PHILIPS BUK463-100A

Philips Semiconductors
Product specification
PowerMOS transistor
GENERAL DESCRIPTION
N-channel enhancement mode
field-effect power transistor in a plastic
envelope suitable for surface mount
applications.
The device is intended for use in
Switched Mode Power Supplies
(SMPS), motor control, welding,
DC/DC and AC/DC converters, and in
general purpose switching
applications.
PINNING - SOT404
PIN
BUK463-100A
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MAX.
UNIT
VDS
ID
Ptot
Tj
RDS(ON)
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance
100
14
75
175
0.16
V
A
W
˚C
Ω
PIN CONFIGURATION
SYMBOL
DESCRIPTION
d
mb
1
gate
2
drain
3
source
mb
g
2
drain
1
3
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
VDGR
±VGS
ID
ID
IDM
Ptot
Tstg
Tj
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage temperature
Junction temperature
RGS = 20 kΩ
Tmb = 25 ˚C
Tmb = 100 ˚C
Tmb = 25 ˚C
Tmb = 25 ˚C
-
- 55
-
100
100
30
14
10
56
75
175
175
V
V
V
A
A
A
W
˚C
˚C
THERMAL RESISTANCES
SYMBOL PARAMETER
Rth j-mb
Rth j-a
CONDITIONS
Thermal resistance junction to
mounting base
Thermal resistance junction to minimum footprint
ambient
FR4 board (see fig. 18)
February 1996
1
MIN.
TYP.
MAX.
UNIT
-
-
2
K/W
-
50
-
K/W
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
BUK463-100A
STATIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V(BR)DSS
Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain current
Zero gate voltage drain current
Gate source leakage current
Drain-source on-state
resistance
VGS = 0 V; ID = 0.25 mA
100
-
-
V
VDS = VGS; ID = 1 mA
VDS = 100 V; VGS = 0 V; Tj = 25 ˚C
VDS = 100 V; VGS = 0 V; Tj = 125 ˚C
VGS = ±30 V; VDS = 0 V
VGS = 10 V; ID = 5 A
2.1
-
3.0
1
0.1
10
0.15
4.0
10
1.0
100
0.16
V
µA
mA
nA
Ω
MIN.
TYP.
MAX.
UNIT
VGS(TO)
IDSS
IDSS
IGSS
RDS(ON)
DYNAMIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
gfs
Forward transconductance
VDS = 25 V; ID = 5 A
4.0
5.5
-
S
Ciss
Coss
Crss
Input capacitance
Output capacitance
Feedback capacitance
VGS = 0 V; VDS = 25 V; f = 1 MHz
-
660
140
60
825
200
100
pF
pF
pF
td on
tr
td off
tf
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
VDD = 30 V; ID = 3 A;
VGS = 10 V; RGS = 50 Ω;
Rgen = 50 Ω
-
10
25
60
40
20
40
90
55
ns
ns
ns
ns
Ld
Internal drain inductance
-
2.5
-
nH
Ls
Internal source inductance
Measured from upper edge of drain
tab to centre of die
Measured from source lead
soldering point to source bond pad
-
7.5
-
nH
MIN.
TYP.
MAX.
UNIT
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
IDR
-
-
-
14
A
IDRM
VSD
Continuous reverse drain
current
Pulsed reverse drain current
Diode forward voltage
IF = 14 A ; VGS = 0 V
-
1.2
56
1.5
A
V
trr
Qrr
Reverse recovery time
Reverse recovery charge
IF = 14 A; -dIF/dt = 100 A/µs;
VGS = 0 V; VR = 30 V
-
90
0.6
-
ns
µC
MIN.
TYP.
MAX.
UNIT
-
-
70
mJ
AVALANCHE LIMITING VALUE
Tmb = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
WDSS
Drain-source non-repetitive
unclamped inductive turn-off
energy
ID = 14 A ; VDD ≤ 50 V ;
VGS = 10 V ; RGS = 50 Ω
February 1996
2
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
120
BUK463-100A
Normalised Power Derating
PD%
1E+01
ZTHX53
Zth j-mb / (K/W)
110
100
90
80
1E+00
0.5
70
0.2
60
50
0.1
40
0.05
1E-01
tp
PD
0.02
30
D=
tp
T
20
0
10
0
0
20
40
60
80 100
Tmb / C
120
140
160
180
Fig.1. Normalised power dissipation.
PD% = 100⋅PD/PD 25 ˚C = f(Tmb)
120
1E-05
1E-03
t/s
1E-01
1E+01
Fig.4. Transient thermal impedance.
Zth j-mb = f(t); parameter D = tp/T
Normalised Current Derating
ID%
t
T
1E-02
1E-07
28
ID / A
110
15
24
100
90
BUK453-100A
10
8
20
VGS / V =
20
80
70
7
16
60
12
50
6
40
8
30
20
4
5
10
4
0
0
0
20
40
60
80 100
Tmb / C
120
140
160
180
ID / A
4
6
8
10
Fig.5. Typical output characteristics, Tj = 25 ˚C.
ID = f(VDS); parameter VGS
BUK453-100
1.0
A
/ID
2
VDS / V
Fig.2. Normalised continuous drain current.
ID% = 100⋅ID/ID 25 ˚C = f(Tmb); conditions: VGS ≥ 10 V
100
0
BUK453-100A
RDS(ON) / Ohm
S
)
ON
=
VD
tp = 10 us
(
S
RD
5
0.8
5.5
4.5
10
100 us
DC
VGS / V =
6.5
0.6
7
1 ms
7.5
0.4
10 ms
100 ms
1
6
8
0.2
0
0.1
1
10
100
VDS / V
Fig.3. Safe operating area. Tmb = 25 ˚C
ID & IDM = f(VDS); IDM single pulse; parameter tp
February 1996
10
20
0
4
8
12
16
ID / A
20
24
28
Fig.6. Typical on-state resistance, Tj = 25 ˚C.
RDS(ON) = f(ID); parameter VGS
3
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
28
BUK463-100A
ID / A
VGS(TO) / V
BUK453-100A
max.
4
24
Tj / C =
25
150
20
typ.
3
16
min.
2
12
8
1
4
0
0
0
2
4
6
8
10
-60
-20
20
VGS / V
gfs / S
100
140
180
Fig.10. Gate threshold voltage.
VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS
Fig.7. Typical transfer characteristics.
ID = f(VGS) ; conditions: VDS = 25 V; parameter Tj
7
60
Tj / C
BUK453-100A
6
SUB-THRESHOLD CONDUCTION
ID / A
1E-01
1E-02
5
2%
1E-03
4
3
typ
98 %
1E-04
2
1E-05
1
1E-06
0
0
4
8
12
16
ID / A
20
24
28
0
Fig.8. Typical transconductance, Tj = 25 ˚C.
gfs = f(ID); conditions: VDS = 25 V
2.4
2
VGS / V
3
4
Fig.11. Sub-threshold drain current.
ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS
Normalised RDS(ON) = f(Tj)
a
1
10000
C / pF
BUK4y3-100
2.2
2.0
1.8
1.6
1000
Ciss
1.4
1.2
1.0
0.8
Coss
100
0.6
Crss
0.4
0.2
0
-60
-20
20
60
Tj / C
100
140
10
180
0
40
VDS / V
Fig.9. Normalised drain-source on-state resistance.
a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 5 A; VGS = 10 V
February 1996
20
Fig.12. Typical capacitances, Ciss, Coss, Crss.
C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
4
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
BUK463-100A
BUK453-100
VGS / V
120
12
WDSS%
110
VDS / V =20
10
100
90
80
8
80
70
60
6
50
40
4
30
20
2
10
0
0
0
2
4
6
8
10
QG / nC
12
14
20
16
Fig.13. Typical turn-on gate-charge characteristics.
VGS = f(QG); conditions: ID = 14 A; parameter VDS
30
IF / A
40
60
80
100
120
Tmb / C
140
160
180
Fig.15. Normalised avalanche energy rating.
WDSS% = f(Tmb); conditions: ID = 14 A
BUK453-100A
VDD
+
L
VDS
20
-
VGS
-ID/100
T.U.T.
0
10
Tj / C = 150
25
RGS
R 01
shunt
0
0
1
VSDS / V
2
Fig.16. Avalanche energy test circuit.
WDSS = 0.5 ⋅ LID2 ⋅ BVDSS /(BVDSS − VDD )
Fig.14. Typical reverse diode current.
IF = f(VSDS); conditions: VGS = 0 V; parameter Tj
February 1996
5
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
BUK463-100A
MECHANICAL DATA
Dimensions in mm
4.5 max
1.4 max
10.3 max
Net Mass: 1.4 g
11 max
15.4
2.5
0.85 max
(x2)
0.5
2.54 (x2)
Fig.17. SOT404 : centre pin connected to mounting base.
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5
2.0
3.8
5.08
Fig.18. SOT404 : soldering pattern for surface mounting.
Notes
1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent
damage to MOS gate oxide.
2. Epoxy meets UL94 V0 at 1/8".
February 1996
6
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
BUK463-100A
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
February 1996
7
Rev 1.000