Philips Components Product specification Fusible chip resistor size 1206 FEATURES • Overload protection without the risk of fire • Grey coating for ease of recognition • Reduced size of final equipment • Low assembly costs • Higher component and equipment reliability. APPLICATIONS • Power supplies in small sized equipment • Car telephones • Portable radio, CD and cassette players. FRC01 5% QUICK REFERENCE DATA DESCRIPTION VALUE Resistance range 1 to 510 Ω; E24/E96 series Resistance tolerance ±5% Temperature coefficient: 1 to 4.7 Ω ≤±250 × 10−6/K 5.1 to 510 Ω ≤±200 × 10−6/K Absolute maximum dissipation at Tamb = 70 °C 0.125 W Maximum permissible voltage 200 V (DC or RMS) Operating temperature range −55 °C to +125 °C Climatic category (IEC 60068) 55/125/56 Basic specification IEC 60115-8 ORDERING INFORMATION DESCRIPTION The resistors are constructed on a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste which is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance, by laser cutting of this resistive layer. The resistive layer is covered with a protective coat and printed with the resistance value. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a lead/tin alloy. To enable recognition of a fusible device, the resistor should be mounted face up. 1999 Feb 10 Table 1 Ordering code indicating type and packaging ORDERING CODE 2322 750 ..... TYPE PAPER TAPE ON REEL 5000 units FRC01 6.... Ordering code (12NC) Table 2 Last digit of 12NC • The resistors have a 12-digit ordering code starting with 2322 RESISTANCE DECADE • The subsequent 4 digits indicate the resistor type and packaging; see Table 1. 1 to 9.76 Ω 8 10 to 97.6 Ω 9 100 to 240 Ω 1 • The remaining 4 digits indicate the resistance value: – The first 3 digits indicate the resistance value. – The last digit indicates the resistance decade in accordance with Table 2. 361 LAST DIGIT ORDERING EXAMPLE The ordering code of a FRC01 resistor, value 200 Ω, packed in paper tape and supplied on a reel of 5000 units is: 2322 750 62001. Philips Components Product specification Fusible chip resistor size 1206 FRC01 5% series are in accordance with “IEC publication 60063”. FUNCTIONAL DESCRIPTION Product characterization Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±5%. The values of the E24/E96 Fusing characteristics t (s) 10 1 10−1 10−2 10−3 0 2 ,,, ,,, , , ,,, ,,, ,,, ,,, 4 6 The fusing characteristic is measured under constant voltage with resistors mounted on a ceramic or glass epoxy (FR4) substrate; see Fig.3. The resistors will fuse without the risk of fire and within an indicated range of overload. Fusing means that the CCA852 102 handbook, halfpage resistive value of the resistor increases at least 100 times; see Figs 1 and 2. 8 102 handbook, halfpage t (s) 10 1 10−1 10−2 10−3 0 10 ,,,, ,,,, ,,,, ,,,, ,,,, ,,,, 2 Poverload (W) This graph is based on measured data which may deviate according to the application. 6 8 10 Poverload (W) This graph is based on measured data which may deviate according to the application. Fig.2 Fig.1 4 CCA853 Fusing characteristic: 10 Ω ≤ R < 240 Ω, measured using ceramic board material. Fusing characteristic: 1 Ω ≤ R < 240 Ω, measured using glass epoxy (FR4) board material. resistor mount (FACE UP) handbook, full pagewidth conductor: lead frame mount Al2O3 or FR4 40.3 × 7.6 × 0.635 mm NiCr Au 1.5 µm Ni 0.5 µm Au 0.1 µm 1.7 × 1.0 mm Fig.3 Test substrate layout. 1999 Feb 10 362 CCB649 Philips Components Product specification Fusible chip resistor size 1206 FRC01 5% Limiting values TYPE LIMITING VOLTAGE(1) (V) LIMITING POWER (W) 200(2) 0.125 FRC01 MBG605 50 handbook, halfpage Vmax (V) 40 Notes 1. The maximum voltage that may be continuously applied to the resistor element, see “IEC publication 60115-8”. 30 2. The maximum voltage that may be applied after fusing is shown in Fig.4. 20 10 1 10 102 Rn (Ω) 103 Fig.4 Maximum applied voltage after fusing. DERATING PULSE LOADING CAPABILITIES The power that the resistor can dissipate depends on the operating temperature; see Fig.5. MBG607 102 handbook, halfpage Vmax (V) handbook, P halfpage MLB206 max (%Prated ) 1.2/50 µsec 10/700 µsec 10 100 50 1 0 55 0 50 70 100 125 o Tamb ( C) 1 10 102 Rn (Ω) 103 These pulses may not be applied on a regular basis. Fig.5 Maximum dissipation (Pmax) in percentage of rated power as a function of the ambient temperature (Tamb). 1999 Feb 10 Fig.6 363 Maximum permissible peak pulse voltage without failing to ‘open circuit’ in accordance with DIN IEC 60040 (CO) 533. Philips Components Product specification Fusible chip resistor size 1206 FRC01 5% MBG606 103 handbook, full pagewidth P max (W) 102 10 single pulse tp/ti = 1000 1 10−1 10−6 10−5 Fig.7 10−4 10−3 10−2 10−1 ti (s) 1 Pulse on a regular basis; maximum permissible peak pulse power ( Pˆ max ) as a function of pulse duration, single pulse and repetitive pulse tp/ti = 1000. MBG608 600 handbook, full pagewidth V max (V) 500 400 300 200 100 0 10−6 10−5 Fig.8 1999 Feb 10 10−4 10−3 10−2 10−1 ti (s) ˆ max ) as Pulse on a regular basis; maximum permissible peak pulse voltage ( V a function of pulse duration. 364 1 Philips Components Product specification Fusible chip resistor size 1206 MECHANICAL DATA FRC01 5% Outlines Mass per 100 units TYPE FRC01 MASS (g) handbook, 4 columns 1.0 T Marking ,, ,, ,, ,, ,, ,,,,,,, ,, ,,,,,, 220R ,,,,,, ,,,,,, tb All resistors are marked with a four digit code on the protective coat to designate the nominal resistance value. tt 4-DIGIT MARKING W For all values, the R is used as a decimal point. protective coat resistor layer inner electrode end termination ceramic substrate protective coat marking MBE929 Example L MARKING 120R RESISTANCE 120 Ω For dimensions see Table 3. PACKAGE MARKING The packaging is also marked and includes resistance value, tolerance, catalogue number, quantity, production period, batch number and source code. Fig.9 Outlines. Table 3 TYPE FRC01 1999 Feb 10 Chip resistor type and relevant physical dimensions; see Fig.9 L (mm) W (mm) 3.20 1.60 ±0.15 +0.10/−0.20 365 T (mm) 0.55 ±0.10 tt (mm) tb (mm) 0.45 ±0.25 0.50 ±0.25 Philips Components Product specification Fusible chip resistor size 1206 FRC01 5% Unless otherwise specified the following values apply: TESTS AND REQUIREMENTS Temperature: 15 °C to 35 °C Essentially all tests are carried out in accordance with the schedule of “IEC publication 60115-8”, category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and EIAJ. Relative humidity: 45% to 75% Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). In Table 4 the tests and requirements are listed with reference to the relevant clauses of “IEC publications 60115-8 and 60068”; a short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. The tests are carried out in accordance with IEC publication 60068, “Recommended basic climatic and mechanical robustness testing procedure for electronic components” and under standard atmospheric conditions according to “IEC 60068-1”, subclause 5.3. All soldering tests are performed with mildly activated flux. Table 4 Test procedures and requirements IEC 60115-8 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS Tests in accordance with the schedule of IEC publication 60115-8 4.4.1 visual examination 4.4.2 dimensions (outline) no holes; clean surface; no damage gauge (mm) 0.45 ≤ T ≤ 0.65 1.45 ≤ W ≤ 1.75 3.0 ≤ L ≤ 3.3 4.5 resistance applied voltage (+0/−10%): R − Rnom: max. ±5% R < 10 Ω: 0.1 V 10 Ω ≤ R < 100 Ω: 0.3 V 100 Ω ≤ R < 240 Ω: 1 V 4.18 20 (Tb) resistance to soldering heat unmounted chips; 10 ±1 s; 260 ±5 °C no visible damage ∆R/R max.: ±(1% +0.05 Ω) 4.29 45 (Xa) component solvent resistance isopropyl alcohol or H2O followed by no visible damage brushing in accordance with “MIL 202 F” 4.17 20 (Ta) solderability unmounted chips completely immersed good tinning (≥95% covered); for 2 ±0.5 s in a solder bath at 235 ±2 °C no visible damage 4.7 voltage proof on insulation maximum voltage (RMS) during 1 minute metal block method no breakdown or flashover 4.13 short time overload room temperature; P = 6.25 × Pn; 5 s (V ≤ 2 × Vmax) ∆R/R max.: ±(1% +0.05 Ω) 4.33 bending resistors mounted on a 90 mm glass epoxy resin PCB (FR4), bending: 3 mm no visible damage rapid change of temperature 30 minutes at LCT and 30 minutes at UCT; 5 cycles no visible damage damp heat (steady state) 56 days; 40 ±2°C; 93 +2/−3% RH; loaded with 0.01 Pn ∆R/R max.: ±(3% +0.1 Ω) 4.19 4.24.2 14 (Na) 3 (Ca) 1999 Feb 10 366 ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(1% +0.05 Ω) Philips Components Product specification Fusible chip resistor size 1206 IEC 60115-8 CLAUSE IEC 60068-2 TEST METHOD 4.25.1 4.23.2 27 (Ba) 4.8.4.2 FRC01 5% TEST PROCEDURE REQUIREMENTS endurance 1000 +48/−0 hours; 70 ±2 °C; loaded with Pn or Vmax; 1.5 hours on and 0.5 hours off ∆R/R max.: ±(3% +0.1 Ω) endurance at upper category temperature 1000 +48/−0 hours; no load ∆R/R max.: ±(3% +0.1 Ω) temperature coefficient at 20/LCT/20 °C and 20/UCT/20 °C: R<5Ω ≤±250 × 10−6/K R ≤ 510 Ω ≤±200 × 10−6/K Other tests in accordance with IEC 60115 clauses and IEC 60068 test method 4.17 20 (Ta) solderability (after ageing) 8 hours steam or 16 hours 155 °C; good tinning (≥95% covered); unmounted chips completely immersed no damage for 2 ±0.5 s in a solder bath at 235 ±2 °C 4.6.1.1 insulation resistance voltage (DC) after 1 minute, metal block method: 100 V Rins min.: 103 MΩ 4.12 noise IEC publication 60195 (measured with Quantech-equipment) max. 2 µV/V resistance to damp heat (steady state) 1000 +48/−0 hours; 40 ±2 °C; 93 +2/−3% RH; loaded with Pn or Vmax; 1.5 hours on and 0.5 hours off ∆R/R max.: ±(5% +0.1 Ω) leaching unmounted chips 60 ±1 s; 260 ±5 °C good tinning; no leaching trio damp heat test 1000 +48/−0 hours; 85 ±2 °C; 85 ±5% RH; loaded with 0.1 Pn or Vmax ∆R/R max.: ±(5% +0.1 Ω) Other applicable tests (JIS) C 5202 7.5 1999 Feb 10 367