PHILIPS TDA3833

INTEGRATED CIRCUITS
DATA SHEET
TDA3833
BTSC-stereo/SAP/DBX decoder
and DBX expander
Product specification
File under Integrated Circuits, IC02
September 1992
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
FEATURES
• DBX decoder, MPX decoder
and SAP decoder on chip
TDA3833
QUICK REFERENCE DATA
SYMBOL
PARAMETER
TYP.
UNIT
VP
positive supply voltage (pin 32)
5
V
IP
supply current
42
mA
Vi
input signal, 100% modulated, mono
(RMS value, pin 1)
100
mV
• Stereo and SAP signal
available simultaneously
Vo
AF output signal (RMS value, pins 7, 23 and 24)
550
mV
S/N(W)
signal-to-noise ratio, weighted
50
dB
• Reliable stereo/SAP
identification by means of the
noise detector
S/N
signal-to-noise ratio
60
dB
αCH
stereo channel separation
26
dB
αCR
crosstalk attenuation
60
dB
THD
total harmonic distortion
0.2
%
• Extensive switching
possibilities for the AF outputs
and the extra headphone
output
• Integrated filters
• DAC control possible for most
alignments
• Few external components
• Low power consumption
(200 mW)
• +5 V supply voltage
GENERAL DESCRIPTION
The TDA3833 is a sound
processor for stereo/second
audio program (SAP) baseband
signals in accordance with the
BTSC standard for television
receivers and video tape
recorders.
September 1992
ORDERING INFORMATION
PACKAGE
EXTENDED
TYPE NUMBER
PINS
PIN
POSITION
MATERIAL
CODE
TDA3833
32
SDIL
plastic
SOT232AG(1)
TDA3833T
32
SO
plastic
SOT287AH(2)
Note
1. SOT232-1; 1996 December 13.
2. SOT287-1; 1996 December 13.
2
Product specification
TDA3833
(1) control possible by DAC
(2) DBX encoded
BTSC-stereo/SAP/DBX decoder and DBX
expander
September 1992
3
Fig.1 Block diagram, test and application circuit.
Philips Semiconductors
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
PINNING
SYMBOL
PIN
DESCRIPTION
Vi
1
composite input signal (MPX/SAP)
ILV
2
input level control
fref
3
adjustment of filter reference
CSAP
4
SAP identity smoothing capacitor
CND
5
SAP noise detector smoothing capacitor
SAPI
6
SAP indicator output (sink)
Vo HP
7
SAP/mono headphone output
Vo SAP
8
output signal SAP/(L-R) without DBX
SAPLV
9
SAP level control
LRLV
10
(L-R) level control
MODE
11
4-state mode control
C1SPB
12
spectral band timing capacitor
DBXLV
13
DBX spectral adjust
C1WB
14
wideband timing capacitor
DBXT
15
DBX timing adjust
C2SPB
16
spectral RMS-detector smoothing capacitor
C2WB
17
wideband RMS-detector smoothing capacitor
C1DC
18
DC decoupling capacitor 1 for offset compensation
C2DC
19
DC decoupling capacitor 2 for offset compensation
EMPH1
20
time constant for variable emphasis
DBXIN
21
DBX signal input
EMPH2
22
time constant for variable emphasis
VoAF1
23
AF output signal right/SAP or mono
VoAF2
24
AF output signal left/SAP or mono
GND
25
ground (0 V)
Cref
26
smoothing capacitor for internal reference voltage
VCO
27
VCO free running frequency adjustment
LOOP
28
phase detector loop filter
STERI
29
stereo indicator output (sink)
PILOT
30
pilot cancel adjustment
Cpil
31
pilot detector smoothing capacitor, VCO/4 output
VP
32
+5 V supply voltage
September 1992
4
Fig.2 Pin configuration.
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC134)
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VP
supply voltage (pin 32)
0
8
V
V1
composite input voltage
0
VP
V
V11
MODE input voltage
0
8
V
I7,23,24
output current (AF outputs)
0
5
mA
I6,29
output current (indication outputs)
0
5
mA
Ptot
total power dissipation
0
500
mW
Tstg
storage temperature range
−55
+150
°C
Tamb
operating ambient temperature range
0
+70
°C
VESD
electrostatic handling for all pins (note 1)
−
±4000
V
Note to the limiting values
1. Equivalent to discharging a 100 pF capacitor through an 1.5 kΩ series resistor.
CHARACTERISTICS
VP = 5 V; Tamb = +25 °C; for MPX: ∆f = 25 kHz for L+R (100% modulation); fmod = 1 kHz; and for SAP: ∆f = 10 kHz;
fmod = 1 kHz, unless otherwise specified. Measurements taken in Fig. 1 including all adjustments.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
supply voltage range (pin 32)
4.75
5
5.35
V
IP
supply current
−
42
−
mA
Vn
DC input/output voltage at pins 1, 7, 8,
18, 19, 21, 23 and 24
−
VP/2
−
V
mono/SAP
0
−
VP/2−1
V
SAP
VP/2-0.4 −
VP/2+0.4
V
stereo
VP/2+1
−
VP
V
mono
VP+1.4
−
8
V
mono/SAP
−
−
15
µA
SAP
−
−
15
µA
stereo
−
−
5
µA
−
−
300
µA
MODE select 4-state input (see Table 1)
V11
I11
input voltage for
input current for
mono
September 1992
V11 = 7.2 V
5
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
SYMBOL
PARAMETER
CONDITIONS
TDA3833
MIN.
TYP.
MAX.
UNIT
Composite input (pin 1)
Ri
input resistance on pin 1
Vi
input signal on pin 1 (RMS value)
14
20
26
kΩ
70
100
140
mV
stereo on
−
−
16
mV
stereo off
5
−
−
mV
MPX
−
2.5
−
dB
SAP on
−
−
37
mV
SAP off
16
−
−
mV
see note 1
L+R (all other signals in accordance
with BTSC system specification)
pilot threshold for MPX
hysteresis of threshold
Vi
pilot threshold for SAP
hysteresis of threshold
SAP
−
2
−
dB
Gv
gain control range
dependent on V2
±5
±7.5
−
dB
V2
control voltage range (pin 2)
−
1 to 4
−
V
I2
input current (pin 2)
V2 = VP/2
−
−
5
µA
Voltage controlled oscillator (VCO) (pin 27)
fVCO
nominal VCO frequency (4fH)
see note 2
−
62.94
−
kHz
∆f29
capture range
nominal pilot
−
−
1
kHz
TC
temperature coefficient
−
−
50
10−6/K
stereo present
−
−
0.5
V
stereo not present
VP−0.5
−
VP
V
stereo present
3
−
−
mA
output signal (RMS value, pin 7)
see note 3
−
550
−
mV
output signal headroom
mono
Stereo indication output (pin 29)
V29
I29
output voltage range
output current active LOW
SAP/mono output (pin 7)
Vo
−
9.5
−
dB
R7
output resistance
−
100
200
Ω
RL
load resistance
10
−
−
kΩ
CL
load capacitance
−
−
500
pF
THD
total harmonic distortion
SAP signal
−
0.5
−
%
mono signal
−
0.2
−
%
B
frequency response 50 to 10000 Hz
mono; external
75 µs de-emphasis
−3
−
−
dB
S/N(W)
weighted signal-to-noise ratio
(CCIR468-3)
mono; external
75 µs de-emphasis
−
50
−
dB
September 1992
6
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
SYMBOL
PARAMETER
CONDITIONS
TDA3833
MIN.
TYP.
MAX.
UNIT
SAP indication output (pin 6)
V6
I6
output voltage range
output current active LOW
SAP present
−
−
0.5
V
SAP not present
VP-0.5
−
VP
V
SAP present
3
−
−
mA
see note 3
−
550
−
mV
Audio outputs (pins 23 and 24)
Vo
output signal
(RMS value, pins 23 and 24)
output signal headroom
−
9.5
−
dB
∆VL,R
output signal difference between L and R f = 250 to 6300 Hz
−
−
3
dB
∆Vo
output signal difference after switching
from L or R to SAP
f = 250 to 6300 Hz
−
−
3
dB
∆V23,24
DC offset voltage after switching
stereo/mono/SAP
−
−
±100
mV
R23,24
output resistance
−
200
300
Ω
RL
load resistance
10
−
−
kΩ
CL
load capacitance
−
−
500
pF
THD
total harmonic distortion
L and R signal
−
0.2
−
%
SAP signal
−
0.5
−
%
f = 50 to 10000 Hz
12 kHz related to
1 kHz
−3
−
−
dB
−
−3
−
dB
SAP frequency response
f = 50 to 8000 Hz
−3
−
−
dB
S/N(W)
weighted signal-to-noise ratio
L + R signal;
CCIR468-3
−
50
−
dB
S/N
unweighted signal-to-noise ratio
(RMS value)
L + R signal;
f = 20 to 20000 Hz
−
60
−
dB
αCR
crosstalk
L or R into SAP
50
63
−
dB
B
αCH
L and R frequency response
channel separation
(according to DBX requirements)
SAP into L or R
50
70
−
dB
f = 100 to 5000 Hz
10% 75 µs
equivalent input
modulation
20
26
−
dB
1 to 100% 75 µs
15
20
−
dB
equivalent input
modulation
September 1992
7
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
SYMBOL
PARAMETER
CONDITIONS
TDA3833
MIN.
TYP.
MAX.
UNIT
DBX section
V9
SAP level control voltage range
−
1 to 4
−
V
V10
(L - R) level control voltage range
−
1 to 4
−
V
V13
spectral band level control voltage range
−
1.8 to 3.2
−
V
−
−
5
µA
343
381
419
dB/s
−
22.5
−
µA
I9,10,13
input current
S1
spectral RMS-detector release rate
I12
timing current for nominal release
rate of spectral RMS-detector
VI = 0.5VP
see note 4
current adjustment range
−
11 to 45
S2
wideband RMS-detector release rate
112.5
125
137.5
dB/s
I14
timing current for nominal release rate
of wideband RMS-detector
−
7.5
−
µA
current adjustment range
−
4 to 15
−
µA
V15
timing adjustment
−
1.5 to 3.8
−
V
0.33l12; see note 4
µA
Notes to the characteristics
1. Requirements for the MPX/SAP input signal to ensure correct system performance:
a) Maximum variation of MPX/SAP signal under operating conditions: to be found (1 dB).
b) 3 dB bandwidth ≥ 130 kHz (∆f = 25 kHz).
c) THD (L + R, ∆f = 25 kHz, fmod = 1 kHz): 0.2%.
d) S/N(W), weighted in accordance with CCIR468-3 (L + R, ∆f = 25 kHz for sound carrier, fmod = 1 kHz, 75 µs
de-emphasis; with critical picture modulation): S/N(W) > 44 dB; with sync only: S/N(W) > 54 dB.
e) Spectral spurious attenuation: 40 dB (mainly n × fH; L + R, ∆f = 25 kHz for sound carrier fmod = 1 kHz, 50 Hz to
100 kHz, no de-emphasis).
f) Maximum white noise level (unweighted, 200 Hz to 100 kHz) to avoid malfunctioning of the identification circuits:
500 mV (RMS).
2. Adjustable on pin 27, measurement (fH) on pin 7 with a 2.7 kΩ resistor connected between VP and pin 31.
3. Can also be aligned to 600 mV (RMS), then identification threshold and AF output headroom will be decreased by
1.6 dB.
4. I12 and I14 can be measured via an ammeter connected to 4 V (3.5 to 4.1 V).
September 1992
8
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
Table 1
TDA3833
MODE select; 4-state pin 11
V11 (VP = 5 V)
MODE
AF OUTPUTS
(V)
mono
SAP/MONO OUTPUT
SAP CARRIER
PIN 23
PIN 24
PIN 7
8
on
mono
mono
SAP without DBX
stereo
VP
on
right
left
SAP without DBX
SAP
VP/2
on
SAP
SAP
mono
mono/SAP
0
on
SAP
mono
SAP without DBX
mono
8
off
mono
mono
mono
stereo
VP
off
right
left
mono
SAP
VP/2
off
right
left
mono
mono/SAP
0
off
mute
mono
mono
September 1992
9
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
PACKAGE OUTLINES
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
SOT232-1
ME
seating plane
D
A2 A
A1
L
c
e
Z
(e 1)
w M
b1
MH
b
17
32
pin 1 index
E
1
16
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.8
1.3
0.8
0.53
0.40
0.32
0.23
29.4
28.5
9.1
8.7
1.778
10.16
3.2
2.8
10.7
10.2
12.2
10.5
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-02-04
SOT232-1
September 1992
EUROPEAN
PROJECTION
10
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
D
E
A
X
c
y
HE
v M A
Z
17
32
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
16
1
0
detail X
w M
bp
e
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.27
0.18
20.7
20.3
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.2
1.0
0.25
0.25
0.1
0.95
0.55
inches
0.10
0.012 0.096
0.004 0.086
0.01
0.02
0.01
0.011
0.007
0.81
0.80
0.30
0.29
0.050
0.42
0.39
0.055
0.043
0.016
0.047
0.039
0.01
0.01
0.004
0.037
0.022
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-01-25
SOT287-1
September 1992
EUROPEAN
PROJECTION
11
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
SDIP
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
September 1992
12
Philips Semiconductors
Product specification
BTSC-stereo/SAP/DBX decoder and DBX expander
TDA3833
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 1992
13