D at a S he et , V 2. 0 , N ov e m be r 2 00 9 B G F 10 4C H S M MC I n t e rf a c e Fi l t e r a n d ESD P ro t e c t i o n R F & P ro t e c ti o n D e v i c e s Edition 2009-11-12 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF104C HSMMC Interface Filter and ESD Protection BGF104C Revision History: 2009-11-12, V2.0 Previous Version: 2009-09-14, V1.0 Page Subjects (major changes since last revision) 4 3D-figure of package updated 5 Figure 2 updated 6 Footprint (Figure 3) added 6 Tape specification (Figure 4) added all Target status removed Data Sheet 3 V2.0, 2009-11-12 BGF104C HSMMC Interface Filter and ESD Protection BGF104C BGF104C Features • ESD protection and filter for High Speed Multi Media Card interface • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs • 16 pin green wafer level package with SnAgCu solder balls • RoHS and WEEE compliant package • 500 µm solder ball pitch • 300 µm solder ball diameter WLP-16-3-N Description BGF104C is an ESD protection and filter circuit for a high speed multi media card interface. External pins are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 1.92 mm x 1.92 mm and a total height of 0.65 mm. R10, 75kΩ R11, 75kΩ R12, 75kΩ R13, 75kΩ Int. IOs Ext. IOs R14, 7kΩ V MMC V dd A3 A4 MMCclk R2, 50Ω clk A2 B4 MMCcmd R3, 50Ω cmd A1 C4 MMCdat0 R4, 50Ω dat 0 B2 C3 MMCdat1 R5, 50Ω dat 1 B1 D4 MMCdat2 R6, 50Ω dat 2 C1 D3 MMCdat3 R7, 50Ω dat 3 D1 B3, C2, D2 GND BGF104_ schematic.vsd Figure 1 Schematic Type Package Marking Chip BGF104C WLP-16-3 4C N0708 Data Sheet 4 V2.0, 2009-11-12 BGF104C HSMMC Interface Filter and ESD Protection BGF104C Table 1 Maximum Ratings Parameter Symbol Voltage at all pins to GND VP TOP TSTG Operating temperature range Storage temperature range Values Unit Note / Test Condition Min. Typ. Max. 0 – 14 V – -40 – +85 °C – -65 – +150 °C – Electrostatic Discharge According to IEC61000-4-2 Contact discharge external pins to GND (A1, A2, A3, B1, B2, C1, D1) VESD -15 – 15 kV – Contact discharge internal pins to GND (A4, B4,C3, C4, D3, D4) VESD -2 – 2 kV – Unit Note / Test Condition Table 2 Electrical Characteristics1) Parameter Symbol Resistors R2 ... R7 Resistors R10 ... R13 Resistor R14 Line capacitance, each line to GND 2) Reverse current of ESD protection diodes IR = 3 V IR = 14 V 1) at TA = 25 °C 2) Without line coupling by Resistors R7 - R11 Values Min. Typ. Max. R2...7 R10...13 R14 CT 40 50 60 Ω – 52.5 75 97.5 kΩ – 4.9 7 9.1 kΩ – – 16 20 pF V=0V IR – 5 0.1 100 10 nΑ µA – Package Outlines B D4 D3 D2 D1 C4 C3 C2 C1 B4 B3 B2 B1 A4 A3 A2 A1 (0.21 ±0.05) (0.21 ±0.05) A 1.92 ±0.05 0.5 (0.21 ±0.05) 3 x 0.5 = 1.5 C 0.5 0.08 C 16x COPLANARITY 0.3 ±0.05 1) 16x ø0.05 M A B (0.21 ±0.05) SEATING PLANE 3) 0.25 ±0.05 STANDOFF Pin 1 Corner Index Area 2) 1.92 ±0.05 3 x 0.5 = 1.5 0.1 C 0.5 0.65 ±0.05 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) Pin 1 corner identified by marking 3) Primary datum C and seating plane are defined by the spherical crowns of the balls WLP-16-3-N-PO V01 Figure 2 Data Sheet WLP-16-3 (dimensions in mm) 5 V2.0, 2009-11-12 BGF104C HSMMC Interface Filter and ESD Protection BGF104C Footprint 1 1.5 0.5 0.5 0.25 WLP-16-3-N-FP V01 Figure 3 Footprint for WLP-16-3 (dimensions in mm) Tape and reel specification 0.23 Pin 1 Corner Index Area Figure 4 2.22 8 2.22 4 0.77 WLP-16-3-N-TP V01 Tape for WLP-16-3 (dimensions in mm) You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products Data Sheet 6 V2.0, 2009-11-12