INTEGRATED CIRCUITS DATA SHEET PCF1252-X family Threshold detector and reset generator Product specification Supersedes data of 1996 Jan 23 File under Integrated Circuits, IC11 1998 Apr 16 Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family FEATURES GENERAL DESCRIPTION • Very low current consumption, typically 10 µA The PCF1252-Xs are low-power CMOS voltage threshold detectors designed especially for supervision of microcontroller/microprocessor systems for detection of power-on/off conditions and generation of a system reset pulse. The PCF1252-X also provides a POWF (power fail) output which is activated at a precise factory-programmed trip point. A system RESET output has a built-in delay with duration determined by an external capacitor (CCT). • 10 factory programmed threshold voltages available covering trip voltages from 4.75 to 2.55 V • ±50 mV trip point accuracy over full temperature range • Variable RESET delay • RESET pulse polarity selection • Defined outputs at 0.6 V (typ.) A second comparator (comparator 2) has been included to enable the possibility of a second monitoring point in the system. • Comparator for second level detection (e.g. overvoltage detection) • Advance warning of power fail • Operating temperature range −40 to +85 °C. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION PCF1252-XP(1) DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 PCF1252-XT(1) SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 Note 1. X = 0 to 9; depending on threshold voltage. BLOCK DIAGRAM handbook, full pagewidth VDD 8 COMIN 3 comparator 2 + 5 COMOUT − PCF1252-X comparator 1 + 7 − 1.30 V 6 DELAY 4 1 VSS CT 2 MGC915 SELECT Fig.1 Block diagram. 1998 Apr 16 2 POWF RESET Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family PINNING SYMBOL PIN DESCRIPTION CT 1 connection for the external capacitor SELECT 2 select polarity or external reset input COMIN 3 comparator input VSS 4 ground (0 V) COMOUT 5 comparator output RESET 6 reset output POWF 7 power failure signal output VDD 8 supply voltage handbook, halfpage CT 1 SELECT 2 8 VDD 7 POWF PCF1252-X COMIN 3 6 RESET VSS 4 5 COMOUT MGC916 Fig.2 Pinning diagram. FUNCTIONAL DESCRIPTION (see Fig.1) Voltage trip-point The PCF1252-X contains: By selecting the voltage trip-point slightly higher than the minimum operating voltage of the microcontroller/microprocessor, there is sufficient time for data storage before the power actually fails. • A precise factory-programmed voltage reference • Two comparators • A delay circuit. In order to prevent oscillations around the voltage trip-point, a small hysteresis has been included, resulting in a power-on switching point that is higher than the voltage trip-point (minimum of 15 mV). The voltage trip-point refers to the value at which power-off is signalled. The PCF1252-X family is comprised of 10 versions with different factory-programmed voltage trip-points (VTRIP), see Chapter “Characteristics”. Supply COMIN The supply voltage (VDD) is internally divided before being compared, via comparator 1, with the internal reference voltage. Input to the second comparator (comparator 2). When used in conjunction with an external voltage divider, this allows a second point in the system to be monitored. This input has no built-in hysteresis. When not in use connect to VDD. COMOUT will be LOW or HIGH depending on the voltage at COMIN: POWF (see Fig.3) The POWF output is: • LOW, if VDD is below VTRIP • HIGH, if VDD is above VTRIP. • COMOUT = HIGH, if voltage at COMIN is above the switch point VSP (typically 1.30 V). Power-on reset (SELECT = LOW) • COMOUT = LOW, if voltage at COMIN is below the switch point VSP (typically 1.30 V). As VDD rises past VTRIP, a positive reset pulse is generated at RESET. The duration of the reset pulse (tR) is determined by the value of the external capacitor (CCT; maximum 1 µF, see Fig.8) connected to CT. With no external capacitor connected, CCT assumes a minimum value of 100 pF. If SELECT is HIGH, the reset pulse is inverted. Power failure During a power-off condition (VDD < VTRIP), POWF goes LOW. After a time delay (tS), also determined by CCT, RESET goes HIGH. Any POWF assertion (VDD < VTRIP) will result in a subsequent RESET pulse. 1998 Apr 16 3 Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDD supply voltage −0.5 +7.0 V VI input voltage −0.5 VDD + 0.5 V II DC clamp-diode current − 20 mA all pins: VI < −0.5 V or VI > VDD + 0.5 V IO output current − 20 mA Ptot total power dissipation − 150 mW Tstg storage temperature −65 +100 °C Tamb operating ambient temperature −40 +85 °C HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal handling precautions appropriate to handling MOS devices (see “Handling MOS Devices”). CHARACTERISTICS VDD = 2.4 to 6.0 V; VSS = 0 V; Tamb = −40 to +85 °C; (see Fig.3); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 2.4 − 6.0 V PCF1252-0 4.70 4.75 4.80 V PCF1252-1 4.50 4.55 4.60 V PCF1252-2 4.20 4.25 4.30 V PCF1252-3 4.00 4.05 4.10 V PCF1252-4 3.70 3.75 3.80 V PCF1252-5 3.50 3.55 3.60 V PCF1252-6 3.20 3.25 3.30 V PCF1252-7 3.00 3.05 3.10 V PCF1252-8 2.70 2.75 2.80 V PCF1252-9 2.50 2.55 2.60 V 15 µA VDD supply voltage VTRIP Voltage trip-point: Tamb = 25 °C; note 1 IDD supply current Tamb = 25 °C; VDD = VTRIP + 0.5 V; COMIN = VDD; see Figs. 4 and 5 − 10 ∆VTRIP voltage trip-point temperature coefficient note 2 − ±100 × 10−6 ±400 × 10−6 mV/K Vhys voltage trip-point hysteresis 15 30 1998 Apr 16 4 50 mV Philips Semiconductors Product specification Threshold detector and reset generator SYMBOL PARAMETER PCF1252-X family CONDITIONS MIN. TYP. MAX. UNIT COMIN VSP COMIN switch point Tamb = 25 °C; note 1 1.28 1.30 1.32 V ∆VSP COMIN switch point temperature coefficient note 2 − ±0.1 ±0.5 mV/K SELECT VIL LOW level input voltage − − 0.3VDD V VIH HIGH level input voltage 0.7VDD − − V SELECT and COMIN ILI LOW level leakage input current − − −1.0 µA ILI HIGH level leakage input current − − 1.0 µA POWF, RESET and COMOUT IO output sink current VO = 0.4 V; VDD = 2.4 V; see Fig.6 1 3 − mA IO output source current VO = 2.0 V; VDD = 2.4 V; see Fig.7 −0.75 −2 − mA tR reset time CCT = 1 nF; note 3 400 1000 2000 µs tS save time CCT = 1 nF; note 3 40 100 200 µs tR/tS reset to save time ratio − 10 − Cint CT internal capacitance − 100 − pF Notes 1. Long time stability of COMIN switch point VSP and voltage trip point VTRIP: within 10 years of continuous operation at VDD(max) and an average operating temperature of 55 °C the drift of VSP will not exceed ±10 mV. The maximum drift for VTRIP will not exceed (±VTRIP(typ)/VSP(typ)) 10 mV. 2. Values given per degree Kelvin; tested on a sample basis. 3. Conformance to these specifications is only guaranteed if the slew rate of VDD is less than 25 V/ms. 1998 Apr 16 5 Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family VDD Vhys handbook, full pagewidth supply voltage VTRIP typ. = 0.6 V 0V POWF 0V undefined output reset reset RESET (SELECT = VSS) 0V undefined output tR tS tR MGC917 tR = reset time (duration of reset pulse). tS = save time (time between assertion of POWF and assertion of the reset output). This time can be used for storing of critical data and orderly system shut-down. Vhys = hysteresis voltage (prevents oscillation around VTRIP). Fig.3 Timing diagram. 1998 Apr 16 6 Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family Typical performance characteristics MGC918 14 MGC919 12 handbook, halfpage handbook, halfpage IDD (µA) IDD (µA) VTRIP = 2.55 V 12 VTRIP = 2.55 V 4.75 V 8 10 4.75 V 4 8 6 −40 Fig.4 0 0 40 0 80 120 Tamb (oC) Supply current as a function of temperature; VDD = 5 V; COMIN = VDD. Fig.5 MGC920 40 2 4 6 8 Supply current as a function of the supply voltage; Tamb = +25 °C. MGC921 40 handbook, halfpage VDD (V) handbook, halfpage IO IO (mA) VDD = (mA) 6V VDD = 6 V 30 30 4.0 V 20 20 4.0 V 10 10 2.5 V 2.5 V 0 0 0 Fig.6 2 4 6 VO (V) 8 0 Output sink current as a function of the output voltage. 1998 Apr 16 Fig.7 7 2 4 VO (V) 6 Output source current as a function of the output voltage. Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family MGC922 103 handbook, full pagewidth tR(1) (ms) 102 tS(2) (ms) 102 10 10 1 10−1 1 10−1 10−3 10−2 10−1 1 10−2 102 103 external capacitor (nF) 10 (1) tR (typ.) = (0.1 + CCT) ms. (2) tS (typ.) = (0.01 + 0.1 CCT) ms. Fig.8 Reset and save times as a function of the external capacitor (CCT). APPLICATION INFORMATION handbook, full pagewidth VDD (+5 V) PCF1252-X VDD VDD COMIN RESET RESET MICROCONTROLLER/ MICROPROCESSOR SELECT VSS VSS CT MGC923 1 nF VSS (0 V) Fig.9 Typical power-on reset circuit for a microcontroller/microprocessor system; (when not used, COMIN must be connected to VDD). 1998 Apr 16 8 Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family handbook, full pagewidth VOLTAGE REGULATOR 12 V 5V 10 µF 6 MΩ VDD PCF1252-X VDD RESET COMIN COMOUT SELECT 1 MΩ INT MICROCONTROLLER/ MICROPROCESSOR RESET VSS VSS CT 1 nF addres/data bus VDD R/W VRAM RAM CHIPDECODING LOGIC MGC924 CS VSS Fig.10 Data retention circuit for memory back-up systems. VDD handbook, full pagewidth 10 µF VDD external reset input signal (1) SELECT VDD MICROCONTROLLER/ MICROPROCESSOR PCF1252-X VSS RAM INT POWF COMIN VDD RESET RESET VSS CT VSS VSS MGC925 (1) For external reset application, the SELECT input must be debounced. Fig.11 Data retention circuit with external switchable reset for systems with a single voltage supply. 1998 Apr 16 9 Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1998 Apr 16 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 10 Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1998 Apr 16 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 11 o 8 0o Philips Semiconductors Product specification Threshold detector and reset generator Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP • The longitudinal axis of the package footprint must be parallel to the solder flow. SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 Apr 16 PCF1252-X family 12 Philips Semiconductors Product specification Threshold detector and reset generator PCF1252-X family DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Apr 16 13 Philips Semiconductors Product specification Threshold detector and reset generator NOTES 1998 Apr 16 14 PCF1252-X family Philips Semiconductors Product specification Threshold detector and reset generator NOTES 1998 Apr 16 15 PCF1252-X family Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 295102/1200/03/pp16 Date of release: 1998 Apr 16 Document order number: 9397 750 03645