Philips Components Product specification Standard chip resistors sizes 1206, 0805, 0603 and 0402 RC01/11/21/31 FEATURES DESCRIPTION • Low assembly costs The resistors are constructed on a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste which is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance, by laser cutting of this resistive layer. • High component and equipment reliability • Excellent performance at high frequency, especially the RC31 • Complete standard SMD family. APPLICATIONS • All general purpose applications. The resistive layer is covered with a protective coat and printed with the resistance value. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a lead/tin alloy. QUICK REFERENCE DATA VALUE DESCRIPTION Size code RC01 RC11 RC21 RC31(1) 1206 (3216) 0805 (2012) 0603 (1608) 0402(1005) 1 Ω to 10 MΩ Resistance range 10 Ω to 1 MΩ ±5%, ±2%; E24 series Resistance tolerance and E-series ≤ ±200 × 10−6/K Temperature coefficient: 1Ω≤R<5Ω ≤ ±250 × 10−6/K 5 Ω ≤ R ≤ 10 MΩ ≤ ±200 × 10−6/K Maximum dissipation at Tamb = 70 °C Maximum permissible voltage Climatic category (IEC 68) 0.25 W 0.125 W 0.063 W 0.063 W 200 V (DC or RMS) 150 V (DC or RMS) 50 V (DC or RMS) 50 V (DC or RMS) 55/155/56 Basic specification 55/125/56 IEC 115-8 Stability after: load, 1000 hours at Tamb = 70 °C: ∆R/R max.: ±3.0% +0.1 Ω 1 Ω ≤ R ≤ 1 MΩ ∆R/R max.: ±1.5% +0.1 Ω R > 1 MΩ ∆R/R max.: ±3.0% +0.1 Ω ∆R/R max.: ±1.0% +0.1 Ω climatic tests: 1 Ω ≤ R ≤ 1 MΩ ∆R/R max.: ±1.5% +0.1 Ω R > 1 MΩ ∆R/R max.: ±3.0% +0.1 Ω resistance to soldering heat ∆R/R max.: ±0.5% +0.05 Ω ∆R/R max.: ±1.0% +0.1 Ω short time overload ∆R/R max.: ±1.0% +0.05 Ω ∆R/R max.: ±2.0% +0.1 Ω Note 1. Data for RC31 is preliminary. 1997 Feb 26 1 Philips Components Product specification Standard chip resistors sizes 1206, 0805, 0603 and 0402 RC01/11/21/31 ORDERING INFORMATION Table 1 Ordering code indicating resistor type and packaging ORDERING CODE 2322 ... ..... TYPE RC01 RC11 RC21 TOL. (%) CARDBOARD TAPE ON REEL(3) 5000 units ±5 711 61... ±2 711 41... ±5 730 61... ±2 730 31... ±5 702 60... ±2 702 65... ±5 − RC01(1) − 711 91032 RC11(1) − RC21(2) RC31(2) RC31 10000 units 20000 units 711 51... 711 81... − BULK CASE 10000 units 25000 units 100000 units − − − − − − 730 81... 731 81... − − 730 41... 731 51... − − 711 71... 730 71... − 702 70... − 702 81... − 702 80... − 702 75... − 702 50... − − − − 711 91005 711 92004 − − − 730 91002 730 91003 730 92002 731 91006 − − − 702 96001 702 97001 702 92002 − 702 91002 − − − 705 91001 − − − 705 91005 705 70... 705 80... Jumper 0 Ω Notes 1. The jumper has a maximum resistance Rmax = 50 mΩ and a rated current IR = 2 A. 2. The jumper has a maximum resistance Rmax = 50 mΩ and a rated current IR = 1 A. 3. Embossed carrier tape available on request for types RC01 and RC11. Ordering code (12NC) • The resistors have a 12-digit ordering code starting with 2322 • The subsequent 5 digits indicate the resistor type and packaging; see Table 1. • The remaining 3 digits indicate the resistance value: – The first 2 digits indicate the resistance value. – The last digit indicates the resistance decade in accordance with Table 2. 1997 Feb 26 Table 2 Last digit of 12NC ORDERING EXAMPLE RESISTANCE DECADE LAST DIGIT 1 to 9.76 Ω 8 10 to 97.6 Ω 9 100 to 976 Ω 1 1 to 9.76 kΩ 2 10 to 97.6 kΩ 3 100 to 976 kΩ 4 1 to 9.76 MΩ 5 10 MΩ 6 2 The ordering code of a RC11 resistor, value 4700 Ω with ±2% tolerance, supplied on cardboard tape of 5000 units per reel is: 2322 730 31472. Philips Components Product specification Standard chip resistors sizes 1206, 0805, 0603 and 0402 RC01/11/21/31 FUNCTIONAL DESCRIPTION DERATING Product characterization The power that the resistor can dissipate depends on the operating temperature; see Fig.1. Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±5% or ±2%. The values of the E24 series are in accordance with “IEC publication 63”. Pmax Limiting values (%Prated) LIMITING VOLTAGE(1) (V) TYPE LIMITING POWER (W) RC01 200 0.25 RC11 150 0.125 50 0.063 RC21 RC31 CCA443 100 50 RC01 RC11 RC21 RC31 0 − 55 0 50 70 100 125 155 Tamb (°C) Note 1. This is the maximum voltage that may be continuously applied to the resistor element, see “IEC publication 115-8”. Fig.1 Maximum dissipation (Pmax) in percentage of rated power as a function of the ambient temperature (Tamb). PULSE LOADING CAPABILITIES MBD641 10 4 handbook, full pagewidth Vmax (V) 1.2/50 µs 10 3 10/700 µs 10 2 10 10 10 2 10 3 10 4 10 5 10 6 These pulses may not be applied on a regular basis. Fig.2 1997 Feb 26 Maximum permissible peak pulse voltage without failing to ‘open circuit’ in accordance with DIN IEC 40 (CO) 533 for type: RC01. 3 R n (Ω) 10 7 Philips Components Product specification Standard chip resistors sizes 1206, 0805, 0603 and 0402 RC01/11/21/31 MBD587 10 4 handbook, full pagewidth Vmax (V) 10 1.2/50 µs 3 10/700 µs 10 2 10 10 10 2 10 3 10 4 10 5 10 6 R n (Ω) 10 7 These pulses may not be applied on a regular basis. Fig.3 Maximum permissible peak pulse voltage without failing to ‘open circuit’ in accordance with DIN IEC 40 (CO) 533 for type: RC11. MBD590 10 4 handbook, full pagewidth Vmax (V) 10 3 1.2/50 µs 10/700 µs 10 2 10 10 10 2 10 3 10 4 10 5 10 6 These pulses may not be applied on a regular basis. Fig.4 1997 Feb 26 Maximum permissible peak pulse voltage without failing to ‘open circuit’ in accordance with DIN IEC 40 (CO) 533 for type: RC21. 4 R n (Ω) 10 7 Philips Components Product specification Standard chip resistors sizes 1206, 0805, 0603 and 0402 RC01/11/21/31 MLB383 10 3 ^ P max (W) 10 2 single pulse 10 t p /t i = 1000 1 rep. pulse 10 1 10 6 Fig.5 10 5 10 4 10 3 10 2 10 1 t i (s) 1 Pulse on a regular basis for type: RC01; maximum permissible peak pulse power ( Pˆ max ) as a function of pulse duration for R ≤ 10 kΩ, single pulse and repetitive pulse tp/ti = 1000. MGA209 700 handbook, full pagewidth ^ Vmax (V) 600 500 400 300 200 100 0 10 – 6 Fig.6 1997 Feb 26 10 – 5 10 – 4 10 – 3 10 – 2 10 –1 t i (s) Pulse on a regular basis for type: RC01; maximum permissible peak pulse voltage ( Vˆ max ) as a function of pulse duration. 5 1 Philips Components Product specification Standard chip resistors sizes 1206, 0805, 0603 and 0402 RC01/11/21/31 MBD588 10 3 handbook, full pagewidth P max (W) 10 2 single pulse 10 t p /t i =1000 1 10 1 10 6 Fig.7 10 5 10 4 10 3 10 2 10 1 1 t i (s) ˆ max ) as a Pulse on a regular basis for type: RC11; maximum permissible peak pulse power ( P function of pulse duration for R ≤ 10 kΩ, single pulse and repetitive pulse tp/ti = 1000. MLB722 600 handbook, full pagewidth Vmax (V) 400 200 0 10 6 Fig.8 1997 Feb 26 10 5 10 4 10 3 10 2 10 1 t i (s) 1 ˆ max ) as a Pulse on a regular basis for type: RC11; maximum permissible peak pulse voltage ( V function of pulse duration. 6 Philips Components Product specification Standard chip resistors sizes 1206, 0805, 0603 and 0402 RC01/11/21/31 MBD591 2 10full handbook, pagewidth P max (W) 10 single pulse t p /t i =1000 1 10 1 10 2 10 6 Fig.9 10 5 10 4 10 3 10 2 10 1 t i (s) 1 ˆ max ) as a Pulse on a regular basis for type: RC21; maximum permissible peak pulse power ( P function of pulse duration for R ≤ 10 kΩ, single pulse and repetitive pulse tp/ti = 1000. MBD592 300 handbook, full pagewidth Vmax (V) 200 100 0 10 6 10 5 10 4 10 3 10 2 10 1 t i (s) Fig.10 Pulse on a regular basis for type: RC21; maximum permissible peak pulse voltage ( Vˆ max ) as a function of pulse duration. 1997 Feb 26 7 1 Philips Components Product specification Standard chip resistors sizes 1206, 0805, 0603 and 0402 MECHANICAL DATA RC01/11/21/31 Outlines Mass per 100 units TYPE MASS (g) RC01 1.0 RC11 0.55 RC21 0.25 RC31 0.052 protective coat handbook, 4 columns resistor layer inner electrode T end termination ceramic substrate tb protective coat tt marking Marking Each resistor, except RC31, is marked with a three digit code (occasionally four digit) on the protective coating to designate the nominal resistance value. 22R W MBE940 3-DIGIT MARKING L For values up to 91 Ω the R is used as a decimal point. For values of 100 Ω or greater the first 2 digits are significant, the third indicates the number of zeros to follow. Example MARKING For dimensions see Table 3. Fig.11 Outlines. Table 3 RESISTANCE Chip resistor types and relevant physical dimensions; see Fig.11 TYPE L (mm) W (mm) T (mm) tt (mm) tb (mm) RC01 3.20 +0.10/−0.20 1.60 ±0.15 0.55 ±0.10 0.45 ±0.25 0.50 ±0.25 4-DIGIT MARKING RC11 2.00 ±0.15 1.25 ±0.15 0.55 ±0.10 0.40 ±0.20 0.40 ±0.20 For values up to 976 Ω the R is used as a decimal point. For values of 1 kΩ or greater the first 3 digits are significant, the fourth indicates the number of zeros to follow. RC21 1.60 ±0.10 0.80 +0.15/−0.05 0.45 ±0.10 0.30 ±0.20 0.30 ±0.20 RC31 1.00 ±0.05 0.50 ±0.05 0.35 ±0.05 0.20 ±0.10 0.25 ±0.10 12R 12 Ω 823 82 kΩ Example MARKING RESISTANCE 12R0 12 Ω 8202 82 kΩ The packaging is also marked and includes resistance value, tolerance, TC value, catalogue number, quantity, production period, batch number and source code. 1997 Feb 26 8 The tests are carried out in accordance with IEC publication 68, “Recommended basic climatic and mechanical robustness testing procedure for electronic components” and under standard atmospheric conditions according to “IEC 68-1”, subclause 5.3. Table 4 Temperature: 15 °C to 35 °C Relative humidity: 45% to 75% Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). In Table 4 the tests and requirements are listed with reference to the relevant clauses of “IEC publications 115-8 and 68” ; a short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux. Test procedures and requirements IEC IEC 68-2 115-8 TEST CLAUSE METHOD TEST PROCEDURE RESISTANCE RANGE REQUIREMENTS RC01 RC11 RC21 RC31 Tests in accordance with the schedule of IEC publication 115-8 visual examination 4.4.2 dimensions (outline; see Fig.11) 9 4.4.1 no holes; clean surface; no damage gauge (mm) 0.45 ≤ T ≤ 0.65 0.35 ≤ T ≤ 0.55 0.30 ≤ T ≤ 0.40 1.45 ≤ W ≤ 1.10 ≤ W ≤ 0.75 ≤ W ≤ 1.75 1.40 0.95 0.45 ≤ W ≤ 0.55 3.0 ≤ L ≤ 3.3 4.5 resistance Philips Components Essentially all tests are carried out in accordance with the schedule of “IEC publication 115-8”, category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and EIAJ. Standard chip resistors sizes 1206, 0805, 0603 and 0402 1997 Feb 26 Unless otherwise specified the following values apply: TESTS AND REQUIREMENTS applied voltage (+0/−10%): R < 10 Ω: 0.1 V 10 Ω ≤ R < 100 Ω: 0.3 V 100 Ω ≤ R < 1 kΩ: 1 V 100 kΩ ≤ R < 1 MΩ: 25 V R ≥ 1 MΩ: 50 V R − Rnom: max. ±2% or R − Rnom: max. ±5% 1.50 ≤ L ≤ 1.70 0.95 ≤ L ≤ 1.05 R − Rnom: max. ±5% Product specification 10 kΩ ≤ R < 100 kΩ: 10 V 1.85 ≤ L ≤ 2.15 RC01/11/21/31 1 kΩ ≤ R < 10 kΩ: 3 V 0.45 ≤ T ≤ 0.65 20 (Ta) resistance to soldering heat PROCEDURE RESISTANCE RANGE unmounted chips; 10 s; 260 ±5 °C REQUIREMENTS RC01 RC11 RC21 RC31 no visual damage no visual damage ∆R/R max.: ±0.5% +0.05 Ω; ∆R/R max.: ±1% +0.1 Ω 4.29 45 (Xa) component solvent resistance isopropyl alcohol or H2O followed by brushing in accordance with “MIL 202 F” no visual damage 4.17 20 (Ta) solderability unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±5 °C good tinning (≥95% covered); no visual damage voltage proof on maximum voltage (RMS) during insulation 1 minute metal block method 4.13 short time overload room temperature; P = 6.25 × Pn; 5 s (V ≤ 2 × Vmax) 4.33 bending resistors mounted on a 90 mm glass epoxy resin PCB (FR4), bending: 3 mm for RC01 and 5 mm for RC11, RC21 and RC31 ∆R/R max.: ±1% +0.05 Ω 30 minutes at LCT and 30 minutes at UCT; 5 cycles no visual damage no visual damage ∆R/R max.: ±0.5% +0.05 Ω ∆R/R max.: ±2% +0.1 Ω 10 4.7 4.19 14 (Na) 4.23 rapid change of temperature no breakdown or flashover ∆R/R max.: ±1% +0.05 Ω ∆R/R max.: ±2% +0.1 Ω Philips Components 4.18 TEST Standard chip resistors sizes 1206, 0805, 0603 and 0402 1997 Feb 26 IEC IEC 68-2 115-8 TEST CLAUSE METHOD no visual damage climatic sequence: damp heat (accelerated) 1st cycle 4.23.6 30 (D) damp heat (accelerated) remaining cycles 6 days; 55 °C; 95 to 98% RH Rins min.: 104 MΩ R ≤ 1 MΩ ∆R/R max.: ±1.5% +0.1 Ω ∆R/R max.: ±1% +0.1 Ω R > 1 MΩ ∆R/R max.: ±3% +0.1 Ω not applicable Product specification 30 (D) RC01/11/21/31 4.23.3 3 (Ca) 4.25.1 4.23.2 27 (Ba) 4.8.4.2 PROCEDURE RESISTANCE RANGE damp heat (steady state) (IEC) 56 days; 40 °C; 90 to 95% RH; loaded with 0.01 Pn (IEC steps: 4 to 100 V) endurance (at 70 °C) 1000 hours; loaded with Pn or Vmax; R ≤ 1 MΩ 1.5 hours on and 0.5 hours off endurance at upper category temperature 1000 hours; no load temperature coefficient at 20/LCT/20 °C and 20/UCT/20 °C (TC × 10−6/K) REQUIREMENTS RC01 RC11 RC21 RC31 R ≤ 1 MΩ ∆R/R max.: ±1.5% +0.1 Ω ∆R/R max.: ±3% +0.1 Ω R > 1 MΩ ∆R/R max.: ±3% +0.1 Ω not applicable ∆R/R max.: ±1.5% +0.1 Ω ∆R/R max.: ±3% +0.1 Ω R > 1 MΩ ∆R/R max.: ±3% +0.1 Ω not applicable R ≤ 1 MΩ ∆R/R max.: ±1.5% +0.1 Ω ∆R/R max.: ±3% +0.1 Ω R > 1 MΩ ∆R/R max.: ±3% +0.1 Ω not applicable R<5Ω ≤ ±250 not applicable R ≤ 10 MΩ ≤ ±200 ≤ ±200 Other tests in accordance with IEC 115 clauses and IEC 68 test method solderability (after ageing) 8 hours steam or 16 hours 155 °C; unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±5 °C 4.6.1.1 insulation resistance voltage (DC) after 1 minute, metal block method: 100 V for RC01 and RC11, 50 V for RC21 and RC31 4.12 noise IEC publication 195 (measured with Quantech equipment) 4.17 20 (Tb) good tinning (≥95% covered); no damage Philips Components 4.24.2 TEST Standard chip resistors sizes 1206, 0805, 0603 and 0402 1997 Feb 26 IEC IEC 68-2 115-8 TEST CLAUSE METHOD 11 Rins min.: 103 MΩ R ≤ 1 kΩ max. 1 µV/V R ≤ 10 kΩ max. 3 µV/V R ≤ 100 kΩ max. 6 µV/V R ≤ 1 MΩ max. 10 µV/V Other applicable tests leaching unmounted chips; 60 s; 260 ±5 °C trio damp heat test 1 000 hours; +85 °C; 85% RH; loaded with 0.1 Pn or Vmax ∆R/R max.: ±3% +0.1 Ω ∆R/R max.: ±5% +0.1 Ω not applicable good tinning; no leaching R ≤ 1 MΩ R > 1 MΩ ∆R/R max.: ±3% +0.1 Ω ∆R/R max.: ±5% +0.1 Ω not applicable Product specification 1000 hours; +40 °C; 90 to 95% RH; R ≤ 1 MΩ loaded with Pn or Vmax; R > 1 MΩ 1.5 hours on and 0.5 hours off RC01/11/21/31 humidity load (steady state) (JIS)