PHILIPS PCK2510SLDH

INTEGRATED CIRCUITS
PCK2510SL
50–150 MHz 1:10 SDRAM clock driver
Product specification
ICL03 — PC Motherboard ICs; Logic Products Group
2000 Dec 01
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
independent of the duty cycle at CLK. All outputs can be enabled or
disabled via a single output enable input. When the G input is high,
the outputs switch in phase and frequency with CLK; when the G
input is low, the outputs are disabled to the logic-low state.
FEATURES
• Phase-Locked Loop Clock distribution for
PC100/PC133 SDRAM applications
• When outputs are disabled, the PLL and feedback output are
Unlike many products containing PLLs, the PCK2510SL does not
require external RC networks. The loop filter for the PLL is included
on-chip, minimizing component count, board space, and cost.
disabled, dropping AICC to 100 µA in stand-by mode when input
clock signal is present.
• See PCK2510SA for JEDEC compliant option where PLL remains
Because it is based on PLL circuitry, the PCK2510SL requires a
stabilization time to achieve phase lock of the feedback signal to the
reference signal. This stabilization time is required, following power
up and application of a fixed-frequency, fixed-phase signal at CLK,
and following any changes to the PLL reference. The PLL can be
bypassed for test purposes by strapping AVCC to ground.
locked when outputs are disabled.
• Spread Spectrum clock compatible
• Operating frequency 50 to 150 MHz
• (tphase error – jitter) at 100 to133 MHz = ±50 ps
• Jitter (peak-peak) at 100 to 133 MHz = ± 80 ps
• Jitter (cycle-cycle) at 100 to 133 MHz = 65 ps
• Pin-to-pin skew < 200 ps
• Available in plastic 24-Pin TSSOP
• Distributes one clock input to one bank of ten outputs
• External Feedback (FBIN) terminal Is used to synchronize the
The PCK2510SL is characterized for operation from 0 °C to +70 °C.
PIN CONFIGURATION
outputs to the clock input
• On-Chip series damping resistors
• No external RC network required
• Operates at 3.3 V
• See page 7 for Characteristic curves.
AGND
1
24 CLK
VCC
2
23 AVCC
1Y0
3
22 VCC
1Y1
4
21 1Y9
1Y2
5
20 1Y8
GND
6
19 GND
GND
7
18 GND
1Y3
8
17 1Y7
1Y4
9
16 1Y6
VCC 10
15 1Y5
G 11
14 VCC
FBOUT 12
DESCRIPTION
13 FBIN
SW00382
The PCK2510SL is a high-performance, low-skew, low-jitter,
phase-locked loop (PLL) clock driver. It uses a PLL to precisely
align, in both frequency and phase, the feedback (FBOUT) output to
the clock (CLK) input signal. It is specifically designed for use with
synchronous DRAMs. The PCK2510SL operates at 3.3 V VCC and
is input compatible with both 2.5 V and 3.3 V input voltage ranges. It
also provides integrated series damping resistors that make it ideal
for driving point-to-point loads.
One bank of ten outputs provides ten low-skew, low-jitter copies of
CLK. Output signal duty cycles are adjusted to 50 percent,
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
ORDER CODE
DRAWING NUMBER
24-Pin Plastic TSSOP
0 °C to +70 °C
PCK2510SLDH
SOT355-1
2000 Dec 01
2
853–2231 25137
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
PIN DESCRIPTIONS
PIN NUMBER
SYMBOL
TYPE
NAME, FUNCTION, and DIRECTION
1
AGND
GND
Analog ground. AGND provides the ground reference for the analog circuitry.
2, 10, 14, 22
VCC
PWR
Power supply
3, 4, 5, 8, 9,
15, 16, 17, 20, 21
1Y (0–9)
OUT
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 1Y (0–9) is enabled
via the G input. These outputs can be disabled to a logic-low state by de-asserting the G control
input. Each output has an integrated 25 Ω series-damping resistor.
6, 7, 18, 19
GND
GND
Ground
11
G
IN
Output bank enable. G is the output enable for outputs 1Y (0–9). When G is LOW, outputs 1Y
(0–9) are disabled to a logic LOW state. When G is HIGH, all outputs 1Y (0–9) are enabled and
switch at the same frequency as CLK.
12
FBOUT
OUT
Feedback output. FBOUT is dedicated for external feedback. It switches at the same frequency
as CLK. When externally wired to FBIN, FBOUT completes the feedback loop of the PLL.
FBOUT has an integrated 25 Ω series-damping resistor.
13
FBIN
IN
Feedback input. FBIN provides the feedback signal to the internal PLL. FBIN must be
hard-wired to FBOUT to complete the PLL. The integrated PLL synchronizes CLK and FBIN so
that there is nominally zero phase error between CLK and FBIN.
23
AVCC
PWR
Analog power supply. AVCC provides the power reference for the analog circuitry. In addition,
AVCC can be used to bypass the PLL for test purposes. When AVCC is strapped to ground, PLL
is bypassed and CLK is buffered directly to the device outputs.
24
CLK
Clock input. CLK provides the clock signal to be distributed by the PCK2510SL clock driver.
CLK is used to provide the reference signal to the integrated PLL that generates the clock
output signals. CLK must have a fixed frequency and fixed phase for the PLL to obtain phase
lock. Once the circuit is powered up and a valid CLK signal is applied, a stabilization time is
required for the PLL to phase lock the feedback signal to its reference signal.
IN
FUNCTION TABLE
INPUTS
G
OUTPUTS
CLK
1Y (0–9)
X
L
L
L
L
H
L
H
H
H
H
H
2000 Dec 01
FBOUT
3
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
FUNCTIONAL BLOCK DIAGRAM
G
11
3
4
5
8
9
15
16
17
CLK
FBIN
1Y1
1Y2
1Y3
1Y4
1Y5
1Y6
1Y7
24
20
PLL
13
21
AVCC
1Y0
1Y8
1Y9
23
12
FBOUT
SDRAM
SDRAM
SDRAM
SDRAM
SDRAM
SDRAM
SDRAM
SDRAM
SDRAM
SW00383
FRONT SIDE
A[L]VC
A[L]VC
A[L]VC
PCK2510SL
The PLL clock distribution device and A[L]VC registered drivers reduce
signal loads on the memory controller and prevent timing delays and
waveform distortions that would cause unreliable operation.
SW00441
2000 Dec 01
4
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
ABSOLUTE MAXIMUM RATINGS 1, 3
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
AVCC
Supply voltage range
VCC
Supply voltage range
LIMITS
CONDITION
MIN
Note 2
MAX
< VCC + 0.7
–0.5
IIK
Input clamp current
VI < 0
VI
Input voltage range
Note 3
IOK
Output clamp current
VO > VCC or VO < 0
VO
Output voltage range
Notes 3, 4
IO
DC output source or sink current
TSTG
Storage temperature range
PTOT
Power dissipation per package
UNIT
V
+4.6
V
–50
mA
–0.5
6.5
V
±50
mA
–0.5
VCC + 0.5
V
±50
mA
VO = 0 to VCC
–65
+150
°C
700
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. AVCC must not exceed VCC.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
4. This value is limited to 4.6 V maximum.
RECOMMENDED OPERATING CONDITIONS1
SYMBOL
PARAMETER
VCC, AVCC
LIMITS
CONDITIONS
MIN
MAX
3.6
UNIT
Supply voltage
3
VIH
HIGH level input voltage
2
VIL
LOW level input voltage
0
0.8
VI
Input voltage
0
VCC
V
Operating ambient temperature range in free air
0
+70
°C
Tamb
V
V
V
NOTE:
1. Unused inputs must be held high or low to prevent them from floating.
ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range (unless otherwise noted)
SYMBOL
VIK
PARAMETER
AVCC, VCC (V)
OTHER
LIMITS
MIN
TYP
MAX
3
II = –18 mA
IOH = – 100 µA
VCC – 0.2
3
IOH = – 12 mA
2.1
3
IOH = – 6 mA
2.4
MIN to MAX
IOL = 100 µA
–
3
IOL = 12 mA
–
0.8
3
IOL = 6 mA
–
0.55
Input current
3.6
VI = VCC or GND
±5
µA
ICC 1
Quiescent supply current
3.6
VI = VCC or GND;
IO = 0, outputs: LOW or HIGH
10
µA
∆ICC
Additional supply current per
input pin
3.3 to 3.6
One input at VCC – 0.6 V;
other inputs at VCC or GND
500
µA
VOL
II
HIGH level output voltage
LOW level output voltage
–1.2
UNIT
MIN to MAX
VOH
Input clamp voltage
TEST CONDITIONS
V
V
0.2
V
CI
Input capacitance
3.3
VI = VCC or GND
2.8
pF
CO
Output capacitance
3.3
VO= VCC or GND
5.4
pF
NOTE:
1. For ICCA and ICC vs. Frequency, see Figures 1 and 2.
2000 Dec 01
5
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
TIMING REQUIREMENTS
Over recommended ranges of supply voltage and operating free-air temperature
MIN
MAX
UNIT
Clock frequency
PARAMETER
50
150
MHz
Input clock duty cycle
40
60
%
1
ms
SYMBOL
fCLK
Stabilization time1
NOTE:
1. Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained,
a fixed-frequency, fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation
delay, skew, and jitter parameters given in the switching characteristics table are not applicable.
SWITCHING CHARACTERISTICS
Over recommended ranges of supply voltage and operating free-air temperature; CL = 30 pF
PARAMETER
tphase error 2
VCC, AVCC = 3.3 V ±0.3 V
FROM
(INPUT)/CONDITION
TO
(OUTPUT)
MIN
CLKIN↑ = 100 MHz to 133 MHz
FBIN↑
–100
100
ps
TYP
MAX
UNIT
CLKIN↑ = 66 MHz
FBIN↑
–125
125
ps
tphase error – jitter 1, 3
CLKIN↑ = 100 MHz to 133 MHz
FBIN↑
–50
50
ps
tSK(0)
Any Y or FBOUT
Any Y or FBOUT
200
ps
jitter(peak-peak)
–80
80
CLKIN = 100 MHz to 133 MHz
Any Y or FBOUT
Duty cycle reference 1
F(CLKIN > 60 MHz)
Any Y or FBOUT
47
53
%
tr 1
VO = 0.4 V to 2 V
Any Y or FBOUT
2.5
1
V/ns
tf 1
VO = 0.4 V to 2 V
Any Y or FBOUT
2.5
1
V/ns
jitter (cycle-cycle) 1
NOTES:
1. These parameters are not production tested.
2. This is considered as static phase offset.
3. Phase error does not include jitter. (tphase error = static phase error – jitter(cycle-cycle))
4. The tSK(0) specification is only valid for outputs with equal loading.
2000 Dec 01
6
|65|
ps
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
CHARACTERISTIC CURVES
AVCC = VCC = 3.3 V
Tamb = 25 °C
CLOCK FREQUENCY (MHz)
SW00434
Figure 1. Analog supply current vs. clock frequency
Figure 2. Supply current vs. clock frequency
AVCC = VCC = 3.3 V
C(LF) = 12 pF; Tamb = 25 °C
AVCC = VCC = 3.3 V
C(LF) = 12 pF; Tamb = 25 °C
200
CYCLE-TO-CYCLE JITTER (ps)
PEAK-TO-PEAK JITTER (ps)
150
CLOCK FREQUENCY (MHz)
SW00435
150
100
50
0
50
100
133
150
100
80
60
40
20
0
–20
–40
6
8
10
DELAY LENGTH (ns)
SW00439
Figure 5. Phase offset vs. delay length
2000 Dec 01
50
0
60
70
80
90
100
110
120
130
140
Figure 4. Cycle-to-cycle jitter vs. clock frequency
VCC = 3.3 V; C(LF) = 30 pF; f = 100 MHz
4
100
SW00432
Figure 3. Peak-to-peak jitter vs. clock frequency
2
150
CLOCK FREQUENCY (MHz)
SW00433
0
200
50
CLOCK FREQUENCY (MHz)
PHASE OFFSET (ps)
140
130
110
120
90
30
150
140
130
120
110
100
90
80
70
60
50
40
30
1
0
100
3
2
80
4
70
6
5
60
7
50
100
90
80
70
60
50
40
30
20
10
0
SUPPLY CURRENT (mA)
8
40
ANALOG SUPPLY CURRENT (mA)
AVCC = VCC = 3.3 V
Tamb = 25 °C
7
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
PARAMETER MEASUREMENT INFORMATION
3V
50% VCC
INPUT
0V
tpe
FROM OUTPUT
UNDER TEST
2V
30 pF
OUTPUT
500 Ω
50% VCC
0.4 V
0.4 V
tr
LOAD CIRCUIT FOR OUTPUTS
VOH
2V
VOL
tf
VOLTAGE WAVEFORMS & PHASE ERROR TIMES
NOTES:
1. CL includes probe and jig capacitance.
2. All input pulses are supplied by generators having the following characteristics: PRR ≤ 100 MHz, ZO = 50 Ω , tr ≤ 1.2 ns, tf ≤
1.2 The
ns. outputs are measured one at a time with one transition per measurement.
3.
SW00384
Figure 6. Load Circuit and Voltage Waveforms
CLKIN
FBIN
tphase error
FBOUT
ANY Y
tSK(0)
ANY Y
ANY Y
tSK(0)
SW00385
Figure 7. Phase Error and Skew Calculations
2000 Dec 01
8
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
2000 Dec 01
9
SOT355-1
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 2000
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 12-00
Document order number:
2000 Dec 01
10
9397 750 07848