BGA758L7 5-6 GHz LNA for WLAN Data Sheet Revision 1.0, 2010-02-22 Preliminary RF & Protection Devices Edition 2010-02-22 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGA758L7 BGA758L7 5-6 GHz LNA for WLAN Revision History: 2010-02-22, Revision 1.0 Previous Revision: 2009-04-03, Revision 0.1 Page Subjects (major changes since last revision) all Preliminary data sheet all New document layout 7, 8, 10 Electrical Characteristics adjusted Trademarks of Infineon Technologies AG A-GOLD™, BlueMoon™, COMNEON™, CONVERGATE™, COSIC™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CONVERPATH™, CORECONTROL™, DAVE™, DUALFALC™, DUSLIC™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, E-GOLD™, EiceDRIVER™, EUPEC™, ELIC™, EPIC™, FALC™, FCOS™, FLEXISLIC™, GEMINAX™, GOLDMOS™, HITFET™, HybridPACK™, INCA™, ISAC™, ISOFACE™, IsoPACK™, IWORX™, M-GOLD™, MIPAQ™, ModSTACK™, MUSLIC™, my-d™, NovalithIC™, OCTALFALC™, OCTAT™, OmniTune™, OmniVia™, OptiMOS™, OPTIVERSE™, ORIGA™, PROFET™, PRO-SIL™, PrimePACK™, QUADFALC™, RASIC™, ReverSave™, SatRIC™, SCEPTRE™, SCOUT™, S-GOLD™, SensoNor™, SEROCCO™, SICOFI™, SIEGET™, SINDRION™, SLIC™, SMARTi™, SmartLEWIS™, SMINT™, SOCRATES™, TEMPFET™, thinQ!™, TrueNTRY™, TriCore™, TRENCHSTOP™, VINAX™, VINETIC™, VIONTIC™, WildPass™, X-GOLD™, XMM™, X-PMU™, XPOSYS™, XWAY™. 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Last Trademarks Update 2009-10-19 Preliminary Data Sheet 3 Revision 1.0, 2010-02-22 BGA758L7 Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 2.1 2.2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Digital Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Preliminary Data Sheet 4 Revision 1.0, 2010-02-22 BGA758L7 List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Drawing of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Cross-section of Application Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package Outline TSLP-7-8 (side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Footprint TSLP-7-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Preliminary Data Sheet 5 Revision 1.0, 2010-02-22 BGA758L7 List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical Characteristics: TA = 25 °C, VCC = 3.3 V, VPON,ON = 3.3 V, VPON,OFF = 0 V, f = 5.5 GHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Digital Control Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Preliminary Data Sheet 6 Revision 1.0, 2010-02-22 5-6 GHz LNA for WLAN BGA758L7 Features • • • • • • • • • • • • • Gain, |S21|2= 12.5 dB at 5.5 GHz High Linearity, Input P-1dB = -3.5 dBm at 5.5 GHz Low noise figure, NF = 1.3 dB at 5.5 GHz Internal output matching on chip AC coupled RF output port Temperature compensated internal biasing circuit Digital On/Off switch on chip Low external part count 1 kV HBM ESD protection for IN-pin 2 kV HBM ESD protection for all other pins B7HFM silicon germanium technology Tiny TSLP-7-8 leadless package Pb-free (RoHS compliant) package 6 5 4 7 1 2 3 TSLP-7-8 Application • Low noise amplifier for WLAN application PON BIAS VCC Biasing & Logic Circuitry OUT IN GND Figure 1 BGA 758 L7_Blockdiagram .vsd Block Diagram Product Name Marking Package BGA758L7 BA TSLP-7-8 Preliminary Data Sheet 7 Revision 1.0, 2010-02-22 BGA758L7 Features Description The BGA758L7 is a 5 - 6 GHz Silicon Germanium low noise amplifier MMIC in tiny TSLP-7-8 package. The LNA delivers a gain of 12.5 dB while giving an excellent noise figure of 1.3 dB in the application configuration described in Chapter 3. The supply current of 7.0 mA is chosen to maintain a high input compression point of -3.5 dBm. The temperature compensated internal biasing circuit provides stable current conditions over temperature range. Output matching is done by on chip matching circuits in combination with the bonding wire inductances. The application circuit requires only three external elements. With only one additional external element an ultra low noise figure of 1.1 dB can be achieved. For detailed information please refer to Infineon BGA758L7 Application Note. Pin Definition and Function Table 1 Pin Definition and Function Pin No. Name Function 1 PON Power on control 2 IN RF input 3 BIAS DC bias 4 n.c. not connected 5 VCC DC Supply 6 OUT RF output 7 GND RF ground and DC ground for bias and logic circuity Preliminary Data Sheet 8 Revision 1.0, 2010-02-22 BGA758L7 Maximum Ratings 1 Maximum Ratings Table 2 Maximum Ratings Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Voltage at pin VCC VCC -0.3 – 4 V 1) Voltage at pin IN VIN -0.3 – 0.9 V – Voltage at pin BIAS VBIAS -0.3 – 0.9 V – Voltage at pin OUT VOUT -0.3 – VCC + 0.3 V – Voltage at pin PON VPON -0.3 – VCC + 0.3 V – Voltage at pin GND VGND -0.3 – 0.3 V – Current into pin VCC ICC – – 12 mA – RF input power PIN – – 0 dBm – Total power dissipation, TJ – – 48 mW – Junction temperature Ptot – – 150 °C – Ambient temperature range TA -30 – 85 °C – Storage temperature range TSTG -65 – 150 °C – ESD capability all pins VESD-HBM – – 1000 V according to JESD22A-114 ESD capability all pins, excluding pin IN VESD-HBM – – 2000 V according to JESD22A-114, w/o pin IN ESD capability all pins VESD-MM – 100 V according to JESD22A-115 TS < 120°C2) – 1) All voltages refer to GND-Node unless otherwise noted 2) TS is measured on the ground lead at the soldering point Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Thermal Resistance Table 3 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point RthJS 615 1) For calculation of RthJA please refer to Application Note Thermal Resistance K/W 1) Preliminary Data Sheet 9 Revision 1.0, 2010-02-22 BGA758L7 Electrical Characteristics 2 Electrical Characteristics 2.1 Electrical Parameter Table 4 Electrical Characteristics1): TA = 25 °C, VCC = 3.3 V, VPON,ON = 3.3 V, VPON,OFF = 0 V, f = 5.5 GHz Parameter Symbol Pass band frequency range FBW 2 Values Unit Min. Typ. Max. 5.0 – 6.0 GHz – 12.5 – dB Note / Test Condition Gain |S21| Gain flatness ΔG – 0.3 – dB Reverse isolation |S12| – 21 – dB NF – 1.3 – dB Input return loss RLin – 18 – dB 50 Ω Output return loss RLout – 20 – dB 50 Ω Input power at 1dB compression point P-1dB – -3.5 – dBm |S21| – -3 – dB DC - 1.7 GHz – 1 – dB 1.7 - 2.0 GHz – 6 – dB 2.3 - 2.7 GHz – 12 – dB 3.3 - 3.9 GHz – 4 – dB 9.0 - 10 GHz – 3 – dB 10 - 18 GHz – -4 – dBm 0.8 - 1.0 GHz – -12 – dBm 1.7 - 2.0 GHz – -9 – dBm 2.3 - 4.0 GHz – -8 – dBm 4.4 - 4.5 GHz – 0 – dBm 9.0 - 10 GHz Measured from ON signal turns on (90%) to the point were LNA output power stabilizes to within 0.5 dB of final value Noise figure 2) Maximum gain out of band Minimum input 1dB compression out of band P-1dB Turn-on time ton – 0.2 – μs Supply current at VCC ICC 5.0 7.0 9.0 mA Shutdown current Ioff – 6 μA Stability factor k – >1 – In any 50 MHz instantaneous bandwidth VPON = 0 V Unconditional stable for all frequencies 1) Measured on application board according to application schematic on page 12, including PCB losses (unless noted otherwise) 2) PCB losses subtracted Preliminary Data Sheet 10 Revision 1.0, 2010-02-22 BGA758L7 Electrical Characteristics 2.2 Digital Signals Table 5 Digital Control Parameter Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Power on control voltage range VPON -0.3 – VCC V – Control voltage for power on VPON,on 2 – VCC V – Control voltage for power off VPON,off -0.3 – 1.1 V – Capacitance at power on pin Cin – 1 – pF – Input current at power on pin IPON – 10 – μA VPON = 3.3 V Preliminary Data Sheet 11 Revision 1.0, 2010-02-22 BGA758L7 Application Information 3 Application Information Application Board Configuration N1 BGA758L7 PON PON,1 OUT,6 RFout RFin IN,2 VCC,5 VCC C1 L1 BIAS,3 GND,4 C2 GND,7 BGA758 L7_Application _Schematic.vsd Figure 2 Application Schematic Table 6 Bill of Materials Name Value Package Manufacturer Function C1 2.7 pF 0402 Various DC blocking C2 1 nF 0402 Various Supply voltage filtering L1 3.9 nH 0402 Murata LQW type Bias feed and input matching TSLP-7-8 Infineon 5-6 GHz LNA N1 A list of all application notes is available at http://goto.infineon.com/smallsignaldiscretes-appnotes. Preliminary Data Sheet 12 Revision 1.0, 2010-02-22 BGA758L7 Application Information %*$/B$SSOLFDWLRQB%RDUGYVG Figure 3 Drawing of Application Board Micro- Via 150 µm Via 500 µm TOP- Layer CU 35 µm Rogers 4003 200 µm Core GND 1 CU 35 µm FR4 800 µm GND 2 CU 35 µm BGA 758L7 _Cross_section.vsd Figure 4 Cross-section of Application Board Preliminary Data Sheet 13 Revision 1.0, 2010-02-22 BGA758L7 Package Information Package Information Bottom view 1.26 ±0.05 0.31 +0.01 -0.02 0.03 A 4 5 B 3 2 1 0.48 (0.05) 2) TSLP-7-8-PO V01 Package Outline TSLP-7-8 (side and bottom view) 0.4 Pin 1 marking 8 1.7 4 Figure 6 0.03 B 6 x 0.2 ±0.035 1) 1) Dimension applies to plated terminals 2) Dimension of 0.02 MIN. is guaranteed Figure 5 0.03 B 0.05 A 6 7 Pin 1 marking 0.05 B 0.2 MIN. (0.05) 2) 1.1 A 0.5 ±0.0351) 0.05 MAX. 1.16 ±0.035 1) 0.96 6 x 0.2 ±0.035 1) Top view 1.4 ±0.05 4 1.6 TSLP-7-8-TP V01 Marking Layout (top view) Preliminary Data Sheet 14 Revision 1.0, 2010-02-22 BGA758L7 Package Information SMD 1.21 0.51 0.25 0.25 0.25 0.23 0.45 0.25 0.23 0.25 Copper 0.2 0.25 0.2 1.35 0.2 0.45 0.25 0.2 1.35 0.25 0.25 1.21 0.51 0.25 0.23 Solder mask Vias 0.23 Stencil apertures TSLP-7-8-FP V01 Figure 7 Footprint TSLP-7-8 Preliminary Data Sheet 15 Revision 1.0, 2010-02-22 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG