74LVT16245B; 74LVTH16245B 3.3 V 16-bit transceiver; 3-state Rev. 07 — 29 March 2010 Product data sheet 1. General description The 74LVT16245B; 74LVTH16245B is a high-performance BiCMOS product designed for VCC operation at 3.3 V. This device is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The control function implementation minimizes external timing requirements. The device features an output enable input (nOE) for easy cascading and a direction input (nDIR) for direction control. 2. Features and benefits 16-bit bidirectional bus interface 3-state buffers Output capability: +64 mA and −32 mA TTL input and output switching levels Input and output interface capability to systems at 5 V supply Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs Live insertion and extraction permitted Power-up 3-state No bus current loading when output is tied to 5 V bus Latch-up protection: JESD78B Class II exceeds 500 mA ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version −40 °C to +85 °C SSOP48 plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 −40 °C to +85 °C TSSOP48 plastic thin shrink small outline package; 48 leads; SOT362-1 body width 6.1 mm 74LVT16245BEV −40 °C to +85 °C VFBGA56 plastic very thin fine-pitch ball grid array package; SOT702-1 56 balls; body 4.5 × 7 × 0.65 mm 74LVT16245BBQ −40 °C to +85 °C HXQFN60U plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 4 × 6 × 0.5 mm 74LVT16245BDL 74LVTH16245BDL 74LVT16245BDGG 74LVTH16245BDGG 74LVTH16245BBQ SOT1134-1 4. Functional diagram 2DIR 1DIR 2OE 1OE 2A0 1A0 1B0 1A1 2B0 2A1 2B1 1B1 1A2 2A2 1B2 1A3 2B2 2A3 1B3 1A4 2B3 2A4 2B4 1B4 1A5 2A5 1B5 1A6 2B5 2A6 1B6 2B6 2A7 1A7 1B7 2B7 001aaa789 Pin numbers are shown for SSOP48 and TSSOP48 packages only. Fig 1. Logic symbol 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 2 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 1OE 1DIR 48 1 25 2OE 24 2DIR 1A0 1A1 1A2 1A3 1A4 1A5 1A6 1A7 2A0 47 G3 3EN1 [BA] 3EN2 [AB] G6 6EN4 [BA] 6EN5 [AB] 2 1 2 46 3 44 5 43 6 41 8 40 9 38 11 37 12 36 13 4 1B0 1B1 1B2 1B3 1B4 1B5 1B6 1B7 2B0 5 2A1 2A2 2A3 2A4 2A5 2A6 2A7 35 14 33 16 32 17 30 19 29 20 27 22 26 23 2B1 2B2 2B3 2B4 2B5 2B6 2B7 mna709 Pin numbers are shown for SSOP48 and TSSOP48 packages only. Fig 2. IEC logic symbol 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 3 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 5. Pinning information 5.1 Pinning 74LVT16245B 74LVTH16245B 1DIR 1 48 1OE 1B0 2 47 1A0 1B1 3 46 1A1 GND 4 45 GND 1B2 5 44 1A2 1B3 6 43 1A3 VCC 7 42 VCC 1B4 8 41 1A4 1B5 9 40 1A5 GND 10 39 GND 1B6 11 38 1A6 1B7 12 37 1A7 2B0 13 36 2A0 2B1 14 35 2A1 GND 15 34 GND 2B2 16 33 2A2 2B3 17 32 2A3 VCC 18 31 VCC 2B4 19 30 2A4 2B5 20 29 2A5 GND 21 28 GND 2B6 22 27 2A6 2B7 23 26 2A7 2DIR 24 25 2OE 74LVT16245B 1 2 3 4 5 6 A 1DIR n.c. n.c. n.c. n.c. 1OE B 1B1 1B0 GND GND 1A0 1A1 C 1B3 1B2 VCC VCC 1A2 1A3 D 1B5 1B4 GND GND 1A4 1A5 E 1B7 1B6 1A6 1A7 F 2B0 2B1 2A1 2A0 G 2B2 2B3 GND GND 2A3 2A2 H 2B4 2B5 VCC VCC 2A5 2A4 J 2B6 2B7 GND GND 2A7 2A6 K 2DIR n.c. n.c. n.c. n.c. 2OE 001aae474 Transparent top view 001aae471 Fig 3. Pin configuration for SSOP48 and TSSOP48 74LVT_LVTH16245B_7 Product data sheet Fig 4. Pin configuration for VFBGA56 All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 4 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state terminal 1 index area D1 A32 A1 D5 A31 A30 B20 A29 B19 A28 B18 A27 D4 D8 A26 A2 A25 B1 B17 B2 B16 A3 A24 A4 A23 B15 B3 A5 A22 74LVT16245B 74LVTH16245B B4 B14 A6 A21 B5 B13 B6 B12 A7 A20 A8 A19 B7 B11 A9 A18 GND(1) A10 D6 D2 A11 A12 B10 B9 B8 A13 A14 A15 D7 A17 A16 D3 001aaj656 Transparent top view (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 5. Pin configuration SOT1134-1 (HXQFN60U) 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 5 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 5.2 Pin description Table 2. Pin description Symbol Pin Description SOT370-1 and SOT362-1 SOT702-1 SOT1134-1 1DIR, 2DIR 1, 24 A1, K1 A30, A13 1B0 to 1B7 2, 3, 5, 6, 8, 9, 11, 12 B2, B1, C2, C1, D2, D1, E2, E1 B20, A31, D5, D1, A2, data input/output B2, B3, A5 2B0 to 2B7 13, 14, 16, 17, 19, 20, 22, 23 F1, F2, G1, G2, H1, H2, J1, J2 A6, B5, B6, A9, D2, D6, A12, B8 GND 4, 10, 15, 21, 28, 34, 39, B3, D3, G3, J3, J4, 45 G4, D4, B4 A32, A3, A8, A11, A16, ground (0 V) A19, A24, A27 VCC 7, 18, 31, 42 C3, H3, H4, C4 A1, A10, A17, A26 supply voltage 1OE, 2OE 48, 25 A6, K6 A29, A14 output enable input (active LOW) 2A0 to 2A7 36, 35, 33, 32, 30, 29, 27, 26 F6, F5, G6, G5, H6, H5, J6, J5 A21, B13, B12, A18, D3, D7, A15, B10 data input/output 1A0 to 1A7 47, 46, 44, 43, 41, 40, 38, 37 B5, B6, C5, C6, D5, D6, E5, E6 B18, A28, D8, D4, A25, B16, B15, A22 data input/output n.c. - A2, A3, A4, A5, A4, A7, A20, A23, B1, B4, B7, B9, B11, B14, B17, B19 not connected K2, K3, K4, K5 direction control input data input/output 6. Functional description 6.1 Function table Table 3. Function table [1] Control Input/output nOE nDIR nAn nBn L L output nAn = nBn input L H input output nBn = nAn H X Z Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 6 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit −0.5 +4.6 V [1] −0.5 +7.0 V [1] −0.5 +7.0 V −50 - mA VI input voltage VO output voltage output in OFF-state or HIGH-state IIK input clamping current VI < 0 V IOK output clamping current VO < 0 V −50 - mA IO output current output in LOW-state - 128 mA output in HIGH-state −64 - mA −65 +150 °C [2] - 150 °C (T)SSOP48 package [3] - 500 mW VFBGA56 package [4] - 1000 mW HXQFN60U package [4] - 1000 mW storage temperature Tstg Tj junction temperature Ptot total power dissipation Tamb = −40 °C to +85 °C; [1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. [3] Above 60 °C the value of Ptot derates linearly with 5.5 mW/K. [4] Above 70 °C the value of Ptot derates linearly with 1.8 mW/K. 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter Min Typ Max Unit VCC supply voltage Conditions 2.7 - 3.6 V VI input voltage 0 - 5.5 V VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.8 V IOH HIGH-level output current −32 - - mA IOL LOW-level output current none - - 32 mA current duty cycle ≤ 50 %; fi ≥ 1 kHz - - 64 mA in free-air −40 - +85 °C - - 10 ns/V Tamb ambient temperature Δt/ΔV input transition rise and fall rate outputs enabled 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 7 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = −40 °C to +85 Conditions Min Typ Max Unit VCC = 2.7 V; IIK = −18 mA −1.2 −0.85 °C[1] VIK input clamping voltage VOH HIGH-level output voltage IOH = −100 μA; VCC = 2.7 V to 3.6 V VOL - V VCC − 0.2 VCC - V IOH = −8 mA; VCC = 2.7 V 2.4 2.5 - V IOH = −32 mA; VCC = 3.0 V 2.0 2.3 - V IOL = 100 μA - 0.07 0.2 V IOL = 24 mA - 0.3 0.5 V IOL = 16 mA - 0.25 0.4 V IOL = 32 mA - 0.3 0.5 V IOL = 64 mA - 0.4 0.55 V LOW-level output voltage VCC = 2.7 V VCC = 3.0 V II input leakage current control pins VCC = 3.6 V; VI = VCC or GND - 0.1 ±1 μA VCC = 0 V or 3.6 V; VI = 5.5 V - 0.1 10 μA - 0.1 20 μA VI = VCC - 0.5 10 μA VI = 0 V −5 −0.1 - μA - 0.1 ±100 μA 75 135 - μA input/output data pins; VCC = 3.6 V [2] VI = 5.5 V IOFF power-off leakage current VCC = 0 V; VI or VO = 0 V to 4.5 V IBHL bus hold LOW current VCC = 3 V; VI = 0.8 V [3] IBHH bus hold HIGH current VCC = 3 V; VI = 2.0 V - −135 −75 μA IBHLO bus hold LOW overdrive current nAn input; VI = 0 V to 3.6 V; VCC = 3.6 V 500 - - μA IBHHO bus hold HIGH overdrive current nAn input; VI = 0 V to 3.6 V; VCC = 3.6 V - - −500 μA ILO output leakage current output in HIGH-state when VO > VCC; VO = 5.5 V; VCC = 3.0 V - 75 125 μA IO(pu/pd) power-up/power-down output current VCC ≤ 1.2 V; VO = 0.5 V to VCC; VI = GND or VCC; nOE = don’t care - 40 ±100 μA ICC supply current VCC = 3.6 V; VI = GND or VCC; IO = 0 A - 0.07 0.12 mA [4] outputs HIGH outputs LOW outputs disabled ΔICC additional supply current per input pin; VCC = 3.0 V to 3.6 V; one input at VCC − 0.6 V, other inputs at VCC or GND CI input capacitance pins nDIR and nOE, VO = 0 V or 3.0 V 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 - 4.7 6.0 mA [5] - 0.07 0.12 mA [6] - 0.1 0.2 mA - 3 - pF © NXP B.V. 2010. All rights reserved. 8 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit Cio(off) pins nAn and nBn, outputs disabled; VO = GND or VCC - 9 - pF off-state input/output capacitance [1] Typical values are measured at VCC = 3.3 V and at Tamb = 25 °C. [2] Unused pins at VCC or GND. [3] This is the bus hold overdrive current required to force the input to the opposite logic state. [4] This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 ms. From VCC = 1.2 V to VCC = 3.3 V ± 0.3 V a transition time of 100 μs is permitted. This parameter is valid for Tamb = 25 °C only. [5] ICC is measured with outputs pulled to VCC or GND. [6] This is the increase in supply current for each input at the specified voltage level other than VCC or GND. 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter Min Typ[1] Max Unit VCC = 2.7 V - - 3.5 ns VCC = 3.0 V to 3.6 V 1.0 1.9 3.3 ns VCC = 2.7 V - - 3.5 ns VCC = 3.0 V to 3.6 V 1.0 1.7 3.3 ns VCC = 2.7 V - - 5.3 ns VCC = 3.0 V to 3.6 V 1.0 2.8 4.5 ns VCC = 2.7 V - - 5.1 ns VCC = 3.0 V to 3.6 V 1.0 2.8 4.1 ns VCC = 2.7 V - - 5.7 ns VCC = 3.0 V to 3.6 V 1.5 3.2 5.1 ns VCC = 2.7 V - - 4.6 ns VCC = 3.0 V to 3.6 V 1.5 3.0 4.6 ns Conditions Tamb = −40 °C to +85 °C tPLH tPHL tPZH tPZL tPHZ tPLZ [1] LOW to HIGH propagation delay HIGH to LOW propagation delay nAn to nBn or nBn to nAn; see Figure 6 nAn to nBn or nBn to nAn; see Figure 6 OFF-state to HIGH propagation delay nOE to nAn or nBn; see Figure 7 OFF-state to LOW propagation delay nOE to nAn or nBn; see Figure 7 HIGH to OFF-state propagation delay LOW to OFF-state propagation delay nOE to nAn or nBn; see Figure 7 nOE to nAn or nBn; see Figure 7 All typical values are at VCC = 3.3 V and Tamb = 25 °C. 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 9 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 11. Waveforms VI nAn, nBn input VM GND t PHL t PLH VOH nBn, nAn output VM VOL mna477 Measurements points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Propagation delay input (nAn, nBn) to output (nBn, nAn) VI nOE input VM 0V tPLZ tPZL 3.0 V nAn or nBn output VM VX VOL tPHZ tPZH VOH VY nBn or nAn output VM 0V 001aaj658 Measurements points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. 3-state output enable and disable times Table 8. Measurement points Input Output VM VM VX VY 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 10 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state VI tW 90 % negative pulse VM 0V VI tf tr tr tf 90 % positive pulse 0V VM 10 % VM VM 10 % tW VEXT VCC VI PULSE GENERATOR RL VO DUT RT CL RL 001aae235 Test data is given in Table 9. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 8. Table 9. Test circuit for measuring switching times Test data Input Load VEXT VI fi tW tr, tf CL RL tPHZ, tPZH tPLZ, tPZL tPLH, tPHL 2.7 V ≤ 10 MHz 500 ns ≤ 2.5 ns 50 pF 500 Ω GND 6V open 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 11 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 12. Package outline SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 D E A X c y HE v M A Z 25 48 Q A2 A1 A (A 3) θ pin 1 index Lp L 24 1 detail X w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.8 0.4 0.2 2.35 2.20 0.25 0.3 0.2 0.22 0.13 16.00 15.75 7.6 7.4 0.635 10.4 10.1 1.4 1.0 0.6 1.2 1.0 0.25 0.18 0.1 0.85 0.40 8 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT370-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-118 Fig 9. Package outline SOT370-1 (SSOP48) 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 12 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z θ mm 1.2 0.15 0.05 1.05 0.85 0.25 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 8.3 7.9 1 0.8 0.4 0.50 0.35 0.25 0.08 0.1 0.8 0.4 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 10. Package outline SOT362-1 (TSSOP48) 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 13 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1 1/2 C ∅v M C A B ∅w M C b e y1 C e y K J H e G F e2 E D 1/2 e C X B A ball A1 index area 1 2 3 4 5 6 DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b D E e e1 e2 v w y y1 mm 1 0.3 0.2 0.7 0.6 0.45 0.35 4.6 4.4 7.1 6.9 0.65 3.25 5.85 0.15 0.08 0.08 0.1 OUTLINE VERSION SOT702-1 REFERENCES IEC JEDEC JEITA 0 2.5 5 mm scale EUROPEAN PROJECTION ISSUE DATE 02-08-08 03-07-01 MO-225 Fig 11. Package outline SOT702-1 (VFBGA56) 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 14 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 4 x 6 x 0.5 mm B D SOT1134-1 A terminal 1 index area E A A1 detail X e2 e1 1/2 e e C A B C v w L1 D2 D6 A11 eR y D7 B10 A10 L y1 C D3 A16 B8 C C A B C v w b A17 e B11 B7 e3 Eh e4 1/2 e B1 B17 A1 terminal 1 index area A26 D5 D1 B20 B18 A32 D8 A27 X D4 Dh k 0 2.5 Dimensions Unit mm 5 mm scale A A1 b max 0.50 0.05 0.35 nom 0.48 0.02 0.30 min 0.46 0.00 0.25 D Dh E Eh e e1 e2 e3 e4 eR 4.1 4.0 3.9 1.90 1.85 1.80 6.1 6.0 5.9 3.90 3.85 3.80 0.5 1 2.5 3 4.5 0.5 k L 0.25 0.35 0.20 0.30 0.15 0.25 L1 0.125 0.075 0.025 v w y 0.07 0.05 0.08 y1 0.1 sot1134-1_po References Outline version IEC JEDEC JEITA SOT1134-1 --- --- --- European projection Issue date 08-12-17 09-01-22 Fig 12. Package outline SOT1134-1 (HXQFN60U) 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 15 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 13. Abbreviations Table 10. Abbreviations Acronym Description BiCMOS Bipolar Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVT_LVTH16245B_7 20100329 Product data sheet - 74LVT_LVTH16245B_6 Modifications: 74LVT_LVTH16245B_6 Modifications: • 74LVT16245BBQ and 74LVTH16245BBQ changed from HUQFN60U (SOT1025-1) to HXQFN60U (SOT1134-1) package. 20090409 • • Product data sheet - 74LVT_LVTH16245B_5 Section 2: Class II added for latch-up protection. Table 6: Conditions for bus hold overdrive current have changed. 74LVT_LVTH16245B_5 20090312 Product data sheet - 74LVT_LVTH16245B_4 74LVT_LVTH16245B_4 20060323 Product data sheet - 74LVT16245B_3 74LVT16245B_3 20021031 Product data sheet - 74LVT16245B_2 74LVT16245B_2 19980219 Product specification - 74LVT16245B_1 74LVT16245B_1 19940523 Product specification - - 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 16 of 19 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be 74LVT_LVTH16245B_7 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 17 of 19 NXP Semiconductors 74LVT16245B; 74LVTH16245B 3.3 V 16-bit transceiver; 3-state 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVT_LVTH16245B_7 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 07 — 29 March 2010 © NXP B.V. 2010. All rights reserved. 18 of 19 NXP Semiconductors 74LVT16245B; 74LVTH16245B 3.3 V 16-bit transceiver; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 6.1 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional description . . . . . . . . . . . . . . . . . . . 6 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Recommended operating conditions. . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 29 March 2010 Document identifier: 74LVT_LVTH16245B_7