PESD2CAN CAN bus ESD protection diode Rev. 01 — 22 December 2006 Product data sheet 1. Product profile 1.1 General description PESD2CAN in a small SOT23 Surface-Mounted Device (SMD) plastic package designed to protect two automotive Controller Area Network (CAN) bus lines from the damage caused by ElectroStatic Discharge (ESD) and other transients. 1.2 Features n Due to the integrated diode structure only one small SOT23 package is needed to protect two CAN bus lines n Max. peak pulse power: PPP = 230 W at tp = 8/20 µs n Low clamping voltage: VCL = 41 V at IPP = 5 A n Ultra low leakage current: IRM < 1 nA n ESD protection up to 30 kV n IEC 61000-4-2, level 4 (ESD) n IEC 61000-4-5 (surge); IPP = 5 A at tp = 8/20 µs n Small SMD plastic package 1.3 Applications n CAN bus protection n Automotive applications 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit - - 24 V - 25 30 pF Per diode VRWM reverse standoff voltage Cd diode capacitance f = 1 MHz; VR = 0 V PESD2CAN NXP Semiconductors CAN bus ESD protection diode 2. Pinning information Table 2. Pinning Pin Description 1 cathode 1 2 cathode 2 3 common cathode Simplified outline Symbol 3 1 1 2 3 2 006aaa155 3. Ordering information Table 3. Ordering information Type number PESD2CAN Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 4. Marking Table 4. Marking codes Type number Marking code[1] PESD2CAN 6R* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions peak pulse power tp = 8/20 µs peak pulse current tp = 8/20 µs Min Max Unit [1][2] - 230 W [1][2] - 5 A Per diode PPP IPP Per device Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin 1 to 3 or 2 to 3. PESD2CAN_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 2 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode Table 6. ESD maximum ratings Symbol Parameter Conditions electrostatic discharge voltage IEC 61000-4-2 (contact discharge) Min Max Unit [1][2] - 30 kV [2] - 400 V [1][2] - 16 kV Per diode VESD machine model MIL-STD-883 (human body model) [1] Device stressed with ten non-repetitive ESD pulses. [2] Measured from pin 1 to 3 or 2 to 3. Table 7. ESD standards compliance Standard Conditions Per diode IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact) MIL-STD-883; class 3 (human body model) > 4 kV 001aaa631 001aaa630 120 IPP 100 % 90 % 100 % IPP; 8 µs IPP (%) 80 e−t 50 % IPP; 20 µs 40 10 % t tr = 0.7 ns to 1 ns 0 0 10 20 30 30 ns 40 t (µs) 60 ns Fig 1. 8/20 µs pulse waveform according to IEC 61000-4-5 Fig 2. ESD pulse waveform according to IEC 61000-4-2 PESD2CAN_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 3 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode 6. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode VRWM reverse standoff voltage - - 24 V IRM reverse leakage current VRWM = 24 V - <1 10 nA VBR breakdown voltage IR = 1 mA 26.2 28 30.3 V Cd diode capacitance f = 1 MHz; VR = 0 V clamping voltage VCL differential resistance rdif - 25 30 pF IPP = 1 A [1][2] - - 34 V IPP = 5 A [1][2] - - 41 V - - 300 Ω IR = 1 mA [1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin 1 to 3 or 2 to 3. 006aaa937 8.0 IPP (A) 001aaa193 1.2 PPP PPP(25°C) 6.0 0.8 4.0 0.4 2.0 0 0 25 30 35 40 45 0 50 100 150 200 Tj (°C) VCL (V) Tamb = 25 °C Fig 3. Peak pulse current as a function of clamping voltage; typical values Fig 4. Relative variation of peak pulse power as a function of junction temperature; typical values PESD2CAN_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 4 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode 006aaa938 30 Cd (pF) 006aaa939 50 IR (mA) 26 (1) (2) (3) 40 (1) 22 30 (2) (3) 18 20 (4) (5) 14 10 10 0 0 8 16 24 24 26 28 30 32 VR (V) 34 VR (V) f = 1 MHz (1) Tamb = −55 °C (1) Tamb = 150 °C (2) Tamb = 25 °C (2) Tamb = 125 °C (3) Tamb = 150 °C (3) Tamb = 85 °C (4) Tamb = 25 °C (5) Tamb = −40 °C Fig 5. Diode capacitance as a function of reverse voltage; typical values Fig 6. Reverse current as a function of reverse voltage; typical values 006aaa940 25 IPP VR (V) 20 15 −VCL −VBR −VRWM IR IRM −IRM −IR 10 5 VRWM VBR VCL − 0 0 10 20 + −IPP 30 IRM (nA) 006aaa676 Tamb = 150 °C IR is less than 1 nA at −55 °C and 25 °C. Fig 7. Reverse voltage as a function of reverse leakage current; typical values Fig 8. V-I characteristics for a bidirectional ESD protection diode PESD2CAN_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 5 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode ESD TESTER RZ 450 Ω RG 223/U 50 Ω coax 4 GHz DIGITAL OSCILLOSCOPE 10× ATTENUATOR 50 Ω CZ IEC 61000-4-2 network CZ = 150 pF; RZ = 330 Ω D.U.T. (Device Under Test) vertical scale = 10 A/div horizontal scale = 15 ns/div unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) vertical scale = 25 V/div horizontal scale = 100 ns/div clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network), Pin 1 to 3 vertical scale = 10 A/div horizontal scale = 15 ns/div vertical scale = 25 V/div horizontal scale = 100 ns/div unclamped −8 kV ESD pulse waveform (IEC 61000-4-2 network) clamped −8 kV ESD voltage waveform (IEC 61000-4-2 network), Pin 1 to 3 006aaa941 Fig 9. ESD clamping test setup and waveforms PESD2CAN_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 6 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode 7. Application information The PESD2CAN is designed for the protection of two automotive CAN bus lines from the damage caused by ESD and surge pulses. The PESD2CAN can be used for both, high-speed CAN bus and fault-tolerant CAN bus protection. The PESD2CAN provides a surge capability of up to 230 W per line for an 8/20 µs waveform. SPLIT CANH RT/2 CAN BUS TRANSCEIVER CAN bus RT/2 CANL Common mode choke (optional) 2 1 CG PESD2CAN 3 006aaa942 Fig 10. Typical application: ESD protection of two automotive CAN bus lines Circuit board layout and protection device placement: Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the PESD2CAN as close to the input terminal or connector as possible. 2. The path length between the PESD2CAN and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protection conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. PESD2CAN_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 7 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode 8. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm 0.15 0.09 04-11-04 Fig 11. Package outline SOT23 (TO-236AB) 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PESD2CAN [1] Package SOT23 Description 4 mm pitch, 8 mm tape and reel 3000 10000 -215 -235 For further information and the availability of packing methods, see Section 12. PESD2CAN_1 Product data sheet Packing quantity © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 8 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode 10. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PESD2CAN_1 20061222 Product data sheet - - PESD2CAN_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 9 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] PESD2CAN_1 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 22 December 2006 10 of 11 PESD2CAN NXP Semiconductors CAN bus ESD protection diode 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 22 December 2006 Document identifier: PESD2CAN_1