PHILIPS TDA9810T

INTEGRATED CIRCUITS
DATA SHEET
TDA9810
Multistandard VIF-PLL with QSS-IF
and AM demodulator
Product specification
Supersedes data of 1997 Jun 19
File under Integrated Circuits, IC02
1999 May 07
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
FEATURES
• Tuner AGC with adjustable TakeOver Point (TOP)
• 5 V supply voltage
• AFC detector without extra reference circuit
• Gain controlled wide band Video Intermediate
Frequency (VIF)-amplifier (AC-coupled)
• SIF-input for single reference Quasi Split Sound (QSS)
mode (Phase Locked Loop (PLL) controlled); Sound
Intermediate Frequency (SIF) AGC detector for gain
controlled SIF amplifier; single reference QSS mixer
able to operate in high performance single reference
QSS mode
• True synchronous demodulation with active carrier
regeneration (very linear demodulation, good
intermodulation figures, reduced harmonics, excellent
pulse response)
• AM demodulator without extra reference circuit
• Gated phase detector for L/L accent standard;
robustness for over-modulation until 105%
• AM mute (especially for NICAM)
• Voltage Controlled Oscillator (VCO) frequency
switchable between L and L accent (alignment external)
picture carrier frequency
• Stabilizer circuit for ripple rejection and to achieve
constant output signals.
• Separate video amplifier for sound trap buffering with
high video bandwidth
GENERAL DESCRIPTION
The TDA9810 is an integrated circuit for multistandard
vision IF signal processing and sound AM demodulation,
with single reference QSS-IF in TV and VCR sets.
• VIF Automatic Gain Control (AGC) detector for gain
control, operating as peak sync detector for B/G
(optional external AGC) and peak white detector for L;
signal controlled reaction time for L
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA9810
TDA9810T
1999 May 07
SDIP24
SO24
DESCRIPTION
VERSION
plastic shrink dual in-line package; 24 leads (400 mil)
SOT234-1
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
2
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VP
supply voltage
4.5
5
5.5
V
IP
supply current
77
90
103
mA
Vi(VIF)(rms)
vision IF input signal voltage sensitivity
(RMS value)
−
60
100
µV
Vo(CVBS)(p-p)
CVBS output signal voltage
(peak-to-peak value)
1.7
2.0
2.3
V
B−3
−3 dB video bandwidth on pin CVBS
7
8
−
MHz
S/NW(video)
weighted signal-to-noise ratio for video
56
60
−
dB
αIM(1.1)
intermodulation attenuation at ‘blue’
f = 1.1 MHz
58
64
−
dB
αIM(3.3)
intermodulation attenuation at ‘blue’
f = 3.3 MHz
58
64
−
dB
αH(sup)
suppression of video signal harmonics
35
40
−
dB
Vi(SIF)(rms)
sound IF input signal voltage sensitivity
(RMS value)
−3 dB at intercarrier output −
30
70
µV
Vo(intercarrier)(rms)
IF intercarrier level (RMS value)
SC1 output signal
100
140
180
mV
SCAM output signal
100
140
180
mV
−1 dB video at output
B/G and L standard;
CL < 20 pF; RL > 1 kΩ;
AC load
SCNICAM output signal
14
20
26
mV
Vo(AF)(rms)
AF output signal voltage (RMS value)
L standard;
54% modulation
−
500
−
mV
THD
total harmonic distortion
54% modulation
−
0.5
1.0
%
S/NW
weighted signal-to-noise ratio
54% modulation
47
53
−
dB
1999 May 07
3
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14
CBL
21
loop
filter
RTOP
15
3
16
TUNER AND VIF-AGC
AFC
4
18
19
17
AFC DETECTOR
VCO TWD
9
video
1 V (p-p)
12
CVBS
2 V (p-p)
2
VIF
SAW
1
VIF AMPLIFIER
VIDEO DEMODULATOR
AND AMPLIFIER
FPLL
4
VIDEO
BUFFER
23
SIF
SAW
SIF
AMPLIFIER
24
SINGLE REFERENCE
MIXER AND
AM DEMODULATOR
22
20
GND
6
AF/AM
SIF-AGC
8
5
CSAGC
VP = +5 V
Vi(vid)
TDA9810
AF AMPLIFIER
AMPLIFIER SWITCH
INTERNAL VOLTAGE
STABILIZER
13
Philips Semiconductors
CVAGC
Multistandard VIF-PLL with QSS-IF and
AM demodulator
BLOCK DIAGRAM
handbook, full pagewidth
1999 May 07
L/L accent
gating switch
2 x fpc
tuner
AGC
TOP
7
L/L accent
switch
QSS
intercarrier
output
MHA713
AM mute
switch
TDA9810
Fig.1 Block diagram.
11
Product specification
standards
selection
switch
10
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
PINNING
SYMBOL
PIN
DESCRIPTION
SYMBOL
PIN
DESCRIPTION
Vi VIF1
1
VIF differential input signal voltage 1
Vi(vid)
13
video buffer input voltage
Vi VIF2
2
VIF differential input signal voltage 2
LGATSWI
14
L/L accent gating switch
TADJ
3
tuner AGC takeover point adjust
CBL
15
black level detector
TPLL
4
PLL loop filter
TAGC
16
tuner AGC output
CSAGC
5
SIF AGC capacitor
AFC
17
AFC output
Vo AF
6
AM audio frequency output voltage
VCO1
18
VCO1 reference circuit for 2fpc
LSWI
7
L/L accent switch
VCO2
19
VCO2 reference circuit for 2fpc
STD
8
standard switch
GND
20
ground
Vo(vid)
9
composite video output voltage
CVAGC
21
VIF AGC capacitor
Vo QSS
10
single reference QSS output voltage
VP
22
supply voltage
MUTE
11
AM mute switch
Vi SIF1
23
SIF differential input signal voltage 1
Vo CVBS
12
CVBS output signal voltage
Vi SIF2
24
SIF differential input signal voltage 2
handbook, halfpage
handbook, halfpage
Vi VIF1 1
24 Vi SIF2
Vi VIF1 1
24 Vi SIF2
Vi VIF2 2
23 Vi SIF1
Vi VIF2 2
23 Vi SIF1
TADJ 3
22 VP
TADJ 3
22 VP
TPLL 4
21 CVAGC
TPLL 4
21 CVAGC
CSAGC 5
Vo AF 6
CSAGC 5
20 GND
Vo AF 6
19 VCO2
TDA9810
LSWI 7
17 AFC
Vo(vid) 9
15 CBL
14 LGATSWI
MUTE 11
Vo CVBS 12
13 Vi(vid)
13 Vi(vid)
MHA722
MHA712
Fig.3 Pin configuration SO24 package.
Fig.2 Pin configuration SDIP24 package.
1999 May 07
16 TAGC
Vo QSS 10
14 LGATSWI
Vo CVBS 12
17 AFC
Vo(vid) 9
15 CBL
MUTE 11
18 VCO1
STD 8
16 TAGC
Vo QSS 10
19 VCO2
TDA9810T
LSWI 7
18 VCO1
STD 8
20 GND
5
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
The VCO is controlled by two integrated variable
capacitors. The control voltage required to tune the VCO
from its free-running frequency to actually double the PC
frequency is generated by the Frequency-Phase detector
and fed via the loop filter to the first variable capacitor
(FPLL). This control voltage is amplified and additionally
converted into a current which represents the AFC output
signal. The VCO centre frequency can be decreased
(required for L accent standard) by activating an additional
internal capacitor. This is achieved by using the L/L accent
gating switch. In this event the second variable capacitor
can be controlled by a variable resistor at the L/L accent
gating switch for setting the VCO centre frequency to the
required L accent value. At centre frequency the AFC
output current is equal to zero.
FUNCTIONAL DESCRIPTION
Vision IF amplifier
The vision IF amplifier consists of three AC-coupled
differential amplifier stages. Each differential stage
comprises a feedback network controlled by emitter
degeneration.
Tuner and VIF AGC
The AGC capacitor voltage is transferred to an internal IF
control signal, and is fed to the tuner AGC to generate the
tuner AGC output current (pin TAGC, open-collector
output). The tuner AGC takeover point can be adjusted.
This allows the tuner and the SWIF filter to be matched to
achieve the optimum IF input level.
The oscillator signal is divided-by-two with a TWD which
generates two differential output signals with a 90 degree
phase difference independent of the frequency.
The AGC detector charges/discharges the AGC capacitor
to the required voltage for setting of VIF and tuner gain in
order to keep the video signal at a constant level.
Therefore for negative video modulation the sync level and
for positive video modulation the peak white level of the
video signal is detected. In order to reduce the reaction
time for positive modulation, where a very large time
constant is needed, an additional level detector increases
the discharging current of the AGC capacitor (fast mode)
in the event of a decreasing VIF amplitude step.
The additional level information is given by the black-level
detector voltage.
Video demodulator and amplifier
The video demodulator is realized by a multiplier which is
designed for low distortion and large bandwidth. The vision
IF input signal is multiplied with the ‘in phase’ signal of the
travelling wave divider output. In the demodulator stage
the video signal polarity can be switched in accordance
with the TV standard.
The demodulator output signal is fed via an integrated
low-pass filter for attenuation of the carrier harmonics to
the video amplifier. The video amplifier is realized by an
operational amplifier with internal feedback and high
bandwidth. A low-pass filter is integrated to achieve an
attenuation of the carrier harmonics for B/G and
L standard. The standard dependent level shift in this
stage delivers the same sync level for positive and
negative modulation. The video output signal is 1 V (p-p)
for nominal vision IF modulation.
Frequency Phase Locked Loop detector (FPLL)
The VIF-amplifier output signal is fed into a frequency
detector and into a phase detector via a limiting amplifier.
During acquisition the frequency detector produces a DC
current proportional to the frequency difference between
the input and the VCO signal. After frequency lock-in the
phase detector produces a DC current proportional to the
phase difference between the VCO and the input signal.
The DC current of either frequency detector or phase
detector is converted into a DC voltage via the loop filter,
which controls the VCO frequency. In the event of positive
modulated signals the phase detector is gated by
composite sync in order to avoid signal distortion for
overmodulated VIF signals. This mode can be switched off
by the L/L accent gating switch.
Video buffer
For an easy adaption of the sound traps an operational
amplifier with internal feedback is used in the event of B/G
and L standard. This amplifier is featured with a high
bandwidth and 7 dB gain. The input impedance is adapted
for operating in combination with ceramic sound traps.
The output stage delivers a nominal 2 V (p-p) positive
video signal. Noise clipping is provided.
VCO, Travelling Wave Divider (TWD) and AFC
The VCO operates with a resonance circuit (with L and C
in parallel) at double the Picture Carrier (PC) frequency.
1999 May 07
TDA9810
6
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
SIF amplifier and AGC
AM demodulator
The sound IF amplifier consists of two AC-coupled
differential amplifier stages. Each differential stage
comprises a controlled feedback network provided by
emitter degeneration.
The AM demodulator is realized by a multiplier.
The modulated SIF amplifier output signal is multiplied in
phase with the limited (AM is removed) SIF amplifier
output signal. The demodulator output signal is fed via an
integrated low-pass filter for attenuation of the carrier
harmonics to the AF amplifier. This AM output signal can
be muted by using the AM mute switch.
The SIF AGC detector is related to the SIF input signals
(average level of AM or FM carriers) and controls the SIF
amplifier to provide a constant SIF signal to the AM
demodulator and single reference QSS mixer. The SIF
AGC reaction time is set to ‘slow’ for nominal video
conditions. But with a decreasing VIF amplitude step the
SIF AGC is set to ‘fast’ mode controlled by the VIF AGC
detector. In FM mode this reaction time is also set to ‘fast’
controlled by the standard switch.
Internal voltage stabilizer and 1⁄2VP-reference
The bandgap circuit internally generates a voltage of
approximately 1.25 V, independent of supply voltage and
temperature. A voltage regulator circuit, connected to this
voltage, produces a constant voltage of 3.6 V which is
used as an internal reference voltage.
Single reference QSS mixer
For all audio output signals the constant reference voltage
cannot be used because large output signals are required.
Therefore these signals refer to half the supply voltage to
achieve a symmetrical headroom, especially for the
rail-to-rail output stage. For ripple and noise attenuation
the 1⁄2VP voltage has to be filtered via a low-pass filter by
using an external capacitor together with an integrated
resistor (f−3dB = 5 Hz). For a fast setting to 1⁄2VP an internal
start-up circuit is available.
The single reference QSS mixer is realized by a multiplier.
The SIF amplifier output signal is fed to the single
reference QSS mixer and converted to intercarrier
frequency by the regenerated picture carrier (VCO).
The mixer output signal is fed via a high-pass for
attenuation of the video signal components to the output
pin 10. With this system a high performance hi-fi stereo
sound processing can be achieved.
1999 May 07
7
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
VP
supply voltage (pin 22)
VI
CONDITIONS
MIN.
maximum chip temperature
of 125 °C; note 1
MAX.
UNIT
0
5.5
V
input voltage at pins 1 to 8, 11, 13 to 17
and 20 to 24
0
VP
V
tsc(max)
maximum short-circuit time
−
10
s
VTAGC
tuner AGC output voltage
0
13.2
V
Tstg
storage temperature
−25
+150
°C
Tamb
operating ambient temperature
−20
+70
°C
Ves
electrostatic handling voltage
−300
+300
V
note 2
Notes
1. IP = 103 mA; Tamb = 70 °C; Rth j-a = 69 K/W for SDIP24 and Rth j-a = 90 K/W for SO24.
2. Machine Model class B: L = 2.5 µH.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
CONDITIONS
VALUE
UNIT
SOT234-1
69
K/W
SOT137-1
90
K/W
thermal resistance from junction to ambient
1999 May 07
in free air
8
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
CHARACTERISTICS
VP = 5 V; Tamb = 25 °C; see Table 1 for input frequencies and level; input level Vi(IF)(rms) = 10 mV (sync-level for B/G,
peak white level for L); IF input from 50 Ω via broadband transformer 1 : 1; video modulation DSB; residual carrier
B/G: 10%; L = 3%; video signal in accordance with “CCIR, line 17”; measurements taken in Fig.14; unless otherwise
specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin 22)
VP
supply voltage
IP
supply current
note 1
4.5
5
5.5
V
77
90
103
mA
Vision IF amplifier (pins 1 and 2)
Vi(VIF)(rms)
input signal voltage
sensitivity (RMS value)
B/G standard; −1 dB video
at output
−
60
100
µV
Vi(max)(rms)
maximum input signal
voltage (RMS value)
B/G standard; +1 dB video
at output
120
200
−
mV
∆Vo(int)
internal IF amplitude
difference between picture
and sound carrier
within AGC range;
B/G standard;
∆f = 5.5 MHz
−
0.7
1
dB
GIFcr
IF gain control range
see Fig.4
65
70
−
dB
Ri(diff)
differential input resistance
note 2
1.7
2.2
2.7
kΩ
Ci(diff)
differential input capacitance note 2
1.2
1.7
2.5
pF
VI(1,2)
DC input voltage
note 2
−
3.4
−
V
MHz
True synchronous video demodulator; note 3
fVCO(max)
maximum oscillator
frequency for carrier
regeneration
f = 2fpc
125
130
−
∆fosc/∆T
oscillator drift as a function
of temperature
oscillator is free-running;
IAFC = 0; note 4
−
−
±20 × 10−6 K−1
VVCO(rms)
oscillator voltage swing at
pins 18 and 19 (RMS value)
70
100
130
mV
fcr(pc)
picture carrier capture
frequency range
B/G and L standard
±1.5
±2.0
−
MHz
L accent standard;
fpc = 33.9 MHz;
R7 = 5.6 kΩ
±1.0
±1.3
−
MHz
∆fpc(fr)
picture carrier frequency
(free-running) accuracy
L accent standard;
fpc = 33.9 MHz;
R7 = 5.6 kΩ
−
±200
±400
kHz
falg(L accent)
L accent alignment
frequency range
IAFC = 0
±400
±600
−
kHz
tacq
acquisition time
BL = 70 kHz; note 5
−
−
30
ms
Vi(VIF)(rms)
VIF input signal voltage
sensitivity for PLL to be
locked (RMS value;
pins 1 and 2)
maximum IF gain; note 6
−
30
70
µV
Ioffset(FPLL)
FPLL offset current at pin 4
note 7
−
−
±4.5
µA
1999 May 07
9
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
SYMBOL
PARAMETER
TDA9810
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Composite video amplifier (pin 9; sound carrier off)
Vo(video)(p-p)
output signal voltage
(peak-to-peak value)
V/S
ratio between video
(black-to-white) and
sync level
Vsync(9)
sync voltage level
Vclu(9)
upper video clipping voltage
level
Vcll(9)
lower video clipping voltage
level
Ro(9)
output resistance
Ibias(9)(int)
see Fig.9
0.88
1.0
1.12
V
1.9
2.33
3.0
−
−
1.5
−
V
VP − 1.1 VP − 1
−
V
−
0.3
0.4
V
−
−
10
Ω
internal DC bias current for
emitter-follower
2.2
3.0
−
mA
Isink(9)(max)
maximum AC and DC output
sink current
1.6
−
−
mA
Isource(9)(max)
maximum AC and DC output
source current
2.9
−
−
mA
B−1
−1 dB video bandwidth
B/G and L standard;
CL < 50 pF; RL > 1 kΩ;
AC load
5
6
−
MHz
B−3
−3 dB video bandwidth
B/G and L standard;
CL < 50 pF; RL > 1 kΩ;
AC load
7
8
−
MHz
αH(sup)
suppression of video signal
harmonics
CL < 50 pF; RL > 1 kΩ;
AC load; note 8a
35
40
−
dB
PSRR
power supply ripple rejection video signal; grey level;
at pin 9
see Fig.12
B/G standard
32
35
−
dB
L standard
26
30
−
dB
2.6
3.3
4.0
kΩ
B/G and L standard
note 2
CVBS buffer amplifier (only) and noise clipper (pins 12 and 13)
Ri(13)
input resistance
note 2
note 2
Ci(13)
input capacitance
VI(13)
DC input voltage
Gv
voltage gain
Vclu(12)
upper video clipping voltage
level
Vcll(12)
lower video clipping voltage
level
Ro(12)
output resistance
Ibias(12)(int)
Isink(12)(max)
1999 May 07
1.4
2
3.0
pF
1.4
1.7
2.0
V
7
7.5
dB
3.9
4.0
−
V
−
1.0
1.1
V
−
−
10
Ω
DC internal bias current for
emitter-follower
2.0
2.5
−
mA
maximum AC and DC output
sink current
1.4
−
−
mA
B/G and L standard; note 9 6.5
note 2
10
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
SYMBOL
PARAMETER
Isource(12)(max)
maximum AC and DC output
source current
B−1
−1 dB video bandwidth
B−3
−3 dB video bandwidth
TDA9810
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2.4
−
−
mA
B/G and L standard;
CL < 20 pF; RL > 1 kΩ;
AC load
8.4
11
−
MHz
B/G and L standard;
CL < 20 pF; RL > 1 kΩ;
AC load
11
14
−
MHz
Measurements from IF input to CVBS output (pin 12; 330 Ω between pins 9 and 13, sound carrier off)
Vo(CVBS)(p-p)
CVBS output signal voltage
on pin 12
(peak-to-peak value)
note 9
1.7
2.0
2.3
V
∆Vo(CVBS)
output signal voltage
difference
difference between B/G
and L standard
−
−
10
%
Vo(CVBS)(sync)
sync voltage level
B/G standard
−
1.35
−
V
L standard
−
1.35
−
V
−
−
0.5
dB
∆Vo(CVBS)
deviation of CVBS output
signal voltage at B/G
50 dB gain control
30 dB gain control
−
−
0.1
dB
∆Vo(bl)(BG)
black level tilt in
B/G standard
gain variation; note 10
−
−
1
%
∆Vo(bl)(L)
black level tilt for worst case
in L standard
vision carrier modulated
by test line (VITS) only;
gain variation; note 10
−
−
1.9
%
Gdiff
differential gain
“CCIR, line 330”
−
2
5
%
ϕdiff
differential phase
“CCIR, line 330”
−
1
2
deg
B−1
−1 dB video bandwidth
CL < 20 pF; RL > 1 kΩ;
AC load;
B/G and L standard
5
6
−
MHz
B−3
−3 dB video bandwidth
CL < 20 pF; RL > 1 kΩ;
AC load;
B/G and L standard
7
8
−
MHz
S/NW(video)
weighted signal-to-noise
ratio for video
see Fig.6 and note 11
56
60
−
dB
S/N
unweighted signal-to-noise
ratio
see Fig.6 and note 11
49
53
−
dB
αIM(1.1)
intermodulation attenuation
at ‘blue’
f = 1.1 MHz; see Fig.7 and
note 12
58
64
−
dB
intermodulation attenuation
at ‘yellow’
f = 1.1 MHz; see Fig.7 and
note 12
60
66
−
dB
intermodulation attenuation
at ‘blue’
f = 3.3 MHz; see Fig.7 and
note 12
58
64
−
dB
intermodulation attenuation
at ‘yellow’
f = 3.3 MHz; see Fig.7 and
note 12
59
65
−
dB
αIM(3.3)
1999 May 07
11
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
SYMBOL
PARAMETER
TDA9810
CONDITIONS
MIN.
TYP.
MAX.
UNIT
αc(rms)
residual vision carrier
(RMS value)
fundamental wave and
harmonics;
B/G and L standard
−
2
5
mV
∆funwanted(p-p)
robustness for unwanted
frequency deviation of
picture carrier
(peak-to-peak value)
L standard;
residual carrier: 3%;
serration pulses: 50%;
note 2
−
−
12
kHz
∆ϕ
robustness for modulator
imbalance
L standard;
residual carrier: 0%;
serration pulses: 50%;
note 2
−
−
3
%
αH(sup)
suppression of video signal
harmonics
note 8a
35
40
−
dB
αH(spur)
spurious elements
note 8b
40
−
−
dB
PSRR
power supply ripple rejection video signal; grey level;
at pin 12
see Fig.12
B/G standard
25
28
−
dB
L standard
20
23
−
dB
VIF-AGC detector (pin 21)
Ich(21)
charging current
B/G and L standard;
note 10
0.75
1
1.25
mA
additional charging current
L standard in event of
missing VITS pulses and
no white video content
1.9
2.5
3.1
µA
discharging current
B/G standard
15
20
25
µA
normal mode L standard
225
300
375
nA
fast mode L standard
30
40
50
µA
−
0.05
0.1
ms/dB
tresp(AGC)(r)
AGC response to a rising
VIF step
B/G and L standard;
note 13
tresp(AGC)(f)
AGC response to a falling
VIF step
B/G standard
−
2.2
3.5
ms/dB
fast mode L standard
−
1.1
1.8
ms/dB
normal mode L standard;
note 13
−
150
240
ms/dB
−2
−6
−10
dB
L standard
−
1.95
−
V
L standard; fast mode L
−
1.65
−
V
∆IF
VIF amplitude step for
activating fast AGC mode
L standard
Vth(15)
threshold voltage level
additional charging current
see Fig.9
1999 May 07
12
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
SYMBOL
PARAMETER
TDA9810
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Tuner AGC (pin 16)
IF input signal voltage for
minimum starting point of
tuner takeover (RMS value)
input at pins 1 and 2;
−
RTOP = 22 kΩ; I16 = 0.4 mA
IF input signal voltage for
maximum starting point of
tuner takeover (RMS value)
input at pins 1 and 2;
RTOP = 0 Ω; I16 = 0.4 mA
Vo(16)(max)
maximum output voltage
Vsat(16)
saturation voltage
2
5
mV
50
100
−
mV
from external source;
note 2
−
−
13.2
V
I16 = 1.5 mA
−
−
0.2
V
∆VTOP(16)/∆T
variation of takeover point by I16 = 0.4 mA
temperature
−
0.03
0.07
dB/K
Isink(16)
sink current
no tuner gain reduction;
V16 = 13.2 V
−
−
1
µA
maximum tuner gain
reduction
1.5
2
2.6
mA
tuner gain current from
20 to 80%
−
6
8
dB
note 15
0.5
0.75
1.0
Vi(rms)
∆GIF
IF slip by automatic gain
control
see Fig.4
AFC circuit (pin 17); see Fig.8 and note 14
S
control steepness ∆I17/∆f
µA/kHz
10−6
K−1
∆fIF/∆T
frequency variation by
temperature
Vo(17)(max)
output voltage upper limit
VP − 0.6 VP − 0.3 −
V
Vo(17)(min)
output voltage lower limit
−
0.3
0.6
V
Io(source)(17)
output source current
150
200
250
µA
Io(sink)(17)
output sink current
150
200
250
µA
∆I17(p-p)
residual video modulation
B/G and L standard
current (peak-to-peak value)
−
20
30
µA
1999 May 07
B/G and L standard;
IAFC = 0; note 4
13
−
−
±20 ×
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
SYMBOL
PARAMETER
TDA9810
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Sound IF amplifier (pins 23 and 24)
Vi(SIF)(rms)
Vi(max)(rms)
input signal voltage
sensitivity (RMS value)
maximum input signal
voltage (RMS value)
FM mode; −3 dB at
intercarrier output pin 10
−
30
70
µV
AM mode; −3 dB at
AF output pin 6
−
70
100
µV
FM mode; +1 dB at
intercarrier output pin 10
50
70
−
mV
AM mode; +1 dB at
AF output pin 6
80
140
−
mV
Gcr(SIF)
SIF gain control range
FM and AM mode;
see Fig.5
60
67
−
dB
Ri(diff)
differential input resistance
note 2
1.7
2.2
2.7
kΩ
Ci(diff)
differential input capacitance note 2
1.2
1.7
2.5
pF
VI(23,24)
DC input voltage
−
3.4
−
V
αSIF,VIF
crosstalk attenuation
between SIF and VIF input
between pins 1 and 2 and
pins 23 and 24; note 16
50
−
−
dB
FM mode
8
12
16
µA
AM mode
0.8
1.2
1.6
µA
SIF-AGC detector (pin 5)
Ich(5)
Idch(5)
charging current
discharging current
FM mode
8
12
16
µA
normal mode AM
1
1.4
1.8
µA
fast mode AM
60
85
110
µA
B/G standard; SC1;
sound carrier 2 off
100
140
180
mV
L standard;
without modulation
100
140
180
mV
NICAM
Single reference QSS intercarrier mixer (pin 10); note 17
Vo(intercarrier)(rms) IF intercarrier level
(RMS value)
14
20
26
mV
B−3
−3 dB intercarrier bandwidth upper limit
7.5
9
−
MHz
αc(rms)
residual sound carrier
(RMS value)
fundamental wave and
harmonics
−
2
−
mV
Ro(10)
output resistance
note 2
−
−
25
Ω
VO(10)
DC output voltage
−
2.0
−
V
Ibias(int)(10)
DC internal bias current for
emitter-follower
1.5
1.9
−
mA
I(sink)(max)10
maximum AC and DC output
sink current
1.1
1.5
−
mA
I(source)(max)10
maximum AC and DC output
source current
3.0
3.5
−
mA
1999 May 07
14
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
SYMBOL
PARAMETER
TDA9810
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Single reference QSS AF performance for FM operation (B/G standard); notes 18 to 21; see Table 1
S/NW(SC1)
S/NW(SC2)
weighted signal-to-noise
ratio for SC1
weighted signal-to-noise
ratio for SC2
40
−
−
dB
black picture
53
58
−
dB
white picture
52
55
−
dB
6 kHz sine wave (black to 44
white modulation)
48
−
dB
250 kHz square wave
(black to white
modulation)
40
45
−
dB
sound carrier
subharmonics;
f = 2.75 MHz ±3 kHz
45
51
−
dB
sound carrier
subharmonics;
f = 2.87 MHz ±3 kHz
46
52
−
dB
40
−
−
dB
PC/SC1 ratio at pins 1 and
2; 27 kHz (54% FM
deviation); “CCIR 468-4”
PC/SC2 ratio at pins 1 and
2; 27 kHz (54% FM
deviation); “CCIR 468-4”
black picture
48
55
−
dB
white picture
46
52
−
dB
6 kHz sine wave (black to 42
white modulation)
46
−
dB
250 kHz square wave
(black to white
modulation)
29
34
−
dB
sound carrier
subharmonics;
f = 2.75 MHz ±3 kHz
44
50
−
dB
sound carrier
subharmonics;
f = 2.87 MHz ±3 kHz
45
51
−
dB
AM operation (L standard; pin 6); note 22
Vo(AF)(rms)
AF output signal voltage
(RMS value)
54% modulation
400
500
600
mV
THD
total harmonic distortion
54% modulation;
see Fig.11
−
0.5
1.0
%
B−3
−3 dB AF bandwidth
100
125
−
kHz
S/NW
weighted signal-to-noise
ratio
“CCIR 468-4”; see Fig.10
47
53
−
dB
V6
DC potential voltage
tracked with supply voltage −
2.5
−
V
PSRR
power supply ripple rejection see Fig.12
25
−
dB
1999 May 07
15
22
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
SYMBOL
PARAMETER
TDA9810
CONDITIONS
MIN.
TYP.
MAX.
UNIT
AM mute switch (pin 11)
V11
DC potential
input voltage for no mute
note 23
input voltage for mute
IIL
LOW level input current
V11 = 0 V
2.8
−
VP
V
0
−
0.8
V
175
250
325
µA
L/L accent gating switch (pin 14)
V14
DC potential voltage for
gating on
note 23
gating off
IIL
LOW level input current
V14 = 0 V
2.8
−
VP
V
0
−
2.0
V
140
200
260
µA
Notes
1. Values of video and sound parameters are decreased at VP = 4.5 V.
2. This parameter is not tested during production and is only given as application information for designing the
television receiver.
3. Loop bandwidth BL = 70 kHz (natural frequency fn = 12 kHz; damping factor d ≈ 3; calculated for peak level).
Resonance circuit of VCO: Q0 > 50; Cext = 8.2 pF ±0.25 pF; Cint ≈ 8.5 pF (loop voltage ≈2.7 V).
4. Temperature coefficient of external LC-circuit is equal to zero.
5. Vi(IF)(rms) = 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture
video modulation.
6. Vi(IF) signal for nominal video signal.
7. Offset current measured between pin 4 and half of supply voltage (VP = 2.5 V) under the following conditions: no
input signal at VIF input (pins 1 and 2) and VIF amplifier gain at minimum (V21 = VP). Due to sample-and-hold mode
of the FPLL in L standard, the leakage current of the loop filter capacitor (C = 220 nF) should not exceed 500 nA.
8. Measurements taken with SAW filter K6257 (sound carrier suppression: 40 dB); loop bandwidth = 70 kHz.
a) Modulation VSB; sound carrier off; fvideo > 0.5 MHz.
b) Sound carrier on; SIF SAW filter K9453; fvideo = 10 kHz to 10 MHz.
9. The 7 dB buffer gain accounts for 1 dB loss in the sound trap. Buffer output signal is typically 2 V (p-p), in event of
CVBS video amplifier output typical 1 V (p-p). If no sound trap is applied a 330 Ω resistor must be connected from
output to input (from pin 9 to pin 13).
10. The leakage current of the AGC capacitor should not exceed 1 µA at B/G standard respectively 10 nA current at
L standard. Larger currents will increase the tilt.
11. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 12). B = 5 MHz weighted
in accordance with “CCIR 567”.
12. The intermodulation figures are defined:
 V 0 at 4.4 MHz 
α IM ( 1.1 ) = 20 log  -------------------------------------  + 3.6dB ; αIM(1.1) value at 1.1 MHz referenced to black/white signal;
 V 0 at 1.1 MHz 
 V 0 at 4.4 MHz 
α IM ( 3.3 ) = 20 log  --------------------------------------  ; αIM(3.3) value at 3.3 MHz referenced to colour carrier.
 V 0 at 3.3 MHz 
13. Response speed valid for a VIF input level range of 200 µV up to 70 mV.
14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is
given in Fig.8. The AFC-steepness can be changed by the resistors at pin 17.
1999 May 07
16
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
15. Depending on the ratio ∆C/C0 of the LC resonant circuit of VCO (Q0 > 50; see note 3; C0 = Cint + Cext).
16. Source impedance: 2.3 kΩ in parallel to 12 pF (SAW filter); fIF = 38.9 MHz.
17. For picture to sound carrier ratio see Table 1. The NICAM L subcarrier is 17 dB lower than the AM sound carrier and
depends on its AM modulation.
18. The Vo QSS output (pin 10) is analysed by a test demodulator TDA9820. The S/N ratio of this IC is more than 60 dB,
related to a deviation of ±27 kHz, in accordance with “CCIR 468-4”.
19. For all S/N measurements the used vision IF modulator has to meet the following specifications:
a) Incidental phase modulation for black-to-white jump less than 0.5 degrees.
b) QSS AF performance, measured with the television-demodulator AMF2 (audio output, weighted S/N ratio) better
than 60 dB (deviation ±27 kHz) for 6 kHz sine wave black-to-white video modulation.
c) Picture-to-sound carrier ratio; PC/SC1 = 13 dB; (transmitter).
20. Measurements taken with SAW filter K6257 (Siemens) for vision IF (suppressed sound carrier) and K9453
(Siemens) for sound IF (suppressed picture carrier). Input level Vi(SIF)(rms) = 10 mV, 27 kHz (54% FM deviation).
21. The PC/SC ratio at pins 1 and 2 is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC
ratio. This PC/SC ratio is necessary to achieve the S/NW values as noted. A different PC/SC ratio will change
these values.
22. Measurements taken with SAW filter K9453 (Siemens) for AM sound IF (suppressed picture carrier).
23. The input voltage has to be Vi > 2.8 V, or open-circuit.
Table 1
Input frequencies and carrier ratios
DESCRIPTION
SYMBOL
B/G STANDARD L STANDARD
L ACCENT
STANDARD
NICAM L
UNIT
Picture carrier
fpc
38.9
38.9
33.9
38.9
MHz
Sound carrier
fsc1
33.4
32.4
40.4
32.4
MHz
fsc2/NICAM
33.158
−
−
32.05
MHz
PC/SC1
13
10
10
10
dB
PC/SC2/NICAM
20
−
−
27
dB
Picture to sound
carrier ratio
Table 2
Switch logic
STANDARD SWITCH
(PIN 8)
FM-PLL
SELECTED STANDARD
AF-AMPLIFIER
VIDEO POLARITY
1
2
1
2
2.8 V to VP
B/G
negative
on
on
FM
FM
1.3 to 2.3 V
B/G, with external VIF AGC negative
on
on
FM
FM
0 to 0.8 V
L
off
off
AM
mute
1999 May 07
positive
17
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
MHA714
70
andbook, full pagewidth
gain
(dB)
60
0.06
Vi(VIF)(rms)
(mV)
50
0.6
40
Ituner
(mA)
0
30
(1)
6
(2)
(3)
(4)
20
1
10
60
0
2
−10
1
1.5
(1) Ituner; RTOP = 22 kΩ.
(2) Gain.
2
2.5
3
3.5
4
4.5
V21 (V)
(3) Ituner; RTOP = 11 kΩ.
(4) Ituner; RTOP = 0 Ω.
Fig.4 Typical VIF and tuner AGC characteristic.
MHA715
110
handbook, full pagewidth
100
(dBµV)
100
Vi(SIF)(rms)
90
(mV)
10
80
70
1
60
(1)
(2)
50
0.1
40
30
0.01
20
1
1.5
2
2.5
3
(1) AM mode.
(2) FM mode.
Fig.5 Typical SIF AGC characteristic.
1999 May 07
18
3.5
4
V5 (V)
4.5
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
MED684
75
handbook, halfpage
S/N
(dB)
3.2 dB
handbook, halfpage
10 dB
13.2 dB
50
13.2 dB
27 dB
27 dB
25
SC CC
PC
SC CC
BLUE
0
−60
YELLOW
MED685 - 1
−40
−20
0
20
Vi (VIF)(rms)(dB)
0.06
Fig.6
0.6
6 10
60
600
Vi (VIF)(rms)(mV)
SC = sound carrier, with respect to sync level.
CC = chrominance carrier, with respect to sync level.
PC = picture carrier, with respect to sync level.
The sound carrier levels are taking into account
a sound shelf attenuation of 20 dB (SAW filter G1962).
Typical signal-to-noise ratio as a function of
IF input voltage.
handbook, full pagewidth
VP
VP = 5 V
Fig.7 Input signal conditions.
TDA9810 17
200
(source current)
100
I17
VAFC
MHA716
VAFC I17
(V)
(µA)
22 kΩ
2.5
0
100
22 kΩ
(sink current)
200
38.5
38.9
39.3 f (MHz)
Fig.8 Measurement conditions and typical AFC characteristic.
1999 May 07
PC
19
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
handbook,
2.5halfpage
V
white level
1.8 V
black level
1.5 V
sync level
B/G standard
white level
2.5 V
threshold level
1.95 V
black level
1.8 V
threshold level
1.65 V
sync level
1.5 V
L standard
MED864
Fig.9 Typical video signal levels on output pin 9 (sound carrier off).
MED688
10
CCIR-468
(dB)
0
handbook, full pagewidth
(1)
10
20
30
40
50
(2)
60
70
30
40
50
60
70
80
90
input voltage (dBµV)
100
(1) Signal.
(2) Noise.
Fig.10 Typical audio signal-to-noise ratio as a function of input signal at AM standard (m = 54%).
1999 May 07
20
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
MED689
1.25
handbook, full pagewidth
THD
(%)
1.0
0.75
0.5
0.25
0
10 2
10 1
1
10
f (kHz)
10 2
CAGC = 2.2 µF.
Fig.11 Typical total harmonic distortion as a function of audio frequency at AM standard (m = 54%).
handbook, full pagewidth
VP = 5 V
100 mV
(fripple = 70 Hz)
VP = 5 V
TDA9810
MHA717
t
Fig.12 Ripple rejection condition.
1999 May 07
21
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19
21
18
+
+
17
13
9
10
+
+
+
+
23
420
Ω
3.6 V
420
Ω
+
200 µA
3.3
kΩ
+
+
2.2
kΩ
+
9 kΩ
0.5 pF
1.7 pF
1.1 kΩ
+ +
+
2.8 V
2 kΩ
+
1
kΩ
1.1 kΩ
1 mA
24
10 kΩ
10 kΩ
1.7
pF
1
kΩ
1.6
kΩ
1.9 mA
3.0 mA
10 kΩ
16
+
2.5 mA
1
3.6 V
13 kΩ
1.1 kΩ
+
3.6 V
22
+
16 kΩ
TDA9810
14
1.1 kΩ
2
Philips Semiconductors
20
Multistandard VIF-PLL with QSS-IF and
AM demodulator
GND
22
INTERNAL PIN CONFIGURATION
1999 May 07
VP
24
kΩ
0.6 µA
+
+
3.6 V
2.5 µA
+
3.6 V
3.6 V
16 kΩ
13
kΩ
VCO
+
9 kΩ
+
+
+
17
kΩ
+
+
24
kΩ
9
kΩ
+
14.7
kΩ
23 µA
67 µA
+
+
2.5 mA
+
+
+
+
+
25
pF
25 µA
1 mA
13
kΩ
2.3 mA
24
kΩ
20 kΩ
3.6 V
16 kΩ
3
4
5
8
7
6
11
MHA720
TDA9810
Fig.13 Internal pin configuration.
12
Product specification
15
handbook, full pagewidth
120
Ω
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100
nF
22
kΩ
10 nF
L/L accent
gating switch
1:1
SIF
input
50
Ω
1
5
2
4
Q0
2.2
µF
VIF
AGC
3
24
23
22
GND
21
tuner
AGC
50
8.2 pF
100
nF
CBL
20
19
18
330
Ω
23
17
16
15
14
13
8
9
10
11
12
AM mute
switch
CVBS
TDA9810
2
3
1:1
1
VIF
input
50
Ω
5
2
4
3
TOP
22
kΩ
4
5
330
Ω
SIF
AGC
6
7
2.2
µF
22
kΩ
22
kΩ
AFAM
220 nF
L/L
accent
switch
loop
filter
QSS intercarrier
output
MHA718
TDA9810
Fig.14 Test circuit.
video
output
Product specification
standards
selection
switch
+5 V
handbook, full pagewidth
1
Philips Semiconductors
22 kΩ
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TEST AND APPLICATION INFORMATION
1999 May 07
AFC
VP
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22 kΩ
100
nF
22
kΩ
L/L accent
gating switch
10 nF
IF
input
50 Ω
Q0
SAW
FILTER
K9453
2.2
µF
VIF
AGC
(1)
24
23
22
GND
21
50
330
Ω
tuner
AGC
8.2 pF
CBL
20
19
18
15
µH
100
nF
24
17
16
15
14
13
8
9
10
11
12
AM mute
switch
CVBS
TDA9810
1
SAW
FILTER
K6257
(1)
3
2
TOP
22
kΩ
4
5
330
Ω
SIF
AGC
220 nF
6
(2)
2.2
µF
22
kΩ
22
kΩ
de-emphasis
depending on
TV standard/stereo
decoder
loop
filter
video
output
QSS intercarrier
output
Fig.15 Application circuit.
+5 V
standards
selection
switch
MHA719
Product specification
handbook, full pagewidth
L/L
accent
switch
TDA9810
(1) Depends on standard.
(2) Only required for external AGC mode.
7
Philips Semiconductors
AFC
Multistandard VIF-PLL with QSS-IF and
AM demodulator
1999 May 07
VP
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
PACKAGE OUTLINES
SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
SOT234-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
(e 1)
w M
MH
b
13
24
pin 1 index
E
1
12
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.8
1.3
0.8
0.53
0.40
0.32
0.23
22.3
21.4
9.1
8.7
1.778
10.16
3.2
2.8
10.7
10.2
12.2
10.5
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-02-04
SOT234-1
1999 May 07
EUROPEAN
PROJECTION
25
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013AD
1999 May 07
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
26
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
1999 May 07
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
27
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
TDA9810
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
MOUNTING
PACKAGE
WAVE
REFLOW(1)
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable(2)
−
suitable
Surface mount
not suitable
suitable
−
suitable
−
suitable
−
not
recommended(4)(5)
suitable
−
not
recommended(6)
suitable
−
BGA, SQFP
suitable(3)
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 May 07
28
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
NOTES
1999 May 07
29
TDA9810
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
NOTES
1999 May 07
30
TDA9810
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and
AM demodulator
NOTES
1999 May 07
31
TDA9810
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Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1999
SCA 64
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/750/02/pp32
Date of release: 1999 May 07
Document order number:
9397 750 05317