PHILIPS SAA7219HS

INTEGRATED CIRCUITS
DATA SHEET
SAA7219
MPEG2 Transport RISC processor
Preliminary specification
File under Integrated Circuits, IC02
1999 Sep 20
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
SAA7219
CONTENTS
1
FEATURES
1.1
1.2
1.3
External interfaces
CPU related features
MPEG-2 systems features
2
GENERAL DESCRIPTION
2.1
2.2
SAA7219 overview
SAA7219 in a DVB system
3
ORDERING INFORMATION
4
BLOCK DIAGRAM
5
PINNING INFORMATION
5.1
5.2
Pinning
Pin description
6
APPLICATION INFORMATION
6.1
Memory configurations
7
PACKAGE OUTLINE
8
SOLDERING
8.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
8.2
8.3
8.4
8.5
9
DEFINITIONS
10
LIFE SUPPORT APPLICATIONS
11
PURCHASE OF PHILIPS I2C COMPONENTS
1999 Sep 20
2
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
1
SAA7219
FEATURES
• Conditional access descrambling Digital Video
Broadcasting (DVB) compliant and MULTI2 compliant
• Stream demultiplexing: Transport Stream (TS),
Packetized Elementary Stream (PES), program and
proprietary streams
• A General Purpose/High Speed (GP/HS) interface
supporting stream recording through IEEE 1394
interface IC
• Internal 32-bit MIPS RISC based Central Processing
Unit (CPU) supporting MIPS16 instruction set and
running at 81 MHz
• An extended JTAG interface for board test support.
• Low-power sleep modes supported across the chip
• Comprehensive driver software and development tool
support
1.2
CPU related features
• Package: SQFP208.
The SAA7219 contains an embedded RISC CPU, which
incorporates the following features:
1.1
• A 32-bit PR3930 core running at 81 MHz
External interfaces
• 8-kbyte, 2-way set associative instruction cache
• Versatile compressed stream input at 108 Mbits/s
• 4-kbyte, 4-way set associative data cache
• A 32-bit microcontroller extension bus supporting
DRAM, SDRAM, Flash, (E)PROM and external memory
mapped I/O devices. It also supports a synchronous
interface to communicate with the integrated MPEG
Audio Video Graphics Decoder (AVGD) SAA7215 at
40.5 Mbytes.
• A programmable Low-power mode, including wake-up
on interrupt
• A memory management unit with 32 odd/even entries
and variable page sizes
• Multiply/accumulate/divide unit with fast
multiply/accumulate for 16-bit and 32-bit operands
• An IEEE 1284 interface (Centronics) supporting master
and slave modes. Usable as a general purpose port.
• Two fully independent 24-bit timers and one 24-bit timer
including watchdog facilities
• An interface to IEEE 1394 devices (such as Philips
PDI 1394 chip-set)
• A real-time clock unit (active in Sleep mode)
• Two UART (RS232) data ports with Direct Memory
Access (DMA) capabilities (187.5 kbits/s) including
hardware flow control signals RXD, TXD, RTS and CTS
for modem support
• Built-in software debug support unit as part of Extended
Enhanced JTAG debug interface
• On-chip SRAM of 4 kbytes for storing code which needs
fast execution.
• A Synchronous Serial Interface (SSI) to connect an
off-chip modem analog front-end
1.3
• An elementary UART with DMA capabilities, dedicated
to front panel devices for instance
• Hardware based parsing of Transport Stream (TS),
Philips Semiconductors program and proprietary
software data streams. Maximum input rate is
108 Mbits/s.
• Two dedicated smart-card reader interfaces (ISO 7816
compatible) with DMA capabilities
• Two I2C-bus master/slave transceivers with DMA
capabilities, supporting the standard (100 kbit/s) and
fast (400 kbits/s) I2C-bus modes
• A real-time descrambler consisting of 3 modules:
– A control word bank containing 14 pairs (odd, even)
of control words and a default control word
• 32 general purpose, bidirectional I/O interface pins, 8 of
which may also be used as interrupt inputs
– The DVB descrambler core implementing the stream
decipher and block decipher algorithms
• One Pulse Width Modulated (PWM) output with 8-bit
resolution
1999 Sep 20
MPEG-2 systems features
– The MULTI2 descrambler algorithm implementing
the CBC and OFB mode descrambling functions.
3
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
SAA7219
• Hardware section filtering based on 32 different Packet
Identifiers (PIDs) with a flexible number of filter
conditions (8 or 4-byte condition plus 8 or 4-byte mask)
per PID and a total filter capacity of 40 (8-byte condition
checks) or up to 80 (4-byte condition checks) filter
conditions:
The SAA7219 receives transport streams through a
versatile stream input interface capable of handling both
byte-parallel and bit-serial streams in various formats,
supporting data streams up to and including 13.5 Mbyte/s
(108 Mbits/s). The stream data is first applied to an on-chip
descrambler incorporating a DVB descrambling algorithm,
on the basis of 14 control word pairs stored in on-chip
RAM. Demultiplexing is subsequently applied to the
stream, to separate up to 32 individual data streams.
– 4 TS/PES filters for retrieval for data at TS or PES
level for applications such as subtitling, TXT or
retrieval of private data
The demultiplexer section includes clock recovery and
timebase management. Program Specific Information
(PSI), Service Information (SI), Conditional Access (CA)
messages and private data are selected and stored in
external memory, for subsequent off-line processing by
the internal PR3930 CPU core.
– Flexible DMA based storage of the 32 section
substreams and 4 TS/PES data substreams in the
external memory
• System time base management with a double counter
mechanism for clock control and discontinuity handling,
2 Presentation Time Stamp (PTS)/Decoding Time
Stamp (DTS) timers
To support advanced board testing facilities the SAA7219
includes boundary scan test hardware, according to the
EJTAG standard. The device features a Low-power sleep
mode, which is capable of sustaining set-top box stand-by
functionality, thus eliminating the need for a separate
front-panel controller. The SAA7219 requires a supply
voltage of 3.3 V and most devices input and output
interfaces are 5 V tolerant except the extension bus which
is 3.3 V only. The SAA7219 is mounted in a SQFP208
package.
• A GP/HS filter which can serve as an alternate input
from for example IEEE 1394 devices. The IEEE 1394
GP/HS mode supports packet insertion and has an
internal SRAM for storing 2 packets. It can also output
either scrambled or descrambled TS to IEEE 1394
devices.
2
GENERAL DESCRIPTION
2.1
SAA7219 overview
2.2
The device is part of a comprehensive source decoding kit
which contains all the hardware and software required to
receive and decode MPEG-2 transport streams, including
descrambling, demultiplexing. In addition, it includes a
PR3930 core which is a 32-bit MIPS RISC-based CPU
core supporting the MIPS 16 instruction set to reduce
memory requirements and several peripheral interfaces
such as UARTs, I2C-bus units, an IEC 1883, and an
IEEE 1284 (Centronics) interface. The SAA7219 is
therefore capable of performing all controller tasks in
digital television receiver applications such as set-top
boxes. Furthermore, the SAA7219 is compliant to DVB
and MULTI2 standards.
3
SAA7219 in a DVB system
The SAA7219 has been designed to offer optimum
performance when used with the SAA7215 for MPEG-2e
AVG decoding.
• Synchronous bus interface transfer at 40.5 MHz on
16 bits
• SAA7215 has one dedicated SDRAM for MPEG-2e
audio video handling and one for graphics and CPU
data. The second memory offers high bandwidth and
low latency to the SAA7219 when accessing it to
download graphics or executing some applications. This
enables a high level of performance together with a low
system cost by having one SDRAM for graphics and
CPU data.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
SAA7219HS
1999 Sep 20
DESCRIPTION
SQFP208 plastic shrink quad flat package; 208 leads (lead length 1.3 mm);
body 28 × 28 × 3.4 mm
4
VERSION
SOT316-1
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CPU section
demultiplexer descrambler section
MIPS
PR3930
CORE
INPUT
INTERFACE
PID
FILTER
DATA CACHE
DESCRAMBLER
DVB AND MULTI2
AV
FILTER
MPEG system-bus
AUDIO AND
VIDEO
INTERFACE
AVD
interface
INSTRUCTION CACHE
GP/HS
INTERFACE
1394 GATEWAY
TIMER 1
PCR
PROCESSING
TS/PES
FILTERS
FILTER DMA
CONTROLLER
TIMER 2
MPEG SYSTEM
GATEWAY
TIMER 3 (WATCHDOG)
DSU
SECTION
FILTERS
M
MPEG SYSTEM
INT.HANDLER
MMU
Reset
EJTAG
MPEG2 Transport RISC processor
BLOCK DIAGRAM
PWM
Philips Semiconductors
4
l pagewidth
1999 Sep 20
input
stream
output
stream
Clock
5
PI-bus
S
PI-BUS
CTRL
S
EXTENSION BUS
CONTROLLER
M
M
CARD READER
0
1
UART
2 0 1
M
SSI
S
PIO
INTERFACE
S
I2C
0
1
M
1284
S
RTC
32 KHz
S
INTERRUPT
CONTROLLER
S
4-KBYTE
SRAM
JTAG
peripheral section
FCE374
external
bus interface
32-bit PIO
smart card
interface
UART and SSI
connections
SCL and 1284 bus
SDA lines
Fig.1 Block diagram.
SAA7219
M = master peripheral with embedded DMA channel
S = slave peripheral
Preliminary specification
JTAG interface
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
Pinning
handbook, halfpage
157
5.1
PINNING INFORMATION
208
5
SAA7219
156
1
SAA7219
104
105
53
52
Fig.2 Pin configuration
1999 Sep 20
6
FCE380
Table 1
SQFP208 package: 179 functional pins and 29 power supply pins
SYMBOL
BUFFER TYPE
VOLT(1)
PIN
I/O
DESCRIPTION
PIO0 to PIO7
105 to 112
I/O
bidirectional, 3 mA output drive 5 V
usable as interrupt inputs and/or I/O lines
PIO8/BOOTIS32
113
I/O
bidirectional, 3 mA output drive 5 V
PIO bit and PIO-strap. At power-on, it indicates the
data bus size of the booting device.
PIO9/BOOTIS16
114
I/O
bidirectional, 3 mA output drive 5 V
PIO bit and PIO-strap. At power-on, if BOOTIS32 is
LOW, it indicates if the system should reboot from a
16-bit or 8-bit device.
PIO10 to PIO15
116 to 121
I/O
bidirectional, 3 mA output drive 5 V
PIO bit and PIO-strap
PIO(31:16)/D(31:16)
2, 4 to 9, 11 to 16, I/O
18 to 20
bidirectional, 6 mA output drive 5 V
I/O lines or upper 16-bit data bus. The data bus
width of the booting device is automatically
configured at power-on.
D15 to D0
21, 22, 24, 25,
I/O
28 to 30, 33 to 36,
38 to 41
bidirectional, 8 mA output drive 3.3 V
lower 16-bit data bus
A0 to A21
63 to 65, 67 to 71, O
73 to 77, 81 to 85,
87 to 90
8 mA output drive
3.3 V
address bus
RAS0N
49
8 mA output drive
3.3 V
row access strobe for DRAM and SDRAM Bank 0
PIO interface (32 pins)
Extension bus (58 pins)
7
O
48
O
8 mA output drive
3.3 V
row access strobe for DRAM and SDRAM Bank 1
LCASN
46
O
8 mA output drive
3.3 V
column access strobe lower byte
MLCASN
43
O
8 mA output drive
3.3 V
column access strobe mid lower byte
MUCASN
44
O
8 mA output drive
3.3 V
column access strobe mid upper byte
UCASN
42
O
8 mA output drive
3.3 V
column access strobe upper byte
WEN
62
O
8 mA output drive
3.3 V
write enable
DCS0N
47
O
8 mA output drive
3.3 V
chip select for SDRAM Bank 0
50 to 56
O
8 mA output drive
3.3 V
chip select
OEN
58
O
8 mA output drive
3.3 V
output enable
DTACKN
59
I
TTL input
5V
Data termination acknowledge. Asserted LOW by
the peripheral when the data bus is valid.
CS_SDN
60
O
2 mA output drive
3.3 V
selects the graphics SDRAM memory space of the
SAA7215
SAA7219
CS6N to CS0N
Preliminary specification
RAS1N/DCS1N
Philips Semiconductors
Pin description
MPEG2 Transport RISC processor
1999 Sep 20
5.2
I/O
BUFFER TYPE
VOLT(1)
DESCRIPTION
CS_RGN
61
O
2 mA output drive
3.3 V
selects the control registers of the SAA7215
CLK
91
O
8 mA output drive
3.3 V
40.5 MHz clock
RXD0
141
I
TTL input
5V
UART 0 receive data line or receive serial data
TXD0
142
O
2 mA output drive
3.3 V
UART 0 transmit data line or transmit serial data
RTSN0
143
O
2 mA output drive
3.3 V
UART 0 request to send or Frame synchronization
reference of the SSI interface
CTSN0
144
I
TTL input
5V
UART 0 clear to send or serial I/O interface clock of
the SSI interface
UART 0 interface (4 pins)
UART 1 and SSI interfaces (4 pins)
137
I
TTL input
5V
UART 1 receive data line or receive serial data of
the SSI interface
TXD1/V34_TXD
138
O
2 mA output drive
3.3 V
UART 1 transmit data line or transmit serial data of
the SSI interface
RTSN1/V34_FS
139
I/O
bidirectional, 3 mA output drive 5 V
UART 1 request to send (output) or frame
synchronization reference of the SSI interface
(input)
CTSN1/V34_CLK
140
I
TTL input
5V
UART 1 clear to send or serial input interface clock
of the SSI interface (up to 3.375 MHz)
MCLK
146
O
2 mA output drive
3.3 V
master clock for the SSI interface (36.684 MHz)
RXD2
135
I
TTL input
5V
UART 2 receive data line
TXD2
136
O
2 mA output drive
3.3 V
UART 2 transmit data line
8
RXD1/V34_RXD
Philips Semiconductors
PIN
MPEG2 Transport RISC processor
1999 Sep 20
SYMBOL
UART 2 interface (2 pins)
I2C-bus 0 interface (2 pins)
149
I/O
bidirectional with open-drain
8 mA output drive
5V
I2C-bus 0 clock line
SDA0
150
I/O
bidirectional with open-drain
8 mA output drive
5V
I2C-bus 0 data line
SAA7219
Preliminary specification
SCL0
I/O
BUFFER TYPE
VOLT(1)
DESCRIPTION
I2C-bus 1 interface (2 pins)
SCL1
147
I/O
bidirectional with open-drain
8 mA output drive
5V
I2C-bus 1 clock line
SDA1
148
I/O
bidirectional with open-drain
8 mA output drive
5V
I2C-bus 1 data line
Smart card 0 interface (5 pins)
CLK_CARD0
128
O
2 mA output drive
3.3 V
ISO UART 0 card clock
CMDVCCN0
129
O
2 mA output drive
3.3 V
ISO UART 0 Command of the VCC
RSTIN0
132
O
2 mA output drive
3.3 V
ISO UART 0 Reset of the card
OFFN0
133
I
TTL input
5V
ISO UART 0 Card presence
SC_I/O0
134
I/O
bidirectional with open-drain
8 mA output drive
5V
ISO UART 0 I/O line
Smart card 1 interface (5 pins)
9
CLK_CARD1
122
O
2 mA output drive
3.3 V
ISO UART 1 card clock
CMDVCCN1
123
O
2 mA output drive
3.3 V
ISO UART 1 Command of the VCC
RSTIN1
124
O
2 mA output drive
3.3 V
ISO UART 1 Reset of the card
OFFN1
125
I
TTL input
5V
ISO UART 1 Card presence
SC_I/O1
126
I/O
bidirectional with open-drain
8 mA output drive
5V
ISO UART 1 I/O line
Philips Semiconductors
PIN
MPEG2 Transport RISC processor
1999 Sep 20
SYMBOL
Input Stream interface (11 pins)
PKTSTROBE
154
I
TTL input
5V
byte strobe or bit strobe
PKTSYNC
155
I
TTL input
5V
packet synchronization
PKTVALID
156
I
TTL input
5V
data valid, or bit stream word select
I
TTL input
5V
8-bit primary TS data input
PKTDATA7 to PKTDATA0 157 to 164
GP/HS interface (11 pins)
I/O
bidirectional, 3 mA output drive 5 V
GP/HS data bus
GPVALID
175
I/O
bidirectional, 3 mA output drive 5 V
GP/HS control lines
GPSYNC
176
I/O
bidirectional, 3 mA output drive 5 V
GP/HS control lines
GPSTROBE
177
I/O
bidirectional, 3 mA output drive 5 V
GP/HS control lines
Preliminary specification
166 to 169,
171 to 174
SAA7219
GPDATA7 to GPDATA0
I/O
BUFFER TYPE
VOLT(1)
DESCRIPTION
SAA7215 MPEG interface (11 pins)
V_STROBE
93
O
2 mA output drive
3.3 V
HIGH-to-LOW transition strobes the video data in
the AV_DATA stream
A_STROBE
94
O
2 mA output drive
3.3 V
HIGH-to-LOW transition strobes the audio data in
the AV_DATA stream
AV_ERROR
95
O
2 mA output drive
3.3 V
flag for bit stream error (active HIGH)
AV_DATA7 to AV_DATA0
96 to 103
O
2 mA output drive
3.3 V
MPEG audio/video stream output port
IEEE 1284 interface (18 pins)
GPD0 to GPD7
190 to 197
I/O
bidirectional, 3 mA output drive 5 V
parallel data bus
NSELECTIN
199
I/O
bidirectional, 3 mA output drive 5 V
host to peripheral select line
NINIT
200
I/O
bidirectional, 3 mA output drive 5 V
host to peripheral control line
NSTROBE
201
I/O
bidirectional, 3 mA output drive 5 V
host to peripheral strobe line
NACK
202
I/O
bidirectional, 3 mA output drive 5 V
peripheral acknowledge line
BUSY
203
I/O
bidirectional, 3 mA output drive 5 V
peripheral busy line
10
PERROR
204
I/O
bidirectional, 3 mA output drive 5 V
peripheral error line
SELECT
205
I/O
bidirectional, 3 mA output drive 5 V
peripheral on-line
NAUTOF
206
I/O
bidirectional, 3 mA output drive 5 V
host to peripheral control line
NFAULT
207
I/O
bidirectional, 3 mA output drive 5 V
peripheral error line
DIR1284
208
O
2 mA output drive
3.3 V
direction control of the external buffers
165
O
open-drain 8 mA output drive
5V
open-drain 5 V tolerant for VCXO control
RESETN
1
I/O
bidirectional with open-drain
8 mA output drive and Schmitt
trigger input with high
hysteresis
3.3 V
General system reset; active LOW. The pad is
bidirectional with an open-drain which is asserted
LOW when the internal watchdog time out is
detected.
XTAL1
153
I
3.3 V
13.5 MHz crystal input
XTAL2
152
O
3.3 V
13.5 MHz crystal output
Philips Semiconductors
PIN
MPEG2 Transport RISC processor
1999 Sep 20
SYMBOL
PWM interface (1 pin)
PWM0
System interface (3 pins)
Preliminary specification
SAA7219
I/O
BUFFER TYPE
VOLT(1)
DESCRIPTION
JTAG and Test interface (5 pins)
TDO
178
O
3-state, 2 mA output drive
3.3 V
Test data output/Target PC output.
Real-Time Trace mode off. Serial output data is
shifted from JTAG instruction register to the TDO
pin at the falling of the TCK clock. When no data is
shifted out, TDO is 3-stated.
Real-Time Trace mode on. TDO provides
non-sequential program counter output at the
processor clock speed.
TDI
179
I
TTL input
5V
Test data input/Debug interrupt.
Real-Time Trace mode off. Serial input data (TDI) is
shifted into the JTAG instruction register or data
register on the rising edge of the TCK clock,
depending of the TAP controller state.
11
Real-Time Trace mode on. An active LOW level at
this input sampled by TCK positive edge, is used as
interrupt to switch the Real-Time Trace mode off
(standard JTAG).
TMS
180
I
TTL input
5V
Test mode select. This input is decoded by the TAP
controller to control test operation. Sampled on
TCK rising edge.
TRST
181
I
TTL input
5V
Test reset. Active LOW level for asynchronous reset
of the EJTAG module, independent of the processor
logic.
TCK
184
I
TTL input
5V
Test clock. Input clock used to shift data into or out
the JTAG instruction or data register.
Philips Semiconductors
PIN
MPEG2 Transport RISC processor
1999 Sep 20
SYMBOL
EJTAG extension reserved for PR3930 (4 pins)
O
2 mA output drive
3.3 V
DSU clock is equivalent to the processor clock.
Captures address and data from pin TDO when PC
trace mode is on. Is 3-stated when bit 0 or 15 of the
JTAG Control Register is logic 0.
PCST0 to PCST2
186, 188, 189
O
2 mA output drive
3.3 V
CPU status: debug mode, pipeline stall, occurrence
of exception
Preliminary specification
185
SAA7219
DSU_CLK
I/O
BUFFER TYPE
VOLT(1)
DESCRIPTION
Supplies (29 pins)
VDD(P)
3, 17, 31, 43, 66,
80, 92, 115, 145,
187
−
−
−
pad supply voltage
VSS(P)
10, 23, 37, 57, 72,
86, 104, 127, 170,
198
−
−
−
ground supply
VDD(C)
27, 79, 130, 182
−
−
−
core supply voltage
VSS(C)
26, 78, 131, 183
−
−
−
ground supply
VDD(PLL)
151
−
−
−
analog supply for the on-chip PLLs
Note
1. 5 V tolerant inputs can receive signals swinging between VSS and 3.3 V or VSS and 5 V. 5 V tolerant bidirectional I/O pins can receive signals
swinging between VSS and 3.3 V or VSS and 5 V when they are inputs and swing between VSS and VDD when they are outputs.
Philips Semiconductors
PIN
MPEG2 Transport RISC processor
1999 Sep 20
SYMBOL
12
Preliminary specification
SAA7219
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
6
SAA7219
APPLICATION INFORMATION
RF in
handbook, full pagewidth
TDA8060
TDA5056
TUNER
2
SAA8044
(SDD)
I2C-bus
MPEG TS
FRONT
PANEL
CONTROL
Telecommunication i/f
VXX
MODEM
Smart cards
TDA8004
SAA7219
BUFFERS
IEEE 1384
RS232
IEEE 1394
L + PHY
IEEE 1394
FLASH
AV PES
DRAM
(OPTIONAL)
16-MBIT
SDRAM
FCE375
SAA7215
CVBS/YC
LR
A DAC
RGB
16-MBIT
SDRAM
(OPTIONAL)
SWITCHING
SCART1 SCART2 SCART3
Fig.3 Set-top box example.
1999 Sep 20
13
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
6.1
SAA7219
Memory configurations
Table 2
Low-end and high-end memory configurations
CONFIGURATION
FLASH
PERIPHERALS
SDRAM
DRAM
Low-end
1M × 16
256K × 16
512K × 8
−
High-end
up to 2 banks of 64 Mbits
up to 2 banks of 4 Mbytes
up to 4 Mbytes
2 to 7 banks of up
to 4 Mbytes
16
DRAM/
SDRAM
PROM
8
PROM
FLASH
RESERVED
SAA7219
16
16
SAA7215
SDRAM
(MPEG)
FCE376
Fig.4 Typical low-end memory configuration.
16
8
PROM
DRAM
SAA7219
16
16
SAA7215
16
FLASH 1
SDRAM
(MPEG)
SDRAM
GRAPHICS
FCE377
Fig.5 Typical high-end unified memory configuration.
1999 Sep 20
14
FLASH 2
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
7
SAA7219
PACKAGE OUTLINE
SQFP208: plastic shrink quad flat package;
208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm
SOT316-1
c
y
X
A
156
157
105
104
ZE
e
E HE
A
A2
A1
(A 3)
wM
θ
Lp
bp
L
pin 1 index
208
detail X
53
52
1
ZD
wM
bp
e
v M A
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
4.10
0.50
0.25
3.6
3.2
0.25
0.27
0.17
0.20
0.09
28.1
27.9
28.1
27.9
0.5
30.9
30.3
30.9
30.3
1.3
0.75
0.45
0.2
0.08
0.08
Z D (1) Z E (1)
θ
1.39
1.11
8
0o
1.39
1.11
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT316-1
1999 Sep 20
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-08-01
99-09-08
MS-029FA1
15
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
8
8.1
SAA7219
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
SOLDERING
Introduction to soldering surface mount
packages
• For packages with leads on two sides and a pitch (e):
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
8.2
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
8.3
8.4
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Sep 20
Manual soldering
16
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
8.5
SAA7219
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Sep 20
17
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
9
SAA7219
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
10 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
11 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Sep 20
18
Philips Semiconductors
Preliminary specification
MPEG2 Transport RISC processor
SAA7219
NOTES
1999 Sep 20
19
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SCA 68
© Philips Electronics N.V. 1999
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Printed in The Netherlands
545004/01/pp20
Date of release: 1999
Sep 20
Document order number:
9397 750 05378