STMICROELECTRONICS EMIF06

EMIF06-HMC01F2
6-line IPAD™, EMI filter including ESD protection
Features
■
6-line low-pass-filter
■
High efficiency in EMI filtering
■
Very low PCB space occupation: < 4.4 mm2
■
Lead-free package
■
Very thin package: 0.65 mm
■
High efficiency in ESD suppression
■
High reliability offered by monolithic integration
■
High reducing of parasitic elements through
integration and wafer level packaging
Flip Chip
(16 bumps)
Figure 1.
Pin layout (bump side)
4
3
2
1
Complies with the following standards
A
■
IEC 61000-4-2 level 4 on external pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
B
MIL STD 883E - Method 3015-6 Class 3
D
■
C
A1
A2
A3
A4
B1
B2
B3
B4
Applications
■
High speed MultiMediaCard
Description
The EMIF06-HMC01F2 is a highly integrated
array designed to suppress EMI / RFI noise for
high speed MultiMediaCard port filtering. The
EMIF06-HMC01F2 Flip Chip packaging means
the package size is equal to the die size.
Figure 2.
cmd
clk
Vmmc/Vdd
MMCclk
dat1
dat0
gnd
MMCcmd
C1
C2
C3
C4
D1
D2
D3
D4
dat2
gnd
MMCdat1
MMCdat0
dat3
gnd
MMCdat3
MMCdat2
Basic cell configuration
R10
R11
R12
R13
R14
Additionally, this filter includes ESD protection
circuitry which prevents damage to the application
when subjected to ESD surges up to 15 kV.
Vmmc
MMCclk
MMCcmd
MMCdat0
MMCdat1
MMCdat2
MMCdat3
Vmmc
R2
R3
R4
R5
R6
R7
clk
cmd
dat0
dat1
dat2
dat3
GND
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 2
1/8
www.st.com
8
Characteristics
1
EMIF06-HMC01F2
Characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
VPP
Tj
Parameter and test conditions
Value
Internal pins (A4, B4, C3, C4, D3, D4):
ESD discharge IEC61000-4-2, air discharge
ESD discharge IEC61000-4-2, contact discharge
External pins (A1, A2, A3, B1, B2, C1, D1):
ESD discharge IEC61000-4-2, air discharge
ESD discharge IEC61000-4-2, contact discharge
15
8
Maximum junction temperature
125
°C
2
2
kV
Top
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to 150
°C
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
Parameters
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
Cline
Input capacitance per line
I
VBR
Symbol
Test conditions
VRM
IRM
IRM
Tolernace
Min
Typ
V
VRM VBR
Max
14
Unit
VBR
IR = 1 mA
IRM
VRM = 3V
0.1
µA
Cline
@ 0V
20
pF
R2,R3,R4,
I = 50 mA
R5, R6, R7
2/8
Unit
V
± 20 %
50
Ω
R10, R11,
R12, R13
I = 50 µA
± 30 %
75
kΩ
R14
I = 200 µA
± 30 %
7
kΩ
EMIF06-HMC01F2
Figure 3.
Characteristics
S21 (dB) attenuation measurement Figure 4.
Analog crosstalk measurement
0.00
0.00
dB
dB
- 10.00
- 10.00
- 20.00
- 30.00
- 20.00
- 40.00
- 30.00
- 50.00
- 60.00
- 40.00
- 70.00
- 50.00
- 80.00
100.0k
1.0M
10.0M
100.0M
1.0G
100.0k
f/Hz
Figure 5.
1.0M
10.0M
ESD response to IEC 61000-4-2
(+15kV air discharge) on one input
(Vin) and on one output (Vout)
Figure 6.
Input
Input
10V/d
10V/d
Output
Output
10V/d
10V/d
1.0G
ESD response to IEC 61000-4-2
(-15kV air discharge) on one input
(Vin) and on one output (Vout)
200ns/d
200ns/d
Figure 7.
100.0M
f/Hz
Junction capacitance versus reverse voltage applied (typical values)
CLINE (pF)
16
14
Vosc=30mV
F=1MHz
Ta=25 °C
12
10
8
6
4
2
0
0
1
2
3
4
5
VLINE (V)
3/8
Application information
2
EMIF06-HMC01F2
Application information
Figure 8.
Aplac model device structure
R10
R11
R12
Lbump Rbump
Vmmc_Vdd
R13
Cbump Rsub
A3
bulk
Vmmc_Vdd
R14
Lbump Rbump
R2
MMCclk
Cbump Rsub
A4
clk
MMCclk
MMCcmd
cmd
bulk
Lbump
R4
MMCdat0
Rbump
MMCcmd
R5
MMCdat1
Lbump
Rbump
MMCdat0
Cbump Rsub
C4
MMCdat3
cmd
dat2
bulk
dat3
A2
A1
Rbump Lbump
MODEL = demif06
Rsub Cbump
bulk
MMCdat1
bulk
dat1
B2
Rbump Lbump
MODEL = demif06_gnd
Rsub Cbump
bulk
bulk
Lbump Rbump
Lbump
MMCdat2
dat2
Cbump Rsub
D4
B1
Rbump Lbump
Rbump
bulk
Rsub Cbump
bulk
Lbump Rbump
MMCdat3
Cbump Rsub
D3
Lgnd
dat3
Rgnd
bulk
C1
Rbump Lbump
Rsub Cbump
bulk
Cgnd
Figure 9.
Aplac parameters
Variables
Variables
demif06_gnd
demif06
R2 50
Cz 11pF
BV=14
BV=14
R3 50
Cz_gnd 45pF
IBV=1m
IBV=1m
R4 50
RS_gnd 480m
CJO=Cz_gnd
CJO=Cz
Ls 950pH
M=0.31
M=0.31
Rs 150m
RS=RS_gnd
RS=1
Rbump 100m
VJ=0.6
VJ=0.6
Lbump 50pH
TT=100n
TT=100n
R5 50
R6 50
R7 50
R10 75k
R11 75k
R12 75k
4/8
Cbump
dat0
MODEL = demif06
Cbump Rsub
C3
dat1
R7
Cbump
Rbump Lbump
Rsub
MMCdat2
bulk
Lbump Rbump
Rsub
R6
bulk
Rbump Lbump
bulk
dat0
Cbump Rsub
B4
clk
R3
Cbump 0.15pF
R13 75k
Lgnd 50pH
R14 7k
Rgnd 100m
Rsub 100m
Cgnd 0.15pF
D1
EMIF06-HMC01F2
3
Ordering information scheme
Ordering information scheme
Figure 10. Ordering information scheme
EMIF
yy
-
xxx zz
Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Package dimensions
500 µm ± 10
315 µm ± 50
650 µm ± 65
1.92 mm ± 50 µm
500 µm ± 10
210 µm
1.92 mm ± 50 µm
210 µm
4
5/8
Ordering information
EMIF06-HMC01F2
Figure 12. Footprint
Figure 13. Marking
Dot, ST logo
xx = marking
z = manuafacturing location
yww = datecode
(y = year
ww = week)
Copper pad Diamete :
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
E
x x z
y ww
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location
3.5 ± 0.1
2.06
STE
xxx
yww
4 ± 0.1
User direction of unreeling
All dimensions in mm
Note:
2.06
STE
xxx
yww
STE
xxx
yww
8 ± 0.3
0.73 ± 0.05
1.75 ± 0.1
Ø 1.5 ± 0.1
4 ± 0.1
More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
5
Ordering information
Table 3.
6/8
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF06-HMC01F2
GH
Flip Chip
5.3 mg
5000
Tape and reel 7”
EMIF06-HMC01F2
6
Revision history
Revision history
Table 4.
Document revision history
Date
Revision
Changes
25-Jan-2005
1
Initial release.
28-Apr-2008
2
Updated ECOPACK statement. Updated Figure 10, Figure 11,
Figure 12, Figure 13 and Figure 14. Reformatted to current
standards.
7/8
EMIF06-HMC01F2
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