PHILIPS PSS8550D

DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D186
PSS8550
PNP medium power 25 V transistor
Product specification
Supersedes data of 2002 Nov 19
2004 Aug 10
Philips Semiconductors
Product specification
PNP medium power 25 V transistor
FEATURES
PSS8550
QUICK REFERENCE DATA
• High total power dissipation
SYMBOL
• High current capability.
VCEO
collector-emitter voltage
−25
V
IC
collector current (DC)
−1.5
A
PARAMETER
MAX.
UNIT
APPLICATIONS
• Medium power switching and muting
PINNING
• Amplification
PIN
• Portable radio output amplifier (class-B, push-pull).
DESCRIPTION
DESCRIPTION
1
collector
2
base
3
emitter
PNP transistor in a SOT54 (TO-92) plastic package.
NPN complement: PSS8050.
handbook, halfpage
MARKING
TYPE NUMBER
1
2
3
MARKING CODE
MSB033
PSS8550C
S8550C
PSS8550D
S8550D
Fig.1
Simplified outline (SOT54).
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
−40
VCEO
collector-emitter voltage
open base
−
−25
V
VEBO
emitter-base voltage
open collector
−
−6
V
IC
collector current (DC)
−
−1.5
A
ICM
peak collector current
−
−2
A
IB
base current (DC)
−
−300
mA
IBM
peak base current
−
−1
A
Ptot
total power dissipation
Tamb ≤ 25 °C; note 1
−
850
mW
Tamb ≤ 25 °C; note 2
−
900
mW
Tamb ≤ 25 °C; note 3
−
1
W
+150
°C
V
Tstg
storage temperature
−65
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
Notes
1. Device mounted on a printed-circuit board; single sided copper; tinplated; standard footprint.
2. Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 1 cm2.
3. Device mounted on a printed-circuit board; single sided copper; tinplated; standard footprint. Operated under pulsed
conditions: pulse width tp ≤ 1 s; duty cycle δ ≤ 0.75%.
2004 Aug 10
2
Philips Semiconductors
Product specification
PNP medium power 25 V transistor
PSS8550
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
VALUE
UNIT
in free air; note 1
147
K/W
in free air; note 2
139
K/W
in free air; note 3
125
K/W
Notes
1. Device mounted on a printed-circuit board; single sided copper; tinplated; standard footprint.
2. Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 1 cm2.
3. Device mounted on a printed-circuit board; single sided copper; tinplated; standard footprint.
Operated under pulsed conditions: pulse width tp ≤ 1 s; duty cycle δ ≤ 0.75%.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
collector-base cut-off current
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCB = −35 V; IE = 0
−
−
−100
nA
VCB = −35 V; IE = 0;
Tamb = 150 °C
−
−
−50
µA
ICEO
collector-emitter cut-off current
VCE = −25 V; IB = 0
−
−
−100
nA
IEBO
emitter-base cut-off current
VEB = −6 V; IC = 0
−
−
−100
nA
hFE
DC current gain
IC = −5 mA; VCE = −1 V
45
−
−
IC = −800 mA; VCE = −1 V
40
−
−
PSS8550C
120
−
200
PSS8550D
160
−
300
DC current gain
IC = −100 mA; VCE = −1 V
VCEsat
collector-emitter saturation voltage
IC = −800 mA; IB = −80 mA
−
−190
−500
mV
VBEsat
base-emitter saturation voltage
IC = −800 mA; IB = −80 mA
−
−
−1.2
V
VBEon
base-emitter turn-on voltage
IC = −10 mA; VCE = −1 V
−
−
−1
V
fT
transition frequency
IC = −50 mA; VCE = −10 V;
f = 100 MHz
100
−
−
MHz
Cc
collector capacitance
VCB = 10 V; IE = ie = 0; f = 1 MHz
−
−
12
pF
2004 Aug 10
3
Philips Semiconductors
Product specification
PNP medium power 25 V transistor
PSS8550
MLD958
400
MLD959
−1200
handbook, halfpage
handbook, halfpage
hFE
VBE
(mV)
−1000
300
(1)
(1)
−800
200
(2)
100
0
−10−1
−1
(2)
−600
(3)
−400
−10
(3)
−102
−200
−10−1
−103
−104
IC (mA)
−1
PSS8550C VCE = −1 V.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
PSS8550C VCE = −1 V.
(1) Tamb = −55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.
Fig.2
Fig.3
DC current gain as a function of collector
current; typical values.
MLD960
−103
handbook, halfpage
−10
−102
−103
−104
IC (mA)
Base-emitter voltage as a function of
collector current; typical values.
MLD962
−1200
handbook, halfpage
VBEsat
(mV)
−1000
VCEsat
(1)
(mV)
(2)
−800
−102
(3)
−600
(2)
(1)
−400
(3)
−10
−10−1
−1
−10
−102
−200
−10−1
−103
− 104
IC (mA)
−1
PSS8550C IC/IB = 10.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
PSS8550C IC/IB = 10.
(1) Tamb = −55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.
Fig.4
Fig.5
Collector-emitter saturation voltage as a
function of collector current; typical values.
2004 Aug 10
4
−10
−102
−103
−104
IC (mA)
Base-emitter saturation voltage as a
function of collector current; typical values.
Philips Semiconductors
Product specification
PNP medium power 25 V transistor
PSS8550
MLD961
103
handbook, halfpage
MLD963
−2.5
IC
handbook, halfpage
RCEsat
(A)
(Ω)
(3) (2)
−2
102
(1)
(4)
(5)
(6)
(7)
(8)
−1.5
10
(9)
−1
(10)
1
−0.5
(1)
(2)
(3)
0
−10−1
−1
−10
−102
0
−103
−104
IC (mA)
−0.5
0
−2
−1.5
VCE (V)
PSS8550C IC/IB = 10.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
PSS8550C
(1) IB = −100 mA.
(2) IB = −90 mA.
(3) IB = −80 mA.
Fig.6
Fig.7
Equivalent on-resistance as a function of
collector current; typical values.
2004 Aug 10
−1
5
(4) IB = −70 mA.
(5) IB = −60 mA.
(6) IB = −50 mA.
(7) IB = −40 mA.
(8) IB = −30 mA.
(9) IB = −20 mA.
(10) IB = −10 mA.
Collector current as a function of
collector-emitter voltage; typical values.
Philips Semiconductors
Product specification
PNP medium power 25 V transistor
PSS8550
MLD964
400
MLD965
−1200
handbook, halfpage
handbook, halfpage
VBE
(mV)
−1000
(1)
hFE
300
(1)
−800
(2)
200
(2)
−600
(3)
100
(3)
−400
0
−10−1
−1
−10
−102
−200
−10−1
−103
−104
IC (mA)
−1
PSS8550D VCE = −1 V.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
PSS8550D VCE = −1 V.
(1) Tamb = −55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.
Fig.8
Fig.9
DC current gain as a function of collector
current; typical values.
MLD966
−103
handbook, halfpage
−10
−102
−103
−104
IC (mA)
Base-emitter voltage as a function of
collector current; typical values.
MLD968
−1200
VBEsat
handbook, halfpage
(mV)
−1000
VCEsat
(1)
(mV)
(2)
−800
−102
(3)
−600
(2)
−10
−10−1
(1)
−400
(3)
−1
−10
−102
−200
−10−1
−103
− 104
IC (mA)
−1
−10
−102
−103
−104
IC (mA)
PSS8550D IC/IB = 10.
(1) Tamb = −55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.
PSS8550D IC/IB = 10.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
Fig.10 Collector-emitter saturation voltage as a
function of collector current; typical values.
Fig.11 Base-emitter saturation voltage as a
function of collector current; typical values.
2004 Aug 10
6
Philips Semiconductors
Product specification
PNP medium power 25 V transistor
PSS8550
MLD967
103
handbook, halfpage
MLD969
−2.5
IC
handbook, halfpage
RCEsat
(A)
(Ω)
(3) (2)
(1)
−2
102
(4)
(5)
(6)
(7)
(8)
−1.5
10
(9)
−1
(10)
1
−0.5
(1)
(2)
(3)
0
−10−1
−1
−10
−102
0
−103
−104
IC (mA)
0
−0.5
−1
−2
−1.5
VCE (V)
(4) IB = −70 mA.
(5) IB = −60 mA.
(6) IB = −50 mA.
(7) IB = −40 mA.
(8) IB = −30 mA.
(9) IB = −20 mA.
(10) IB = −10 mA.
PSS8550D IC/IB = 10.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.
PSS8550D
(1) IB = −100 mA.
(2) IB = −90 mA.
(3) IB = −80 mA.
Fig.12 Equivalent on-resistance as a function of
collector current; typical values.
Fig.13 Collector current as a function of
collector-emitter voltage; typical values.
2004 Aug 10
7
Philips Semiconductors
Product specification
PNP medium power 25 V transistor
PSS8550
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
e1
2
D
e
3
b1
L1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b1
c
D
d
E
mm
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
e
2.54
e1
L
L1(1)
1.27
14.5
12.7
2.5
max.
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54
2004 Aug 10
REFERENCES
IEC
JEDEC
JEITA
TO-92
SC-43A
8
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
04-06-28
Philips Semiconductors
Product specification
PNP medium power 25 V transistor
PSS8550
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Aug 10
9
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA76
© Koninklijke Philips Electronics N.V. 2004
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Printed in The Netherlands
R75/02/pp10
Date of release: 2004
Aug 10
Document order number:
9397 750 13683