INFINEON BGM781N11

Data Sheet, Rev.3.1, Oct. 2009
BGM781N11
GPS Front-End Module
Small Signal Discretes
Edition 2009-10-30
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2009.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
BGM781N11
Oct. 2009
Revision History: GPS Front-End Module, Rev.3.1
Previous Version: 2009-09-08, Rev.3.0
Page
8
4,7
Subjects (major changes since last revision)
Application changed from high-Q to low-Q externals, L1 and L2 values changed
typ. noise figure from 1.6dB to 1.7dB updated due to low-Q externals
6
Pin 6 and Pin 11 tied together for ESD capability HBM in Table 2
10
Updated package drawing in figure 5 from 0.20mm to 0.25mm minimum distance in package
6
Maximum RF input power updated in Table 2
Data Sheet
3
Rev.3.1, 2009-10-30
GPS Front-End Module
1
BGM781N11
GPS Front-End Module
Features
• Operating frequency: 1575.42 MHz
• High Gain: 18.6 dB
• Low Noise Figure: 1.7 dB
• Low current consumption: 3.3 mA
• Out-of-band rejection in cellular bands: 80 dBc
• Input compression point in cellular bands: 20 dBm
• Supply voltage: 1.5 V to 3.6 V
• Tiny TSNP-11-2 leadless package
• RF input internally pre-matched to 50 Ω
• RF output internally matched to 50 Ω
• HBM ESD capability of all pins: 2 kV
• IEC ESD contact discharge of RF input pin: 8 kV
• Only 2 external SMD parts
• RoHS compliant package (Pb-free)
7613YVG
TSNP-11-2 Package top view
(2.5 x 2.5 x 0.73 mm³)
Application
• 1575.42 MHz GPS, Galileo, GPS phones, personal navigaton
devices
%2
$,
321
%,$6
9&&
%,$6
3UH)LOWHU
3RVW)LOWHU
/1$
5),1
%*01
%*
*1'
%*
%*0B%ORFNGLDJUDPBZLWKBH[WHUQDOYVG
Figure 1
Data Sheet
Blockdiagram with main external components
4
Rev.3.1, 2009-10-30
BGM781N11
Description
2
Description
The BGM781N11 is a combination of a low-insertion-loss pre-filter with Infineon’s high performance low noise
amplifier (LNA) and a high-attenuation post-filter for Global Positioning System (GPS) applications. Through the
low insertion loss of the filters, the BGM781N11 provides 18.6 dB gain, 1.7 dB noise figure and high linearity
performance. In addition BGM781N11 provides very high out-of-band attenuation in conjunction with a high input
compression point. Its current consumption is as low as 3.3 mA. It operates over the 1.5 V to 3.6 V supply voltage
range.
Type
Package
Marking
BGM781N11
TSNP-11-2
M781
Pin Definition and Function
Table 1
Pin Definition and Function
Pin No.
Symbol
Function
1
BG2
Optional Output-Filter GND
2
PON
Power On/Off
3
VCC
Power Supply
4
n.c.
not used
5
RFIN
RF Input
6
BG1
Input-Filter GND
7
BO1
Input-Filter Output
8
AI
LNA Input
9
BIAS
BIAS
10
RFOUT
RF Output
11
GND
Package Middle Island
Maximum Ratings
Table 2
Parameter
Maximum Ratings
1)
Voltage at pin BG2 to GND
Voltage at pin PON to GND
Voltage at pin VCC to GND
Voltage at pin RFIN to GND
Voltage at pin BG1 to GND
Voltage at pin B01 to GND
Voltage at pin AI to GND
Voltage at pin BIAS to GND
Voltage at pin RFOUT to GND
Current into pin VCC
RF input power inband
Data Sheet
Symbol
Value
Unit
VBG2
VPON
VCC
VRFIN
VBG1
VBO1
VAI
VBIAS
VRFOUT
IVCC
PIN
-1...1
V
-0.3...3.6
V
-0.3...3.6
V
-3...3
V
-3...3
V
-3...3
V
-0.3...0.9
V
-0.3...0.9
V
-3...3
V
25
mA
3
dBm
5
Note / Test Condition
Continuous wave signal
f = 1575.42 MHz
50 ohm source and load
impedances
Rev.3.1, 2009-10-30
BGM781N11
Description
Table 2
Parameter
Maximum Ratings (cont’d)
1)
Symbol
Value
RF input power out of band
PIN,OOB
21
Total power dissipation
Ptot
TJ
TA
TSTG
VESD1
90
mW
150
°C
-40... 85
°C
VESD2
Junction temperature
Ambient temperature range
Storage temperature range
ESD capability HBM of all pins, with
pin 6 and GND middle island pin 11
tied together
ESD contact discharge capability of
RF input pin 5
Unit
Note / Test Condition
Continuous wave signal
f = 50 - 1460 MHz and
1710 - 4000 MHz
50 ohm source and load
impedances
-65... 85
°C
2
kV
according to JESD22A-114
8
kV
according to IEC61000-4-2
1) All voltages refer pin-to-pin, unless otherwise specified.
Data Sheet
6
Rev.3.1, 2009-10-30
BGM781N11
Electrical Characteristics
3
Electrical Characteristics
Table 3
Electrical Characteristics: TA = 25 °C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V1)
Parameter
Symbol
Supply Voltage
VCC
ICC
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
1.5
1.8
3.6
V
-
3.3
-
mA
ON-Mode
-
0.2
3
µA
OFF-Mode
1.0
-
Vcc
V
ON-Mode
0
-
0.4
V
OFF-Mode
-
5
-
µA
ON-Mode
-
-
1
µA
OFF-Mode
-
5
-
µs
OFF- to ON-Mode
-
5
-
µs
ON- to OFF-mode
|S21|2
17.1
18.6
-
dB
NF
RLin
RLout
1/|S12|2
IIP3
-
1.7
2.3
dB
-
12
-
dB
-
15
-
dB
-
40
-
dB
-
-7
-
dBm
Inband Input 1 dB
Compression Point
IP1dB
-
-15
-
dBm
Out-of-band Input 1 dB
Compression Point
IP1dB_900M
-
20
-
f1 = 900 MHz
Out-of-band Input 1 dB
Compression Point
IP1dB_1710M
-
20
-
f1 = 1710 MHz
Rej900M
Rej1800M
Rej2400M
k
-
90
-
dBc
-
80
-
dBc
-
72
-
dBc
-
>1
-
Supply Current
Power On Control Voltage
Power On Control Current
Power Gain Settling Time
2)
Vpon
Ipon
tS
Passband Parameters @
f = 1575.42 MHz
Insertion Power Gain
3)
Noise Figure
Input Return Loss
Output Return Loss
Reverse Isolation
Inband Input 3rd Order
Intercept Point
ZS = 50 Ω
f1 = 1575.42 MHz
f2 = f1 + 1 MHz
f1 = 1575.42 MHz
Stopband Parameters
Rejection4)
4)
Rejection
4)
Rejection
Stability
f = 806 MHz - 928 MHz
f = 1710 MHz - 1980 MHz
f = 2400 MHz - 2500 MHz
f = 20 MHz - 20 GHz
1) Specification based on performance as measured on BGM781N11application board shown in Figure 3 and including PCB
losses (unless noted otherwise)
2) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode
3) PCB and connector losses subtracted, verified on AQL base
4) Rejection=|(1/|S21|2 at stopband frequency)|+|(1/|S21|2 at 1575.42 MHz)|
Data Sheet
7
Rev.3.1, 2009-10-30
BGM781N11
Application Information
4
Application Information
4.1
Application Circuit
%*
%*01
7RSYLHZ
5)287
%,$6
321
/
$,
9&&
&
/
%2
QF
%*
5),1
*1'
%*0B$SSOLFDWLRQBFLUFXLWBZLWKBH[WHUQDOYVG
Figure 2
Application circuit with external components
Table 4
Bill of Materials
Name
Value
Package
Manufacturer
Function
C1
1 µF
0402
Various
Supply voltage filtering (optional)
L1
3.6 nH
0402
muRata LQG15HS
Input matching
L2
33 nH
0402
muRata LQG15HS
Bias
N1
BGM781N11
TSNP-11-2
Infineon
GPS FE Module
Data Sheet
8
Rev.3.1, 2009-10-30
BGM781N11
Application Information
4.2
Application Board
%*0B$SS%RDUGB/D\RXWBWRSYVG
Figure 3
Top view of application board
&RSSHU—PJROGSODWHG
5RJHUV52&PP
&RSSHU—P
)5PP
&RSSHU—P
%*0B$SS%RDUGB&URVVB6HFWLRQYVG
Figure 4
Data Sheet
Cross section view of application board
9
Rev.3.1, 2009-10-30
BGM781N11
Package Information
5
Package Information
Figure 5
Side and bottom views of TSNP-11-2 package
3LQPDUNLQJ
/DVHUPDUNLQJ
%*01
7\SHFRGH
0
&:
'DWHFRGH<<::
7613B0DUNLQJB/D\RXWB%*0YVG
Figure 6
Data Sheet
Marking layout
10
Rev.3.1, 2009-10-30
BGM781N11
Package Information
Figure 7
Recommended TSNP-11-2 footprint for optimum RF performance
Figure 8
Alternative TSNP-11-2 footprint for low cost PCB designs
Data Sheet
11
Rev.3.1, 2009-10-30
BGM781N11
Packing Information
6
Packing Information
Figure 9
TSNP-11-2 carrier tape
Figure 10
TSNP-11-2 pin 1 orientation in tape
Data Sheet
12
Rev.3.1, 2009-10-30