INTEGRATED CIRCUITS DATA SHEET SAA3049A Infrared remote control decoder Product specification Supersedes data of 1996 Apr 15 File under Integrated Circuits, IC02 1996 Sep 13 Philips Semiconductors Product specification Infrared remote control decoder SAA3049A FEATURES GENERAL DESCRIPTION • Decodes 64 remote control commands with a maximum of 32 subaddresses The main function of the SAA3049A is to check and convert the received coded data (RECS80/RC5) into latched binary outputs. The device address can be hard-wired for a particular address, allowing several devices in one location. Alternatively, received data with any address can be accepted; the received data and address are then outputs. • Accepts RECS80 codes with pulse position modulation (SAA3004, SAA3007, SAA3008) or RC5 codes with bi-phase transmission (SAA3006, SAA3010) • Suitable for low voltage and low SAA3049A supply current applications • Adding circuitry for binary decoding allows a maximum of 2048 commands to be used, for example 1-of-16 decoder (HEF4515). ORDERING INFORMATION PACKAGE TYPE NUMBER NAME SAA3049AP DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 SAA3049AT SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 1996 Sep 13 DESCRIPTION 2 VERSION Philips Semiconductors Product specification Infrared remote control decoder SAA3049A SYSTEM DIAGRAM command acknowledge handbook, full pagewidth +5 V VBatt VCC CA bits A B REMOTE CONTROL TRANSMITTER SAA3004 SAA3007 SAA3008 or SAA3006 SAA3010 REMOTE CONTROL DECODER C data D E F CQW89A CQY89A IR BPW50 IR PREAMPLIFIER IN T0 SAA3049A toggle A0 (S0) A1 (S1) A2 (S2) A3 (S3) A4 4 MHz Remote control transmitters (see individual data sheet for full specification): SAA3004: VBatt = 4 to 11 V (max.); 7 × 64 = 448 commands (RECS80 code). SAA3007: VBatt = 2 to 6.5 V (max.); 20 × 64 = 1280 commands (RECS80 code). SAA3008: VBatt = 2 to 6.5 V (max.); 20 × 64 = 1280 commands (RECS80 code). SAA3006: VBatt = 2 to 7 V (max.); 32 × 64 = 2048 commands (RC5 code). SAA3010: VBatt = 2 to 7 V (max.); 32 × 64 = 2048 commands (RC5 code). Fig.1 System diagram. 1996 Sep 13 3 MGE374 address Philips Semiconductors Product specification Infrared remote control decoder SAA3049A PINNING SYMBOL PIN DESCRIPTION A 1 data output B 2 data output C 3 data output D 4 data output E 5 F A0 (S0) handbook, halfpage A 1 20 VCC data output B 2 19 CRI 6 data output C 3 18 T0 7 data/address output/input D 4 17 A2 (S2) E 5 A1 (S1) 8 data/address output/input IN 9 digital input GND 10 ground MODE 11 RC5/RECS80 mode selection XTAL1 12 XTAL2 16 A3 (S3) SAA3049A F 6 15 A4 A0 (S0) 7 14 RESET crystal oscillator A1 (S1) 8 13 XTAL2 13 crystal oscillator IN 9 12 XTAL1 RESET 14 reset input GND 10 11 MODE A4 15 address output/input A3 (S3) 16 address output/input A2 (S2) 17 address output/input T0 18 T0 bit CRI 19 command received indicator VCC 20 supply voltage 1996 Sep 13 MGD347 Fig.2 Pin configuration. 4 Philips Semiconductors Product specification Infrared remote control decoder SAA3049A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.5 +7 V VI input voltage any pin −0.5 VCC + 0.5 V II DC input current any pin − −10 mA IO DC output current any pin − 10 mA Ptot total power dissipation − 125 mW Po power dissipation per output − 30 mW IDD positive supply current −50 +50 mA ISS negative supply current −100 +50 mA Tamb operating ambient temperature −40 +85 °C Tstg storage temperature −65 +150 °C HANDLING Inputs and outputs are protected against electrostatic charge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”). 1996 Sep 13 5 Philips Semiconductors Product specification Infrared remote control decoder SAA3049A CHARACTERISTICS VCC = 2.5 to 5.5 V; Tamb = −40 to +85 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VCC supply voltage ICC supply current VDD = 3 V, fxtal = 4 MHz 2.5 − 5.5 V − 0.3 0.7 mA Input signals (pin 9) VIH HIGH level input voltage 0.7VCC − VCC V VIL LOW level input voltage 0 − 0.3VCC V Mode selection (pin 11) VIH HIGH level input voltage 0.7VCC − VCC V VIL LOW level input voltage 0 − 0.3VCC V Command received indicator and mode control (pin 19); note 1 VIH HIGH level input voltage 0.7VCC − VCC V VIL LOW level input voltage 0 − 0.3VCC V − 4 − MHz −1.6 −12 − mA Crystal oscillator fosc oscillator frequency note 2 Outputs OPEN-DRAIN WITHOUT INTERNAL PULL-UP RESISTOR; note 3 IOL(sink) LOW level output sink current VCC = 5 V; VOL = 0.4 V Notes 1. With pin 19 = HIGH, then pins 7, 8, 15, 16 and 17 are address inputs. With pin 19 = LOW, then pins 7, 8, 15, 16, and 17 are 4 or 5 address received outputs. a) In Figs 5, 6 and 7 this HIGH/LOW switching is dependent on whether the transistor on pin 19 is fed via a series resistor or not. In both applications pin 19, which toggles several times (see Fig.4) while a valid command is acknowledged, can be used to activate (flash) an LED indicator. 2. A quartz crystal with a frequency of 4 MHz is recommended for the standard transmitter application. 3. Application as output requires connection of an external pull-up resistor. 1996 Sep 13 6 Philips Semiconductors Product specification Infrared remote control decoder SAA3049A Reset The circuit is shown in Figs 5, 6 and 7. The alternative reset circuit shown in Fig.3 protects against short term power supply transients by generating a reset. The reset pin should either be connected to external reset circuitry as proposed or connected to VSS. If connected to VSS, a reset pulse will be generated by the on-chip Power-on reset circuit at typically 1.3 V (±500 mV accuracy). handbook, full pagewidth VCC 20 390 Ω 1 µF 1.8 kΩ SAA3049A 1N4148 zener diode 3.6 V 14 BC548 1N4148 68 kΩ 1 kΩ MGE375 Fig.3 Proposed improved reset circuit. Infrared signal input (pin 9) APPLICATION INFORMATION This pin is sensitive to a negative-going edge. In Fig.5, the circuit shown is for use with transmitters SAA3004, SAA3007 or SAA3008; pin 11 is HIGH for RECS80 code. Command received indicator (pin 19) In Fig.6, the circuit shown is for use with transmitter types SAA3006 or SAA3010; pin 11 is LOW for RC5 code. In Fig.7, the decoder is set for the required subaddress by holding the address pins HIGH or LOW. Pin 11 is HIGH for use with transmitter types SAA3004, SAA3007 or SAA3008 (RECS80 code). Pin 11 is LOW for use with transmitter types SAA3006 or SAA3010 (RC5 code). The remote control decoder is for up to 32 subaddresses with 6 + 1-bit parallel outputs (RC5 code). handbook, halfpage signal at pin 19 ≈15 ms ≈120 ms MGE376 Fig.4 Output diagram of command acknowledge. 1996 Sep 13 7 1996 Sep 13 BC548 5.6 kΩ D1 CQW24 8 19 2 B 20 1 A 33 kΩ VCC (+5 V) C 3 18 D 4 17 data outputs 5.6 kΩ 15 F 6 7 14 8 13 IN input 9 12 4 MHz 1N4148 10 11 S0-bit S1-bit S3-bit S2-bit (1) MGE377 address outputs address outputs Fig.5 Remote control decoder with latched 11 (10) -bit parallel outputs [10 (9) -bits inverted]. E 5 SAA3049A 16 subaddress range (2) 1 µF 68 kΩ T0-bit Infrared remote control decoder (1) Only for subaddress 8 to 20. (2) subaddress range: when LOW (subaddress 8 to 20) pin 15 is connected to ground when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to VCC. BC548 220 Ω command acknowledge handbook, full pagewidth Philips Semiconductors Product specification SAA3049A 1996 Sep 13 BC548 9 19 2 B 20 1 A 33 kΩ VCC (+5 V) C 3 18 D 4 17 data outputs 5.6 kΩ 15 E 5 F 6 SAA3049A 16 1 µF 7 14 8 13 IN input 9 12 4 MHz 1N4148 68 kΩ 10 11 A0-bit A1-bit A4-bit A3-bit A2-bit T0-bit MGE378 address outputs address outputs Infrared remote control decoder Fig.6 Remote control decoder with latched 12 -bit parallel outputs (11 bits inverted). 5.6 kΩ D1 CQW24 BC548 220 Ω command acknowledge handbook, full pagewidth Philips Semiconductors Product specification SAA3049A 1996 Sep 13 BC548 T0 5.6 kΩ D1 CQW24 10 B 2 1 A 19 20 68 kΩ VCC (+5 V) 33 kΩ D 4 17 data outputs C 3 18 5.6 kΩ 15 F 6 7 14 8 13 IN input 9 12 4 MHz 1N4148 10 11 MGE379 for address see data sheets of transmitter ICs S0 (A0) S1 (A1) (A4) (2) S3 (A3) S2 (A2) set subaddresses H or L (1) H selects RECS80 code L selects RC5 CODE Fig.7 Remote control decoder for up to 20 subaddresses with 6 + 1-bit parallel outputs (RECS80 code). E 5 SAA3049A 16 1 µF 68 kΩ mode Infrared remote control decoder (1) Address inputs: when LOW address input pin is connected to ground when HIGH address input pin is connected via pull-up resistor to VCC. (2) subaddress range RECS80 code: when LOW (subaddress 8 to 20) pin 15 is connected to ground when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to VCC. BC548 220 Ω command acknowledge handbook, full pagewidth Philips Semiconductors Product specification SAA3049A Philips Semiconductors Product specification Infrared remote control decoder SAA3049A PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D (1) e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1996 Sep 13 REFERENCES IEC JEDEC EIAJ SC603 11 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Product specification Infrared remote control decoder SAA3049A SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.42 0.39 0.055 0.043 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1996 Sep 13 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-24 12 o 8 0o Philips Semiconductors Product specification Infrared remote control decoder SAA3049A Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1996 Sep 13 13 Philips Semiconductors Product specification Infrared remote control decoder SAA3049A DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Sep 13 14 Philips Semiconductors Product specification Infrared remote control decoder SAA3049A NOTES 1996 Sep 13 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/25/02/pp16 Date of release: 1996 Sep 13 Document order number: 9397 750 01145