INTEGRATED CIRCUITS DATA SHEET TEA5582 PLL stereo decoder (BTSC system) Product specification File under Integrated Circuits, IC02 July 1990 Philips Semiconductors Product specification PLL stereo decoder (BTSC system) TEA5582 GENERAL DESCRIPTION Features The TEA5582, a 20-pin integrated phase-locked loop (PLL) stereo decoder, is designed primarily for low cost stereo decoding in a low- to medium-line TV. The MUX input (pin 1) is a low impedance current input, the gain of the input amplifier is therefore determined by the external resistor R1 (see Fig.5). All characteristics are measured with R1 = 47 kΩ. The de-emphasis of (L, R) and (L-R) can be chosen by means of external capacitors and resistors. The supply voltage range of the device is from 7 V to 16 V. • Wide supply voltage range • Automatic mono/stereo switching (pilot presence detector) • LED driver for stereo indicator • Smooth mono/stereo control • Matrix and two amplifiers for left and right output signals • A source selector to switch between the MUX signal and an external signal • Mute circuit for 60 dB muting of the output level • External de-emphasis control of (L, R) and (L − R) • 6 dB fixed attenuation of (L − R) with respect to (L + R) prior to matrix • All pins are protected against Electrostatic Discharge (ESD) QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL Supply voltage range Total current consumption MIN. TYP. MAX. UNIT VS 7.0 8.5 16 V without LED driver Itot − 19 25 mA mono; R1 = 47 kΩ Go(Vo/Vi) 4 5.8 7 dB V14 = V15 − 245 − mV Decoder Overall gain AF output voltage (RMS value) THD − 0.3 − % V14/V15 − 0.1 − dB L = 1; R = 0 α 24 28 − dB Suppression of MUX signal V6 ≥ 2 V α 80 90 − dB Suppression of external signal V6 ≤ 0.8 V α 56 60 − dB MUX signal Gv 6.7 7.2 7.7 dB external signal Gv −0.5 0 +0.5 dB V11 = V10 460 560 640 mV MUX signal α 56 60 − dB external signal α 56 60 − dB Total harmonic distortion Vo = 600 mV Output channel unbalance Channel separation Source selector Output amplifiers Gain output amplifier AF output voltage (RMS value) Mute suppression V7 ≤ 0.8 V PACKAGE OUTLINE 20-LEAD DIL; PLASTIC (SOT146); SOT146-1; 1996 November 18. July 1990 2 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Philips Semiconductors PLL stereo decoder (BTSC system) July 1990 3 Product specification TEA5582 Fig.1 Block diagram. Philips Semiconductors Product specification PLL stereo decoder (BTSC system) TEA5582 PINNING Fig.2 Pinning diagram. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER SYMBOL MIN. MAX. UNIT Supply voltage range (pin 5) VP − 18 V LED-driver current (peak value) I3 − 75 mA Total power dissipation Ptot Storage temperature range Tstg −65 +150 °C Operating ambient temperature range Tamb 0 +70 °C Electrostatic handling(1) Ves −2 +2 kV see Fig.3 Note 1. ESD withstand voltage is defined by MIL STD 883C (C = 100 pF; R = 1.5 kΩ). July 1990 4 Philips Semiconductors Product specification PLL stereo decoder (BTSC system) TEA5582 Fig.3 Power derating curve. DC CHARACTERISTICS All voltages are with respect to ground (pin 20); all currents are positive into the device; all parameters are measured in the test set-up (see Fig.5) at a nominal supply voltage of VS = 8.5 V; Tamb = 25 °C unless otherwise specified. PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT VS 7.0 8.5 16 V Itot − 19 25 mA Ptot − 160 − mW pin 1 V1 − 2.1 − V pins 8, 9, 10, 11, 12 and 13 V8 − V13 − 4.2 − V −I14, I15 1.1 1.4 1.8 mA I3 − − 20 mA V19 − 2 − V I19 50 − − µA Supply voltage Total current consumption without LED driver Power dissipation Voltage DC output current pins 14 and 15 LED-driver current pin 3 Switch “VCO-OFF” voltage I19 = 50 µA Switch “VCO-OFF” current July 1990 5 Philips Semiconductors Product specification PLL stereo decoder (BTSC system) TEA5582 AC CHARACTERISTICS Measured in the test circuit of Fig.5; VS = 8.5 V; Tamb = 25 °C. AC conditions: (1) input signal (Vi) of 815 mV p-p for L = 1, R = 1 (mono) fm = 1 kHz (= 80% modulation). (2) MUX input signal (Vi) of 1.2 V p-p for L = 1, R = 0 and no DBX; fm = 1 kHz (stereo) and Vpilot = 200 mV p-p. (3) S1 open, unless specified (without L−R filter); voltage controlled oscillator (VCO) adjusted to 188.8 kHz at Vi = 0 V; values are measured with an external IF roll-off network (−2 dB at 31.5 kHz = 2fH) at the input (dashed components RS and CS in Fig.5). All the above conditions apply unless otherwise specified. PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Overall performance (Vi to Vo) Input current (RMS value) Overall gain mono; R1 = 47 kΩ Il(rms) − − 12 µA Go (Vo/Vi) 4 5.8 7 dB V11 = V10 460 560 640 mV V15 = V14 − 245 − mV THD − 0.3 0.5 % AF output voltage (mono) (RMS value) AF output voltage (mono) (RMS value) Total harmonic distortion note 1 Output voltage THD = 1% Output channel unbalance V11 = V10 − 800 − mV V11/V10 − 0.1 1 dB Channel separation L = 1; R = 0 α 24 28 − dB Signal-to-noise ratio bandwidth 20 Hz to 16 kHz S/N − 76 − dB bandwidth IEC 79 (curve Din A) S/N − 82 − dB stereo Vpilot − 40 60 mV mono Vpilot 15 30 − mV hysteresis ∆Vpilot − 2.5 − dB − dB Pilot presence detector note 2 Switching to: Smooth mono/stereo control (pin 16) see Fig.4 Channel separation (α) Full stereo V16 ≥ 1.25 V α 24 28 Smooth operation V16 = typ. 1 V α − 10 − dB Full mono V16 ≤ 0.75 V α − − 1 dB July 1990 6 Philips Semiconductors Product specification PLL stereo decoder (BTSC system) PARAMETER TEA5582 CONDITIONS SYMBOL Pilot signal suppression TYP. MAX. UNIT − 6 − dB αfH 32 36 − dB α2fH − 60 − dB α12fH − 75 − dB α5fH − 60 − dB − 60 − dB Attenuation (L-R) Carrier and harmonic suppression at the output MIN. note 3 fpilot = 15.734 kHz (1 fH) Subcarrier suppression f = 2 fH VCO suppression f = 12fH SAP signal suppression (Second Audio Programme) f = 5fH Intermodulation suppression note 4 fm = 8.367 kHz spurious signal fs = 1 kHz α2 fm = 10.823 kHz spurious signal fs = 1 kHz α3 − 70 − dB f = 120 Hz; Vripple = 100 mV; mono RR120 − 50 − dB fOSC = 188.808 kHz R7 = 10 kΩ 5% C6 = 820 pF 1% Radj 0 − 8 kΩ deviation from fOSC centre frequency; Vpilot = 200 mV p-p ∆f/f − 4.5 − % TC − 250 × 10−6 − K−1 MUX signal Gv 6.7 7.2 7.7 dB external signal Gv −0.5 0 +0.5 dB Ripple rejection VCO R adjust (R5) Capture range Temperature coefficient uncompensated Output amplifiers Gain Input impedance Zi − 50 − kΩ Output impedance Zo − 10 − Ω External load impedance Z1 10 − − kΩ External load capacitance Z1 − − 1.5 nF MUX signal α 56 60 − dB external signal α 56 60 − dB Mute suppression July 1990 V7 ≤ 0.8 V 7 Philips Semiconductors Product specification PLL stereo decoder (BTSC system) PARAMETER TEA5582 CONDITIONS SYMBOL MIN. TYP. MAX. UNIT mute OFF-to-ON ∆V − 10 50 mV mute ON-to-OFF ∆V − 10 50 mV Suppression of MUX signal V6 ≥ 2 V α 80 90 − dB Suppression of external signal V6 ≤ 0.8 V α 56 60 − dB Switching level MUX selected VIL − − 0.8 V IIL − 10 25 µA VIH 2 − VP V VI = VP IIH − 0.1 1 µA mute ON VIL − − 0.8 V mute OFF VIH 2 − VP V mute ON; VIL = 0.8 V −IIL − 10 25 µA mute OFF; VIH = VP IIL − 0.1 1 µA DC offset voltage at outputs Source selector (pin 6) voltage current Switching level VI = 0.8 V external selected voltage current Muting circuit (pin 7) Input voltage Input current Notes 1. Guaranteed for mono, mono + pilot and stereo. 2. Adjustable. 3. S1 closed; reference: AF output voltage f = 1 kHz (mono). 4. Intermodulation suppression (Beat-Frequency Components (BFC)): V o ( signal ) ( at 1 kHz ) α 2 = ---------------------------------------------------------------- ; f s = ( 2 × 8.367 kHz ) – fH V o ( spurious ) ( at 1 kHz ) V o ( signal ) ( at 1 kHz ) α 3 = ------------------------------------------------------------- ; f s = ( 3 × 10.823 kHz ) – 2fH V o ( spurious ) ( at 1 kHz ) measured with 100% modulated input signal: L = R; pilot signal = 200 mV p-p; fm = 8.367 or 10.823 kHz. July 1990 8 Philips Semiconductors Product specification PLL stereo decoder (BTSC system) TEA5582 Fig.4 Smooth mono/stereo control. July 1990 9 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Philips Semiconductors PLL stereo decoder (BTSC system) July 1990 10 Product specification TEA5582 Fig.5 Test and application circuit. Philips Semiconductors Product specification PLL stereo decoder (BTSC system) TEA5582 PACKAGE OUTLINE DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 July 1990 REFERENCES IEC JEDEC EIAJ SC603 11 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Product specification PLL stereo decoder (BTSC system) TEA5582 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1990 12