Array chip resistors size 4 × 0603 ARC241/ARC242 ARV241/ARV242 FEATURES DESCRIPTION • 4 × 0603 sized resistors in one 1206-sized package The resistors are constructed on a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste which is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance, by laser cutting of this resistive layer. • Reduced reel exchange time • Low assembly costs • Reduced PCB area • Reduced size of final equipment • Higher component and equipment reliability. APPLICATIONS handbook, 2 columns R1 • Hand held measuring equipment • Car telephones • Computers • Portable radio, CD and cassette players. R3 R4 CCA862 The resistive layer is covered with a protective coating and printed with the resistance value. Finally, external end terminations are added. For ease of soldering the outer layer of these end terminations is a lead-tin alloy. • Camcorders R2 R1 = R2 = R3 = R4. For dimensions see Fig.3 and Table 3. Fig.1 Equivalent circuit diagram. QUICK REFERENCE DATA VALUE DESCRIPTION ARC241 ARV241 ARC242 ARV242 10 Ω to 1 MΩ Resistance range Resistance tolerance and E-series ±5%; E24 series ±1%; E96 series ±1%; E24/E96 series Temperature coefficient ≤±200 × 10−6/K ≤±100 × 10−6/K ≤±200 × 10−6/K Absolute maximum dissipation per resistive element at T amb = 70 °C 0.063 W Maximum permissible voltage 50 V (DC or RMS) Climatic category (IEC 60068) 55/155/56 Basic specification IEC 60115-8 R-Array overview TYPE TERMINATION TECHNOLOGY SIZE TOLERANCE (%) ARC241 concave 4 × 0603 5 ARC242 concave 4 × 0603 1 ARV241 convex 4 × 0603 5 ARV242 convex 4 × 0603 1 1 Array chip resistors size 4 × 0603 ARC241/ARC242 ARV241/ARV242 FUNCTIONAL DESCRIPTION DERATING Product characterization The power that the resistor can dissipate depends on the operating ambient temperature; see Fig.2. Standard values of nominal resistance are taken from the E24 or E96 series for resistors with a tolerance of ±5% or ±1%. The values of the E24/E96 series are in accordance with “IEC publication 60063”. CCB412 handbook, 4 columns Pmax (%Prated) 100 Limiting values TYPE LIMITING VOLTA GE(1) (V) LIMITING POWER (W) 50 0.063 50 ARC241 ARC242 ARV241 0 −55 0 50 70 100 155 Tamb (°C) ARV242 Note 1. This is the maximum voltage that may be continuously applied to the resistor element, see “IEC publication 60115-8”. Fig.2 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb). 3 Array chip resistors size 4 × 0603 ARC241/ARC242 ARV241/ARV242 MECHANICAL DATA PACKAGE MARKING Mass per 100 units The packaging is also marked and includes resistance value, tolerance, catalogue number, quantity, production period, batch number and source code. TYPE MASS (g) ARC241 1.1 ARC242 1.1 ARV241 0.9186 ARV242 0.9186 Outlines C A a handbook, 4 columns B All resistors within the E24 series are marked with a 3-digit code and a 4-digit code for resistors of the E96 series, on the protective coat to designate the nominal resistance value. T B 103 Marking A a 103 a P a P L W L 3-DIGIT MARKING G For values up to 91 Ω the R is used as a decimal point. For values of 100 Ω or greater the first 2 digits apply to the resistance value and the third indicates the number of zeros to follow. CCA863 C 124 120 kΩ 000 jumper Fig.3 Outlines. Table 3 Physical dimensions; see Fig.3 ARC241/242 4-DIGIT MARKING ARV241 ARV242 SYMBOL UNIT VALUE TOL. VALUE TOL. VALUE L 3.20 +0.20/−0.10 3.20 ±0.15 3.20 ±0.15 mm W 1.60 +0.20/−0.10 1.60 ±0.15 1.60 ±0.15 mm T 0.60 ±0.20 0.55 ±0.10 0.55 ±0.10 mm A 0.60 ±0.15 0.40 ±0.15 0.60 ±0.05 mm B 0.35 ±0.15 0.30 ±0.20 0.30 ±0.20 mm P 0.80 ±0.15 0.80 ±0.15 0.80 ±0.15 mm RESISTANCE E 0.50 ±0.15 − − 12 Ω G 0.50 ±0.15 0.30 ±0.15 0.30 ±0.15 mm 120 kΩ C 0.10 min. 0.10 min. 0.40 ±0.15 mm For values up to 976 Ω the R is used as a decimal point. For values of 1 K or greater the first 3 digits apply to the resistance value and the fourth indicates the number of zeros to follow. Example 1203 concave termination For dimensions see Table 3. RESISTANCE 12 Ω 12R0 C Dimensions in mm. 12R MARKING E convex termination Example MARKING G 4 − TOL. − mm TESTS AND REQUIREMENTS Unless otherwise specified the following values apply: The tests are carried out in accordance with IEC publication 60 068, “Recommended basic climatic and mechanical robustness testing procedure for electronic components” and under standard atmospheric conditions according to “IEC 60068-1”, subclause 5.3. Temperature: 15 °C to 35 °C Relative humidity: 25% to 75% Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). In Table 4 the tests and requirements are listed with reference to the relevant clauses of “IEC publications 60 115-8 and 60068” ; a short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux. Table 4 Array chip resistors size 4 × 0603 Essentially all tests are carried out in accordance with the schedule of “IEC publication 60 115-8”, category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and EIAJ. Test procedures and requirements IEC 60115-8 CLAUSE IEC 60068-2 TEST METHOD REQUIREMENTS TEST PROCEDURE ARC241 ARV241 ARC242 ARV242 Tests in accordance with the schedule of IEC publication 60115-8 5 4.4.1 visual examination no holes; clean surface; no visible damage 4.4.2 dimensions (outline; see Fig.3) gauge (mm) 4.5 resistance applied voltage (+0/−10%): 10 Ω ≤ R < 100 Ω: 0.3 V − see Table 3 R − Rnom: max. ±5% R − Rnom: max. ±1% R − Rnom: max. ±5% 100 Ω ≤ R < 1 kΩ: 1 V 1 kΩ ≤ R < 10 kΩ: 3 V 10 kΩ ≤ R < 100 kΩ: 10 V R ≥ 1 MΩ: 50 V 4.18 20 (Tb) resistance to soldering heat unmounted chips; 10 ±1 s; 260 ±5 °C no visible damage ∆R/R max.: ±(0.5% +0.05 Ω) 4.29 45 (Xa) component solvent resistance isopropyl alcohol or H2O followed by brushing in accordance with “MIL 202 F” 4.17 20 (Ta) solderability unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±2 °C ∆R/R max.: ±(1% +0.05 Ω) no visible damage good tinning (≥95% covered); no visible damage ARC241/ARC242 ARV241/ARV242 100 kΩ ≤ R < 1 MΩ: 25 V IEC 60068-2 TEST METHOD REQUIREMENTS TEST PROCEDURE ARC241 4.7 voltage proof on insulation 4.13 short time overload room temperature; P = 6.25 × Pn; 5 s (V ≤ 2 × Vmax) 4.33 bending 4.19 4.24.2 14 (Na) 3 (Ca) 4.25.1 6 4.23.2 27 (Ba) 4.8.4.2 maximum voltage (RMS) during 1 minute, metal block method resistors mounted on a 90 mm glass epoxy resin PCB (FR4), bending: 5 mm ARV241 ARC242 ARV242 no breakdown or flashover ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(2% +0.1 Ω) no visible damage ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(0.5% +0.05 Ω) ∆R/R max.: ±(1% +0.05 Ω) rapid change of temperature 30 minutes at LCT and 30 minutes at UCT; 5 cycles damp heat (steady state) 56 days; 40 ±2 °C; 93 +2/−3% RH; loaded with 0.01 Pn ∆R/R max.: ±(3% +0.1 Ω) ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(2% +0.1 Ω) endurance 1000 +48/−0 hours; 70 ±2 °C; loaded with Pn or V max; 1.5 hours on and 0.5 hours off ∆R/R max.: ±(2% +0.1 Ω) ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(2% +0.1 Ω) ∆R/R max.: ±(2% +0.1 Ω) ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(2% +0.1 Ω) ≤±200 × 10−6/K ≤±100 × 10−6/K ≤±200 × 10−6/K endurance at upper 1000 +48/−0 hours; no load category temperature temperature coefficient at 20/LCT/20 °C and 20/UCT/20 °C Array chip resistors size 4 × 0603 IEC 60115-8 CLAUSE no visible damage ∆R/R max.: ±(0.5% +0.05 Ω) ∆R/R max.: ±(1% +0.05 Ω) Other tests in accordance with IEC 60115 clauses and IEC 60068 test method 8 hours steam or 16 hours 155 °C; unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±2 °C 4.6.1.1 insulation resistance voltage (DC) after 1 minute, metal block method: 10 V 4.12 noise IEC publication 60195 (measured with Quantech-equipment): 20 (Ta) R ≤ 100 Ω good tinning (≥95% covered); no damage Rins min.: 10 3 MΩ max. 0.316 µV/V (−10 dB) 100 Ω < R ≤ 1 kΩ max. 1 µV/V (0 dB) 1 kΩ < R ≤ 10 kΩ max. 3 µV/V (9.54 dB) 10 kΩ < R ≤ 100 kΩ max. 6 µV/V (15.56 dB) 100 kΩ < R ≤ 1 MΩ max. 10 µV/V (20 dB) ARC241/ARC242 ARV241/ARV242 solderability (after ageing) 4.17 IEC 60068-2 TEST METHOD REQUIREMENTS TEST PROCEDURE ARC241 ARV241 ARC242 ARV242 Other applicable tests (JIS) C 5202 7.9 endurance (under damp and load) 1000 +48/−0 hours; 40 ±2 °C; 93 +2/−3% RH; loaded with P n or V max; 1.5 hours on and 0.5 hours off EIA 575 3.13 leaching unmounted chips; 60 ±1 s; 260 ±5 °C EIA/IS 703 4.5 load humidity 1 000 +48/−0 hours; 85 ±2 °C; 85 ±5% RH; loaded with 0.01 Pn or V max ∆R/R max.: ±(3% +0.1 Ω) ∆R/R max.: ±(2% +0.1 Ω) good tinning; no leaching Array chip resistors size 4 × 0603 IEC 60115-8 CLAUSE ∆R/R max.: ±(2% +0.1 Ω) 7 ARC241/ARC242 ARV241/ARV242