INTEGRATED CIRCUITS DATA SHEET 74HC1G125; 74HCT1G125 Bus buffer/line drivers; 3-state Product specification Supersedes data of 2002 May 17 2004 Jul 27 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 FEATURES DESCRIPTION • Wide supply voltage range from 2.0 to 6.0 V The 74HC1G/HCT1G125 is a high-speed Si-gate CMOS device. • Symmetrical output impedance • High noise immunity The 74HC1G/HCT1G125 provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input pin (OE). A HIGH at pin OE causes the output as assume a high-impedance OFF-state. • Low power dissipation • Balanced propagation delays • Very small 5 pins package • Output capability: bus driver. The bus driver output currents are equal compared to the 74HC/HCT125. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 6.0 ns. TYPICAL SYMBOL PARAMETER CONDITIONS UNIT HC1G tPHL/tPLH propagation delay A to Y CI input capacitance CPD power dissipation capacitance CL = 15 pF; VCC = 5 V notes 1 and 2 HCT1G 9 10 ns 1.5 1.5 pF 30 27 pF Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; ∑ (CL × VCC2 × fo) = sum of outputs. 2. For HC1G the condition is VI = GND to VCC. For HCT1G the condition is VI = GND to VCC − 1.5 V. FUNCTION TABLE See note 1. INPUTS OUTPUT OE A Y L L L L H H H X Z Note 1. H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 2004 Jul 27 2 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE MARKING −40 to +125 °C 5 SC-88A plastic SOT353 HM 74HC1G125GW 74HCT1G125GW −40 to +125 °C 5 SC-88A plastic SOT353 TM 74HC1G125GV −40 to +125 °C 5 SC-74A plastic SOT753 H25 74HCT1G125GV −40 to +125 °C 5 SC-74A plastic SOT753 T25 PINNING PIN SYMBOL DESCRIPTION 1 OE output enable input 2 A data input A 3 GND ground (0 V) 4 Y data output Y 5 VCC supply voltage handbook, halfpage OE 1 A 2 GND handbook, halfpage 5 VCC A 1 OE Y 4 125 3 4 Y MNA118 MNA117 Fig.1 Pin configuration. handbook, halfpage 2 Fig.2 Logic symbol. handbook, halfpage Y A 2 4 1 OE OE MNA119 MNA120 Fig.3 IEC logic symbol. 2004 Jul 27 Fig.4 Logic diagram. 3 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 RECOMMENDED OPERATING CONDITIONS 74HC1G125 SYMBOL PARAMETER 74HCT1G125 CONDITIONS UNIT MIN. TYP. MAX. MIN. TYP. MAX. VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 − VCC 0 − VCC V VO output voltage 0 − VCC 0 − VCC V Tamb operating ambient temperature +25 +125 −40 +25 +125 °C tr, tf input rise and fall times see DC and AC −40 characteristics per device VCC = 2.0 V − − 1000 − − − ns VCC = 4.5 V − − 500 − − 500 ns VCC = 6.0 V − − 400 − − − ns LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER VCC supply voltage IIK input diode current CONDITIONS VI < −0.5 V or VI > VCC + 0.5 V; note 1 MIN. MAX. UNIT −0.5 +7.0 V − ±20 mA IOK output diode current VO < −0.5 V or VO > VCC + 0.5 V; note 1 − ±20 mA IO output source or sink current −0.5 V < VO < VCC + 0.5 V; note 1 − ±12.5 mA ICC VCC or GND current note 1 − ±25 mA Tstg storage temperature −65 +150 °C PD power dissipation per package − 200 mW for temperature range from −40 to +125 °C; note 2 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 55 °C the value of PD derates linearly with 2.5 mW/K. 2004 Jul 27 4 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 DC CHARACTERISTICS Family 74HC1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL VIL VOH VOL −40 to +85 PARAMETER OTHER VIH Tamb (°C) HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VCC (V) MIN. TYP.(1) −40 to +125 MAX. MIN. UNIT MAX. 2.0 1.5 1.2 − 1.5 − V 4.5 3.15 2.4 − 3.15 − V 6.0 4.2 3.2 − 4.2 − V 2.0 − 0.8 0.5 − 0.5 V 4.5 − 2.1 1.35 − 1.35 V 6.0 − 2.8 1.8 − 1.8 V VI = VIH or VIL; IO = −20 µA 2.0 1.9 2.0 − 1.9 − V VI = VIH or VIL; IO = −20 µA 4.5 4.4 4.5 − 4.4 − V VI = VIH or VIL; IO = −20 µA 6.0 5.9 6.0 − 5.9 − V VI = VIH or VIL; IO = −2.0 mA 4.5 4.13 4.32 − 3.7 − V VI = VIH or VIL; IO = −2.6 mA 6.0 5.63 5.81 − 5.2 − V VI = VIH or VIL; IO = 20 µA 2.0 − 0 0.1 − 0.1 V VI = VIH or VIL; IO = 20 µA 4.5 − 0 0.1 − 0.1 V VI = VIH or VIL; IO = 20 µA 6.0 − 0 0.1 − 0.1 V VI = VIH or VIL; IO = 2.0 mA 4.5 − 0.15 0.33 − 0.4 V VI = VIH or VIL; IO = 2.6 mA 6.0 − 0.16 0.33 − 0.4 V ILI input leakage current VI = VCC or GND 6.0 − − 1.0 − 1.0 µA IOZ 3-state output current OFF-state VI = VIH or VIL; 6.0 VO = VCC or GND − − 5 − 10 µA ICC quiescent supply current VI = VCC or GND; 6.0 IO = 0 − − 10 − 20 µA Note 1. All typical values are measured at Tamb = 25 °C. 2004 Jul 27 5 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 Family 74HCT1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL Tamb (°C) −40 to +85 PARAMETER OTHER VCC (V) MIN. TYP.(1) −40 to +125 MAX. MIN. UNIT MAX. VIH HIGH-level input voltage 4.5 to 5.5 2.0 1.6 − 2.0 − V VIL LOW-level input voltage 4.5 to 5.5 − 1.2 0.8 − 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; IO = −20 µA 4.5 4.4 4.5 − 4.4 − V VI = VIH or VIL; IO = −2.0 mA 4.5 4.13 4.32 − 3.7 − V VI = VIH or VIL; IO = 20 µA 4.5 − 0 0.1 − 0.1 V VI = VIH or VIL; IO = 2.0 mA 4.5 − 0.15 0.33 − 0.4 V VOL LOW-level output voltage ILI input leakage current VI = VCC or GND 5.5 − − 1.0 − 1.0 µA IOZ 3-state output current OFF-state VI = VIH or VIL; VO = VCC or GND 5.5 − − 5 − 10 µA ICC quiescent supply current VI = VCC or GND; IO = 0 5.5 − − 10 − 20 µA ∆ICC additional supply current per input VI = VCC − 2.1 V; IO = 0 4.5 to 5.5 − − 500 − 850 µA Note 1. All typical values are measured at Tamb = 25 °C. 2004 Jul 27 6 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 AC CHARACTERISTICS Type 74HC1G125 GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL tPZH/tPZL tPHZ/tPLZ −40 to +85 PARAMETER WAVEFORMS tPHL/tPLH Tamb (°C) propagation delay A to Y see Figs 5 and 7 3-state output enable time OE to Y see Figs 6 and 7 3-state output disable time OE to Y see Figs 6 and 7 VCC (V) MIN. TYP.(1) 2.0 − 24 4.5 − 6.0 − 2.0 −40 to +125 MAX. MIN. UNIT MAX. 125 − 150 ns 10 25 − 30 ns 8 21 − 26 ns − 19 155 − 190 ns 4.5 − 9 31 − 38 ns 6.0 − 7 26 − 32 ns 2.0 − 18 155 − 190 ns 4.5 − 12 31 − 38 ns 6.0 − 11 26 − 32 ns Note 1. All typical values are measured at Tamb = 25 °C. Type 74HCT1G125 GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF. Tamb (°C) TEST CONDITIONS SYMBOL −40 to +85 PARAMETER WAVEFORMS VCC (V) MIN. TYP.(1) −40 to +125 MAX. MIN. UNIT MAX. tPHL/tPLH propagation delay A to Y see Figs 5 and 7 4.5 − 11 30 − 36 ns tPZH/tPZL 3-state output enable time OE to Y see Figs 6 and 7 4.5 − 10 35 − 42 ns tPHZ/tPLZ 3-state output disable time OE to Y see Figs 6 and 7 4.5 − 11 31 − 38 ns Note 1. All typical values are measured at Tamb = 25 °C. 2004 Jul 27 7 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 AC WAVEFORMS handbook, halfpage VI VM A input GND tPLH tPHL VM Y output MNA121 For HC1G: VM = 50%; VI = GND to VCC. For HCT1G: VM = 1.3 V; VI = GND to 3.0 V. Fig.5 The input (A) to output (Y) propagation delays. VI handbook, full pagewidth VM OE input GND tPLZ tPZL VCC output LOW-to-OFF OFF-to-LOW VM VOL +0.3 V tPHZ tPZH VOH −0.3 V output HIGH-to-OFF OFF-to-HIGH VM GND output enabled output disabled output enabled MNA122 For HC1G: VM = 50%; VI = GND to VCC. For HCT1G: VM = 1.3 V; VI = GND to 3.0 V. Fig.6 The 3-state enable and disable times. 2004 Jul 27 8 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 VCC handbook, halfpage PULSE GENERATOR VI VO RL = 1 kΩ S1 D.U.T. VCC open CL 50 pF RT MNA123 TEST S1 tPLH/tPHL open tPLZ/tPZL VCC tPHZ/tPZH GND Definitions for test circuit: CL = load capacitance including jig and probe capacitance (see “AC characteristics”). RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.7 Load circuitry for switching times. 2004 Jul 27 9 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 PACKAGE OUTLINES Plastic surface mounted package; 5 leads SOT353 D E B y X A HE 5 v M A 4 Q A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E (2) e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT353 2004 Jul 27 REFERENCES IEC JEDEC EIAJ SC-88A 10 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 Plastic surface mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION SOT753 2004 Jul 27 REFERENCES IEC JEDEC JEITA SC-74A 11 EUROPEAN PROJECTION ISSUE DATE 02-04-16 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Jul 27 12 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R44/04/pp13 Date of release: 2004 Jul 27 Document order number: 9397 750 13725