PHILIPS BGY240S

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D369
BGY240S
UHF amplifier module
Product specification
Supersedes data of 1998 Nov 05
1999 Aug 23
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
FEATURES
PINNING - SOT388C
• 3.5 V nominal supply voltage
PIN
DESCRIPTION
• 3 W output power
1
RF input
• Easy output power control by DC voltage.
2
VC
3
VS
4
RF output
APPLICATIONS
• Digital cellular radio systems with Time Division Multiple
Access (TDMA) operation (GSM systems) in the
890 to 915 MHz frequency range.
Flange
ground
handbook, halfpage
DESCRIPTION
The BGY240S is a three-stage UHF amplifier module in a
SOT388C package. The module consists of three NPN
silicon planar transistor dies mounted together with
matching and bias circuit components on a metallized
ceramic substrate.
1
2
Top view
3
4
MBK197
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
f
(MHz)
VS
(V)
VC
(V)
PL
(W)
Gp
(dB)
η
(%)
ZS, ZL
(Ω)
890 to 915
3.5
≤2.2
≥3
≥35
typ. 47
50
MODE OF
OPERATION
Pulsed; δ = 1 : 8
typ. 3.5
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VS
PARAMETER
DC supply voltage
CONDITIONS
MIN.
MAX.
UNIT
VC < 0.2 V; no RF
−
7
V
VC ≥ 0.2 V
−
5
V
VC
DC control voltage
−
3
V
PD
input drive power
−
5
mW
PL
load power
−
3.8
W
Tstg
storage temperature
−40
+100
°C
Tmb
operating mounting base temperature
−30
+100
°C
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
1999 Aug 23
2
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
CHARACTERISTICS
ZS = ZL = 50 Ω; PD = 1 mW; VS = 3.5 V; VC ≤ 2.2 V; f = 890 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IQ
leakage current
VC = 0.2 V
−
−
10
µA
ICM
peak control current
adjust VC for PL = 2.5 W
−
−
3
mA
PL
load power
VC = 2.2 V
3
3.5
−
W
Gp
power gain
adjust VC for PL = 2.5 W
35
−
−
dB
η
efficiency
adjust VC for PL = 2.5 W
−
44
−
%
H2
second harmonic
adjust VC for PL = 2.5 W
−
−
−35
dBc
H3
third harmonic
adjust VC for PL = 2.5 W
−
−
−33
dBc
VSWRin
input VSWR
adjust VC for PL = 2.5 W
−
1.8 : 1
3:1
stability
VS = 3 to 5 V; PD = −2 to +5 dBm;
VC = 0 to 2.2 V; PL ≤ 3 W;
VSWR ≤ 12 : 1 through all phases
−
−
−60
dBc
isolation
VC = 0.2 V
−
−45
−36
dBm
noise power
PL = 2.5 W; bandwidth = 30 kHz;
10 MHz above transmission band
−
−82
−80
dBm
AM/PM conversion
PD = −2 to +5 dBm;
PL = 6 to 34 dBm
−
−
3
deg/dB
AM/AM conversion
PD with 3% AM; f = 100 kHz;
PL = 6 to 34 dBm
−
−
12
%
tr
carrier rise time
PL = 6 to 34 dBm; time to settle
within −0.5 dB of final PL
−
1.5
2
µs
tf
carrier fall time
PL = 6 to 34 dBm; time to settle
within −0.5 dB of final PL
−
1.5
2
µs
ruggedness
VS = 5 V; adjust VC for PL = 3 W;
VSWR ≤ 12 : 1 through all phases
Pn
1999 Aug 23
3
no degradation
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
MGM155
4
handbook, halfpage
PL
(W)
MGM156
6
880 MHz
handbook, halfpage
915 MHz
PL
(W)
880 MHz
3
915 MHz
4
2
2
1
0
0.5
1
1.5
0
2.5
2 V (V) 2.5
C
3
3.5
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VC = 2.2 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.2
Fig.3
Load power as a function of control voltage;
typical values.
MGM157
50
η
(%)
4
VS (V) 4.5
Load power as a function of supply voltage;
typical values.
MGM158
5
handbook, halfpage
handbook, halfpage
PL
(W)
4
40
915 MHz
3
30
880 MHz
20
2
10
1
0
880
0
0
1
2
3
PL (W) 4
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.4
1999 Aug 23
890
900
910
f (MHz)
920
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; VC = 2.2 V;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Efficiency as a function of load power;
typical values.
Fig.5
4
Load power as a function of frequency;
typical values.
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
MGM151
4
MGM152
−20
handbook, halfpage
handbook, halfpage
H2, H3
(dBc)
VSWRin
−30
3
H3
−40
H2
880 MHz
2
−50
915 MHz
−60
880
1
0
1
2
3
PL (W) 4
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.6
890
900
910
f (MHz)
920
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; PL = 2.5 W;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Input VSWR as a function of load power;
typical values.
Fig.7
Harmonics as a function of frequency;
typical values.
MGM153
5
MGM154
10
output
AM
(%)
8
handbook, halfpage
PL
(W)
4
915 MHz
(1)
(2)
3
880 MHz
6
(3)
(4)
2
4
1
2
0
0
20
0
40
60
80
100
Tmb (°C)
0
10
20
30
PL (dBm)
40
ZS = ZL = 50 Ω; PD = 1 mW; VC = 2.2 V; δ = 1 : 8; tp = 575 µs.
(1)
(2)
(3)
(4)
VS = 3.5 V; f = 880 MHz.
VS = 3.5 V; f = 915 MHz.
VS = 3.1 V; f = 880 MHz.
VS = 3.1 V; f = 915 MHz.
Fig.8
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C;
∆f = 100 kHz; input amplitude modulation = 3%; δ = 1 : 8; tp = 575 µs.
Load power as a function of mounting base
temperature; typical values.
1999 Aug 23
Fig.9
5
Output amplitude modulation as a function
of load power; typical values.
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
handbook, full pagewidth
1
90
2 3 4
50 Ω
input
50 Ω
output
47
VC
VS
MBH435
Dimensions in mm.
Fig.10 Printed-circuit board test fixture.
handbook, full pagewidth
C2
L1
C1
Z1
R1
RF input
VC
C4
MGD432
typ.
1.35A
Fig.11 Test circuit.
1999 Aug 23
Z2
C3
6
VS
RF output
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
List of components (see Fig.11)
COMPONENT
C1, C2
DESCRIPTION
multilayer ceramic chip capacitor
VALUE
DIMENSIONS
680 pF
C3
tantalum capacitor
2.2 µF; 35 V
C4
electrolytic capacitor
47 µF; 40 V
L1
Grade 4S2 Ferroxcube bead
Z1, Z2
stripline; note 1
50 Ω
R1
metal film resistor
100 Ω; 0.6 W
CATALOGUE NO.
2222 851 11681
2222 030 37479
4330 030 36300
width 2.33 mm
2322 156 11001
Note
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2);
thickness 1⁄32 inch.
1999 Aug 23
7
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
SOLDERING
The indicated temperatures are those at the solder
interfaces.
MGM159
300
handbook, halfpage
Advised solder types are types with a liquidus less than or
equal to 210 °C.
T
(°C)
Solder dots or solder prints must be large enough to wet
the contact areas.
200
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
100
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 °C and damage the module.
The maximum allowed temperature is 250 °C for a
maximum of 5 seconds.
0
0
1
2
3
4
t (min)
5
The maximum ramp-up is 10 °C per second.
The maximum cool-down is 5 °C per second.
Fig.12 Recommended reflow temperature profile.
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1999 Aug 23
8
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
17.7
handbook, full pagewidth
12.5
12
6
4
8.75
6.75
footprint metallization
1
solder area
1.8
2.9
occupied area
0.57
0.7
1.37
5.08
1.7
5.08
2.54
17.9
17.1
12.4
12.1
6.4
solder area
7.55
5.55
2.45
1.67
2.7
1.1
0.5
1.37
5.08
1.5
5.08
Dimensions in mm.
Fig.13 Footprint SOT388C.
1999 Aug 23
9
2.54
MGM150
12.5
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
PACKAGE OUTLINE
Rectangular single-ended surface-mount package; metal cap; 4 in-line leads
SOT388C
U
A
y
D
U1
E
1
2
3
L1
4
L
b
Z
e
c
w M
e1
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
e
e1
E
L
L1
U
U1
w
y
Z
mm
2.7
2.3
0.56
0.46
0.30
0.20
17.1
16.7
5.08
2.54
12.2
11.8
0.7
0.3
3.4
3.0
17.3
16.9
6.0
5.6
0.25
0.15
2.3
1.9
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
99-02-06
SOT388C
1999 Aug 23
EUROPEAN
PROJECTION
10
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Aug 23
11
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Internet: http://www.semiconductors.philips.com
SCA 67
© Philips Electronics N.V. 1999
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Printed in The Netherlands
125002/07/pp12
Date of release: 1999
Aug 23
Document order number:
9397 750 06262