Q3 2014 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
Third QUARTER 2014
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product BU)
2
3. HTOL (sorted by technology)
3
4. Data Retention Bake (sorted by product BU)
4
5. Data Retention Bake (sorted by technology)
5
6. Temperature Cycle
6
7. Temperature Humidity Bias & HAST
7
8. Steam Pressure Pot
8
9. Failure Rate Calculations
9
10. Definitions
10
RELIABILITY MONITOR
Reliability Monitor Report
Date:
July 25, 2014
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process, package or business unit and performing a series of reliability
tests to ensure that the reliability has maintained over time. Listed below are the
overall results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
✓ Failure Rate: 12 FITS (344K device-hours)
✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours. All failures were inconclusive.
2.
Data Retention Bake (150°C; 0 failures)
✓ Failure Rate: 6 FITS (1,408K device-hours)
✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
✓ Failure Rate: 0.00% (0 failures out of 1,162 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
✓ Failure Rate: 0.00% (0 failures out of 482K device-hours)
✓ Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
✓ Failure Rate: 0.00% (0 failures out of 162 units)
RELIABILITY MONITOR
1
High Temperature Operating Life
(sorted by FAMILY)
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ SS
BU
QTR
Device-Hours*
WAF
EFR PPM
FITS
MEMORY
2
LAST 4Q
0
0
259
259
0
0
259
259
0
0
259
259
0
0
259
259
259,000
259,000
221
221
0
0
16
16
MCU
2
LAST 4Q
0
0
85
1,205
0
0
85
553
0
0
85
553
0
0
85
553
85,000
625,592
236
236
0
0
46
6
ATMEL
2
1
4
3
LAST 4Q
0
0
0
0
0
344
0
891
229
1,464
0
0
0
0
0
344
0
239
229
812
0
0
0
0
0
344
0
239
229
812
0
0
0
0
0
344
0
239
229
812
344,000
0
270,296
270,296
884,592
224
0
236
236
231
0
0
0
0
0
12
0
14
14
4
RELIABILITY MONITOR
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
TECH
QTR
63.9K
2
LAST 4Q
0
0
85
85
0
0
85
85
0
0
85
85
0
0
63K
2
LAST 4Q
0
69
0
69
0
69
58.9K
2
LAST 4Q
0
0
82
82
0
0
82
82
0
0
58K
2
LAST 4Q
0
79
0
79
2
LAST 4Q
0
80
0
36K
2
LAST 4Q
0
0
82
82
35.9K
2
LAST 4Q
0
0
35.4K
2
LAST 4Q
2
LAST 4Q
37K
ATMEL
Device-Hours*
WAF
EFR PPM
FITS
85
85
85,000
85,000
236
236
0
0
46
46
0
69
69,000
236
0
56
82
82
0
0
82
82
82,000
82,000
236
236
0
0
47
47
0
79
0
79
79,000
236
0
49
80
0
80
0
80
80,000
236
0
49
0
0
82
82
0
0
82
82
0
0
82
82
82,000
82,000
213
213
0
0
52
52
95
95
0
0
95
95
0
0
95
95
0
0
95
95
95,000
95,000
213
213
0
0
45
45
0
892
0
240
0
240
0
240
271,296
236
0
14
0
0
344
1,464
0
0
344
812
0
0
344
812
0
0
344
812
344,000
843,296
224
231
0
0
12
5
RELIABILITY MONITOR
3
Data Retention Bake
(sorted by FAMILY)
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
BU
QTR
Device-Hours
AF
FITS
MEMORY
2
LAST 4Q
0
0
246
246
0
0
246
246
0
0
246
246
246,000
246,000
117
117
32
32
MCU
2
LAST 4Q
0
0
1,162
2,355
0
0
1,162
2,355
0
0
1,162
2,355
1,162,000
2,355,000
117
117
7
3
ATMEL
2
LAST 4Q
0
0
1,408
2,601
0
0
1,408
2,601
0
0
1,408
2,601
1,408,000
2,601,000
117
117
6
3
RELIABILITY MONITOR
4
Data Retention Bake
(sorted by TECHNOLOGY)
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
TECH
QTR
66K
2
LAST 4Q
0
160
0
160
0
160
160,000
117
49
63.9K
2
LAST 4Q
0
0
82
82
0
0
82
82
0
0
82
82
82,000
82,000
117
117
96
96
63 K
2
LAST 4Q
0
77
0
77
0
77
77,000
117
102
2
LAST 4Q
0
80
0
80
0
80
80,000
117
98
58K
2
LAST 4Q
0
0
80
156
0
0
80
156
0
0
80
156
80,000
156,000
117
117
98
50
56K
2
LAST 4Q
0
80
0
80
0
80
80,000
117
98
37K
2
LAST 4Q
0
0
1,000
1,080
0
0
1,000
1,080
0
0
1,000
1,080
1,000,000
1,080,000
117
117
8
7
36K
2
LAST 4Q
0
0
164
164
0
0
164
164
0
0
164
164
164,000
164,000
117
117
48
48
35.9K
2
LAST 4Q
0
0
82
162
0
0
82
162
0
0
82
162
82,000
162,000
117
117
96
48
35.4K
2
LAST 4Q
0
400
0
400
0
400
400,000
117
20
2
LAST 4Q
0
80
0
80
0
80
80,000
117
98
2
LAST 4Q
0
80
0
80
0
80
80,000
117
98
2
LAST 4Q
0
0
1,408
2,601
0
0
1,408
2,601
0
0
1,408
2,601
1,408,000
2,601,000
117
117
6
3
59.5K
35K
19.6K
ATMEL
RELIABILITY MONITOR
Device-Hours AF
FITS
5
Temperature Cycle
100 Cycles
REJ
SS
200 Cycles
REJ
SS
500 Cycles
REJ
SS
1K Cycles
REJ
SS
PACKAGE
QTR
LQFP
2
LAST 4Q
0
0
80
80
0
0
80
80
0
0
80
80
0
0
80
80
0.00%
0.00%
MLF / QFN
2
LAST 4Q
0
239
0
239
0
239
0
239
0.00%
PDIP
2
LAST 4Q
0
0
1,000
1,160
0
0
1,000
1,160
0
0
1,000
1,160
0
0
1,000
1,160
0.00%
0.00%
SOIC
2
LAST 4Q
0
320
0
320
0
320
0
320
0.00%
2
LAST 4Q
0
400
0
400
0
400
0
400
0.00%
TSSOP
2
LAST 4Q
0
0
82
82
0
0
82
82
0
0
82
82
0
0
82
82
0.00%
0.00%
ATMEL
2
LAST 4Q
0
0
1,162
2,281
0
0
1,162
2,281
0
0
1,162
2,281
0
0
1,162
2,281
0.00%
0.00%
TQFP
RELIABILITY MONITOR
% Defective
6
Temperature Humidity Bias / HAST
Temperature Humidity Bias
HAST
168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective
REJ SS REJ SS REJ SS REJ SS
PACKAGE
QTR
LQFP
2
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
80
80
160,000
160,000
0.00%
0.00%
MLF / QFN
2
LAST 4Q
0
0
0
0
0
0
0
240
480,000
0.00%
PDIP
2
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
80
160
160,000
320,000
0.00%
0.00%
SOIC
2
LAST 4Q
0
0
0
0
0
0
0
320
640,000
0.00%
2
LAST 4Q
0
0
0
0
0
0
0
400
800,000
0.00%
TSSOP
2
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
81
81
162,000
162,000
0.00%
0.00%
ATMEL
2
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
241
1,281
482,000
2,562,000
0.00%
0.00%
TQFP
RELIABILITY MONITOR
7
Steam Pressure Pot
96 Hours
REJ
SS
168 Hours
REJ
SS
240 Hours
REJ
SS
PACKAGE
QTR
PDIP
2
LAST 4Q
0
0
80
240
0
0
80
240
0
0
80
240
0.0%
0.0%
SOIC
2
LAST 4Q
0
240
0
240
0
240
0.0%
2
LAST 4Q
0
160
0
160
0
160
0.0%
TSSOP
2
LAST 4Q
0
0
82
82
0
0
82
82
0
0
82
82
0.0%
0.0%
ATMEL
2
LAST 4Q
0
0
162
722
0
0
162
722
0
0
162
722
0.00%
0.00%
TQFP
RELIABILITY MONITOR
% Defective
8
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR
9
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to retain
a charge for extended periods of time without applying voltage bias. Stressing
at high temperatures (150°C for plastic packages) accelerates any discharge
causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and is
identical to the expression PPM/K hours. For example, three failures out of a
million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to accelerate
thermally activated failure mechanisms through the use of high temperatures
(typically between 125°C and 150°C), increased voltage, and dynamic bias
conditions. Readouts at various time points are taken to determine the Early
Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in
defective parts per million (DPPM) and IFR is expressed in Failures in Time
(FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH) conditions
in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction characteristics
of the die and mold compound by repeated alternating temperature dwells
between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a factor
of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR
10