Data Sheet, Rev.3.1, Oct. 2009 BGM781N11 GPS Front-End Module Small Signal Discretes Edition 2009-10-30 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGM781N11 Oct. 2009 Revision History: GPS Front-End Module, Rev.3.1 Previous Version: 2009-09-08, Rev.3.0 Page 8 4,7 Subjects (major changes since last revision) Application changed from high-Q to low-Q externals, L1 and L2 values changed typ. noise figure from 1.6dB to 1.7dB updated due to low-Q externals 6 Pin 6 and Pin 11 tied together for ESD capability HBM in Table 2 10 Updated package drawing in figure 5 from 0.20mm to 0.25mm minimum distance in package 6 Maximum RF input power updated in Table 2 Data Sheet 3 Rev.3.1, 2009-10-30 GPS Front-End Module 1 BGM781N11 GPS Front-End Module Features • Operating frequency: 1575.42 MHz • High Gain: 18.6 dB • Low Noise Figure: 1.7 dB • Low current consumption: 3.3 mA • Out-of-band rejection in cellular bands: 80 dBc • Input compression point in cellular bands: 20 dBm • Supply voltage: 1.5 V to 3.6 V • Tiny TSNP-11-2 leadless package • RF input internally pre-matched to 50 Ω • RF output internally matched to 50 Ω • HBM ESD capability of all pins: 2 kV • IEC ESD contact discharge of RF input pin: 8 kV • Only 2 external SMD parts • RoHS compliant package (Pb-free) 7613YVG TSNP-11-2 Package top view (2.5 x 2.5 x 0.73 mm³) Application • 1575.42 MHz GPS, Galileo, GPS phones, personal navigaton devices %2 $, 321 %,$6 9&& %,$6 3UH)LOWHU 3RVW)LOWHU /1$ 5),1 %*01 %* *1' %* %*0B%ORFNGLDJUDPBZLWKBH[WHUQDOYVG Figure 1 Data Sheet Blockdiagram with main external components 4 Rev.3.1, 2009-10-30 BGM781N11 Description 2 Description The BGM781N11 is a combination of a low-insertion-loss pre-filter with Infineon’s high performance low noise amplifier (LNA) and a high-attenuation post-filter for Global Positioning System (GPS) applications. Through the low insertion loss of the filters, the BGM781N11 provides 18.6 dB gain, 1.7 dB noise figure and high linearity performance. In addition BGM781N11 provides very high out-of-band attenuation in conjunction with a high input compression point. Its current consumption is as low as 3.3 mA. It operates over the 1.5 V to 3.6 V supply voltage range. Type Package Marking BGM781N11 TSNP-11-2 M781 Pin Definition and Function Table 1 Pin Definition and Function Pin No. Symbol Function 1 BG2 Optional Output-Filter GND 2 PON Power On/Off 3 VCC Power Supply 4 n.c. not used 5 RFIN RF Input 6 BG1 Input-Filter GND 7 BO1 Input-Filter Output 8 AI LNA Input 9 BIAS BIAS 10 RFOUT RF Output 11 GND Package Middle Island Maximum Ratings Table 2 Parameter Maximum Ratings 1) Voltage at pin BG2 to GND Voltage at pin PON to GND Voltage at pin VCC to GND Voltage at pin RFIN to GND Voltage at pin BG1 to GND Voltage at pin B01 to GND Voltage at pin AI to GND Voltage at pin BIAS to GND Voltage at pin RFOUT to GND Current into pin VCC RF input power inband Data Sheet Symbol Value Unit VBG2 VPON VCC VRFIN VBG1 VBO1 VAI VBIAS VRFOUT IVCC PIN -1...1 V -0.3...3.6 V -0.3...3.6 V -3...3 V -3...3 V -3...3 V -0.3...0.9 V -0.3...0.9 V -3...3 V 25 mA 3 dBm 5 Note / Test Condition Continuous wave signal f = 1575.42 MHz 50 ohm source and load impedances Rev.3.1, 2009-10-30 BGM781N11 Description Table 2 Parameter Maximum Ratings (cont’d) 1) Symbol Value RF input power out of band PIN,OOB 21 Total power dissipation Ptot TJ TA TSTG VESD1 90 mW 150 °C -40... 85 °C VESD2 Junction temperature Ambient temperature range Storage temperature range ESD capability HBM of all pins, with pin 6 and GND middle island pin 11 tied together ESD contact discharge capability of RF input pin 5 Unit Note / Test Condition Continuous wave signal f = 50 - 1460 MHz and 1710 - 4000 MHz 50 ohm source and load impedances -65... 85 °C 2 kV according to JESD22A-114 8 kV according to IEC61000-4-2 1) All voltages refer pin-to-pin, unless otherwise specified. Data Sheet 6 Rev.3.1, 2009-10-30 BGM781N11 Electrical Characteristics 3 Electrical Characteristics Table 3 Electrical Characteristics: TA = 25 °C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V1) Parameter Symbol Supply Voltage VCC ICC Values Unit Note / Test Condition Min. Typ. Max. 1.5 1.8 3.6 V - 3.3 - mA ON-Mode - 0.2 3 µA OFF-Mode 1.0 - Vcc V ON-Mode 0 - 0.4 V OFF-Mode - 5 - µA ON-Mode - - 1 µA OFF-Mode - 5 - µs OFF- to ON-Mode - 5 - µs ON- to OFF-mode |S21|2 17.1 18.6 - dB NF RLin RLout 1/|S12|2 IIP3 - 1.7 2.3 dB - 12 - dB - 15 - dB - 40 - dB - -7 - dBm Inband Input 1 dB Compression Point IP1dB - -15 - dBm Out-of-band Input 1 dB Compression Point IP1dB_900M - 20 - f1 = 900 MHz Out-of-band Input 1 dB Compression Point IP1dB_1710M - 20 - f1 = 1710 MHz Rej900M Rej1800M Rej2400M k - 90 - dBc - 80 - dBc - 72 - dBc - >1 - Supply Current Power On Control Voltage Power On Control Current Power Gain Settling Time 2) Vpon Ipon tS Passband Parameters @ f = 1575.42 MHz Insertion Power Gain 3) Noise Figure Input Return Loss Output Return Loss Reverse Isolation Inband Input 3rd Order Intercept Point ZS = 50 Ω f1 = 1575.42 MHz f2 = f1 + 1 MHz f1 = 1575.42 MHz Stopband Parameters Rejection4) 4) Rejection 4) Rejection Stability f = 806 MHz - 928 MHz f = 1710 MHz - 1980 MHz f = 2400 MHz - 2500 MHz f = 20 MHz - 20 GHz 1) Specification based on performance as measured on BGM781N11application board shown in Figure 3 and including PCB losses (unless noted otherwise) 2) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode 3) PCB and connector losses subtracted, verified on AQL base 4) Rejection=|(1/|S21|2 at stopband frequency)|+|(1/|S21|2 at 1575.42 MHz)| Data Sheet 7 Rev.3.1, 2009-10-30 BGM781N11 Application Information 4 Application Information 4.1 Application Circuit %* %*01 7RSYLHZ 5)287 %,$6 321 / $, 9&& & / %2 QF %* 5),1 *1' %*0B$SSOLFDWLRQBFLUFXLWBZLWKBH[WHUQDOYVG Figure 2 Application circuit with external components Table 4 Bill of Materials Name Value Package Manufacturer Function C1 1 µF 0402 Various Supply voltage filtering (optional) L1 3.6 nH 0402 muRata LQG15HS Input matching L2 33 nH 0402 muRata LQG15HS Bias N1 BGM781N11 TSNP-11-2 Infineon GPS FE Module Data Sheet 8 Rev.3.1, 2009-10-30 BGM781N11 Application Information 4.2 Application Board %*0B$SS%RDUGB/D\RXWBWRSYVG Figure 3 Top view of application board &RSSHUPJROGSODWHG 5RJHUV52&PP &RSSHUP )5PP &RSSHUP %*0B$SS%RDUGB&URVVB6HFWLRQYVG Figure 4 Data Sheet Cross section view of application board 9 Rev.3.1, 2009-10-30 BGM781N11 Package Information 5 Package Information Figure 5 Side and bottom views of TSNP-11-2 package 3LQPDUNLQJ /DVHUPDUNLQJ %*01 7\SHFRGH 0 &: 'DWHFRGH<<:: 7613B0DUNLQJB/D\RXWB%*0YVG Figure 6 Data Sheet Marking layout 10 Rev.3.1, 2009-10-30 BGM781N11 Package Information Figure 7 Recommended TSNP-11-2 footprint for optimum RF performance Figure 8 Alternative TSNP-11-2 footprint for low cost PCB designs Data Sheet 11 Rev.3.1, 2009-10-30 BGM781N11 Packing Information 6 Packing Information Figure 9 TSNP-11-2 carrier tape Figure 10 TSNP-11-2 pin 1 orientation in tape Data Sheet 12 Rev.3.1, 2009-10-30