PHILIPS TDA1523

INTEGRATED CIRCUITS
DATA SHEET
TDA1523
Stereo cassette head
preamplifier and equalizer
Preliminary specification
File under Integrated Circuits, IC01
1996 Feb 26
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
FEATURES
GENERAL DESCRIPTION
• Two independent amplifiers with open-loop gain of
90 dB (typical)
The TDA1523 is a playback amplifier for car radio/cassette
players.
• Internal DC feedback via 140 kΩ resistor from output to
feedback point
• AC characteristics that can be determined externally by
an RC network
• Electronic on/off switching with transient suppression for
switch on
• Head input at DC ground that eliminates the input
coupling capacitor
• Minimum external component requirement
• Stability down to a gain of 30 dB
• Low input noise
• Low distortion
• DC input current <2 µA.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
supply voltage (pin 7)
7.5
−
12
V
IP
supply current (pin 7)
−
5
−
mA
Tamb
operating ambient temperature
−30
−
+85
°C
THD
total harmonic distortion
−
0.05
−
%
αcs
channel separation
45
−
−
dB
RS = 10 kΩ; LS = 0
ORDERING INFORMATION
TYPE
NUMBER
TDA1523
1996 Feb 26
PACKAGE
NAME
DIP14
DESCRIPTION
plastic dual in-line package; 14 leads (300 mil)
2
VERSION
SOT27-1
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
BLOCK DIAGRAM
handbook, full pagewidth
C102
220
µF
R102
R101
C101
8.2 Ω
5.6 kΩ
22 nF
TDA1523
feedback 1 140 kΩ
R fb1
2
3
R S1 = 300 Ω
L S1 = 80 mH
Vi1
MUTE
L S2 = 80 mH
C c1
14
output 1
10 µF
4
Vo1
R L1
4.7 kΩ
1
R S2 = 300 Ω
Vi2
AMP 1
SUPPLY
&
MUTE
7
C c2
5
6
8
AMP 2
output 2
10 µF
R fb2
Vo2
R L2
4.7 kΩ
feedback 2 140 kΩ
C202
220
µF
R202
R201
C201
8.2 Ω
5.6 kΩ
22 nF
VP
MGC988
Fig.1 Block diagram with external components; also used as test circuit.
1996 Feb 26
3
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
PINNING
SYMBOL
PIN
DESCRIPTION
MUTE
1
mute input
FB1
2
feedback 1
Vi1
3
input voltage 1
GND
4
ground
Vi2
5
input voltage 2
FB2
6
feedback 2
VP
7
power supply
Vo2
8
output voltage 2
n.c.
9
not connected
n.c.
10
not connected
n.c.
11
not connected
n.c.
12
not connected
n.c.
13
not connected
Vo1
14
output voltage 1
1996 Feb 26
handbook, halfpage
MUTE 1
14 Vo1
FB1 2
13 n.c.
Vi1 3
12 n.c.
GND 4
TDA1523
11 n.c.
Vi2 5
10 n.c.
FB2 6
9 n.c.
VP 7
8 Vo2
MGC989
Fig.2 Pin configuration.
4
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VP
supply voltage (pin 7)
7.5
12
V
Ifb
feedback current (pins 2 and 6)
−
10
mA
Ptot
total power dissipation
−
300
mW
Tamb
operating ambient temperature
−30
+85
°C
Tstg
storage temperature
−55
+150
°C
Note
1. All pins except 2 and 6 (feedback) can be connected to VP (pin 7) or ground (pin 4).
CHARACTERISTICS
VP = 8.5 V; Tamb = 25 °C; see test circuit Fig.1; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin 7)
VP
supply voltage
7.5
−
12
V
IP
supply current
−
5
−
mA
µV
Inputs (pins 3 or 5)
Vni(rms)
unweighted noise input voltage
(RMS value)
f = 20 Hz to 20 kHz;
measured in Fig.3
−
1.6
−
Vni
noise input voltage
RS = 0; f = 1 kHz; measured
in Fig.3; see also Fig.5
−
5
−
Ini
noise input current
f = 1 kHz; measured in Fig.3;
see also Fig.6
−
1.2
−
I3, I5
DC input current at pins 3 and 5
−
−
−2
µA
Zi
input impedance
f = 1 kHz; note 1
200
−
−
kΩ
Vi = 0.3 mV; f = 315 Hz
−
0.72
−
V
THD = 1%; f = 1 kHz
1.0
−
−
V
V1-4 ≥ 7.5 V; mute off
−5
−10
−
mA
−
3.7
−
V
RS = 300 Ω; LS = 80 mH
−
700
−
µV
RS = 300 Ω; LS = 80 mH
−
1200
−
µV
nV
-----------Hz
pA
-----------Hz
Outputs (pins 14 or 8); see Fig.7
Vo
output voltage
IO
output source current
VO
DC output voltage
Vno(rms)
weighted noise output voltage;
DIN A (RMS value)
Vno
weighted noise output voltage
CCITT (peak value)
RS = 300 Ω; LS = 80 mH
−
1600
−
µV
Vno
unweighted noise output voltage;
DIN 45405 (peak value)
RS = 300 Ω; LS = 80 mH
−
1800
−
µV
Zo
output impedance
f = 1 kHz; note 1
−
−
1
kΩ
CCIR (peak value)
1996 Feb 26
5
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
SYMBOL
TDA1523
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Mute on/off (pin 1); see Fig.4
Vmute(on)
mute on voltage
mute switch closed
0
−
1
V
Imute(on)
mute on current
mute switch closed or
V1-4 = 0 V
−
2.7
−
µA
Vmute(off)
mute off voltage
mute switch open
7.5
−
VP
V
Rfb
internal feedback resistor
note 1
100
140
180
kΩ
Gv
open-loop voltage gain
f = 315 Hz; note 1
−
90
−
dB
General
αcs
channel separation
RS = 10 kΩ; LS = 0; note 2
45
−
−
dB
PSRR
power supply ripple rejection
VP(rms) = 0.1 V; f = 100 Hz;
note 3
90
95
−
dB
THD
total harmonic distortion
f = 1 kHz; Vo = 0.3 V; note 4
−
0.05
−
%
Notes
1. Applies to each amplifier.
2. Frequency range 300 Hz to 20 kHz.
3. Referred to the input.
4. Measured selective.
handbook, full pagewidth
C102
1000
µF
R102
R101
C101
8.2 Ω
9.1 kΩ
10 µF
TDA1523
feedback 1 140 kΩ
R fb1
2
3
Vi1
AMP 1
C c1
14
output 1
10 µF
4
R S1
4.7 kΩ
4.7 kΩ
R L1
4.7 kΩ
1
R S2
Vi2
SUPPLY
&
MUTE
7
C c2
5
6
8
AMP 2
output 2
10 µF
R fb2
R202
R201
C201
8.2 Ω
9.1 kΩ
10 µF
VP
MGC990
Fig.3 Test circuit for noise measurement.
1996 Feb 26
6
Vo2
R L2
4.7 kΩ
feedback 2 140 kΩ
C202
1000
µF
Vo1
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
MGC991
0
handbook, halfpage
Vo
(dB)
20
40
60
80
100
0
Fig.4
2
4
V1 4 (V)
6
Muting depth as a function of control voltage
at pin 1.
MLD340
2
10full
handbook,
pagewidth
Vni
(nV/ Hz)
(1)
(2)
10
(3)
1
10
10 2
10 3
10 4
(1) RS = 10 kΩ.
(2) RS = 5 kΩ.
(3) RS = 0.
Fig.5 Noise input voltage as a function of frequency.
1996 Feb 26
7
f (Hz)
10 5
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
MLD341
handbook,10
full pagewidth
Ini
(pA/ Hz)
1
10 1
10
10 2
10 3
10 4
f (Hz)
10 5
Fig.6 Noise input current as a function of frequency.
MLD342
20
handbook, full pagewidth
gf
g 315 Hz
(dB)
10
0
10
20
30
10
10 2
10 3
10 4
Fig.7 Frequency response curve for the circuit in Fig.1.
1996 Feb 26
8
f (Hz)
10 5
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
PRINTED-CIRCUIT BOARD
65
handbook, full pagewidth
RM1
Vo2
RL2
CC2
R201
C201
D201
R202
VP
Vi2
RS2
IC1
SM
C202
CVP1
45
C102
RS1
MUTE
R102
C101
RL1 C
C1 CM
Vo1
R101
Vi1
D101
RM
MGC994
Fig.8 Printed-circuit board component side, showing component layout of Fig.1 and/or Fig.10.
1996 Feb 26
9
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
APPLICATION INFORMATION
handbook, full pagewidth
C102
220
µF
R102
R101
C101
8.2 Ω
5.6 kΩ
22 nF
TDA1523
feedback 1 140 kΩ
R fb1
2
3
Vi1
Vi2
R S1 = 300 Ω
L S1 = 80 mH
Rm
MUTE
SWITCH
output 1
10 µF
4
SUPPLY
&
MUTE
7
C c2
5
6
8
AMP 2
150 kΩ
output 2
10 µF
R fb2
1 µF
R202
R201
C201
8.2 Ω
5.6 kΩ
22 nF
Fig.9 Simple mute application.
1996 Feb 26
10
VP
Vo2
R L2
4.7 kΩ
feedback 2 140 kΩ
C202
220
µF
Vo1
R L1
4.7 kΩ
1
R S2 = 300 Ω
L S2 = 80 mH
AMP 1
C c1
14
MGC992
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
1N4148
handbook, full pagewidth
C102
220
µF
R102
R101
C101
8.2 Ω
5.6 kΩ
22 nF
TDA1523
feedback 1 140 kΩ
R fb1
2
3
Vi1
Vi2
R S1 = 300 Ω
L S1 = 80 mH
68 kΩ
68
2.2
kΩ
µF
SUPPLY
&
MUTE
7
C c2
5
8
AMP 2
R fb2
R201
C201
8.2 Ω
5.6 kΩ
22 nF
1N4148
Fig.10 Application for plop-free muting.
11
Vo2
R L2
4.7 kΩ
feedback 2 140 kΩ
VP
1996 Feb 26
output 2
10 µF
R202
C202
220 µF
Vo1
R L1
4.7 kΩ
1
6
MUTE
SWITCH
output 1
10 µF
4
R S2 = 300 Ω
L S2 = 80 mH
AMP 1
C c1
14
MGC993
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
PACKAGE OUTLINE
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
MH
8
14
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches
0.17
0.020
0.13
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT27-1
050G04
MO-001AA
1996 Feb 26
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-03-11
12
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Feb 26
13
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
NOTES
1996 Feb 26
14
Philips Semiconductors
Preliminary specification
Stereo cassette head
preamplifier and equalizer
TDA1523
NOTES
1996 Feb 26
15
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SCDS47
© Philips Electronics N.V. 1996
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other industrial or intellectual property rights.
Printed in The Netherlands
517021/1100/01/pp16
Document order number:
Date of release: 1996 Feb 26
9397 750 00694