
5962-8959816MTA
54230
3/
3/
57300
3DTT2
3/
EDI88130LPS70FB
L7C108MMB25
MSM8128GLMC-70
MT5C1008F-70L883C
P4C1024L-70FSMB
S128K8TL-70MF
5962-8959816MTC
3/
MMDJ65608V70/883
5962-8959816MUA
54230
57300
3/
EDI88130LPS70LB
MT5C1008EC-70L883C
S128K8TL-70ML
5962-8959816MXA
54230
3/
57300
3DTT2
3/
EDI88130LPS70CB
MSM8128SLMC-70
MT5C1008CW-70L883C
P4C1024L-70C6MB
S128K8TL-70MC
5962-8959816MYA
54230
3/
57300
3DTT2
3/
EDI88130LPS70NB
L7C108YMB25
MT5C1008SOJ-70L883C
P4C1024L-70CJMB
S128K8TL-70MS
5962-8959816MZA
3/
54230
3/
3/
3/
57300
3DTT2
3/
CY7C1009L-70DMB
EDI88130LPS70TB
L7C108CMB25
MMC965608V70/883
MSM8128KLMC-70
MT5C1008C-70L883C
P4C1024L-70C4MB
S128K8TL-70ME
5962-8959817BTA
3/
5962-8959817BUA
3/
5962-8959817BXA
3/
See footnotes at end of table.
14 of 49
Vendor
Similar
PIN 2/
MT5C1008DCJ-70L883C
MSM8128JLMC-70
CY7C1009L-70LMB
EDI88130LPS70L32B
MT5C1008ECA-70L883C
P4C1024L-70LMB
L7C108KMB25
MSM8128WLMC-70
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959817BZA
3/
5962-8959817M7A
65896
57300
L7C109YMB55L
MT5C1008DCJ-55L
5962-8959817M7C
65896
L7C109YMB55L
5962-8959817M9A
3/
5962-8959817MMA
3/
65896
54230
57300
3/
3DTT2
3/
0C7V7
CY7C1009L-55LMB
L7C109KAMB55L
EDI88130LPS55L32B
MT5C1008ECA-55L
NS41024L55E/883
P4C1024L-55LMB
PDM41024L55L32B
QP7C1009BL-55LMB
5962-8959817MMC
65896
L7C109KAMB55L
5962-8959817MTA
54230
3/
3/
57300
3/
3DTT2
0C7V7
3/
EDI88130LPS55FB
L7C108MMB25
MSM8128GLMC-55
MT5C1008F-55L
NS41024L55F/883
P4C1024L-55FSMB
QP7C1009BL-55FMB
S128K8TL-55MF
5962-8959817MTC
3/
MMDJ65608V55/883
5962-8959817MUA
54230
65896
57300
3/
3DTT2
EDI88130LPS55LB
L7C109KMB55L
MT5C1008EC-55L
NS41024L55Y/883
P4C1024L-55L1MB
5962-8959817MUC
65896
L7C109KMB55L
5962-8959817MXA
54230
3/
57300
3DTT2
3/
3/
EDI88130LPS55CB
MSM8128SLMC-55
MT5C1008CW-55L
P4C1024L-55C6MB
PDM41024L55CB
S128K8TL-55MC
5962-8959817MYA
54230
65896
60264
57300
3/
3DTT2
3/
EDI88130LPS55NB
L7C109YMB55L
MS2128K8LC55S
MT5C1008SOJ-55L
NS41024L55S/883
P4C1024L-55CJMB
S128K8TL-55MS
MSM8128JLMC-55
See footnotes at end of table.
15 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959817MYC
65896
L7C109YMB55L
5962-8959817MZA
3/
54230
65896
3/
60264
57300
3/
3DTT2
3/
0C7V7
3/
CY7C1009L-55DMB
EDI88130LPS55TB
L7C109DMB55L
MMC965608V55/883
MS2128K8LC55C
MT5C1008C-55L
NS41024L55D/883
P4C1024L-55C4MB
PDM41024L55CB
QP7C1009BL-55DMB
S128K8TL-55ME
5962-8959817MZC
65896
L7C109DMB55L
5962-8959818BTA
3/
5962-8959818BUA
3/
5962-8959818BXA
3/
5962-8959818BZA
3/
5962-8959818M7A
65896
L7C109YMB45L
5962-8959818M7A
57300
MT5C1008DCJ-45L
5962-8959818M7C
65896
L7C109YMB45L
5962-8959818M9A
3/
5962-8959818MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
CY7C1009L-45LMB
EDI88130LPS45L32B
L7C109KAMB45L
MT5C1008ECA-45L
NS41024L45E/883
P4C1024L-45LMB
PDM41024L45L32B
QP7C1009BL-45LMB
5962-8959818MMC
65896
L7C109KAMB45L
5962-8959818MNA
3/
3/
5962-8959818MTA
54230
65896
3/
57300
3/
3DTT2
0C7V7
3/
See footnotes at end of table.
16 of 49
Vendor
Similar
PIN 2/
MSM8128JLMC-45
L7C108KMB25
MSM8128WLMC-45
EDI88130LPS45FB
L7C109FMB45
MSM8128GLMC-45
MT5C1008F-45L
NS41024L45F/883
P4C1024L-45FSMB
QP7C1009BL-45FMB
S128K8TL-45MF
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959818MTC
F7400
MMDJ-65608EV-45MQ
5962-8959818MUA
54230
65896
57300
3/
3DTT2
3/
EDI88130LPS45LB
L7C109KMB45L
MT5C1008EC-45L
NS41024L45Y/883
P4C1024L-45L1MB
S128K8TL-45ML
5962-8959818MUC
65896
L7C109KMB45L
5962-8959818MXA
54230
3/
57300
3DTT2
3/
3/
EDI88130LPS45CB
MSM8128SLMC-45
MT5C1008CW-45L
P4C1024L-45C6MB
PDM41024L45CB
S128K8TL-45MC
5962-8959818MYA
54230
65896
65896
60264
57300
3DTT2
3/
EDI88130LPS45NB
L7C108YMB25
L7C109YMB45L
MS2128K8LC45S
MT5C1008SOJ-45L
P4C1024L-45CJMB
S128K8TL-45MS
5962-8959818MYC
65896
L7C109YMB45L
5962-8959818MZA
3/
54230
3/
65896
60264
57300
3/
3DTT2
3/
0C7V7
3/
CY7C1009L-45DMB
EDI88130LPS45TB
L7C108CMB25
L7C109DMB45L
MS2128K8LC45C
MT5C1008C-45L
NS41024L45D/883
P4C1024L-45C4MB
PDM41024L45CB
QP7C1009BL-45DMB
S128K8TL-45ME
5962-8959818MZC
65896
F7400
L7C109DMB45L
MMC9-65608EV-45MQ
5962-8959818VTC
F7400
SMDJ-65608EV-45SV
5962-8959818VZC
F7400
SMC9-65608EV-45SV
5962-8959819BTA
3/
5962-8959819BUA
3/
5962-8959819BXA
3/
See footnotes at end of table.
17 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959819BZA
3/
5962-8959819M7A
65896
L7C109YMB35L
5962-8959819M7A
57300
MT5C1008DCJ-35L
5962-8959819M7C
65896
L7C109YMB35L
5962-8959819M9A
3/
5962-8959819MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
CY7C1009L-35LMB
EDI88130LPS35L32B
L7C109KAMB35L
MT5C1008ECA-35L
NS41024L35E/883
P4C1024L-35LMB
PDM41024L35L32B
QP7C1009BL-35LMB
5962-8959819MMC
65896
L7C109KAMB35L
5962-8959819MNA
3/
3/
5962-8959819MTA
54230
3/
57300
3/
3/
3DTT2
0C7V7
3/
EDI88130LPS35FB
L7C108MMB25
MT5C1008F-35L
MSM8128GLMC-35
NS41024L35F/883
P4C1024L-35FSMB
QP7C1009BL-35FMB
S128K8TL-35MF
5962-8959819MTC
3/
MMDJ65608EV-35MQ
5962-8959819MUA
54230
65896
57300
3/
3DTT2
3/
EDI88130LPS35LB
L7C109KMB35L
MT5C1008EC-35L
NS41024L35Y/883
P4C1024L-35L1MB
S128K8TL-35ML
5962-8959819MUC
65896
L7C109KMB35L
5962-8959819MXA
54230
3/
57300
3DTT2
3/
3/
EDI88130LPS35CB
MSM8128SLMC-35
MT5C1008CW-35L
P4C1024L-35C6MB
PDM41024L35CB
S128K8TL-35MC
MSM8128JLMC-35
L7C108KMB25
MSM8128WLMC-35
See footnotes at end of table.
18 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959819MYA
54230
3/
65896
60264
57300
3DTT2
3/
EDI88130LPS35NB
L7C108YMB25
L7C109YMB35L
MS2128K8LC35S
MT5C1008SOJ-35L
P4C1024L-35CJMB
S128K8TL-35MS
5962-8959819MYC
65896
L7C109YMB35L
5962-8959819MZA
3/
54230
3/
65896
3/
60264
57300
3/
3DTT2
3/
0C7V7
3/
CY7C1009L-35DMB
EDI88130LPS35TB
L7C108CMB25
L7C109DMB35L
MMC965608V-35/883
MS2128K8LC35C
MT5C1008C-35L
NS41024L35D/883
P4C1024L-35C4MB
PDM41024L35CB
QP7C1009BL-35DMB
S128K8TL-35ME
5962-8959819MZC
65896
L7C109DMB35L
5962-8959819VTC
3/
SMDJ65608EV-35SV
5962-8959819VZC
3/
SMC965608EV-35SV
5962-8959820BTA
3/
5962-8959820BUA
3/
5962-8959820BXA
3/
5962-8959820BZA
3/
5962-8959820M7A
65896
57300
L7C109YMB25L
MT5C1008DCJ-25L
5962-8959820M7C
65896
L7C109YMB25L
5962-8959820M9A
3/
5962-8959820MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
MSM8128JLMC-25
CY7C1009L-25LMB
EDI88130LPS25L32B
L7C109KAMB25L
MT5C1008ECA-25L
NS41024L25E/883
P4C1024L-25LMB
PDM41024L25L32B
QP7C1009BL-25LMB
See footnotes at end of table.
19 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959820MMC
65896
5962-8959820MNA
3/
3/
5962-8959820MTA
54230
3/
65896
3/
57300
3/
3DTT2
0C7V7
3/
EDI88130LPS25FB
L7C108MMB25
L7C109FMB25
MSM8128GLMC-25
MT5C1008F-25L
NS41024L25F/883
P4C1024L-25FSMB
QP7C1009BL-25FMB
S128K8TL-25MF
5962-8959820MTC
3/
MMDJ65608EV25/883
5962-8959820MUA
54230
65896
57300
3/
3DTT2
3/
EDI88130LPS25LB
L7C109KMB25L
MT5C1008EC-25L
NS41024L25Y/883
P4C1024L-25L1MB
S128K8TL-25ML
5962-8959820MUC
65896
L7C109KMB25L
5962-8959820MXA
54230
3/
57300
3DTT2
3/
3/
EDI88130LPS25CB
MSM8128SLMC-25
MT5C1008CW-25L
P4C1024L-25C6MB
PDM41024L25CB
S128K8TL-25MC
5962-8959820MYA
54230
3/
65896
60264
57300
3/
3DTT2
3/
EDI88130LPS25NB
L7C108YMB25
L7C109YMB25L
MS2128K8LC25S
MT5C1008SOJ-25L
NS41024L25S/883
P4C1024L-25CJMB
S128K8TL-25MS
5962-8959820MYC
65896
L7C109YMB25L
See footnotes at end of table.
20 of 49
Vendor
Similar
PIN 2/
L7C109KAMB25L
L7C108KMB25
MSM8128WLMC-25
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959820MZA
3/
54230
3/
65896
3/
60264
57300
3/
3DTT2
3/
0C7V7
3/
3/
CY7C1009L-25DMB
EDI88130LPS25TB
L7C108CMB25
L7C109DMB25L
MMC965608V25/883
MS2128K8LC25C
MT5C1008C-25L
NS41024L25D/883
P4C1024L-25C4MB
PDM41024L25CB
QP7C1009BL-25DMB
S128K8TL-25ME
SMJ5C1008L-25JDCM
5962-8959820MZC
65896
L7C109DMB25L
5962-8959821M7A
65896
57300
L7C109YMB20L
MT5C1008DCJ-20L
5962-8959821M7C
65896
L7C109YMB20L
5962-8959821M9A
3/
5962-8959821MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
CY7C1009L-20LMB
EDI88130LPS20L32B
L7C109KAMB20L
MT5C1008ECA-20L
NS41024L20E/883
P4C1024L-20LMB
PDM41024L20L32B
QP7C1009BL-20LMB
5962-8959821MMC
65896
L7C109KAMB20L
5962-8959821MNA
3/
3/
5962-8959821MTA
54230
65896
3/
57300
3/
3DTT2
0C7V7
3/
EDI88130LPS20FB
L7C109FMB20
MSM8128GLMC-20
MT5C1008F-20L
NS41024L20F/883
P4C1024L-20FSMB
QP7C1009BL-20FMB
S128K8TL-20MF
5962-8959821MUA
54230
65896
57300
3/
3DTT2
3/
EDI88130LPS20LB
L7C109KMB20L
MT5C1008EC-20L
NS41024L20Y/883
P4C1024L-20L1MB
S128K8TL-20ML
See footnotes at end of table.
21 of 49
MSM8128JLMC-20
L7C109-20 (GEN)
MSM8128WLMC-20
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959821MUC
65896
L7C109KMB20L
5962-8959821MXA
54230
3/
57300
3DTT2
3/
3/
EDI88130LPS20CB
MSM8128SLMC-20
MT5C1008CW-20L
P4C1024L-20C6MB
PDM41024L20CB
S128K8TL-20MC
5962-8959821MYA
54230
65896
60264
57300
3/
3DTT2
3/
EDI88130LPS20NB
L7C109YMB20L
MS2128K8LC20S
MT5C1008SOJ-20L
NS41024L20S/883
P4C1024L-20CJMB
S128K8TL-20MS
5962-8959821MYC
65896
L7C109YMB20L
5962-8959821MZA
3/
54230
65896
60264
57300
3/
3DTT2
3/
0C7V7
3/
CY7C1009L-20DMB
EDI88130LPS20TB
L7C109DMB20L
MS2128K8LC20C
MT5C1008C-20L
NS41024L20D/883
P4C1024L-20C4MB
PDM41024L20CB
QP7C1009BL-20DMB
S128K8TL-20ME
5962-8959821MZC
65896
L7C109DMB20L
5962-8959822BTA
3/
5962-8959822BUA
3/
5962-8959822BXA
3/
5962-8959822BZA
3/
5962-8959822M7A
57300
MT5C1009DCJ-120
5962-8959822M8A
54230
EDI88128CS120ZB
5962-8959822M9A
3/
MSM8128JXMC-12
5962-8959822MMA
57300
MT5C1009ECA-120
5962-8959822MNA
3/
3/
L7C108KMB25
MSM8128WXMC-12
See footnotes at end of table.
22 of 49
Vendor
Similar
PIN 2/
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959822MNC
3/
5962-8959822MTA
54230
3/
3/
57300
3/
EDI88128CS120FB
L7C108MMB25
MSM8128GXMC-12
MT5C1009F-120883C
S128K8-120MF
5962-8959822MUA
54230
57300
3/
EDI88128CS120LB
MT5C1009EC-120
S128K8-120ML
5962-8959822MXA
54230
3/
57300
3/
EDI88128CS120CB
MSM8128SXMC-12
MT5C1009CW-120883C
S128K8-120MC
5962-8959822MYA
54230
3/
57300
3/
EDI88128CS120NB
L7C108YMB25
MT5C1009SOJ-120883C
S128K8-120MS
5962-8959822MZA
54230
3/
3/
57300
3/
EDI88128CS120TB
L7C108CMB25
MSM8128KXMC-12
MT5C1009C-120883C
S128K8-120ME
5962-8959823BTA
3/
5962-8959823BUA
3/
5962-8959823BXA
3/
5962-8959823BZA
3/
5962-8959823M7A
57300
MT5C1009DCJ-100
5962-8959823M8A
54230
EDI88128CS100ZB
5962-8959823M9A
3/
MSM8128JXMC-10
5962-8959823MMA
57300
MT5C1009ECA-100
5962-8959823MNC
3/
L7C108KMB25
5962-8959823MNA
3/
3/
L7C108KMB25
MSM8128WXMC-10
L7C108KMB25
See footnotes at end of table.
23 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959823MTA
54230
3/
3/
57300
3/
EDI88128CS100FB
L7C108MMB25
MSM8128GXMC-10
MT5C1009F-100883C
S128K8-100MF
5962-8959823MUA
54230
57300
3/
EDI88128CS100LB
MT5C1009EC-100883C
S128K8-100ML
5962-8959823MXA
54230
3/
57300
3/
EDI88128CS100CB
MSM8128SXMC-10
MT5C1009CW-100883C
S128K8-100MC
5962-8959823MYA
54230
3/
57300
3/
EDI88128CS100NB
L7C108YMB25
MT5C1009SOJ-100883C
S128K8-100MS
5962-8959823MZA
54230
3/
3/
57300
3/
EDI88128CS100TB
L7C108CMB25
MSM8128KXMC-10
MT5C1009C-100883C
S128K8-100ME
5962-8959824BTA
3/
5962-8959824BUA
3/
5962-8959824BXA
3/
5962-8959824BZA
3/
5962-8959824M7A
57300
MT5C1009DCJ-85
5962-8959824M8A
54230
EDI88128CS85ZB
5962-8959824M9A
3/
MSM8128JXMC-85
5962-8959824MMA
57300
MT5C1009ECA-85
5962-8959824MNA
3/
3/
L7C108KMB25
MSM8128WXMC-85
5962-8959824MNC
3/
L7C108KMB25
See footnotes at end of table.
24 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959824MTA
54230
3/
3/
57300
3/
EDI88128CS85FB
L7C108MMB25
MSM8128GXMC-85
MT5C1009F-85883C
S128K8-85MF
5962-8959824MUA
54230
57300
3/
EDI88128CS85LB
MT5C1009EC-85
S128K8-85ML
5962-8959824MXA
54230
3/
57300
3/
EDI88128CS85CB
MSM8128SXMC-85
MT5C1009CW-85883C
S128K8-85MC
5962-8959824MYA
54230
3/
57300
3/
EDI88128CS85NB
L7C108YMB25
MT5C1009SOJ-85883C
S128K8-85MS
5962-8959824MZA
54230
3/
3/
57300
3/
EDI88128CS85TB
L7C108CMB25
MSM8128KXMC-85
MT5C1009C-85883C
S128K8-85ME
5962-8959825BTA
3/
5962-8959825BUA
3/
5962-8959825BXA
3/
5962-8959825BZA
3/
5962-8959825M7A
57300
MT5C1009DCJ-70
5962-8959825M8A
54230
EDI88128CS70ZB
5962-8959825M9A
3/
MSM8128JXMC-70
5962-8959825MMA
57300
MT5C1009ECA-70
5962-8959825MNA
3/
3/
L7C108KMB25
MSM8128WXMC-70
5962-8959825MNC
3/
L7C108KMB25
5962-8959825MTA
54230
3/
3/
57300
3/
EDI88128CS70FB
L7C108MMB25
MSM8128GXMC-70
MT5C1009F-70883C
S128K8-70MF
See footnotes at end of table.
25 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959825MUA
54230
57300
3/
EDI88128CS70LB
MT5C1009EC-70
S128K8-70ML
5962-8959825MXA
54230
3/
57300
3/
EDI88128CS70CB
MSM8128SXMC-70
MT5C1009CW-70883C
S128K8-70MC
5962-8959825MYA
54230
3/
57300
3/
EDI88128CS70NB
L7C108YMB25
MT5C1009SOJ-70883C
S128K8-70MS
5962-8959825MZA
54230
3/
3/
57300
3/
EDI88128CS70TB
L7C108CMB25
MSM8128KXMC-70
MT5C1009C-70883C
S128K8-70ME
5962-8959826BTA
3/
5962-8959826BUA
3/
5962-8959826BXA
3/
5962-8959826BZA
3/
5962-8959826M7A
65896
L7C108YMB55
5962-8959826M7A
57300
MT5C1009DCJ-55
5962-8959826M7C
65896
L7C108YMB55
5962-8959826M8A
54230
EDI88128CS55ZB
5962-8959826M9A
3/
MSM8128JXMC-55
5962-8959826MMA
57300
MT5C1009ECA-55
5962-8959826MNA
3/
3/
L7C108KMB25
MSM8128WXMC-55
5962-8959826MNC
3/
L7C108KMB25
5962-8959826MTA
54230
3/
3/
57300
3/
EDI88128CS55FB
L7C108MMB25
MSM8128GXMC-55
MT5C1009F-55
S128K8-55MF
See footnotes at end of table.
26 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959826MUA
54230
57300
3/
EDI88128CS55LB
MT5C1009EC-55
S128K8-55ML
5962-8959826MXA
54230
3/
57300
3/
3/
EDI88128CS55CB
MSM8128SXMC-55
MT5C1009CW-55
PDM41024S55CE0B
S128K8-55MC
5962-8959826MYA
54230
65896
60264
57300
3/
EDI88128CS55NB
L7C108YMB55
MS1128K8C55S
MT5C1009SOJ-55
S128K8-55MS
5962-8959826MYC
65896
L7C108YMB55
5962-8959826MZA
54230
3/
65896
3/
57300
3/
EDI88128CS55TB
L7C108CMB25
L7C108DMB55
MSM8128KXMC-55
MT5C1009C-55
S128K8-55ME
5962-8959826MZC
65896
L7C108DMB55
5962-8959827BTA
3/
5962-8959827BUA
3/
5962-8959827BXA
3/
5962-8959827BZA
3/
5962-8959827M7A
65896
57300
L7C108YMB45
MT5C1009DCJ-45
5962-8959827M7C
65896
L7C108YMB45
5962-8959827M8A
54230
EDI88128CS45ZB
5962-8959827M9A
3/
MSM8128JXMC-45
5962-8959827MMA
57300
MT5C1009ECA-45
5962-8959827MNA
3/
3/
L7C108-45 (GEN)
MSM8128WXMC-45
5962-8959827MNC
3/
L7C108KMB25
See footnotes at end of table.
27 of 49
Vendor
Similar
PIN 2/
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959827MTA
54230
3/
3/
57300
3/
EDI88128CS45FB
L7C108MMB25
MSM8128GXMC-45
MT5C1009F-45883C
S128K8-45MF
5962-8959827MUA
54230
57300
3/
EDI88128CS45LB
MT5C1009EC-45
S128K8-45ML
5962-8959827MXA
54230
3/
57300
3/
3/
EDI88128CS45CB
MSM8128SXMC-45
MT5C1009CW-45
PDM41024S45CE0B
S128K8-45MC
5962-8959827MYA
54230
65896
60264
57300
3/
EDI88128CS45NB
L7C108YMB45
MS1128K8C45S
MT5C1009SOJ-45
S128K8-45MS
5962-8959827MYC
65896
L7C108YMB45
5962-8959827MZA
54230
65896
3/
57300
3/
EDI88128CS45TB
L7C108DMB45
MSM8128KXMC-45
MT5C1009C-45
S128K8-45ME
5962-8959827MZC
65896
L7C108DMB45
5962-8959828BTA
3/
5962-8959828BUA
3/
5962-8959828BXA
3/
5962-8959828BZA
3/
5962-8959828M7A
65896
57300
L7C108YMB35
MT5C1009DCJ-35
5962-8959828M7C
65896
L7C108YMB35
5962-8959828M8A
54230
EDI88128CS35ZB
5962-8959828M9A
3/
MSM8128JXMC-35
See footnotes at end of table.
28 of 49
Vendor
Similar
PIN 2/
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959828MMA
57300
5962-8959828MNA
3/
3/
3/
L7C108-35 (GEN)
L7C108KMB25
MSM8128WXMC-35
5962-8959828MNC
3/
L7C108KMB25
5962-8959828MTA
54230
3/
3/
57300
3/
EDI88128CS35FB
L7C108MMB25
MSM8128GXMC-35
MT5C1009F-35
S128K8-35MF
5962-8959828MUA
54230
57300
3/
EDI88128CS35LB
MT5C1009EC-35
S128K8-35ML
5962-8959828MNC
3/
5962-8959828MXA
54230
3/
57300
3/
3/
EDI88128CS35CB
MSM8128SXMC-35
MT5C1009CW-35
PDM41024S35CE0B
S128K8-35MC
5962-8959828MYA
54230
65896
60264
57300
3/
EDI88128CS35NB
L7C108YMB35
MS1128K8C35S
MT5C1009SOJ-35
S128K8-35MS
5962-8959828MYC
65896
L7C108YMB35
5962-8959828MZA
54230
65896
3/
57300
EDI88128CS35TB
L7C108DMB35
MSM8128KXMC-35
MT5C1009C-35
5962-8959828MZA
3/
S128K8-35ME
5962-8959828MZC
65896
L7C108DMB35
5962-8959829BTA
3/
5962-8959829BUA
3/
5962-8959829BXA
3/
5962-8959829BZA
3/
MT5C1009ECA-35
L7C108KMB25
See footnotes at end of table.
29 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959829M7A
65896
57300
L7C108YMB25
MT5C1009DCJ-25
5962-8959829M7C
65896
L7C108YMB25
5962-8959829M8A
54230
EDI88128CS25ZB
5962-8959829M9A
3/
MSM8128JXMC-25
5962-8959829MMA
57300
MT5C1009ECA-25
5962-8959829MNA
3/
3/
L7C108-25 (GEN)
MSM8128WXMC-25
5962-8959829MNC
3/
L7C108KMB25
5962-8959829MTA
54230
3/
3/
57300
3/
EDI88128CS25FB
L7C108MMB25
MSM8128GXMC-25
MT5C1009F-25
S128K8-25MF
5962-8959829MUA
54230
57300
3/
EDI88128CS25LB
MT5C1009EC-25
S128K8-25ML
5962-8959829MXA
54230
3/
57300
3/
3/
EDI88128CS25CB
MSM8128SXMC-25
MT5C1009CW-25
PDM41024S25CE0B
S128K8-25MC
5962-8959829MYA
54230
65896
60264
57300
3/
EDI88128CS25NB
L7C108YMB25
MS1128K8C25S
MT5C1009SOJ-25
S128K8-25MS
5962-8959829MYC
65896
L7C108YMB25
5962-8959829MZA
54230
3/
65896
3/
57300
3/
EDI88128CS25TB
L7C108CMB25
L7C108DMB25
MSM8128KXMC-25
MT5C1009C-25
S128K8-25ME
5962-8959829MZC
65896
L7C108DMB25
5962-8959830BTA
3/
See footnotes at end of table.
30 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959830BUA
3/
5962-8959830BXA
3/
5962-8959830BZA
3/
5962-8959830M7A
57300
5962-8959830M9A
3/
5962-8959830MMA
3/
54230
57300
3DTT2
5962-8959830MNA
3/
3/
L7C109KMB25
MSM8128WMC-12
5962-8959830MNC
3/
L7C109KMB25
5962-8959830MTA
54230
5962-8959830MTA
3/
L7C109MMB25
5962-8959830MTA
3/
MSM8128GMC-12
5962-8959830MTA
57300
MT5C1008F-120
5962-8959830MTA
3DTT2
P4C1024-120FSMB
5962-8959830MTA
3/
S128K8-120MF
5962-8959830MTC
3/
MMDJ65608L120/883
5962-8959830MUA
54230
57300
3DTT2
3/
EDI88130CS120LB
MT5C1008EC-120
P4C1024-120L1MB
S128K8-120ML
5962-8959830MXA
54230
3/
57300
3DTT2
3/
EDI88130CS120CB
MSM8128SMC-12
MT5C1008CW-120
P4C1024-120C6MB
S128K8-120MC
MT5C1008DCJ-120
MSM8128JMC-12
CY7C1009-120LMB
EDI88130CS120L32B
MT5C1008ECA-120
P4C1024-120LMB
EDI88130CS120FB
See footnotes at end of table.
31 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959830MYA
54230
3/
57300
3DTT2
3/
EDI88130CS120NB
L7C109YMB25
MT5C1008SOJ-120
P4C1024-120CJMB
S128K8-120MS
5962-8959830MZA
3/
54230
3/
3/
3/
57300
3DTT2
3/
CY7C1009-120DMB
EDI88130CS120TB
L7C109CMB25
MMC965608L120/883
MSM8128KMC-12
MT5C1008C-120
P4C1024-120C4MB
S128K8-120ME
5962-8959831BTA
3/
5962-8959831BUA
3/
5962-8959831BXA
3/
5962-8959831BZA
3/
5962-8959831M7A
57300
5962-8959831M9A
3/
5962-8959831MMA
3/
54230
57300
3DTT2
5962-8959831MNA
3/
3/
L7C109KMB25
MSM8128WMC-10
5962-8959831MNC
3/
L7C109KMB25
5962-8959831MTA
54230
3/
3/
57300
3DTT2
3/
5962-8959831MTC
3/
5962-8959831MUA
54230
57300
3DTT2
3/
MT5C1008DCJ-100
MSM8128JMC-10
CY7C1009-100LMB
EDI88130CS100L32B
MT5C1008ECA-100
P4C1024-100LMB
EDI88130CS100FB
L7C109MMB25
MSM8128GMC-10
MT5C1008F-100
P4C1024-100FSMB
S128K8-100MF
MMDJ65608L100/883
EDI88130CS100LB
MT5C1008EC-100
P4C1024-100L1MB
S128K8-100ML
See footnotes at end of table.
32 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959831MXA
54230
3/
57300
3DTT2
3/
EDI88130CS100CB
MSM8128SMC-10
MT5C1008CW-100
P4C1024-100C6MB
S128K8-100MC
5962-8959831MYA
54230
3/
57300
3DTT2
3/
EDI88130CS100NB
L7C109YMB25
MT5C1008SOJ-100
P4C1024-100CJMB
S128K8-100MS
5962-8959831MZA
3/
54230
3/
3/
3/
57300
3DTT2
3/
CY7C1009-100DMB
EDI88130CS100TB
L7C109CMB25
MMC965608L100/883
MSM8128KMC-10
MT5C1008C-100
P4C1024-100C4MB
S128K8-100ME
5962-8959832BTA
3/
5962-8959832BUA
3/
5962-8959832BXA
3/
5962-8959832BZA
3/
5962-8959832M7A
57300
MT5C1008DCJ-85
5962-8959832M9A
3/
MSM8128JMC-85
5962-8959832MMA
3/
54230
57300
3DTT2
5962-8959832MNA
3/
3/
L7C109KMB25
MSM8128WMC-85
5962-8959832MNC
3/
L7C109KMB25
5962-8959832MTA
54230
3/
3/
57300
3DTT2
3/
CY7C1009-85LMB
EDI88130CS85L32B
MT5C1008ECA-85
P4C1024-85LMB
EDI88130CS85FB
L7C109MMB25
MSM8128GMC-85
MT5C1008F-85
P4C1024-85FSMB
S128K8-85MF
See footnotes at end of table.
33 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959832MTC
3/
5962-8959832MUA
54230
57300
3DTT2
3/
EDI88130CS85LB
MT5C1008EC-85
P4C1024-85L1MB
S128K8-85ML
5962-8959832MXA
54230
3/
57300
3DTT2
3/
EDI88130CS85CB
MSM8128SMC-85
MT5C1008CW-85
P4C1024-85C6MB
S128K8-85MC
5962-8959832MYA
54230
3/
57300
3DTT2
3/
EDI88130CS85NB
L7C109YMB25
MT5C1008SOJ-85
P4C1024-85CJMB
S128K8-85MS
5962-8959832MZA
3/
54230
3/
3/
3/
57300
3DTT2
3/
CY7C1009-85DMB
EDI88130CS85TB
L7C109CMB25
MMC965608L85/883
MSM8128KMC-85
MT5C1008C-85
P4C1024-85C4MB
S128K8-85ME
5962-8959833BTA
3/
5962-8959833BUA
3/
5962-8959833BXA
3/
5962-8959833BZA
3/
5962-8959833M7A
57300
MT5C1008DCJ-70
5962-8959833M9A
3/
MSM8128JMC-70
5962-8959833MMA
3/
54230
57300
3/
3/
3DTT2
5962-8959833MNA
3/
3/
See footnotes at end of table.
34 of 49
Vendor
Similar
PIN 2/
MMDJ65608L85/883
CY7C1009-70LMB
EDI88130CS70L32B
MT5C1008ECA-70
L7C109KMB25
MSM8128WMC-70
P4C1024-70LMB
L7C109KMB25
MSM8128WMC-70
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959833MNC
3/
5962-8959833MTA
54230
3/
3/
57300
3DTT2
3/
5962-8959833MTC
3/
5962-8959833MUA
54230
57300
3DTT2
3/
EDI88130CS70LB
MT5C1008EC-70
P4C1024-70L1MB
S128K8-70ML
5962-8959833MXA
54230
3/
57300
3DTT2
3/
EDI88130CS70CB
MSM8128SMC-70
MT5C1008CW-70
P4C1024-70C6MB
S128K8-70MC
5962-8959833MTC
3/
5962-8959833MYA
54230
3/
57300
3DTT2
3/
EDI88130CS70NB
L7C109YMB25
MT5C1008SOJ-70
P4C1024-70CJMB
S128K8-70MS
5962-8959833MZA
3/
54230
3/
3/
3/
57300
3DTT2
3/
CY7C1009-70DMB
EDI88130CS70TB
L7C109CMB25
MMC965608L70/883
MSM8128KMC-70
MT5C1008C-70
P4C1024-70C4MB
S128K8-70ME
5962-8959834BTA
3/
5962-8959834BUA
3/
5962-8959834BXA
3/
5962-8959834BZA
3/
5962-8959834M7A
65896
See footnotes at end of table.
35 of 49
Vendor
Similar
PIN 2/
L7C109KMB25
EDI88130CS70FB
L7C109MMB25
MSM8128GMC-70
MT5C1008F-70
P4C1024-70FSMB
S128K8-70MF
MMDJ65608L70/883
MMDJ65608L70/883
L7C109YMB55
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959834M7A
57300
MT5C1008DCJ-55
5962-8959834M7C
65896
L7C109YMB55
5962-8959834M9A
3/
5962-8959834MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
CY7C1009-55LMB
EDI88130CS55L32B
L7C109KAMB55
MT5C1008ECA-55
NS41024S55E/883
P4C1024-55LMB
PDM41024S55L32B
QP7C1009B-55LMB
5962-8959834MMC
65896
L7C109KAMB55
5962-8959834MNA
3/
3/
L7C109KMB25
MSM8128WMC-55
5962-8959834MNC
3/
L7C109KMB25
5962-8959834MTA
3/
54230
3/
3/
57300
3/
3DTT2
0C7V7
3/
CY7C109A-55FMB
EDI88130CS55FB
L7C109MMB25
MSM8128GMC-55
MT5C1008F-55
NS41024S55F/883
P4C1024-55FSMB
QP7C1009B-55FMB
S128K8-55MF
5962-8959834MTC
3/
MMDJ65608L55/883
5962-8959834MUA
3/
54230
65896
57300
3/
3DTT2
3/
CY7C109A-55LMB
EDI88130CS55LB
L7C109KMB55
MT5C1008EC-55
NS41024S55Y/883
P4C1024-55L1MB
S128K8-55ML
5962-8959834MUC
65896
L7C109KMB55
5962-8959834MXA
54230
3
57300
3DTT2
3/
3/
EDI88130CS55CB
SM8128SMC-55
MT5C1008CW-55
P4C1024-55C6MB
PDM41024S55CB
S128K8-55MC
See footnotes at end of table.
36 of 49
Vendor
Similar
PIN 2/
MSM8128JMC-55
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959834MYA
54230
3/
65896
60264
57300
3/
3DTT2
3/
EDI88130CS55NB
L7C109YMB25
L7C109YMB55
MS2128K8C55S
MT5C1008SOJ-55
NS41024S55S/883
P4C1024-55CJMB
S128K8-55MS
5962-8959834MYC
65896
L7C109YMB55
5962-8959834MZA
3/
3/
54230
65896
3/
3/
3/
60264
3/
57300
3/
3DTT2
3/
0C7V7
3/
CY7C1009-55DMB
CY7C109A-55DMB
EDI88130CS55TB
L7C109DMB55
CY7C109A-55DMB
L7C109CMB25
MMC965608L55/883
MS2128K8C55C
MSM8128KMC-55
MT5C1008C-55
NS41024S55D/883
P4C1024-55C4MB
PDM41024S55TCB
QP7C1009B-55DMB
S128K8-55ME
5962-8959834MZC
65896
L7C109DMB55
5962-8959835BTA
3/
5962-8959835BUA
3/
5962-8959835BXA
3/
5962-8959835BZA
3/
5962-8959835M7A
65896
57300
L7C109YMB45
MT5C1008DCJ-45
5962-8959835M7C
65896
L7C109YMB45
5962-8959835M9A
3/
See footnotes at end of table.
37 of 49
MSM8128JMC-45
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959835MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
CY7C1009-45LMB
EDI88130CS45L32B
L7C109KAMB45
MT5C1008ECA-45
NS41024S45E/883
P4C1024-45LMB
PDM41024S45L32B
QP7C1009B-45LMB
5962-8959835MMC
65896
L7C109KAMB45
5962-8959835MNA
3/
3/
L7C109KMB25
MSM8128WMC-45
5962-8959835MNC
3/
L7C109KMB25
5962-8959835MTA
3/
54230
3/
3/
57300
3/
3DTT2
0C7V7
3/
5962-8959835MTC
3/
5962-8959835MUA
3/
54230
65896
57300
3/
3DTT2
3/
CY7C109A-45LMB
EDI88130CS45LB
L7C109KMB45
MT5C1008EC-45
NS41024S45Y/883
P4C1024-45L1MB
S128K8-45ML
5962-8959835MUC
65896
L7C109KMB45
5962-8959835MXA
54230
3/
57300
3DTT2
3/
3/
EDI88130CS45CB
MSM8128SMC-45
MT5C1008CW-45
P4C1024-45C6MB
PDM41024S45CB
S128K8-45MC
5962-8959835MYA
54230
3/
65896
60264
57300
3/
3DTT2
3/
EDI88130CS45NB
L7C109YMB25
L7C109YMB45
MS2128K8C45S
MT5C1008SOJ-45
NS41024S45S/883
P4C1024-45CJMB
S128K8-45MS
See footnotes at end of table.
38 of 49
CY7C109A-45FMB
EDI88130CS45FB
L7C109MMB25
MSM8128GMC-45
MT5C1008F-45
NS41024S45F/883
P4C1024-45FSMB
QP7C1009B-45FMB
S128K8-45MF
MMDJ65608EV-45MQ
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959835MYC
65896
L7C109YMB45
5962-8959835MZA
3/
3/
54230
3/
65896
3/
60264
3/
57300
3/
3DTT2
3/
0C7V7
3/
CY7C1009-45DMB
CY7C109A-45DMB
EDI88130CS45TB
L7C109CMB25
L7C109DMB45
MMC965608EV45/883
MS2128K8C45C
MSM8128KMC-45
MT5C1008C-45
NS41024S45D/883
P4C1024-45C4MB
PDM41024S45TCB
QP7C1009B-45DMB
S128K8-45ME
5962-8959835MZC
65896
3/
L7C109DMB45
MMC965608EV-45MQ
5962-8959835VTC
3/
65608-45 (GEN)
5962-8959835VZC
3/
65608-45 (GEN)
5962-8959836BTA
3/
5962-8959836BUA
3/
5962-8959836BXA
3/
5962-8959836BZA
3/
5962-8959836M7A
65896
57300
L7C109YMB35
MT5C1008DCJ-35
5962-8959836M7C
65896
L7C109YMB35
5962-8959836M9A
3/
5962-8959836MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
CY7C1009-35LMB
EDI88130CS35L32B
L7C109KAMB35
MT5C1008ECA-35
NS41024S35E/883
P4C1024-35LMB
PDM41024S35L32B
QP7C1009B-35LMB
5962-8959836MMC
65896
L7C109KAMB35
See footnotes at end of table.
39 of 49
Vendor
Similar
PIN 2/
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959836MNA
3/
3/
L7C109KMB25
L7C109-35 (GEN)
5962-8959836MNC
3/
L7C109KMB25
5962-8959836MTA
3/
54230
3/
3/
57300
3/
3DTT2
0C7V7
3/
5962-8959836MTC
3/
5962-8959836MUA
3/
54230
65896
57300
3DTT2
3/
3/
CY7C109A-35LMB
EDI88130CS35LB
L7C109KMB35
MT5C1008EC-35
P4C1024-35L1MB
NS41024S35Y/883
S128K8-35ML
5962-8959836MUC
65896
L7C109KMB35
5962-8959836MXA
54230
3/
57300
3DTT2
3/
3/
EDI88130CS35CB
MSM8128SMC-35
MT5C1008CW-35
P4C1024-35C6MB
PDM41024S35CB
S128K8-35MC
5962-8959836MYA
54230
3/
65896
60264
57300
3/
3DTT2
3/
EDI88130CS35NB
L7C109YMB25
L7C109YMB35
MS2128K8C35S
MT5C1008SOJ-35
NS41024S35S/883
P4C1024-35CJMB
S128K8-35MS
5962-8959836MYC
65896
L7C109YMB35
See footnotes at end of table.
40 of 49
Vendor
Similar
PIN 2/
CY7C109A-35FMB
EDI88130CS35FB
L7C109MMB25
MSM8128GMC-35
MT5C1008F-35
NS41024S35F/883
P4C1024-35FSMB
QP7C1009B-35FMB
S128K8-35MF
MMDJ65608EV-35MQ
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959836MZA
3/
3/
54230
3/
65896
3/
60264
3/
57300
3/
3DTT2
3/
0C7V7
3/
CY7C1009-35DMB
CY7C109A-35DMB
EDI88130CS35TB
L7C109CMB25
L7C109DMB35
MMC965608EV35MQ
MS2128K8C35C
MSM8128KMC-35
MT5C1008C-35
NS41024S35D/883
P4C1024-35C4MB
PDM41024S35TCB
QP7C1009B-35DMB
S128K8-35ME
5962-8959836MZC
65896
L7C109DMB35
5962-8959836VTC
3/
65608-35 (GEN)
5962-8959836VZC
3/
65608-35 (GEN)
5962-8959837BTA
3/
5962-8959837BUA
3/
5962-8959837BXA
3/
5962-8959837BZA
3/
5962-8959837M7A
65896
57300
L7C109YMB25
MT5C1008DCJ-25
5962-8959837M7C
65896
L7C109YMB25
5962-8959837M9A
3/
5962-8959837MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
CY7C1009-25LMB
EDI88130CS25L32B
L7C109KAMB25
MT5C1008ECA-25
NS41024S25E/883
P4C1024-25LMB
PDM41024S25L32B
QP7C1009B-25LMB
5962-8959837MMC
65896
L7C109KAMB25
5962-8959837MNA
3/
3/
3/
See footnotes at end of table.
41 of 49
MSM8128JMC-25
7C109-25 (GEN)
MSM8128WMC-25
L7C109KMB25
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959837MNC
3/
5962-8959837MTA
3/
54230
3/
3/
57300
3/
3DTT2
0C7V7
3/
CY7C109A-25FMB
EDI88130CS25FB
L7C109MMB25
MSM8128GMC-25
MT5C1008F-25
NS41024S25F/883
P4C1024-25FSMB
QP7C1009B-25FMB
S128K8-25MF
5962-8959837MTC
3/
MMDJ65608L-25MQ
5962-8959837MUA
3/
54230
65896
57300
3/
3DTT2
3/
3/
CY7C109A-25LMB
EDI88130CS25LB
L7C109KMB25
MT5C1008EC-25
NS41024S25Y/883
P4C1024-25L1MB
S128K8-25ML
SMJ5C1008-25HMM
5962-8959837MUC
65896
L7C109KMB25
5962-8959837MXA
54230
3/
57300
3DTT2
3/
3/
3/
EDI88130CS25CB
MSM8128SMC-25
MT5C1008CW-25
P4C1024-25C6MB
PDM41024S25CB
S128K8-25MC
SMJ5C1008-25JDDM
5962-8959837MYA
54230
65896
60264
57300
3/
3DTT2
3/
EDI88130CS25NB
L7C109YMB25
MS2128K8C25S
MT5C1008SOJ-25
NS41024S25S/883
P4C1024-25CJMB
S128K8-25MS
5962-8959837MYC
65896
L7C109YMB25
See footnotes at end of table.
42 of 49
Vendor
Similar
PIN 2/
L7C109KMB25
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959837MZA
3/
3/
54230
65896
3/
60264
3/
57300
3/
3DTT2
0C7V7
3/
3/
CY7C1009-25DMB
CY7C109A-25DMB
EDI88130CS25TB
L7C109DMB25
MMC965608EV25MQ
MS2128K8C25C
MSM8128KMC-25
MT5C1008C-25
NS41024S25D/883
P4C1024-25C4MB
QP7C1009B-25DMB
S128K8-25ME
SMJ5C1008-25JDCM
5962-8959837MZC
65896
L7C109DMB25
5962-8959838BTA
3/
5962-8959838BUA
3/
5962-8959838BXA
3/
5962-8959838BZA
3/
5962-8959838M7A
65896
L7C109YMB20
5962-8959838M7A
57300
MT5C1008DCJ-20
5962-8959838M7C
65896
L7C109YMB20
5962-8959838M9A
3/
5962-8959838MMA
3/
54230
65896
57300
3/
3DTT2
3/
0C7V7
CY7C1009-20LMB
EDI88130CS20L32B
L7C109KAMB20
MT5C1008ECA-20
NS41024S20E/883
P4C1024-20LMB
PDM41024S20L32B
QP7C1009B-20LMB
5962-8959838MMC
65896
L7C109KAMB20
5962-8959838MNA
3/
3/
See footnotes at end of table.
43 of 49
MSM8128JMC-20
L7C109-20 (GEN)
MSM8128WMC-20
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959838MTA
54230
3/
57300
3/
3DTT2
0C7V7
3/
EDI88130CS20FB
MSM8128GMC-20
MT5C1008F-20
NS41024S20F/883
P4C1024-20FSMB
QP7C1009B-20FMB
S128K8-20MF
5962-8959838MUA
54230
65896
57300
3/
3DTT2
3/
3/
EDI88130CS20LB
L7C109KMB20
MT5C1008EC-20
NS41024S20Y/883
P4C1024-20L1MB
S128K8-20ML
SMJ5C1008-20HMM
5962-8959838MUC
65896
L7C109KMB20
5962-8959838MXA
54230
3/
57300
3DTT2
3/
3/
EDI88130CS20CB
MSM8128SMC-20
MT5C1008CW-20
P4C1024-20C6MB
S128K8-20MC
SMJ5C1008-20JDDM
5962-8959838MYA
54230
65896
60264
57300
3/
3DTT2
3/
EDI88130CS20NB
L7C109YMB20
MS2128K8C20S
MT5C1008SOJ-20
NS41024S20S/883
P4C1024-20CJMB
S128K8-20MS
5962-8959838MYC
65896
L7C109YMB20
5962-8959838MZA
3/
54230
65896
60264
3/
57300
3/
3DTT2
0C7V7
3/
3/
CY7C1009-20DMB
EDI88130CS20TB
L7C109DMB20
MS2128K8C20C
MSM8128KMC-20
MT5C1008C-20
NS41024S20D/883
P4C1024-20C4MB
QP7C1009B-20DMB
S128K8-20ME
SMJ5C1008-20JDCM
5962-8959838MZC
65896
L7C109DMB20
5962-8959839M7A
65896
57300
L7C108YMB20
MT5C1009DCJ-20
See footnotes at end of table.
44 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959839M7C
65896
L7C108YMB20
5962-8959839M8A
54230
EDI88128CS20ZB
5962-8959839MMA
57300
MT5C1009ECA-20
5962-8959839MNA
3/
L7C108-20 (GEN)
5962-8959839MTA
54230
57300
EDI88128CS20FB
MT5C1009F-20
5962-8959839MUA
54230
57300
EDI88128CS20LB
MT5C1009EC-20
5962-8959839MXA
54230
57300
EDI88128CS20CB
MT5C1009CW-20
5962-8959839MYA
54230
65896
60264
57300
EDI88128CS20NB
L7C108YMB20
MS1128K8C20S
MT5C1009SOJ-20
5962-8959839MYC
65896
L7C108YMB20
5962-8959839MZA
54230
65896
57300
EDI88128CS20TB
L7C108DMB20
MT5C1009C-20
5962-8959839MZC
65896
L7C108DMB20
5962-8959840M7A
65896
57300
L7C108YMB20L
MT5C1009DCJ-20L
5962-8959840M7C
65896
L7C108YMB20L
5962-8959840M8A
54230
EDI88128LPS20ZB
5962-8959840MMA
57300
3/
MT5C1009ECA-20L
L7C108-20 (GEN)
5962-8959840MTA
54230
57300
EDI88128LPS20FB
MT5C1009F-20L
5962-8959840MUA
54230
57300
EDI88128LPS20LB
MT5C1009EC-20L
5962-8959840MXA
54230
57300
EDI88128LPS20CB
MT5C1009CW-20L
See footnotes at end of table.
45 of 49
Vendor
Similar
PIN 2/
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959840MYA
54230
65896
60264
57300
EDI88128LPS20NB
L7C108YMB20L
MS1128K8LC20S
MT5C1009SOJ-20L
5962-8959840MYC
65896
L7C108YMB20L
5962-8959840MZA
54230
65896
57300
EDI88128LPS20TB
L7C108YMB20L
MT5C1009C-20L
5962-8959841M7A
65896
57300
L7C109YMB15
MT5C1008DCJ-15
5962-8959841M7C
65896
L7C109YMB15
5962-8959841MMA
3/
54230
65896
57300
0C7V7
CY7C1009-15LMB
EDI88130CS15L32B
L7C109KAMB15
MT5C1008ECA-15
QP7C1009B-15LMB
5962-8959841MMC
65896
L7C109KAMB15
5962-8959841MTA
57300
0C7V7
MT5C1008F-15
QP7C1009B-15FMB
5962-8959841MUA
65896
57300
L7C109KMB15
MT5C1008EC-15
5962-8959841MUC
65896
L7C109KMB15
5962-8959841MXA
57300
MT5C1008CW-15
5962-8959841MYA
65896
60264
57300
L7C109YMB15
MS2128K8C15S
MT5C1008SOJ-15
5962-8959841MYC
65896
L7C109YMB15
5962-8959841MZA
3/
54230
65896
60264
CY7C1009-15DMB
EDI88130CS15TB
L7C109DMB15
MS2128K8C15C
5962-8959841MZA
57300
0C7V7
MT5C1008C-15
QP7C1009B-15DMB
5962-8959841MZC
65896
L7C109DMB15
5962-8959842MXA
54230
EDI88128LP70CB
See footnotes at end of table.
46 of 49
Vendor
Similar
PIN 2/
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
5962-8959842MYA
54230
EDI88128LP70NB
5962-8959843MXA
54230
EDI88128C70CB
5962-8959843MYA
54230
EDI88128C70NB
5962-8959844M7A
65896
57300
L7C108YMB15
MT5C1009DCJ-15
5962-8959844M7C
65896
L7C108YMB15
5962-8959844MMA
57300
MT5C1009ECA-15
5962-8959844MTA
57300
MT5C1009F-15
5962-8959844MUA
57300
MT5C1009EC-15
5962-8959844MXA
57300
MT5C1009CW-15
5962-8959844MYA
65896
60264
57300
L7C108YMB15
MS1128K8C15S
MT5C1009SOJ-15
5962-8959844MYC
65896
L7C108YMB15
5962-8959844MZA
54230
65896
57300
EDI88128CS15TB
L7C108DMB15
MT5C1009C-15
5962-8959844MZC
65896
L7C108DMB15
5962-8959845MMA
54230
EDI88130CS12L32B
5962-8959845MZA
54230
54230
EDI88130CS12TB
EDI88128CS12TB
5962-8959847Q6A
F7400
MM0-65608EV-30MQ
5962-8959847Q9A
3/
MMD-65608EV-30MQ
5962-8959847QTC
F7400
MMDJ-65608EV-30MQ
5962-8959847QZC
F7400
MMC9-65608EV-30MQ
5962-8959847V6A
F7400
SM0-65608EV-30SV
5962-8959847V9A
3/
SMD-65608EV-30SV
See footnotes at end of table.
47 of 49
Vendor
Similar
PIN 2/
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959847VTC
F7400
SMDJ-65608EV-30SV
5962-8959847VZC
F7400
SMC9-65608EV-30SV
5962-8959848M7A
65896
L7C108DMB15L
5962-8959848M7C
65896
L7C108DMB15L
5962-8959848MYA
65896
L7C108DMB15L
5962-8959848MYC
65896
L7C108DMB15L
5962-8959848MZA
65896
L7C108DMB15L
5962-8959848MZC
65896
L7C108DMB15L
5962-8959848MTA
54230
EDI88128LPS15FB
5962-8959848MXA
3/
1128K8LC15 (GEN)
5962-8959848MYA
60264
MS1128K8LC15S
5962-8959849QTC
F7400
AT65609EHV-DJ40MQ
5962-8959849VTC
F7400
AT65609EHV-DJ40SV
5962R8959849VTC
F7400
AT65609EHV-DJ40SR
5962-8959849QZC
F7400
AT65609EHV-C940MQ
5962-8959849VZC
F7400
AT65609EHV-C940SV
5962R8959849VZC
F7400
AT65609EHV-C940SR
1/ The lead finish shown for each PIN, representing a hermetic
package, is the most readily available from the manufacturer
listed for that part. If the desired lead finish is not listed contact
the Vendor to determine availability.
2/ Caution. Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
3/ Not available from an approved source of supply.
48 of 49
STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.
Vendor CAGE
Number
Vendor name
and address
57300
Austin Semiconductor
8701 Cross Park Drive
Austin, TX 78754
65786
Cypress Semiconductor
3901 N. First Street
San Jose, CA 95134-1599
54230
White Electronic Designs Corp.
3601 East University Drive
Phoenix, AZ 85034
F7400
Atmel Nantes
La Chantrerie BP 70602
44306 Nantes Cedex 3
France
0C7V7
QP Semiconductor
2945 Oakmead Village Court
Santa Clara, CA 95051
3DTT2
Pyramid Semiconductor Corporation
1340 Bordeaux Drive
Sunnyvale, CA 94089
65896
Logic Devices, Inc.
1375 Geneva Drive
Sunnyvale, California 94089
The following table lists the SMD part numbers for die.
Standard
microcircuit drawing
PIN
Vendor
CAGE
number
Vendor
Similar
PIN 1/
5962-8959847Q6A
F7400
MM0-65608EV-30MQ
5962-8959847V6A
F7400
SM0-65608EV-30SV
1/ Caution. Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
F7400
Atmel Nantes
La Chantrerie BP 70602
44306 Nantes Cedex 3
France
The information contained herein is disseminated for convenience only and the
government assumes no liability whatsoever for any inaccuracies in this
information bulletin.
49 of 49