ETC ARC241

Array chip resistors
size 4 × 0603
ARC241/ARC242
ARV241/ARV242
FEATURES
DESCRIPTION
• 4 × 0603 sized resistors in one
1206-sized package
The resistors are constructed on a
high grade ceramic body (aluminium
oxide). Internal metal electrodes are
added at each end and connected by
a resistive paste which is applied to
the top surface of the substrate. The
composition of the paste is adjusted
to give the approximate resistance
required and the value is trimmed to
within tolerance, by laser cutting of
this resistive layer.
• Reduced reel exchange time
• Low assembly costs
• Reduced PCB area
• Reduced size of final equipment
• Higher component and equipment
reliability.
APPLICATIONS
handbook, 2 columns
R1
• Hand held measuring equipment
• Car telephones
• Computers
• Portable radio, CD and cassette
players.
R3
R4
CCA862
The resistive layer is covered with a
protective coating and printed with the
resistance value. Finally, external end
terminations are added. For ease of
soldering the outer layer of these end
terminations is a lead-tin alloy.
• Camcorders
R2
R1 = R2 = R3 = R4.
For dimensions see Fig.3 and Table 3.
Fig.1 Equivalent circuit diagram.
QUICK REFERENCE DATA
VALUE
DESCRIPTION
ARC241
ARV241
ARC242
ARV242
10 Ω to 1 MΩ
Resistance range
Resistance tolerance and E-series
±5%; E24 series
±1%; E96 series
±1%; E24/E96 series
Temperature coefficient
≤±200 × 10−6/K
≤±100 × 10−6/K
≤±200 × 10−6/K
Absolute maximum dissipation
per resistive element at T amb = 70 °C
0.063 W
Maximum permissible voltage
50 V (DC or RMS)
Climatic category (IEC 60068)
55/155/56
Basic specification
IEC 60115-8
R-Array overview
TYPE
TERMINATION
TECHNOLOGY
SIZE
TOLERANCE
(%)
ARC241
concave
4 × 0603
5
ARC242
concave
4 × 0603
1
ARV241
convex
4 × 0603
5
ARV242
convex
4 × 0603
1
1
Array chip resistors
size 4 × 0603
ARC241/ARC242
ARV241/ARV242
FUNCTIONAL DESCRIPTION
DERATING
Product characterization
The power that the resistor can dissipate depends on the operating ambient
temperature; see Fig.2.
Standard values of nominal
resistance are taken from the
E24 or E96 series for resistors
with a tolerance of ±5% or ±1%.
The values of the E24/E96 series
are in accordance with
“IEC publication 60063”.
CCB412
handbook, 4 columns Pmax
(%Prated)
100
Limiting values
TYPE
LIMITING
VOLTA GE(1)
(V)
LIMITING
POWER
(W)
50
0.063
50
ARC241
ARC242
ARV241
0
−55
0
50
70
100
155
Tamb (°C)
ARV242
Note
1. This is the maximum voltage that
may be continuously applied to
the resistor element, see
“IEC publication 60115-8”.
Fig.2
Maximum dissipation (Pmax) in percentage of rated power as
a function of the operating ambient temperature (Tamb).
3
Array chip resistors
size 4 × 0603
ARC241/ARC242
ARV241/ARV242
MECHANICAL DATA
PACKAGE MARKING
Mass per 100 units
The packaging is also marked and includes resistance value, tolerance,
catalogue number, quantity, production period, batch number and source code.
TYPE
MASS
(g)
ARC241
1.1
ARC242
1.1
ARV241
0.9186
ARV242
0.9186
Outlines
C
A
a
handbook, 4 columns
B
All resistors within the E24 series are
marked with a 3-digit code and a
4-digit code for resistors of the
E96 series, on the protective coat to
designate the nominal resistance
value.
T
B
103
Marking
A
a
103
a
P
a
P
L
W
L
3-DIGIT MARKING
G
For values up to 91 Ω the R is used as
a decimal point. For values of 100 Ω
or greater the first 2 digits apply to the
resistance value and the third
indicates the number of zeros to
follow.
CCA863
C
124
120 kΩ
000
jumper
Fig.3 Outlines.
Table 3
Physical dimensions; see Fig.3
ARC241/242
4-DIGIT MARKING
ARV241
ARV242
SYMBOL
UNIT
VALUE
TOL.
VALUE
TOL.
VALUE
L
3.20
+0.20/−0.10
3.20
±0.15
3.20
±0.15 mm
W
1.60
+0.20/−0.10
1.60
±0.15
1.60
±0.15 mm
T
0.60
±0.20
0.55
±0.10
0.55
±0.10 mm
A
0.60
±0.15
0.40
±0.15
0.60
±0.05 mm
B
0.35
±0.15
0.30
±0.20
0.30
±0.20 mm
P
0.80
±0.15
0.80
±0.15
0.80
±0.15 mm
RESISTANCE
E
0.50
±0.15
−
−
12 Ω
G
0.50
±0.15
0.30
±0.15
0.30
±0.15 mm
120 kΩ
C
0.10
min.
0.10
min.
0.40
±0.15 mm
For values up to 976 Ω the R is used
as a decimal point. For values of 1 K
or greater the first 3 digits apply to the
resistance value and the fourth
indicates the number of zeros to
follow.
Example
1203
concave termination
For dimensions see Table 3.
RESISTANCE
12 Ω
12R0
C
Dimensions in mm.
12R
MARKING
E
convex termination
Example
MARKING
G
4
−
TOL.
−
mm
TESTS AND REQUIREMENTS
Unless otherwise specified the following values apply:
The tests are carried out in accordance with IEC publication 60 068,
“Recommended basic climatic and mechanical robustness testing
procedure for electronic components” and under standard atmospheric
conditions according to “IEC 60068-1”, subclause 5.3.
Temperature: 15 °C to 35 °C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
In Table 4 the tests and requirements are listed with reference to the
relevant clauses of “IEC publications 60 115-8 and 60068” ; a short
description of the test procedure is also given.
In some instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
Table 4
Array chip resistors
size 4 × 0603
Essentially all tests are carried out in accordance with the schedule of
“IEC publication 60 115-8”, category LCT/UCT/56 (rated temperature
range: Lower Category Temperature, Upper Category Temperature;
damp heat, long term, 56 days). The testing also covers the requirements
specified by EIA and EIAJ.
Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
REQUIREMENTS
TEST
PROCEDURE
ARC241
ARV241
ARC242
ARV242
Tests in accordance with the schedule of IEC publication 60115-8
5
4.4.1
visual examination
no holes; clean surface;
no visible damage
4.4.2
dimensions
(outline; see Fig.3)
gauge (mm)
4.5
resistance
applied voltage (+0/−10%):
10 Ω ≤ R < 100 Ω: 0.3 V
−
see Table 3
R − Rnom:
max. ±5%
R − Rnom:
max. ±1%
R − Rnom:
max. ±5%
100 Ω ≤ R < 1 kΩ: 1 V
1 kΩ ≤ R < 10 kΩ: 3 V
10 kΩ ≤ R < 100 kΩ: 10 V
R ≥ 1 MΩ: 50 V
4.18
20 (Tb)
resistance to
soldering heat
unmounted chips; 10 ±1 s; 260 ±5 °C
no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
4.29
45 (Xa)
component solvent
resistance
isopropyl alcohol or H2O followed by
brushing in accordance with “MIL 202 F”
4.17
20 (Ta)
solderability
unmounted chips completely immersed for
2 ±0.5 s in a solder bath at 235 ±2 °C
∆R/R max.:
±(1% +0.05 Ω)
no visible damage
good tinning (≥95% covered);
no visible damage
ARC241/ARC242
ARV241/ARV242
100 kΩ ≤ R < 1 MΩ: 25 V
IEC
60068-2
TEST
METHOD
REQUIREMENTS
TEST
PROCEDURE
ARC241
4.7
voltage proof on
insulation
4.13
short time overload room temperature; P = 6.25 × Pn;
5 s (V ≤ 2 × Vmax)
4.33
bending
4.19
4.24.2
14 (Na)
3 (Ca)
4.25.1
6
4.23.2
27 (Ba)
4.8.4.2
maximum voltage (RMS) during 1 minute,
metal block method
resistors mounted on a 90 mm glass epoxy
resin PCB (FR4), bending: 5 mm
ARV241
ARC242
ARV242
no breakdown or flashover
∆R/R max.: ±(1% +0.05 Ω)
∆R/R max.:
±(2% +0.1 Ω)
no visible damage
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(0.5% +0.05 Ω)
∆R/R max.:
±(1% +0.05 Ω)
rapid change of
temperature
30 minutes at LCT and
30 minutes at UCT; 5 cycles
damp heat
(steady state)
56 days; 40 ±2 °C; 93 +2/−3% RH;
loaded with 0.01 Pn
∆R/R max.:
±(3% +0.1 Ω)
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(2% +0.1 Ω)
endurance
1000 +48/−0 hours; 70 ±2 °C; loaded with
Pn or V max; 1.5 hours on and 0.5 hours off
∆R/R max.:
±(2% +0.1 Ω)
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(2% +0.1 Ω)
∆R/R max.:
±(2% +0.1 Ω)
∆R/R max.:
±(1% +0.05 Ω)
∆R/R max.:
±(2% +0.1 Ω)
≤±200 × 10−6/K
≤±100 × 10−6/K
≤±200 × 10−6/K
endurance at upper 1000 +48/−0 hours; no load
category
temperature
temperature
coefficient
at 20/LCT/20 °C and 20/UCT/20 °C
Array chip resistors
size 4 × 0603
IEC
60115-8
CLAUSE
no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
∆R/R max.:
±(1% +0.05 Ω)
Other tests in accordance with IEC 60115 clauses and IEC 60068 test method
8 hours steam or 16 hours 155 °C;
unmounted chips completely immersed for
2 ±0.5 s in a solder bath at 235 ±2 °C
4.6.1.1
insulation
resistance
voltage (DC) after 1 minute,
metal block method: 10 V
4.12
noise
IEC publication 60195 (measured with
Quantech-equipment):
20 (Ta)
R ≤ 100 Ω
good tinning (≥95% covered);
no damage
Rins min.: 10 3 MΩ
max. 0.316 µV/V (−10 dB)
100 Ω < R ≤ 1 kΩ
max. 1 µV/V (0 dB)
1 kΩ < R ≤ 10 kΩ
max. 3 µV/V (9.54 dB)
10 kΩ < R ≤ 100 kΩ
max. 6 µV/V (15.56 dB)
100 kΩ < R ≤ 1 MΩ
max. 10 µV/V (20 dB)
ARC241/ARC242
ARV241/ARV242
solderability
(after ageing)
4.17
IEC
60068-2
TEST
METHOD
REQUIREMENTS
TEST
PROCEDURE
ARC241
ARV241
ARC242
ARV242
Other applicable tests
(JIS) C
5202 7.9
endurance
(under damp
and load)
1000 +48/−0 hours; 40 ±2 °C;
93 +2/−3% RH; loaded with P n or V max;
1.5 hours on and 0.5 hours off
EIA
575 3.13
leaching
unmounted chips; 60 ±1 s; 260 ±5 °C
EIA/IS
703 4.5
load humidity
1 000 +48/−0 hours; 85 ±2 °C; 85 ±5% RH;
loaded with 0.01 Pn or V max
∆R/R max.:
±(3% +0.1 Ω)
∆R/R max.:
±(2% +0.1 Ω)
good tinning; no leaching
Array chip resistors
size 4 × 0603
IEC
60115-8
CLAUSE
∆R/R max.:
±(2% +0.1 Ω)
7
ARC241/ARC242
ARV241/ARV242