Philips Semiconductors Product Specification PowerMOS transistor GENERAL DESCRIPTION N-channel enhancement mode field-effect power transistor in a plastic envelope. The device is intended for use in Automotive and general purpose switching applications. PINNING - TO220AB PIN QUICK REFERENCE DATA SYMBOL PARAMETER VDS ID Ptot Tj RDS(ON) Drain-source voltage Drain current (DC) Total power dissipation Junction temperature Drain-source on-state resistance PIN CONFIGURATION DESCRIPTION 1 gate 2 drain 3 source tab BUK456-60H MAX. UNIT 60 60 150 175 20 V A W ˚C mΩ SYMBOL d tab g drain s 1 23 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS VDGR ±VGS ID ID IDM Ptot Tstg Tj Drain-source voltage Drain-gate voltage Gate-source voltage Drain current (DC) Drain current (DC) Drain current (pulse peak value) Total power dissipation Storage temperature Junction Temperature RGS = 20 kΩ Tmb = 25 ˚C Tmb = 100 ˚C Tmb = 25 ˚C Tmb = 25 ˚C - - 55 - 60 60 30 60 46 240 150 175 175 V V V A A A W ˚C ˚C THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-mb Thermal resistance junction to mounting base Thermal resistance junction to ambient Rth j-a May 1993 MIN. TYP. MAX. UNIT - - - 1.0 K/W - - 60 - K/W 1 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor BUK456-60H STATIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS V(BR)DSS Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Zero gate voltage drain current Gate source leakage current Drain-source on-state resistance VGS(TO) IDSS IDSS IGSS RDS(ON) MIN. TYP. MAX. UNIT VGS = 0 V; ID = 0.25 mA 60 - - V VDS = VGS; ID = 1 mA VDS = 60 V; VGS = 0 V; Tj = 25 ˚C VDS = 60 V; VGS = 0 V; Tj =125 ˚C VGS = ±30 V; VDS = 0 V VGS = 10 V; ID = 25 A 2.1 - 3.0 1 0.1 10 17 4.0 10 1.0 100 20 V µA mA nA mΩ MIN. TYP. MAX. UNIT DYNAMIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS gfs Forward transconductance VDS = 25 V; ID = 25 A 17 22 - S Ciss Coss Crss Input capacitance Output capacitance Feedback capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1600 800 310 2200 1000 450 pF pF pF td on tr td off tf Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time VDD = 30 V; ID = 3 A; VGS = 10 V; RGS = 50 Ω; Rgen = 50 Ω - 30 90 190 140 40 120 250 180 ns ns ns ns Ld Internal drain inductance - 3.5 - nH Ld Internal drain inductance - 4.5 - nH Ls Internal source inductance Measured from contact screw on tab to centre of die Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad - 7.5 - nH MIN. TYP. MAX. UNIT REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS IDR - - - 50 A IDRM VSD Continuous reverse drain current Pulsed reverse drain current Diode forward voltage IF = 50 A ; VGS = 0 V - 1.8 200 2.5 A V trr Qrr Reverse recovery time Reverse recovery charge IF = 50 A; -dIF/dt = 100 A/µs; VGS = 0 V; VR = 30 V - 80 0.4 250 - ns µC MIN. TYP. MAX. UNIT - - 150 mJ AVALANCHE LIMITING VALUE Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS WDSS Drain-source non-repetitive unclamped inductive turn-off energy ID = 50 A ; VDD ≤ 25 V ; VGS = 10 V ; RGS = 50 Ω May 1993 2 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor 120 BUK456-60H Normalised Power Derating PD% 10 Zth j-mb / (K/W) BUKx56-lv 110 100 90 D= 1 80 0.5 70 0.2 0.1 0.05 60 0.1 50 0.02 40 30 0.01 tp PD 10 0 0 20 40 60 80 100 Tmb / C 120 140 160 1E-05 1E-01 1E+01 Fig.4. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T Normalised Current Derating ID% 1E-03 t/s tp T t T 0.001 180 Fig.1. Normalised power dissipation. PD% = 100⋅PD/PD 25 ˚C = f(Tmb) 120 D= 0 20 100 ID / A 20 BUK456-60H 10 8 110 VGS / V = 7.5 15 100 80 90 7 80 60 70 6.5 60 6 50 40 40 5.5 30 5 20 20 4.5 10 0 0 0 20 40 60 80 100 Tmb / C 120 140 160 180 0 0.1 ID S/ 8 10 RDS(ON) / Ohm 4.5 5 BUK456-60H 5.5 6 6.5 7 0.08 VD tp = 10 us O 100 S( RD 0.06 100 us 0.04 1 ms 8 DC 10 10 ms 100 ms 0.02 VGS / V = 15 0 1 1 10 0 100 20 40 10 60 80 100 ID / A VDS / V Fig.3. Safe operating area. Tmb = 25 ˚C ID & IDM = f(VDS); IDM single pulse; parameter tp May 1993 6 Fig.5. Typical output characteristics, Tj = 25 ˚C. ID = f(VDS); parameter VGS BUK456-60H ID / A = N) 4 VDS / V Fig.2. Normalised continuous drain current. ID% = 100⋅ID/ID 25 ˚C = f(Tmb); conditions: VGS ≥ 10 V 1000 2 Fig.6. Typical on-state resistance, Tj = 25 ˚C. RDS(ON) = f(ID); parameter VGS 3 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor BUK456-60H VGS(TO) / V BUK456-60H ID / A 100 max. 4 Tj / C = 25 80 150 typ. 3 60 min. 2 40 1 20 0 0 0 2 4 6 8 -60 10 -20 20 VGS / V gfs / S BUK456-60H 30 100 140 180 Fig.10. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS Fig.7. Typical transfer characteristics. ID = f(VGS) ; conditions: VDS = 25 V; parameter Tj 35 60 Tj / C Tj / C = 25 SUB-THRESHOLD CONDUCTION ID / A 1E-01 1E-02 25 150 2% 1E-03 20 15 typ 98 % 1E-04 10 1E-05 5 1E-06 0 0 20 40 60 80 100 0 1 2 VGS / V ID / A Fig.8. Typical transconductance, Tj = 25 ˚C. gfs = f(ID); conditions: VDS = 25 V 2.0 a 3 4 Fig.11. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS Normalised RDS(ON) = f(Tj) 10000 BUK456-60H C / pF 1.5 Ciss 1000 1.0 Coss 0.5 Crss 100 0 -60 -20 20 60 Tj / C 100 140 180 20 40 VDS / V Fig.9. Normalised drain-source on-state resistance. a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 25 A; VGS = 10 V May 1993 0 Fig.12. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz 4 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor 15 BUK456-60H VGS / V BUK456-60H 120 WDSS% 110 100 VDS / V =12 90 10 80 48 70 60 50 40 5 30 20 10 0 0 0 20 40 QG / nC 60 20 80 Fig.13. Typical turn-on gate-charge characteristics. VGS = f(QG); conditions: ID = 50 A; parameter VDS 100 IS / A 40 60 80 100 120 Tmb / C 140 160 180 Fig.15. Normalised avalanche energy rating. WDSS% = f(Tmb); conditions: ID = 50 A BUK456-60H VDD + L 80 Tj / C = 25 150 VDS 60 - VGS -ID/100 40 T.U.T. 0 20 RGS R 01 shunt 0 0 1 0.5 1.5 VSDS / V Fig.16. Avalanche energy test circuit. WDSS = 0.5 ⋅ LID2 ⋅ BVDSS /(BVDSS − VDD ) Fig.14. Typical reverse diode current. IF = f(VSDS); conditions: VGS = 0 V; parameter Tj May 1993 5 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor BUK456-60H MECHANICAL DATA Dimensions in mm 4,5 max Net Mass: 2 g 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 0,9 max (3x) 2,54 2,54 0,6 2,4 Fig.17. TO220AB; pin 2 connected to mounting base. Notes 1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for TO220 envelopes. 3. Epoxy meets UL94 V0 at 1/8". May 1993 6 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor BUK456-60H DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 1993 7 Rev 1.100