PHILIPS SA56606-44GW

INTEGRATED CIRCUITS
SA56606-XX
CMOS system reset
Product data
Supersedes data of 2001 Apr 24
File under Integrated Circuits, Standard Analog
2001 Jun 19
Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
GENERAL DESCRIPTION
The SA56606-XX is a CMOS device designed to generate a reset
signal for a variety of microprocessor and logic systems. Accurate
reset signals are generated during momentary power interruptions
or whenever power supply voltages sag to intolerable levels. An
Open Drain output topology is incorporated for adaptability to a wide
variety of logic and microprocessor applications. Several reset
threshold versions of the device are available.
The SA56606-XX is available in the SOT23-5 surface mount
package.
FEATURES
APPLICATIONS
• Microcomputer systems
• Logic systems
• Battery monitoring systems
• Back-up power supply circuits
• Voltage detection circuits
• 12 VDC maximum operating voltage
• CMOS N-channel Open Drain output
• Offered in reset thresholds of
2.0, 2.7, 2.8, 2.9, 3.0, 3.1, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7 VDC
• Available in SOT23-5 surface mount package
SIMPLIFIED SYSTEM DIAGRAM
VDD
2 VDD
VDD
SA56606-XX
RPU
R
CPU
1
VREF
VOUT
RESET
R
R
VSS
3 VSS
VSS
SL01313
Figure 1. Simplified system diagram.
2001 Jun 19
2
885–2247 26559
Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
SA56606-XXGW
NAME
DESCRIPTION
TEMPERATURE
RANGE
SOT23-5, SOT25, SO5
plastic small outline package; 5 leads (see dimensional drawing)
–40 to +85 °C
NOTE:
The device has twelve detection voltage options, indicated by the
XX on the order code.
XX
DETECT VOLTAGE (Typical)
20
2.0 V
27
2.7 V
28
2.8 V
29
30
Part number marking
Each package is marked with a four letter code. The first three
letters designate the product. The fourth letter, represented by ‘x’, is
a date tracking code. For example, AAKB is device AAK (the
SA56606-30 reset), produced in time period ‘B’.
Part number
Marking
SA56606-20
AA F x
SA56606-27
AA G x
2.9 V
SA56606-28
AA H x
3.0 V
SA56606-29
AA J x
31
3.1 V
SA56606-30
AA K x
42
4.2 V
SA56606-31
AA L x
SA56606-42
AA M x
SA56606-43
AA N x
SA56606-44
AA P x
43
4.3 V
44
4.4 V
45
4.5 V
SA56606-45
AA R x
46
4.6 V
SA56606-46
AA S x
47
4.7 V
SA56606-47
AAT x
PIN CONFIGURATION
VOUT
PIN DESCRIPTION
1
VDD
2
VSS
3
5
N/C
SA56606-XX
4
N/C
PIN
SYMBOL
1
VOUT
Reset High Output
DESCRIPTION
2
VDD
Positive Supply
3
VSS
Ground. Negative Supply
4
N/C
No connection
5
N/C
No connection
SL01312
Figure 2. Pin configuration.
MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDD
Power supply voltage
–0.3
12
V
VOUT
Output voltage
–
VSS – 0.3
V
IOUT
Output current
–
50
mA
Toper
Operating temperature
–40
85
°C
Tstg
Storage temperature
–40
125
°C
P
Power dissipation
–
150
mW
2001 Jun 19
3
Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
DC ELECTRICAL CHARACTERISTICS
Characteristics measured with Tamb = 25 °C, unless otherwise specified.
PARAMETER
SYMBOL
CONDITIONS
TEST
CIRCUIT
MIN.
TYP.
MAX.
UNIT
VS – 2%
VS
VS + 2%
V
VS × 0.03
VS × 0.05
VS × 0.08
V
–
±0.01
–
%/°C
VS
Reset detection threshold
∆VS
Hysteresis
VS/∆T
Threshold voltage temperature
coefficient
ICC
Supply current
VDD = VS + 1.0 V
–
0.25
1.0
µA
IOH
IDS leakage current when OFF
VDD = VDS = 10 V
–
–
0.1
µA
IDS1
N-channel IDS output sink current 1
–0.23
–1.4
–
mA
–1.6
–8.3
–
mA
–3.2
–14.7
–
mA
VDD = 0 V → VS + 1.0 V → 0 V
–40 °C ≤ Tamb ≤ +85 °C
VDS = 0.5 V; VDD = 1.2 V
IDS2
N-channel IDS output sink current 2
(for VS > 2.6 V)
VDS = 0.5 V; VDD = 2.4 V
IDS3
N-channel IDS output sink current 3
(for VS > 3.9 V)
VDS = 0.5 V; VDD = 3.6 V
2001 Jun 19
1
Fig. 17
4
2
Fig. 18
Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
TYPICAL PERFORMANCE CURVES
+0.20
0.50
I DD, SUPPLY CURRENT (mA)
0.45
VS , NORMALIZED THRESHOLD (V)
VDD = VS + 1.0 V
NORMALIZED TO 25 °C
0.40
0.35
0.30
0.25
0.20
0.15
0.10
–50
–25
0
25
50
75
100
VCC FALLING
VS NORMALIZED TO 25 °C
+0.15
+0.10
+0.05
VS
–0.05
–0.10
–0.15
–0.20
–50
125
–25
0
25
50
75
100
SL01344
SL01345
Figure 3. Supply current versus temperature.
Figure 4. Detection threshold versus temperature.
3.0
VDS = 0.5 V
VS(HYS) = VSH – VSL
(VCC RISING – VCC FALLING)
I DS , OUTPUT FET CURRENT (mA)
VS(HYS) , DETECTION HYSTERESIS (mV)
200
150
100
50
0
–50
2.5
2.0
1.5
N-CHANNEL
1.0
0.5
0
–25
0
25
50
75
100
–50
125
–25
0
Tamb, TEMPERATURE (°C)
25
50
75
100
125
Tamb, AMBIENT TEMPERATURE (°C)
SL01346
SL01317
Figure 6. Output FET current versus temperature.
Figure 5. Detection hysteresis versus temperature.
0.6
5.0
TAMB = 25 °C
TYPICAL CHARACTERISTIC.
DETECTION AND RELEASE
VOLTAGE POINTS DEPEND ON
THE SPECIFIC DEVICE TYPE.
TAMB = 25 °C
0.5
I DD , SUPPLY CURRENT ( µA)
4.0
3.0
2.0
1.0
RELEASE (VSH )
VS(HYS)
DETECTION (VSL)
VOUT , OUTPUT VOLTAGE (V)
125
Tamb, TEMPERATURE (°C)
Tamb, TEMPERATURE (°C)
0.4
0.3
0.2
0.1
0
0
0
1.0
2 .0
3.0
4.0
5.0
0
6.0
VDD, SUPPLY VOLTAGE (V)
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
VDD, SUPPLY VOLTAGE (V)
SL01348
SL01349
Figure 7. Output voltage versus supply voltage
2001 Jun 19
1.0
Figure 8. Supply current versus supply voltage
5
Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
t PHL, t PLH , PROPAGATION DELAY (µs)
105
TAMB = 25 °C
(SEE FIGURES 10 AND 11)
VS + 2.0 V
INPUT SIGNAL
104
1.2 V
VSS
103
tPHL
7.0 V
102
3.5 V
OUTPUT SIGNAL
tPLH
101
10–5
10–4
10–3
10–2
VSS
tPHL
10–1
tPLH
CL, OUTPUT LOAD CAPACITANCE (µF)
SL01350
SL01351
Figure 9. Propagation delay versus output load C
Figure 10. Propagation delay measurements
7.0 V
VDD
INPUT
SIGNAL
SA56606-XX
VSS
RPU = 100 kΩ
OUTPUT
CL = 10 pF to 0.1 µF
VSS
SL01322
Figure 11. Propagation delay measurement circuit
2001 Jun 19
6
Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
TECHNICAL DESCRIPTION
The low side N-Channel FET (TR2) establishes threshold hysteresis
by turning ON whenever the threshold comparator’s output goes to
a HIGH state (when VDD sags to or below the threshold level). TR2’s
turning ON causes additional current to flow through resistors R1 and
R2, causing the inverting input of the threshold comparator to be
pulled even lower. For the comparator to reverse its output polarity
and turn OFF TR2, the VDD source voltage must overcome this
additional pull-down voltage present on the comparator’s inverting
input. The differential voltage required to do this establishes the
hysteresis voltage of the sensed threshold voltage. Typically it is
(VS × 0.05) volts.
The SA56606-XX is a CMOS device designed to provide power
source monitoring and a system reset function in the event the
supply voltage sags below an acceptable level for the system to
reliably operate. The device is designed to generate a compatible
reset signal for a wide variety of microprocessor and logic systems.
The SA56606 can operate at voltages up to 12 volts. The series
includes several versions providing precision threshold voltage reset
values of 2.0, 2.7, 2.8, 2.9, 3.0, 3.1, 4.2, 4.6 and 4.7 V. The reset
threshold incorporates a typical hysteresis of (VS × 0.05) volts to
prevent erratic resets from being generated.
The output of the SA56606 utilizes a low side open drain topology,
which requires an external pull-up resistor (RPU) to the VDD power
source. Although this may be regarded as a disadvantage, it is an
advantage in many sensitive applications because the open drain
output cannot source reset current to a microprocessor when both
are operated from a common supply. For this reason the SA56606
offers a safe inter-connect to a wide variety of microprocessors.
When the VDD voltage sags, and is at or below the Detection
Threshold (VSL), the device will assert a Reset LOW output at or
very near ground potential. As the VDD voltage rises from
(VDD < VSL) to VSH or higher, the Reset is released and the output
follows VDD. Conversely, decreases in VDD from (VDD > VSL) to VSL
or lower cause the output to be pulled to ground.
The SA56606 operates at very low supply currents, typically
0.25 µA, while offering a high precision of threshold detection (±2%).
Figure 12 is a functional block diagram of the SA56606. The internal
reference source voltage (VREF) is typically 0.8 V over the operating
temperature range. The reference voltage is connected to the
non-inverting input of the threshold comparator, while the inverting
input monitors the supply voltage through a resistor divider network
made up of R1, R2, and R3. The output of the threshold comparator
drives the output Open Drain N-Channel FET of the device TR1).
When the supply voltage sags to the threshold detection voltage, the
resistor divider network supplies a voltage to the inverting input of
the threshold comparator, which is less than that of VREF, causing
the output of the comparator to go to a HIGH output state. This
causes the low side N-Channel FET to be active ON, pulling its
drain voltage to a LOW state. The device adheres to a true
input/output logic protocol: the output goes LOW when input is LOW
(below threshold) and output goes HIGH when input is HIGH (above
threshold).
VDD
Hysteresis Voltage = Release Voltage – Detection Threshold Voltage
VHYS = VSH – VSL
where:
VSH = VSL + VHYS ≅ VREF(R1 + R2) / R2
VSL = VREF(R1 + R2 + R3) / (R2 + R3)
When VDD drops to levels below the minimum operating voltage,
typically less than 0.95 volts, the output is undefined and output
reset LOW assertion is not guaranteed. At this level of VDD the
output will try to rise to VDD.
The VREF voltage is typically 0.8 V. The devices are fabricated using
a high resistance CMOS process and utilize high resistance R1, R2,
and R3 values requiring very small amounts of current. This
combination achieves very efficient low power performance over the
full operating temperature.
2
SA56606-XX
1
R1
VOUT
TR1
VREF
R
R2
TR2
R3
VSS
3
SL01323
Figure 12. Functional diagram.
2001 Jun 19
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Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
Timing diagram
D–E: Between ‘D’ and ‘E’, VDD starts rising.
The timing diagram shown in Figure 13 depicts the operation of the
device. Letters A–J on the TIME axis indicate specific events.
E: At ‘E’, VDD rises to the VSH. Once again, the device releases
the hold on the VOUT reset. The Reset output VOUT tracks VDD as it
rises above VSH.
A: At ‘A’, VDD begins to increase. Also the VOUT voltage initially
increases but abruptly decreases when VDD reaches the level
(approximately 0.8 V) that activates the internal bias circuitry and
RESET is asserted.
F–G: At ‘F’, VDD is above the upper threshold and begins to fall,
causing VOUT to follow it. As long as VDD remains above the VSH,
no reset signal will be triggered. Before VDD falls to the VSH, it
begins to rise, causing VOUT to follow it. At ‘G’, VDD returns to
normal.
B: At ‘B’, VDD reaches the threshold level of VSH. At this point the
device releases the hold on the VOUT reset. The Reset output VOUT
tracks VDD as it rises above VSH (assuming the reset pull-up resistor
RPU is connected to VDD). In a microprocessor based system these
events release the reset from the microprocessor, allowing the
microprocessor to function normally.
H: At event ‘H’ VDD falls until the VSL undervoltage detection
threshold point is reached. At this level, a RESET signal is
generated and VOUT goes LOW.
C–D: At ‘C’, VDD begins to fall, causing VOUT to follow. VDD
continues to fall until the VSL undervoltage detection threshold is
reached at ‘D’. This causes a reset signal to be generated (VOUT
Reset goes LOW).
J: At ‘J’ the VDD voltage has decreased until normal internal circuit
bias is unable to maintain a VOUT reset. As a result, VDD may rise to
less than 0.8 V. As VDD decreases further, VOUT reset also
decreases to zero.
∆VS
VSH
VSL
VDD
0
VOUT
0
A
B
C
D
E
F
G
H
J
TIME
SL01354
Figure 13. Timing diagram.
2001 Jun 19
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Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
Application information
VDD
SUPPLY
R11
VDD
RPU
CURRENT CHANGES
RPU
CPU
A
SA56606-XX
VOUT
RESET
VDD
VSUPPLY
R12
SA56606-XX
OUTPUT
VSS
VSS
GND
SL01371
SL01373
Figure 14. Conventional reset application.
Figure 16. High impedance supply operating problems.
The Power ON Reset Circuit shown in Figure 15 is an example of
how to obtain a stable reset condition upon power-up. If the power
supply voltage rises abruptly, the RESET may go HIGH momentarily
when VDD is below the minimum operating voltage (0.95 V). To
overcome this, a resistor (R) is placed between positive supply and
the VDD pin with a capacitor from the VDD pin to ground.
Significant voltage variations of VDD may occur when the device is
operated from high impedance power sources. When the device
asserts or releases a reset, VDD variations are produced as a result
of the voltage drop developed across R11 due to the current
variations through the resistor R11 (representing the supply
impedance). If the VDD variations are large, such that they exceed
the Detection Hysteresis, the output of the device can oscillate from
a HIGH state to a LOW state. The user should avoid using high
impedance VDD sources to prevent such situations.
VDD
SUPPLY
R
D
VDD
RPU
SA56606-XX
CPU
RESET
VOUT
C
VSS
GND
SL01372
Figure 15. Power ON reset circuit.
2001 Jun 19
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Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
Test circuits
A
VDD
VDD
V
VDD
RPU
100 kΩ
SA56606-XX
VDD
V
VOUT
SA56606-XX
A
VOUT
VDS
V
VSS
VSS
SL01374
SL01375
Figure 17. Test circuit 1.
Figure 18. Test circuit 2.
PACKING METHOD
The SA56606-XX is packed in reels, as shown in Figure 19.
GUARD
BAND
TAPE
REEL
ASSEMBLY
TAPE DETAIL
COVER TAPE
CARRIER TAPE
BARCODE
LABEL
BOX
SL01305
Figure 19. Tape and reel packing method
2001 Jun 19
10
Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
SOT23-5: plastic small outline package; 5 leads; body width 1.5 mm
1.35
2001 Jun 19
1.2
1.0
0.025
0.55
0.41
0.22
0.08
3.00
2.70
1.70
1.50
0.55
0.35
11
Philips Semiconductors
Product data
CMOS system reset
SA56606-XX
Data sheet status
Data sheet status [1]
Product
status [2]
Definitions
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be
published at a later date. Philips Semiconductors reserves the right to change the specification
without notice, in order to improve the design and supply the best possible product.
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply.
Changes will be communicated according to the Customer Product/Process Change Notification
(CPCN) procedure SNW-SQ-650A.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on
the Internet at URL http://www.semiconductors.philips.com.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 2001
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 06-01
Document order number:
2001 Jun 19
12
9397 750 08451